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HSACTD003A
Data Sheet
HSACTD003A
□Accelerometer function
Head office 1-7,Yukigaya-otsukamachi, Ota-ku, Tokyo, 145-8501, JAPAN
Phone+81 3-3726-1211 FAX+81 3-3728-1741
Nagaoka Plant 1-3-5, Higashitakamimachi, Nagaoka-city, Niigata-pref.940-0006, JAPAN
Phone+81 258-24-4111 FAX+81 258-24-4110
This specification is subject to change without notice.
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- OVERVIEW
This product is an ultra-low power, low-noise, integrated digital output 3-axis
accelerometer with a feature set optimized for wearables and consumer product motion
sensing. Applications include wearable consumer products, IoT devices, user interface
control, gaming motion input, electronic compass tilt compensation for cell phones,
game controllers, remote controls and portable media products.
Low noise and low power are inherent in the monolithic fabrication approach, where the
MEMS accelerometer is integrated in a single-chip with the electronics integrated circuit.
The internal sample rate can be set from 14 to 1300 samples / second. Specific tap or
sample acquisition conditions can trigger an interrupt to a remote MCU. Alternatively,
the device supports the reading of sample and event status via polling.
- FEATURES
Range, Sampling & Power
・ ±2, 4, 8, 12 or 16g ranges
・ 8, 10 or 12-bit resolution with FIFO
o 14-bit single samples
・ Sample rate 14 - 1300 samples/sec
o Sample trigger via internal oscillator, clock pin or software command
・ Sniff and Wake modes
o 0.4 μA Sniff current @ 6Hz
o Separate or combined sniff/wake
・ Ultra-Low Power with 32 sample FIFO
o 0.9 μA typical current @ 25Hz
o 1.6 μA typical current @ 50Hz
o 2.8 μA typical current @ 100Hz
o 36 μA typical current @ 1300Hz
Simple System Integration
・ I2C interface, up to 1 MHz
・ SPI Interface, up to 8 MHz
・ 1.6 × 1.6 × 0.94 mm 10-pin package
・ Single-chip 3D silicon MEMS
・ Low noise to 2.3mgRMS
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Table of Contents
1 Order Information .............................................................................................................
5
5
2 Functional Block Diagram ................................................................................................
6
6
3 Packaging and Pin Description ........................................................................................
7
7
3.1 Package Outline ...................................................................................................................
7
7
3.2 Package Orientation .............................................................................................................
8
8
3.3 Pin Description .....................................................................................................................
9
9
3.4 Typical Application Circuits ................................................................................................
10
10
3.5 Tape and Reel ...................................................................................................................
13
13
4 Specifications .................................................................................................................
15
15
4.1 Absolute Maximum Ratings ................................................................................................
15
15
4.2 Sensor Characteristics .......................................................................................................
16
16
4.3 Electrical and Timing Characteristics ..................................................................................
17
17
4.3.1 Electrical Power and Internal Characteristics ..................................................................
17
17
4.3.2 Electrical Characteristics ................................................................................................
18
18
4.3.3 I2C Timing Characteristics ..............................................................................................
19
19
4.3.4 SPI Timing Characteristics..............................................................................................
20
20
5 General Operation .........................................................................................................
21
21
5.1 Sensor Sampling ................................................................................................................
21
21
5.2 Offset and Gain Calibration ................................................................................................
21
21
5.3 Reset .................................................................................................................................
21
21
5.4 Reload ...............................................................................................................................
22
22
5.5 Operational Modes .............................................................................................................
23
23
5.6 Mode State Machine Flow ..................................................................................................
24
24
6 Interfaces .......................................................................................................................
25
25
6.1 SPI vs I2C Operation Modes ..............................................................................................
25
25
6.2 I2C Physical Interface ........................................................................................................
25
25
6.3 I2C Message Format ..........................................................................................................
26
26
6.4 SPI Physical Interface ........................................................................................................
27
27
6.5 SPI 3-Wire Mode ................................................................................................................
27
27
6.6 SPI Protocol .......................................................................................................................
27
27
6.7 SPI Register Write Cycle - Single .......................................................................................
28
28
6.8 SPI Register Write Cycle - Burst ........................................................................................
28
28
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Table of Contents (Continue)
6.9 SPI Register Read Cycle - Single .......................................................................................
28
28
6.10 SPI Register Read Cycle - Burst ........................................................................................
29
29
6.11 SPI Status Option ...............................................................................................................
29
29
6.12 SPI High-Speed Mode........................................................................................................
30
30
7 Register Interface ..........................................................................................................
31
31
7.1 Register Summary .............................................................................................................
32
32
7.2 (0x00) Extended Status Register 1 .....................................................................................
34
34
7.3 (0x01) Extended Status Register 2 .....................................................................................
35
35
7.4 (0x02 – 0x07) XOUT, YOUT & ZOUT Data Output Registers .............................................
36
36
7.5 (0x08) Status Register 1 .....................................................................................................
37
37
7.6 (0x09) Status Register 2 .....................................................................................................
