SCDE1C0200

Combine Type Connector (for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picture Card™) SCDE Series Push-in push-out eject mechanism applicable to four media types. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure Mounting type Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial） （ Contact resistance （Initial） Connector contacts Detection switch Applicable media Memory StickTM xD-Picture CardTM Surface mounting type Standard mount / Reverse mount Push-push type −10℃ to ＋60℃ 500V AC 1minute SCDE1） 250V AC 1minute（SCDE2） （ , 1,000MΩ min. 100mΩ max. SCDE1） 150mΩ max. SCDE2） （ , （ 500mΩ max. SCDE1） 600mΩ max. SCDE2） （ , （ 10,000cycles SD Memory Card, xD-Picture CardTM） （ 12,000cycles Memory StickTM） （ Features ● Applications ● ● ● Applicable to four memory card standards - SD Memory Card, MultiMediaCardTM, Memory StickTM and xD-Picture CardTM. Push-push ejection mechanism applied in both card types. Same insertion and ejection position applied for both cards. ● ● ● For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players Typical Specifications Items Specifications SD Memory Card MultiMediaCard™ Performance Insertion and removal cycle Product Line Media ejection structure Mounting system Standard mount Push-push type Reverse mount 0 Tray SCDE2B0100 2 Stand-off mm） Packing system （ Product No. SCDE1C0200 Drawing No. 1 40 Combine Type Connector(for SD Memory Card, MultiMediaCard™, Memory Stick™, xD-Picure Card™) SCDE Series Dimensions No. Style Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） 4.5 MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 SD No.4 SD No.5 SD No.6 SD No.7 SD No.8 48.1 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 SD No.3 SD No.2 SD No.1 SD No.9 33.25 29.7 13.95 13.025 10.475 10.475 8.65 19-1.1 27(P1.5×18) For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type CD switch (for SD) 21 (1.2)Over travel 16.7 14.9 ø2 Locked position (5) (5.5) Eject position WP switch (for SD) xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 xD No.!3 xD No.!2 xD No.!1 xD No.!0 Ground xD No.1 xD No.0 (CD for xD) xD No.2 xD No.3 xD No.4 xD No.5 xD No.6 xD No.7 xD No.8 xD No.9 15(P1×15) 19-0.6 9.2 9.3 10 6.65 7.5 8.35 Card center Connector center 31 27 Land No pattern area ø1.5 6.25 15.5 Common (for SD) 19.375 17.175 16.05 14.55 4.95 3.15 0.9 1 27 1.55 1.4 13.7 ø1.55 (hole) 28.75 26.6 25.5 (hole) For Compact Flash™ For PC cards supporting CardBus 5.7 7.255 6.275 1.5 6.65 2.2 5.3 0.95 MS No.6 MS No.7 MS No.8 MS No.9 MS No.!0 0.2 4.75 4.6 15.85 0.975 23.6 15.85 SD No.4 SD No.3 (Dummy) SD No.2 (Dummy) SD No.1 SD No.9 MS No.5 MS No.4 MS No.3 MS No.2 MS No.1 SD No.5 (Dummy) SD No.6 (Dummy) SD No.7 SD No.8 Common(for SD) CD Switch(for SD) ø1 .7 ho 0.95 For Express Card™ For CMOS Camera Module le 0.65 8.475 1.5 14 7.525 14 2.8 ø1 .5h ole (1.2) Over travel 22 39.25 36.25 30.175 1. 1 43.95 47.7 0.75 21.2 0.65 0.95 Lock Position 2 4.9 5.1 GND xD No.1 xD No.0 xD No.2 xD No.3 xD No.4 xD No.5 xD No.6 xD No.7 xD No.8 xD No.9 (GND for xD) On the card entry side, the metal exposed part is connected to terminal No.9 of the xD card. (5.5) WP Switch (for SD) xD No.!8 xD No.!7 xD No.!6 xD No.!5 xD No.!4 xD No.!3 xD No.!2 xD No.!1 xD No.!0 (5) Eject Position 9.7 1.775 12 4.5 14.1 2.25 6 14.1 2.25 Connector center xD card center 30.5 No pattern area 2-φ1.3 28 MS, SD card center No pattern exposure area 0.65 ø3 .5 41 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50