Connector for SIM Card 8pins
SCGC Series
Small size surface mounting contributes to improved flexibility in set design.
For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM
NEW
Features
● ●
Applications
●
Thin type 1.55mm push-push type. Equipped with card detection switch.
PCs and personal digital assistants
For Memory Stick Micro™ For Memory Stick™ Combine Type
Typical Specifications
Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial) ( Contact resistance (Initial) Connector contacts Detection switch
Standard mount Push-push type −25℃ to +70℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 500mΩ max. 5,000cycles
Specifications
SIM Card 8pins Surface mounting type
For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module
Performance
Insertion and removal cycle
Product Line
Media ejection structure
Push-push type
Mounting style
Stand-off (mm)
0
Packing system
Product No.
Standard mount
Taping
SCGC1B0101
27
Connector for SIM Card 8pins SCGC Series
Dimensions
Style
Unit:mm
PC board mounting hole dimensions (Viewed from the mounting face side)
For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module
C7 C8 C3 C4 C8 C7 C3 C4 C6 C5 C2 C1 C5 C6 C2 C1 2-2 2.4 26.77 Card detect switch Common 2-0.7 0.18 3.65 8.5 0.17 3.59 4-4 10.35 9.045 3.65 1.3 10.35 9.045 8.5 1.3
11.47
11.47
3.59
4.6 0.86
21.22 25.77
25.77 21.22
3.455
6.045 26.77
Card lock(1.3) Over travel(0.3)
3-0.8 Pitch
8-0.3
P= 0.8 0.6
13.77 9.2 :No pattern area :Land area :No parts area
9.2
2.4
Eject stroke(3.5)
(1.23) 18.44 19.94 Card center Connector center
28
1.55
2.6
4.6
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference) (
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K)or CC T) ( (. 3. Temperature profile Surface of products) ( .
For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type
240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.)
Room temperature
For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
50
很抱歉,暂时无法提供与“SCGC”相匹配的价格&库存,您可以联系我们找货
免费人工找货