39
39
7.7 (0x0D) Feature Register 1 ..................................................................................................
41
41
7.8 (0x0E) Feature Register 2 ..................................................................................................
43
43
7.9 (0x0F) Initialization Register 1 ............................................................................................
46
46
7.10 (0x10) Mode Control Register ............................................................................................
47
47
7.11 (0x11) Rate Register 1 .......................................................................................................
49
49
7.12 (0x12) Sniff Control Register ..............................................................................................
51
51
7.13 (0x13) Sniff Threshold Control Register .............................................................................
54
54
7.14 (0x14) Sniff Configuration Register ....................................................................................
57
57
7.15 (0x15) Range and Resolution Control Register ..................................................................
59
59
7.16 (0x16) FIFO Control Register .............................................................................................
61
61
7.17 (0x17) Interrupt Control Register ........................................................................................
62
62
7.18 (0x1A) Initialization Register 3 ............................................................................................
64
64
7.19 (0x1B) Scratchpad Register ...............................................................................................
65
65
7.20 (0x1C) Power Mode Control Register .................................................................................
66
66
7.21 (0x20) Drive Motion X Register ..........................................................................................
68
68
7.22 (0x21) Drive Motion Y Register ..........................................................................................
69
69
7.23 (0x22) Drive Motion Z Register ...........................................................................................
70
70
7.24 (0x24) Reset Register ........................................................................................................
71
71
7.25 (0x28) Initialization Register 2 ............................................................................................
72
72
7.26 (0x29) Trigger Count Register ............................................................................................
73
73
7.27 (0x2A – 0x2B) X-Axis Offset Registers ...............................................................................
74
74
7.28 (0x2C – 0x2D) Y-Axis Offset Registers ..............................................................................
75
75
7.29 (0x2E – 0x2F) Z-Axis Offset Registers ...............................................................................
76
76
7.30 (0x2B & 0x30) X-Axis Gain Registers .................................................................................
77
77
7.31 (0x2D & 0x31) Y-Axis Gain Registers .................................................................................
78
78
7.32 (0x2F & 0x32) Z-Axis Gain Registers .................................................................................
79
79
8 Index of Tables ..............................................................................................................
80
80
9 Revision History .............................................................................................................
82
82
10 Legal ..............................................................................................................................
83
83
11 Asking that use this product .....................................................................................................................
84
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1 ORDER INFORMATION
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2 FUNCTIONAL BLOCK DIAGRAM
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3 PACKAGING AND PIN DESCRIPTION
3.1 PACKAGE OUTLINE
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3.2 PACKAGE ORIENTATION
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3.3 PIN DESCRIPTION
Notes:
1) When using the I2C interface, this pin requires a pull-up resistor, typically 4.7kΩ to pin
VDDIO. Refer to I2C Specification for Fast-Mode devices. Higher resistance values can be
used (typically done to reduce current leakage) but such applications are outside the
scope of this datasheet.
2) This pin can be configured by software to operate either as an open-drain output or
push-pull output. If set to open-drain, then it requires a pull-up resistor, typically 4.7kΩ to
pin VDDIO.
3) INTN pin polarity is programmable.
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3.4 TYPICAL APPLICATION CIRCUITS
In typical applications, the interface power supply may contain significant noise
from external sources and other circuits which should be kept away from the
device. Therefore, for some applications a lower-noise power supply might be
desirable to power the device.
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3.4 TYPICAL APPLICATION CIRCUITS (Continue)
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3.4 TYPICAL APPLICATION CIRCUITS (Continue)
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3.5 TAPE AND REEL
Devices are shipped in reels, in standard cardboard box packaging. See Figure 8.
Tape Dimensions and Figure 9. Reel Dimensions.
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3.5 TAPE AND REEL (Continue)
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4 SPECIFICATIONS
4.1 ABSOLUTE MAXIMUM RATINGS
Parameters exceeding the Absolute Maximum Ratings may permanently
damage the device.
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HSACTD003A
4.2 SENSOR CHARACTERISTICS
1
Values are based on device characterization, not tested in production.
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4.3 ELECTRICAL AND TIMING CHARACTERISTICS
4.3.1 ELECTRICAL POWER AND INTERNAL CHARACTERISTICS
2
Min and Max limits are hard limits without additional tolerance.
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HSACTD003A
4.3.2 ELECTRICAL CHARACTERISTICS
NOTES:
・ If multiple slaves are connected to the I2C signals in addition to this device, only
1 pull-up resistor on each of SDA and SCL should exist. Also, care must be taken
to not violate the I2C specification for capacitive loading.
・ When pin VDDIO is not powered and set to 0V, INTN, DIN_SDA and SCK_SCL
will be held to VDDIO plus the forward voltage of the internal static protection
diodes, typically about 0.6V.
・ When pin VDDIO is disconnected from power or ground (e.g. Hi-Z), the device
may become inadvertently powered up through the ESD diodes present on other
powered signals.
3
Values are based on device characterization, not tested in production.
