SCDG

Combine Type Connector (for SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™, xD-Picture Card™) SCDG Series New generation 5-in-1 for MultiMediaCard Plus™ For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure xD-Picture Card™ NEW Features ● Applications ● ● Applicable to four memory card standards - SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™ and xD-Picture Card™. Push-push ejection mechanism applied in both card types. ● ● ● For desktop PCs, notebook PCs, various personal digital assistants, digital still cameras, digital camcorders, digital photo frames, facsimile machines and printers. For home audio equipment (TVs and set top boxes) For audio systems For headphone players Typical Specifications Items Specifications SD Memory Card MultiMediaCardTM Applicable media MultiMediaCard PlusTM Memory Stick™ Mounting type Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial） （ Contact resistance （Initial） Connector contacts Detection switch Surface mounting type Standard mount / Reverse mount Push-push type −10℃ to ＋60℃ 250V AC 1minute 1,000MΩ min. 150mΩ max. 500mΩ max. 5,000cycles Performance Insertion and removal cycle Product Line Media ejection structure Mounting system Standard mount Push-push type Reverse mount 0 Taping SCDG2A0101 2 Stand-off mm） Packing system （ Product No. SCDG1A0101 Drawing No. 1 42 Combine Type Connector(for SD Memory Card, MultiMediaCard™, MultiMediaCard Plus™, Memory Stick™, xD-Picure Card™) SCDG Series Dimensions No. 31.6 30.6 29.6 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） （Pitch） 0.8 13.75 8.15 6.35 13.75 8.95 7.15 NO.8 NO.7 1.5 Pitch） （ 0.8 Pitch） （ 0.3 0.8 NO.1 NO.!7 NO.!8 NO.@5 6.45 4.65 0.95 0.8 Pitch） （ 3.85 8-2 8-0.5 Y 26.55 21.75 19.95 （Pitch） For SD Memory Card 0.8 Pitch） （ 7-0.5 7-2 10-2.2 3.85 0.3 0.3 1 .5 For microSD™ Card X 2-¿1.25 36.85 2.5 φ1.4 Hole 10-0.7 35.3 33.3 32.7 27.2 min. 19.4 max. 17.4 min. 4.1 max. 31.7 1.6 4-3.5 26.1 For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ 2.5 2.3 7.2 1.5 0.36 1 Pitch） （ 10.3 8.7 （5） （17.7） 1 Lock position （SD,MMC,xD） Eject position （SD,MMC,xD） （MS） 11 4.8 23.8 NO.@6 Height of xD, MMC NO.$5 Lock position 0.9 max. 22.2 min. 3 max. 22.4 min. （Pitch） 1 2.5 3.5 （5） 6.15） （ 1.4 4-2.2 φ1.8 Hole Eject position （MS） Height of MS Height of SD 21.5 23.8 29.1 19-0.7 Connector center 4.8 Coplanarity 0.15 max. Land area No pattern area （0.15） （1.55） Number 1 2 3 4 5 6 7 8 9 10 11 12 FOR SD SD MMC Plus SD MMC Plus SD SD MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick Pin assign #9 #1 #10 #2 #11 #3 #4 #10 #9 #8 #7 #6 Number 13 14 15 16 17 18 19 20 21 22 23 24 FOR MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick SD MMC Plus SD MMC Plus SD SD SD Pin assign #5 #4 #3 #2 #1 #5 #12 #6 #13 #7 #8 SW.COM Number 25 26 27 28 29 30 31 32 33 34 35 36 （2.05） FOR SD XD XD XD XD XD XD XD XD XD XD XD Pin assign SW.CD #1 #0(CD) #2 #3 #4 #5 #6 #7 #8 #9 #10 Number 37 38 39 40 41 42 43 44 45 FOR XD XD XD XD XD XD XD XD SD Pin assign #11 #12 #13 #14 #15 #16 #17 #18 SW.WP 4.8 0.8 Pitch） （ 7-0.3 31.6 30.8 14.9 14.9 13.75 13.75 7.15 5.6 13.5 1.5 Pitch） （ 10- 0.3 31 Y No.!8 No.@5 0.8 Pitch） （ 7-0.3 0.7 No.$5 No.!7 No.8 No.7 No.1 26.55 21.75 19.95 1.5 Pitch） （ 0.8 Pitch） （ 7-0.5 For CMOS Camera Module 6.45 0.95 0.8 Pitch） （ 8-0.5 4.65 8-2.2 ¿1.4 Hole 3.5 X 10-0.7 2-¿1.25 2-2 2-2.5 0.8 Pitch） （ 7.2 35.8 7-2.2 2-3.5 10-1.8 3.5 0.8 Pitch） （ 10-0.3 37.15 32.35 34 31.7 31 24.5 0.8 Pitch） （ 10-0.5 （5.45） 11.35 2.3 7.2 2.3 （17） （5） 2 Lockposition SD,MMC,xD） （ Ejectposition SD,MMC,xD） （ Lock position MS） （ Eject position MS） （ No.#6 23.8 No.@6 No.#5 ¿1.8 Hole （5） Height Of MMC Connecter center 0.25 （1.1） （1.2） （1.9） Number 1 2 3 4 5 6 7 8 9 10 11 12 FOR SD SD MMC Plus SD MMC Plus SD SD MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick 5.1 Pin assign #9 #1 #10 #2 #11 #3 #4 #10 #9 #8 #7 #6 Number 13 14 15 16 17 18 19 20 21 22 23 24 FOR MemoryStick MemoryStick MemoryStick MemoryStick MemoryStick SD MMC Plus SD MMC Plus SD SD SD Pin assign #5 #4 #3 #2 #1 #5 #12 #6 #13 #7 #8 SW.COM Number 25 26 27 28 29 30 31 32 33 34 35 36 FOR SD XD XD XD XD XD XD XD XD XD XD XD （1.9） Height Of MS Height Of SD Coplanarity 0.15 max. Land area No pattern area Height Of xD Pin assign SW.CD #1 #0(CD) #2 #3 #4 #5 #6 #7 #8 #9 #10 Number 37 38 39 40 41 42 43 44 45 FOR XD XD XD XD XD XD XD XD SD Pin assign #11 #12 #13 #14 #15 #16 #17 #18 SW.WP 10-0.5 0.8 Pitch） （ 31.6 3 11 1.4+0.1 23.8 0 26.6 28.9 1.8 1 3.3 2-2.8 22.5 24.5 31.7 29.1 27.05 1.45 2.05 27.65 34 1.6 43 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50