SCHD

Connector for microSD™ Card (Header Type) SCHD Series Low-profile with 1.6mm thickness provides improved flexibility in set design. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● Applications ● A comfortable click feel at insertion. Card-guide structure for smoother card insertion. For mobile phones and personal digital assistants For Memory Stick Micro™ For Memory Stick™ Typical Specifications Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle Standard mount Manual insertion/removal −20℃ to ＋70℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 10,000cycles Specifications microSD™ Card Surface mounting type Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Product Line Media ejection structure Manual insertion/removal Mounting system Standard mount Stand-off （mm） 0 Packing system Taping Product No. SCHD1A0101 23 Connector for microSD™ Card (Header Type) SCHD Series Dimensions Style Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） For SD Memory Card For microSD™ Card 3.65 12.5 7.6 1.9 6.15 7.6 6.15 2.65 8.6 10.1 9.80 13.20 11.95 For SIM Card 8pins （15） 6.55 For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 4-1.4 0.1 1.6 Pitch 7-1.1 8-0.3 3.2 8-0.8 Pitch 7-1.1 3.2 13.1 Land area No pattern area No parts area 11.1 14.6 24 2 10.95 2 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50