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4.3.3 I2C TIMING CHARACTERISTICS
NOTE: Values are based on I2C Specification requirements, not tested in
production.
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4.3.4 SPI TIMING CHARACTERISTICS
4
Values are based on device characterization.
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5 GENERAL OPERATION
The device supports the reading of samples and device status upon interrupt or
via polling. It contains a 12-bit 32 sample FIFO with programmable watermark.
The device is internally clocked but also includes a manual trigger mode. It can
be put into several low power modes, depending upon the desired sensing
application. The device can run in full-featured mode from its fast internal clock
or from a slower heartbeat clock, with limited functionality and at lower power.
The device can connect as a slave to either a SPI or I2C master.
5.1 SENSOR SAMPLING
X, Y and Z accelerometer data is stored in registers XOUT, YOUT, and ZOUT
registers. The data is represented as 2’s complement format.
The desired resolution and full scale acceleration range are set in the RANGE_C
register.
5.2 OFFSET AND GAIN CALIBRATION
The default digital offset and gain calibration data can be read from the device, if
necessary, in order to reduce the effects of post-assembly influences and
stresses which may cause the sensor readings to be offset from their factory
values.
5.3 RESET
The device can be completely reset via an I2C or SPI instruction. Writing register
0x24 with 0x40 (bit 6) causes a power-on reset operation to execute. No attempt
should be made to access registers within 1mSec after issuing this operation.
The device must be placed in STANDBY mode before executing the reset. The pin
DOUT_A1 is sampled for the purposes of setting the I2C device address after this
reset operation.
NOTE: Immediately after a RESET or power-up event, several registers must be
written with initialization values as shown below. The recommended sequence is:
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5.4 RELOAD
The device registers can be reloaded from OTP via an I2C or SPI instruction.
Writing register 0x24 with 0x80 (bit 7) causes a reload operation to execute. The
contents of OTP are reloaded into the register set. However any non-loaded
register locations will not be affected. No attempt should be made to access
registers within 1mSec after issuing this operation. The device must be placed in
STANDBY mode before executing the reset.
The pin DOUT_A1 is sampled for the purposes of setting the I2C device address
after this reload operation.
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5.5 OPERATIONAL MODES
The device has various modes of operation as described below:
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5.6 MODE STATE MACHINE FLOW
Figure 12. Mode Operational Flow shows the operational mode flow for the
device. The device defaults to SLEEP mode following power-on. Mode transitions
occur at an approximate rate of ~500Hz. Depending on the operation, the MODE
State Machine may trigger events that autoclear or set the MCTRL[2:0] bits in
register 0x10 after a particular command is chosen.
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6 INTERFACES
6.1 SPI VS I2C OPERATION MODES
The device contains both I2C and SPI slave interfaces which share common pins.
However, only one interface can be active for correct device operation. Once the
device completes POR or a hard reset, both interfaces are active.
After power-up and any reset of the device, the first transaction to the device
must be writing to the selected enable bit, either “I2C_EN” or “SPI_EN” in
register 0x0D. The situation where bits are set at the same time must be
avoided or unstable device operation could occur.
To keep the “disabled” interface from interfering in future transactions, the
corresponding “enable” bit must be set in the register set. For example, if the 4wire SPI interface is to be active, write a value of 0x80 to register 0x0D.
6.2 I2C PHYSICAL INTERFACE
The I2C slave interface operates at a maximum speed of 1 MHz in I2C “Fast Mode
Plus”. The SDA (data) is an open-drain, bi-directional pin and the SCL (clock) is
an input pin.
The device always operates as an I2C slave.
An I2C master initiates all communication and data transfers and generates the
SCK_SCL clock that synchronizes the data transfer. The I2C device address
depends upon the settings of various registers and pins as shown in the table
below.
An I2C master initiates all communication and data transfers and generates the
SCK_SCL clock that synchronizes the data transfer. The I2C device address
depends upon the state of pin DOUT_A1 during power-up as shown in the table
below.
The I2C interface remains active as long as power is applied to the VDDIO pin. In
STANDBY mode the device responds to I2C read and write cycles, but interrupts
cannot be cleared. All registers can be written in the SLEEP or STANDBY modes, but
in CWAKE only the (0x10) Mode Control Register can be modified.
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6.2 I2C PHYSICAL INTERFACE (Continue)
Internally, the registers which are used to store samples are clocked by the
sample clock and gated by I2C activity. Therefore, in order to allow the device to
collect and present samples in the sample registers at least one I2C STOP
condition must be present between samples.
Refer to the I2C specification for a detailed discussion of the protocol. Per I2C
requirements, when the I2C interface is enabled, DIN_SDA is an open drain, bidirectional pin. Pins SCK_SCL and DIN_SDA each require an external pull-up
resistor, typically 4.7kΩ.
6.3 I2C MESSAGE FORMAT
NOTE: At least one I2C STOP condition must be present between samples in
order for the device to update the sample data registers.
The device uses the following general format for writing to the internal registers.
