SCNA

Connector for Memory Stick Micro™ SCNA Series Minimum mounting area for compact devices. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance （Initial） Contact resistance （Initial） Insertion and removal cycle Standard mount Push-push type −25℃ to ＋60℃ 250V AC 1minute 1,000MΩ min. 40mΩ max. 12,000cycles Features ● Applications ● Minimized mounting area prevents negation of size advantage of the card. For mobile phones, personal digital assistants, digital still cameras, compact audio equipment Typical Specifications Items Applicable media Mounting type Specifications Memory Stick Micro™ Surface mounting type Product Line Media ejection structure Push-push type Mounting system Standard mount Stand-off mm） （ 0 Packing system Taping Product No. SCNA1A0300 34 Connector for Memory Stick Micro™ SCNA Series Dimensions Style Unit:mm PC board mounting hole dimensions （Viewed from the mounting face side） 14.9 2.01 1.8 0.8 4.4 2.8 0.41 0.75 1.1 0.3 1.3 2.9 15.5 14.9 7.1 6.57 4.4 2.8 4-1.2 9.15 7.8 5.95 3.85 1.4 7.92 For SD Memory Card 7.1 2.01 0.41 2.7 For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ 0.9 12.05 13.95 1 14.7 13.2 11-0.6 Card eject travel (4) Over travel (1) 1 0.75 0.3 P0.9 3.12 0.9G10=9 1 0.75 Card center Connector center 0.33 P0.9 3.07 3.12 0.9G10=9 5.92 4.47 6.57 6.72 6.57 7.62 7.77 7.77 Land area No Pattern area Ground pattern possible area No parts area 7.85 10.45 10.75 12.35 13.9 (16.9) 13.95 15 1 4.7 For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 35 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50