Combine Type Connector (for SIM Card 8pins, microSDTM Card)
SCHG Series
Double-deck for SIM Card (8pins) combine type.
For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type
NEW
Features
●
Applications
●
Two-slot, double-deck structure enables two typs cards, the SIM Card (8pins) and microSD™ Card, to be separately inserted.
For mobile phones, various personal digital assistants, notebook PCs.
Typical Specifications
For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure Items Specifications
SIM Card 8pins
Applicable media
microSDTM Card
Mounting type Mounting style Media ejection structure Operating temperature range Voltage proof Insulation resistance Initial) ( Contact resistance (Initial) Connector contacts Detection switch
Surface mounting type Standard mount Manual insertion/removal/Push-push type −25℃ to +70℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 500mΩ max. 5,000cycles SIM Card 8pins) ( 10,000cycles microSDTM Card) (
Performance
Insertion and removal cycle
Product Line
Media ejection structure
Push-push type
Mounting system
Standard mount
Stand-off mm) (
0
Packing system
Taping
Product No.
SCHG1B0100
44
Combine Type Connector (for SIM Card 8pins, microSD™ Card) SCHG Series
Dimensions
Style
Unit:mm
6.85 0.8
For SD Memory Card For microSD™ Card
No.!4 No.!1 No.!5 No.!2 No.!6 No.!0 No.9 No.!8 No.!7 No.8 No.7 No.6 No.5 No.4 No.3 No.2 No.1 No.!3
(3.5)EJECT TRAVEL (1)OVER TRAVEL (1.4)
9.095 8.995 6.085 5.085 3.095 0.555 9-0.4
16.2
5.195 4.045 2.895 1.745 0.595 microSDª CARD (0.1)
0.8
0.77
CONNECTOR CENTER microSDª CARD CENTER
For SIM Card 8pins For W-SIM
C5C6C7 C8
4.245
17.45 16.62 8.8 P=1.1
1.4
For Memory Stick Micro™ For Memory Stick™ Combine Type
C1C2C3 C4
(7.9)
1.4 9-0.4
CONNECTOR CENTER 3
SIM CARD SIM CARD CENTER
C5C6C7 C8 0.5 7
C1C2C3 C4
CONNECTOR TERMINAL No. No.1 No.2 No.3 No.4 No.5 No.6 No.7 No.8
PIN No. microSD No.1 microSD No.2 microSD No.3 microSD No.4 microSD No.5 microSD No.6 microSD No.7 microSD No.8
PIN ASSIGMENTS CONNECTOR PIN LAYOUT TERMINAL No. DAT 2 No.9 CD/DAT3 No.10 CMD No.11 VDD No.12 CLK No.13 VSS No.14 DAT0 No.15 DAT1 No.16
PIN No. SIM No.C1 SIM No.C2 SIM No.C3 SIM No.C4 SIM No.C5 SIM No.C6 SIM No.C7 SIM No.C8
PIN LAYOUT VCC RST CLK RESERVED GND VPP I/O RESERVED
For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module
1
PC board mounting hole dimensions (Viewed from the mounting face side)
18.045 0.8 16.9 8.8 4.545 P=1.1 1.05 9- 0.8 0.52 1.8
3.095 0.555 9- 0.8
9.295 8.175 8 6.085 5.085
7.75 6.85 5.195 4.045 2.895 1.745 0.595 1.1 1.8 0.55 2-R
2-R 0.2
Hole Land 0.8 1.5
1.8
7
No pattern area Land area
2-0.4 2-1.1
17.345
0.35
45
Small Memory Card Connectors
Soldering Conditions
Example of Reflow Soldering Condition Reference) (
1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K)or CC T) ( (. 3. Temperature profile Surface of products) ( .
For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type
240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.)
Room temperature
For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module
Cautions for using this product
1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice.
50
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