The I2C master generates a START condition, and then supplies the 7-bit device
ID. The 8th bit is the R/W# flag (write cycle = 0). The device pulls DIN_SDA low
during the 9th clock cycle indicating a positive ACK.
The second byte is the 8-bit register address of the device to access, and the last
byte is the data to write.
In a read cycle, the I2C master writes the device ID (R/W#=0) and register address
to be read.
The master issues a RESTART condition and then writes the device ID with the
R/W# flag set to ‘1’. The device shifts out the contents of the register address.
The I2C master may write or read consecutive register addresses by writing or
reading additional bytes after the first access. The device will internally increment
the register address.
NOTE: See (0x0E) Feature Register 2 for address wrap details.
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6.4 SPI PHYSICAL INTERFACE
The device always operates as an SPI slave. An SPI master must initiate all
communication and data transfers and generate the SCK_SCL clock that
synchronizes the data transfer. The CSN pin must be pulled up to VDDIO when
the SPI interface is not in use. The SPI interface can operate in 3-wire or 4-wire
mode.
6.5 SPI 3-WIRE MODE
SPI 3-wire mode is disabled by default. To enable 3-wire mode, the first write to
the device should immediately enable this feature in register (0x0D) Feature
Register 1. In 3-wire mode the pins DOUT_A1 and DIN_SDA must be connected
on the PCB. Anytime there is a reset to the device, a POR event, or a power cycle
the SPI 3-wire configuration will reset to 4-wire mode.
6.6 SPI PROTOCOL
The general protocol for the SPI interface is shown in the figures below. The
falling edge of CSN initiates the start of the SPI bus cycle. The first byte of the
transaction is the command/address byte. Because the register address space is
64 locations, a total of 6 address bits are required for each SPI bus cycle. During
clock ‘1’, the R/W# bit is set to ‘0’ for a write cycle or ‘1’ for a read cycle.
The interface supports 2 types of addressing: 1-byte (typically used) and 2-byte
(to support legacy hardware). In the case of 2-byte addressing, the bits occurring
during clocks 2 and 9-16 must be driven to ‘0’ for the address to be correctly
decoded. Each read or write transaction always requires a minimum of 16 or 24
cycles of the SCK_SCL pin.
When the SPI master is writing data, data may change when the clock is low, and
must be stable on the clock rising edge. Similarly, output data written to the SPI
master is shifted out on the falling edge of clock and can be latched by the master
on the rising edge of the clock.
Serial data in or out of the device is always MSB first.
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6.6 SPI PROTOCOL (Continue)
NOTE: Either 1-byte or 2-byte addressing may be used for any SPI
transaction, although for simplicity, the remaining timing diagrams show only
1-byte addressing.
6.7 SPI REGISTER WRITE CYCLE - SINGLE
A single register write consists of a 16-clock transaction. As described above, the
first bit is set to ‘0’ indicating a register write followed by the register address.
6.8 SPI REGISTER WRITE CYCLE - BURST
A burst (multi-byte) register write cycle uses the address specified at the
beginning of the transaction as the starting register address. Internally the
address will auto-increment to the next consecutive address for each additional
byte (8-clocks) of data written beyond clock 8.
NOTE: See (0x0E) Feature Register 2 for address wrap details.
6.9 SPI REGISTER READ CYCLE - SINGLE
A single register read consists of a 16-clock transaction. As described above, the
first bit is set to ‘1’ indicating a register read followed by the register address.
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6.10 SPI REGISTER READ CYCLE - BURST
A burst (multi-byte) register read cycle uses the address specified at the
beginning of the transaction as the starting register address. Internally the
address will auto-increment to the next consecutive address for each additional
byte (8-clocks) of data read beyond clock 8.
NOTE: See (0x0E) Feature Register 2 for address wrap details.
6.11 SPI STATUS OPTION
The device supports an optional SPI status feature, only in SPI 4-wire mode. This
feature is enabled in register (0x0E) Feature Register 2. During the first 6-bits of
any SPI transaction (immediately after the falling edge of CSN), the DOUT_A1 pin
will output six status bits related to the device. Following the 6th clock cycle, the
device will float the DOUT_A1 pin before a possible read cycle begins. The status
bits sent are shown below:
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6.12 SPI HIGH-SPEED MODE
To achieve SPI speed greater than 2MHz, use the following sequence:
- Start SPI at low speed (less than 2MHz)
- Enable SPI mode –
・ “SPI_EN” in section 7.7 (0x0D) Feature Register 1
- Enable high speed SPI mode –
・ “SPI_HS_EN” in section 7.20 (0x1C) Power Mode Control Register
- Increase SPI speed up to 8MHz
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7 REGISTER INTERFACE
The device has a simple register interface which allows an SPI or I2C master to
configure and monitor all aspects of the device. This section lists an overview of
user programmable registers. By convention, bit 0 is the least significant bit
(LSB) of a byte register.
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7.1 REGISTER SUMMARY
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6.1.2. Sensor Sampling
4
‘R’ registers are read-only. ‘W’ registers are read-write. 'WO' registers are write
only.
