SCHA

Connector for microSD™ Card (Push-push Type) SCHA Series Compact low-profile type most suitable for mobile phones. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance （Initial） Contact resistance （Initial） Connector contacts Detection switch Standard mount/Reverse mount Push-push type −20℃ to ＋70℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 500mΩ max. 5,000cycles Features ● ● Applications ● Improved operability from a clear click feel. Good operational feel. For mobile phones, personal digital assistants, digital still cameras, compact audio equipment. Typical Specifications Items Applicable media Mounting type Specifications microSD™ Card Surface mounting type Performance Insertion and removal cycle Product Line Media ejection structure Mounting system Features Without switch Standard mount Push-push type With switch Reverse mount SCHA2B0300 3 0 Taping SCHA1B0100 2 Stand-off （mm） Packing system Product No. SCHA1A0101 Drawing No. 1 16 Connector for microSD™ Card (Push-push Type) SCHA Series Dimensions Standard mount No. Without switch 14 1.3 1.9 9.4 6.85 6.1 5.7 1.8 1.8 14 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 12.9 Card center No parts area Land area 1.4 0.3 0.7 2.6 （16.7）Card insertion / （1） /Over travel 14.2 14.8 15.2 12.6 9.85 7.4 7.2 2.9 13.6 0.8 1.5 1.9 P=1.1 7.7 1 7.7 （3） /Eject travel 1.9 Card center 1.45 0.3 1.24 Card center Connector center 0.3 P=1.1 0.3 1.4 1.15 For Compact Flash™ For PC cards supporting CardBus For Express Card™ 0.8 No pattern area With switch 14 Card detect switch 1.3 1.9 0.15 1.20 14 13.85 12.55 1.3 0.3 1.4 0.7 4.6 9.2 9.4 （17.8） Card insertion （1） Over travel 15.50 16 6.1 0.3 1.5 0.8 0.3 P=1.1 2 0.3 2.9 1.3 1.24 7.7 (5.7) 7 0.2 max. 13 1.3 （2.8） Eject travel 0.3 Card center Connector center Card center Connector center Land area No pattern area No parts area 1.5 11.25 12.75 14.2 16 1.5 0.3 9.4 1.4 Common （switch） For CMOS Camera Module 17 Connector for microSD™ Card (Push-push Type) SCHA Series Dimensions Reverse mount No. For SD Memory Card For microSD™ Card For SIM Card 8pins 13 12.2 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） With switch 0.85 14 3.81 0.85 Card detect switch 1.9 9.16 7.96 7.46 5.06 3.26 7.24 6.04 5.54 5.34 1.8 0.95 Common 0.4 2.4 1.6 0.8 For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 3 （ 2） 1.9 4-1.2 10-0.3 3.2 2.4 1.6 0.8 10-0.6 Connector center Card center Land area No parts area 1.8 0.96 3.2 13 12.2 （1） Over travel Eject travel 2.85） （ Connector center Card center （0.35） 18 1.8 0.96 1.9 2.55 13.55 Pin1 Dummy Pin2 Pin3 Pin4 Pin8 Dummy Pin7 Pin6 Pin5 1.8 16.1 1 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50