SCKA2A0100

Connector for CMOS Camera Module SCKA Series Compact size achieved from thin body-forming molding. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● ● Applications ● ● ● ● Camera module detaching function. Locking mechanism to prevent the camera module from falling. Shield cover included. Vibration resistant contact structure. Provided with an adsorption area allowing automatic mounting. For camera-equipped mobile phones For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ Typical Specifications Items Dimensions Structure 6 6mm module type Mounting system Operating temperature range Voltage proof Performance Insulation resistance（Initial） Contact resistance （Initial） Insertion and removal cycles Specifications 7×7×3.1mm Surface mounting type –25℃ to ＋85℃ 100V AC 1minute 1,000MΩ min. 100mΩ max. 10cycles For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Product Line Items Product Connector 6×6mm module type Cover 5,000 ― JSCKA0002A 2 Minimum packing unit pcs.） （ 2,000 Packing system Taping Product No. SCKA2A0100 Drawing No. 1 61 Connector for CMOS Camera Module SCKA Series Dimensions 6G6mm module type No. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ 1 Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 0.45 2.6 0.325 0.65 0.42 2.35 6.15 6.98 Unit:mm Style Connector 1.75 1.85 0.8 1.8 6.98 6.15 3.1 0.325 Pitch 0.65 2.6 0.2 PC board mounting hole dimensions Viewed from the mounting face side） （ 6.8 1.4 6.7 0.7 Style Cover 7.4 Connector/Cover combination diagram Reference） （ 1.15 7.4 7.4 2 7.4 CMOS camera module 3.45 62 (3.85) Connector for CMOS Camera Module Soldering Conditions Example of Reflow Soldering Condition（Reference） 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K） CC T）at soldering portion. （ or （ 3. Temperature profile For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ 250℃(max.) Temperature (˚C ) 220℃ 200 190%10℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 55 sec.(max.) Room temperature For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. When soldering, do not use water soluble flux because this may corrode the product. 3. Regarding the setting of reflow conditions, please confirm them with the actual mass production conditions. 4. As PC board warping may alter characteristics, please take this into consideration when designing pattern and layout. For Express Card™ For CMOS Camera Module 63