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7.2 (0X00) EXTENDED STATUS REGISTER 1
This register contains status for the I2C address of the device.
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7.3 (0X01) EXTENDED STATUS REGISTER 2
The device status register reports various conditions of the device data, clock
and sniff circuitry.
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7.4 (0X02 – 0X07) XOUT, YOUT & ZOUT DATA OUTPUT REGISTERS
The measurements from sensors for the 3-axes are available in these 3 registers.
The most-significant bit of the value is the sign bit, and is sign extended to the
higher bits.
Software must set only one of the bits SPI_EN or I2C_EN in register 0x0D to
‘1’, depending upon if the I2C or SPI interface will be used for external
communications. No data will appear in XOUT, YOUT and ZOUT registers if
both the I2C_EN bit and SPI_EN bit are set to 0 (default).
When the FIFO is enabled, the output of the FIFO is mapped to registers 0x02 to
0x07, and the data has a maximum resolution of 12-bits.
During FIFO reads, software must start a read at address 0x02 and complete a
read to address 0x07 for the FIFO pointers to increment correctly.
Once an I2C start bit has been recognized by the device, registers will not be
updated until an I2C stop bit has occurred. Therefore, if software desires to read
the low and high byte registers ‘atomically’, knowing that the values have not
been changed, it should do so by issuing a start bit, reading one register, then
reading the other register then issuing a stop bit. Note that all 6 registers may be
read in one burst with the same effect.
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7.5 (0X08) STATUS REGISTER 1
This register reports the operational mode of the device. Note that the lower 3bits, the MODE[2:0] field, do not immediately change once a command is written
to the MODE register, but may take up to 3 transitions of the heartbeat clock.
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7.5 (0X08) STATUS REGISTER 1 (Continue)
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7.6 (0X09) STATUS REGISTER 2
This register reports the state of the interrupts (‘0’ means not pending; ‘1’ means
pending). A bit in this register will only be set if the corresponding interrupt
enable is set to ‘1’ in (0x17) Interrupt Control Register. Interrupts can be cleared
in the following ways using (0x0E) Feature Register 2 bit 4:
Interface
I2C clearing method (default)
I2C clearing method (optional)
SPI clearing method
Method
Read Register 0x09
Write Register 0x09
Write Register 0x09
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7.6 (0X09) STATUS REGISTER 2 (Continue)
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7.7 (0X0D) FEATURE REGISTER 1
This register is used to select the interface mode as well as the operation style of
the FIFO and interrupt in SWAKE mode.
NOTE: Software must set only one of the bits SPI_EN or I2C_EN in register
0x0D to ‘1’, depending upon if the I2C or SPI interface will be used for external
communications. No data will appear in XOUT, YOUT and ZOUT registers if
both the I2C_EN bit and SPI_EN bit are set to 0 (default).
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7.7 (0X0D) FEATURE REGISTER 1 (Continue)
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7.8 (0X0E) FEATURE REGISTER 2
This register allows selection of various features for the FIFO, external trigger
input, method of interrupt clearing and burst address wrapping.
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7.8 (0X0E) FEATURE REGISTER 2 (Continue)
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7.8 (0X0E) FEATURE REGISTER 2 (Continue)
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7.9 (0X0F) INITIALIZATION REGISTER 1
Software must write a fixed value to this register immediately after power-up
or reset. This register will not typically read-back the value which was written
(see below).
Note: During the internal chip start-up sequence, the read-back value will be 0x45.
The read-back value will become 0x40 after the start-up sequence completes.
After the initialization value of 0x42 is written, the read-back value will be 0x43.
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7.10 (0X10) MODE CONTROL REGISTER
This register is the primary control register for the accelerometer. The operational
mode of the device, X/Y/Z axis enables, and the TRIG one-shot mode can be
written through this register. The mode transitions controlled by this register may
take up to 3 transitions of the heartbeat clock. Depending on the operation, the
lower 3-bits (MCTRL[2:0]) may be automatically set or cleared by hardware if
auto-triggered events are executed.
In general, when software sets an operational mode using the MCTRL [2:0] bits,
there might be a delay time of 2 to 10 mSec before the operational mode is
reflected by the MODE[2:0] bits in Status Register 1.
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7.10 (0X10) MODE CONTROL REGISTER (Conitinue)
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7.11 (0X11) RATE REGISTER 1
This register configures the sample rates for wake modes. The rates also depend
upon the value in register 0x1C. The device has several power modes which can
be adjusted to achieve a desired power consumption at a certain ODR. The
tradeoff for lower power is either higher noise or lower ODR. See the table below.
NOTE: The power mode bits referenced in 0x1C are different than for the
SNIFF rates.
NOTE: Software must set bits[7:4] to 0.
NOTE: Specific setup steps are required in order to set up Register 0x11 value
0x0F (“Rate 15”), as shown below. These steps are not required when using
the other modes:
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7.11 (0X11) RATE REGISTER 1 (Continue)
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7.12 (0X12) SNIFF CONTROL REGISTER
This register selects the sample rate for SNIFF mode and the clock rate for
STANDBY mode.
