SCAK

Connector for Connection with PC Cards Supporting CardBus SCAK/SCAJ Series Highly reliable mounting achieved by unique terminal arrangement. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Performance Structure Contact pitch Number of contacts Operating temperature range Voltage proof Insulation resistance(Initial) Contact resistance(Initial) Insertion and removal cycle 1.27mm 68 pins –20℃ to ＋60℃ 250V AC 1minute 1,000MΩ min. 40mΩ max. Office environment：10,000cycles Outside office environment：5,000cycles Features ● ● Applications ● Eject knob can be applied to the left or right side. Pin header (SCAJ) is provided with an adsorption area allowing automatic mounting. For set top boxes, various PCs and AV equipment Typical Specifications Items Applicable media Mounting method Specifications PC cards which confirm to PC card standard Surface mounting type Product Line 2 step ejector Mounting system Standard mount Reverse mount Ejection mechanism:2step Stand-off（mm） Cover With 0 Without Without Shutter Position of knob Left Right Left Right Product No. Standand Reverse SCAK5B7100 SCAK5B7200 SCAK5B7400 SCAK5B7500 SCAK5B7200 SCAK5B7100 SCAK5B7500 SCAK5B7400 Minimum packing unit (pcs.) 180 Pin header Mounting system Standard mount Reverse mount Stand-off（mm） 0 0 Product No. SCAJ1A1600 Minimum packing unit (pcs.) 300 SCAJ1B1500 Notes 1. ※Please place purchase orders in minimum order units. 2. Please contact us for export packing details. 3. The pin headers and the ejectors are supplied as separate parts. When using them, solder a pin header to a printed circuit board, assemble an ejector to the pin header and screw it. 52 Connector for Connection with PC Cards Supporting CardBus SCAK/SCAJ Series Dimensions No. Standard type With cover Link arm travel area 7.4 8 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） 23.3 53.95 46.6 （0.635x67） =42.545 Pitch 0.635 #1 Pad width 0.35 1.7 4.2 1.95 #35 52.6 ＃４ ３ ＃68 4.9 min. 1. 5 2-¿2 1 4.7 33 max. 53.95 Card center 29.6 max. Pin header 4.5 2.1 For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus 6 63.3 74.1 （85.6） Card end position 17.8 2 min. ¿ 3.4 min. 78.2 73.2 max. 69.9 34.1 min. 52.3 61.46 52.3 30.2 min. 2.25 min. 85.6 14 6.7 min. 1 Knob over tra Knob lock position Knob stroke 8 3.4 6.8 4.6 4-GND pad 2.7 From P.C board mounting side to card center 32.5 3.6 Card entrance 4.2 min. 51.5 5 33.9 Knob 5 Knob eject position 34.9 min. 28.6 min. ＃1 ＃34 Recommend P.C board layout (Mounting face side) No part mounting Land area No pattern area ＃35 P.C bord mounting side ＃68 ¿2.4 2.1 min. 2-3.05 15.2 54.56 61.46 1.4 2.25 min. 23.5 min. 4.13 Engagement face 67.43 2.4 5.9 2-2.6 5.8 max. Ejection travel 42.4 6.7 min. .45 0.57 ¿1.2 Reverse type With cover 53.95 Link arm travel area 4.13 2Pitch For Express Card™ 23.3 4.9 min. 0.57 29.6 max. 53.95 33 max. Card center ¿2 Pin header 4.7 46.6 = （0.635x67） 42.545 .4 4.2 1.7 0.635 0.35 7.4 8 5 5 Pad width ＃1 4.5 2.1 For CMOS Camera Module Card end position （85.6） 74.1 63.3 ¿1.2 1.95 23.5 min. 2 min. Engagement face Ejection travel 5.8 max. 52.6 ＃35 30.2 min. 52.3 2.25 min. 61.46 52.3 85.6 4.6 2 2.4 5.9 2-2.6 15.2 Knob stroke 8 14 2-3.05 2.1min. 54.56 61.46 From P.C board mounting side to card center 2.7 1.4 Knob over tra Knob lock position Knob eject position 2.25 min. 51.5 28.6 min. 4.2 min. 34.9 min. 6.7min. 5 32.5 33.9 3.6 Card entrance ＃68 Knob 5 Recommend P.C board layout (Mounting face side) No part mounting No pattern area ＃35 P.C board mounting side ¿2.4 ＃34 ＃1 Land area 6.7 min. 42.4 69.9 73.2 max. 78.2 3.4 6.8 4-GND pad 3.4 min. 34.1 min. 67.43 17.8 ＃34 ＃68 6 ¿1.1 53 Connector for Connection with PC Cards Supporting CardBus Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. When soldering, do not use water soluble flux because this may corrode the product. 3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and layout. 54