SCEC1B0100

Connector for Memory StickTM SCEC Series ESD (electro-static discharge) protection model whose robust structure achieves high reliability. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Features ● Applications ● ● ● ● Improved operability from long ejection stroke (10mm) and clear click feel. 4 solder lug terminals are provided in the plate for secure mounting onto the PC board. Allows setting of media locking mechanism. Reflow solderable. ● ● For compact audio equipment, personal digital assistants, desktop PCs and notebook PCs For home audio equipment (TVs, set top boxes and recorders) For digital camcorders, digital still cameras, and headphone players Typical Specifications Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle Standard mount Push-push type −20℃ to ＋60℃ 500V AC 1minute 1,000MΩ min. 40mΩ max. 12,000cycles Specifications Memory StickTM Surface mounting type Product Line Media ejection structure Push-push type Mounting system Standard mount Features Stand-off （mm） 0 Packing system Tray Product No. With boss standard mouth SCEC1B0100 36 Connector for Memory Stick™ SCEC Series Dimensions Style With boss standard mouth 27.4 10.2 (5.525) 9-1.5 10-0.5 4 Frame terminals Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） Center of #1-Pad (11.675) 3.7 2-2.1 2-0.9 0.45 Pad 2.4 Pitch 9-1.5 Pad 10-0.9 Pad 8.6 2.4 9.3 17.5 15 Pad 2.4 (※)2.5 min. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module #1 #10 Media full length(50) 40.9 24 24 (53.85) 2-3.2 2-3.2 (※)37.2 max. 2-ø 1.6 ho les 17.5 29.85 Over stroke (12.95) (1.2) 6.6 1.5 22.5 (10) Media outline Card center (11.975) Media eject stroke Locked position Mounting datum plane (※Dimensions) no parts mounting area Media outline (※)17.25 min. (※)17.7 min. (※)10.7 min. (※)18 min. Card center 1.95 Media width for media insertion Opening groove taper Opening groove taper 21.65 0.8 1 Full height 4.1 (※)6.2 min. Guide bosses 2-0.9 C 0. 3 Mounting datum plane (※)39.7 min. 32.6 Pad 4 Pad 4 6.6 37 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50