NOTE: The power mode bits referenced in 0x1C are different than for the
WAKE rates.
NOTE: Software must always write 0 to bit 4.
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7.12 (0X12) SNIFF CONTROL REGISTER (Continue)
NOTE: Specific setup steps are required in order to set up Register 0x12 value
0x0F (“Rate 15”) for sniff, as shown below. These steps are not required when
using the other modes:
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7.12 (0X12) SNIFF CONTROL REGISTER (Continue)
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7.13 (0X13) SNIFF THRESHOLD CONTROL REGISTER
This register sets the threshold values used by the SNIFF logic for activity
detection. For each axis, a delta count is generated and compared to the
threshold. When the delta count is greater than the threshold, a SNIFF wakeup
event occurs. There is a unique sniff threshold for each axis, and an optional
“false detection count” which requires multiple sniff detection events to occur
before a wakeup condition is declared. These features are set by six shadow
registers accessed by register 0x13[5:0] and register 0x14 bits [2:0].
The SNIFF block supports the logical AND or OR of the X/Y/Z SNIFF wakeup flags
when generating a SNIFF wakeup interrupt.
The SNIFF block supports two methods of calculating SNIFF delta counts:
・ Current Sample to Previous Sample (C2P)
○ The current sample and the immediate previous sample are
subtracted to generate a delta
・ Current Sample to Baseline (C2B)
○ The current sample and the first sample captured when
entering SNIFF mode are subtracted to generate a delta.
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7.13 (0X13) SNIFF THRESHOLD CONTROL REGISTER (Continue)
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7.13 (0X13) SNIFF THRESHOLD CONTROL REGISTER (Continue)
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7.14 (0X14) SNIFF CONFIGURATION REGISTER
This register selects which of the six shadow registers is being accessed in
register 0x13, and controls settings of the SNIFF hardware.
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7.14 (0X14) SNIFF CONFIGURATION REGISTER (Continue)
Some example settings for the SNIFF_MUX field are shown below:
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7.15 (0X15) RANGE AND RESOLUTION CONTROL REGISTER
The RANGE register sets the resolution and range options for the accelerometer.
All numbers are sign-extended, 2’s complement format. All results are reported in
registers 0x02 to 0x07.
When the FIFO is enabled, only 6 to 12-bit resolutions are supported due to the
12-bit width of the FIFO.
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7.15 (0X15) RANGE AND RESOLUTION CONTROL REGISTER (Continue)
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7.16 (0X16) FIFO CONTROL REGISTER
This register selects the FIFO threshold level, operation mode, FIFO reset and
enable. With the exception of FIFO_RESET, the FIFO_EN bit must be ‘1’ for any
FIFO interrupts, thresholds, or modes to be enabled. The FIFO flags in register
0x08 will continue to report FIFO defaults even if the FIFO_EN is ‘0’.
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7.17 (0X17) INTERRUPT CONTROL REGISTER
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7.17 (0X17) INTERRUPT CONTROL REGISTER (Continue)
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7.18 (0X1A) INITIALIZATION REGISTER 3
Software must write a fixed value to this register immediately after power-up or
reset.
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7.19 (0X1B) SCRATCHPAD REGISTER
This register can store any 8-bit value and has no effect on hardware.
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7.20 (0X1C) POWER MODE CONTROL REGISTER
This register selects the power setting for CWAKE, SWAKE and SNIFF modes.
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7.20 (0X1C) POWER MODE CONTROL REGISTER (Continue)
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7.21 (0X20) DRIVE MOTION X REGISTER
This register controls the test mode which moves the sensor in the X axis
direction and initializes specific hardware bits.
NOTE: Software must always write 0 to bits [7:4] and 1.
NOTE: Software must always write 1 to bit 0.
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7.22 (0X21) DRIVE MOTION Y REGISTER
This register controls the test mode which moves the sensor in the Y axis
direction and initializes specific hardware
NOTE: Software must always write 0 to bits [6:4] and [1:0].
NOTE: Software must always write 1 to bit 7 after writing to register 0x20[0].
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7.23 (0X22) DRIVE MOTION Z REGISTER
This register controls the test mode which moves the sensor in the Z axis
direction.
NOTE: Software must always write 0 to bits [7:4] and [1:0].
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7.24 (0X24) RESET REGISTER
This register can be used to reset the device. Anytime there is a reset to the
device, a POR event, or a power cycle the SPI 3-wire configuration will reset to 4wire mode.
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7.25 (0X28) INITIALIZATION REGISTER 2
Software must write a fixed value to this register immediately after power-up or
reset.
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7.26 (0X29) TRIGGER COUNT REGISTER
This register selects the number of samples to be taken after the one-shot trigger
is started.
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7.27 (0X2A – 0X2B) X-AXIS OFFSET REGISTERS
This register contains a signed 2’s complement 15-bit value applied as an offset
adjustment to the output of the acceleration values, prior to being sent to the
OUT_EX registers. The Power-On-Reset value for each chip is unique and is set
as part of factory calibration. If necessary, this value can be overwritten by
software.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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7.28 (0X2C – 0X2D) Y-AXIS OFFSET REGISTERS
This register contains a signed 2’s complement 15-bit value applied as an offset
adjustment to the output of the acceleration values, prior to being sent to the
OUT_EX registers. The Power-On-Reset value for each chip is unique and is set
as part of factory calibration. If necessary, this value can be overwritten by
software.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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7.29 (0X2E – 0X2F) Z-AXIS OFFSET REGISTERS
This register contains a signed 2’s complement 15-bit value applied as an offset
adjustment to the output of the acceleration values, prior to being sent to the
OUT_EX registers. The Power-On-Reset value for each chip is unique and is set
as part of factory calibration. If necessary, this value can be overwritten by
software.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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7.30 (0X2B & 0X30) X-AXIS GAIN REGISTERS
The gain value is an unsigned 9-bit number.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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7.31 (0X2D & 0X31) Y-AXIS GAIN REGISTERS
The gain value is an unsigned 9-bit number.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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7.32 (0X2F & 0X32) Z-AXIS GAIN REGISTERS
The gain value is an unsigned 9-bit number.
NOTE: When modifying these registers with new gain or offset values,
software should perform a read-modify-write type of access to ensure that
unrelated bits do not get changed inadvertently.
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8 INDEX OF TABLES
Table 1. Order Information .....................................................................................................................
5
5
Table 2. Pin Description .........................................................................................................................
9
9
Table 3. Absolute Maximum Ratings ....................................................................................................
15
15
Table 4. Sensor Characteristics ...........................................................................................................
16
16
Table 5. Electrical Characteristics – Voltage and Current ....................................................................
17
17
Table 6. Electrical Characteristics – Interface ......................................................................................
18
18
Table 7. I2C Timing Characteristics .....................................................................................................
19
19
Table 8. SPI Interface Timing Parameters ...........................................................................................
20
20
Table 9. Recommended Initialization Sequence ..................................................................................
21
21
Table 10. Operational Modes ...............................................................................................................
23
23
Table 11. I2C Address Selection ..........................................................................................................
25
25
Table 12. Register Summary ...............................................................................................................
33
33
Table 13. Extended Status Register 1 Settings ....................................................................................
34
34
Table 14. Extended Status Register 2 Settings ....................................................................................
35
35
Table 15. XOUT, YOUT, ZOUT Data Output Registers ........................................................................
36
36
Table 16. Status Register 1 Settings ....................................................................................................
38
38
Table 17. Status Register 2 Settings ....................................................................................................
40
40
Table 18. Feature Register 1 Settings ..................................................................................................
42
42
Table 19. Feature Register 2 Settings ..................................................................................................
45
45
Table 20. Initialization Register 1 Settings ...........................................................................................
46
46
Table 21. Mode Control Register Settings ............................................................................................
48
48
Table 22. Rate Register 1 Settings ......................................................................................................
49
49
Table 23. Setup Steps for CWAKE Using “Rate 15” .............................................................................
50
50
Table 24. Sniff Control Register Settings .............................................................................................
52
52
Table 25. Setup Steps For Sniff Using “Rate 15” .................................................................................
53
53
Table 26. Sniff Threshold Control Register Settings .............................................................................
56
56
Table 27. Sniff Configuration Register Settings ....................................................................................
58
58
Table 28. Range and Resolution Control Register Settings .................................................................
60
60
Table 29. FIFO Control Register Settings ............................................................................................
61
61
Table 30. Interrupt Control Register Settings .......................................................................................
63
63
Table 31. Initialization Register 3 Settings ...........................................................................................
64
64
Table 32. Scratchpad Register .............................................................................................................
65
65
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8 INDEX OF TABLES (Continue)
Table 33. Power Mode Control Register Settings .................................................................................
67
67
Table 34. Drive Motion X Register Settings ..........................................................................................
68
68
Table 35. Register 0x21 Read-Back Value ..........................................................................................
69
69
Table 36. Drive Motion Y Register Settings ..........................................................................................
69
69
Table 37. Drive Motion Z Register Settings ..........................................................................................
70
70
Table 38. Reset Register Settings .......................................................................................................
71
71
Table 39. Initialization Register 2 Settings ...........................................................................................
72
72
Table 40. Trigger Register Settings ......................................................................................................
73
73
Table 41. X-Axis Offset Registers ........................................................................................................
74
74
Table 42. Y-Axis Offset Registers ........................................................................................................
75
75
Table 43. Z-Axis Offset Registers ........................................................................................................
73
76
Table 44. X-Axis Gain Registers ..........................................................................................................
77
77
Table 45. Y-Axis Gain Registers ..........................................................................................................
78
78
Table 46. Z-Axis Gain Registers ..........................................................................................................
79
79
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9 Revision History
Revision Date
1.0
13.Nov. 2017
1.1
4.Apr. 2018
Page
4,84
Note
First edition
Add 11. Asking that use this product
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10 LEGAL
1. ALPS reserves the right to make corrections, modifications, enhancements, improvements and
other changes to its products and to this document at any time and discontinue any product
without notice. The information contained in this document has been carefully checked and is
believed to be accurate. However, ALPS shall assume no responsibilities for inaccuracies and make
no commitment to update or to keep current the information contained in this document.
2. ALPS products are designed only for commercial and normal industrial applications and are not
suitable for other purposes, such as: medical life support equipment; nuclear facilities; critical care
equipment; military / aerospace; automotive; security or any other applications, the failure of which
could lead to death, personal injury or environmental or property damage. Use of the products in
unsuitable applications are at the customer’s own risk and expense.
3. ALPS shall assume no liability for incidental, consequential or special damages or injury that may
result from misapplication or improper use of operation of the product.
4. No license, express or implied, by estoppel or otherwise, to any intellectual property rights of
ALPS or any third party is granted under this document.
5. ALPS makes no warranty or representation of non-infringement of intellectual property rights of
any third party with respect to the products. ALPS specifically excludes any liability to the
customers or any third party regarding infringement of any intellectual property rights, including the
patent, copyright, trademark or trade secret rights of any third party, relating to any combination,
machine, or process in which the ALPS products are used.
6. Examples of use described herein are provided solely to guide use of ALPS products and merely
indicate targeted characteristics, performance and applications of products. ALPS shall assume no
responsibility for any intellectual property claims or other problems that may result from
applications based on the examples described herein.
7. Information described in this document including parameters, application circuits and its
constants and calculation formulas, programs and control procedures are provided for the purpose
of explaining typical operation and usage. “Typical” parameters that may be provided in ALPS data
sheets and/or specifications can and do vary in different applications and actual performance may
vary over time. All operating parameters including “Typicals,” must be validated for each customer
application by customer’s technical experts. In no event shall the information described be
regarded as a guarantee of conditions or characteristics of the products. Therefore, the customer
should evaluate the design sufficiently as whole system under the consideration of various external
or environmental conditions and determine their application at the customer’s own risk. ALPS shall
assume no responsibility or liability for claims, damages, costs and expenses caused by the
customer or any third party, owing to the use of the above information.
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3-axis Accelerometer
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Rev.1.1
Apr. 2018
HSACTD003A
11. Asking that use this product
1. For the export of products which are controlled items subject to foreign and domestic export laws and
regulations, you must obtain approval and/or follow the formalities of such laws and regulations.
2. Products must not be used for military and/or antisocial purposes such as terrorism, and shall not be
supplied to any party intending to use the products for such purposes.
3. Unless provided otherwise, the products have been designed and manufactured for application to
equipment and devices which are sold to end-users in the market, such as AV (audio visual) equipment,
home electric equipment, office and commercial electronic equipment, information and communication
equipment or amusement equipment. The products are not intended for use in, and must not be used for,
any application of nuclear equipment, driving control equipment for aerospace or any other unauthorized
use.
With the exception of the above mentioned banned applications, for applications involving high levels of
safety and liability such as medical equipment, burglar alarm equipment, disaster prevention equipment
and undersea equipment, please contact an Alps sales representative and/or evaluate the total system on
the applicability. Also, implement a fail-safe design, protection circuit, redundant circuit, malfunction
protection and/or fire protection into the complete system for safety and reliability of the total system.
4. Before using products which were not specifically designed for use in automotive applications, please
contact an Alps sales representative.
5. The actual performance may vary under any special or extraordinary environments or
conditions where excessive distortion or mechanical stress is applied on the products.
ex) Sealing or coating the products with resin or other coating materials.
The strucure in which the printed circuit board is under excessive distortion.
6. Mechanical sensor are designed to handle high-g shock events, but direct mechanical shock to the
package will generate high g forces and should be avoided. SMT assembly houses should use automated
assembly equipment with either plastic nozzles or nozzles with compliant (soft i.e. rubber or silicone) tips.
7. Recommendations for assembly :
・ Do not use metal or ceramic nozzle tips during assembly.
- These cause excessive g forces and therefore are NOT recommended.
・ Place the sensor with minimal direct force during assembly.
- This is achieved by optimizing the placement force control in the g-sensor library
for chip shooters or IC placers.
・ Place the sensor with minimum pick and place assembly speeds.
- This is achieved by optimizing the speed settings control in the g-sensor library
for chip shooters or IC placers.
・ Discard mishandled sensors.
- If the sensor is dropped from a height of 50mm or greater it should be discarded and not used.
- Direct impact to a hard surface can also generate high g forces.
The best practice is to discard any part that has been dropped.
・ Handle partially finished PCB assemblies carefully.
- Transport assemblies in shock-absorbent carriers.
- Do NOT expose partial assemblies to bending, flexing or excessive shocks during product assembly.
8. Ultrasonic cleaning of the PCB assembly is not recommended to avoid damaging the product.
Confidential
ALPS ELECTRIC CO.,LTD. (/)
(/)
11
10
67548293