SCZA

Connector for W-SIM SCZA Series High reliability contact structure best fit for portable devices. For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM Features ● Applications ● ● ● ● Improved operability from long ejection stroke (5mm) and clear click feel. Good operational feel. Double contact-point for power and ground reduces risk of temporary power failure. Compact and low-profile suitable for portable devices. For mobile phones, PCs, and personal digital assistants For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Typical Specifications Items Applicable media Mounting type Structure Mounting style Media ejection structure Operating temperature range Voltage proof Performance Insulation resistance Initial） （ Contact resistance Initial） （ Insertion and removal cycle Standard mount Push-push type, Manual insertion/removal −20℃ to ＋60℃ 500V AC 1minute 1,000MΩ min. 100mΩ max. 10,000cycles Specifications W-SIM Surface mounting type Product Line Media ejection structure Mounting system Features Without boss L type With boss L type Push-push type Without boss 0.6mm type Standard mount With boss 0.6mm type 0 Without boss 1.2mm type With boss 1.2mm type Manual insertion/removal With boss L type Without boss 0.6mm type Tray Stand-off （mm） Packing system Product No. SCZA1A0100 SCZA1A0200 SCZA1A0300 SCZA1A0400 SCZA1A0500 SCZA1A0600 SCZA2A0100 SCZA2A0200 Drawing No. 1 2 3 4 5 6 7 8 29 Connector for W-SIM SCZA Series Dimensions No. Push-push type Without boss L type For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Over travel (1.2) (44.6) 0.6 Center of gravity (vacuum point) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） 29.5 (1) 15.95 min. 14.25 max. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 29.2 15.95 min. 14.25 max. 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 (11) 30.2 1.45 9.3 min. 6.7 max. 1 2.1 min. 2.4 13 min. 10.4 min. 15.05 min. 15.05 min. 14.25 max. 15.95 min. 14.25 max. 15.95 min. No parts area Land area No pattern area 15.95 min. 14.25 max. 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 4-2.6 min. 2.1 min. 2.4 13 min. 13.65 10.4 min. 4-2 Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Eject travel(5) 1.3 31.3 Card center Connector center Connector center Push-push type With boss L type 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 4.65 29.5 0.6 (1) Center of gravity (Vacuum point) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 C 0.1 30.2 0.6 23 1.45 15.95 min. 14.25 max. 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 29.2 5.1 V1 (44.6) (11) 4.2 4-2 V1 Eject travel(5) 15.05 min. 13.65 Over travel (1.20) 4- 2.6 min. Connector center 1.3 31.3 .1 15.05 min. 14.25 max. 15.95 min. 14.25 max. 15.95 min. Card center Connector center 4.65 No Part Area Land No Pattern Area 30 30.1 2 23 9.3 min. 6.7 max. 30.1 V1. 4 Connector for W-SIM SCZA Series Dimensions No. Push-push type Without boss 0.6mm type 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） For SD Memory Card 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 9.3 min. 6.7 min. 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 0.6 1.45 29.5 (1) Center of gravity (vacuum point) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ 30.2 (11) ALPS 27.7 4-0.5 4-1.1 Hole 4-0.6 3 13 min. 15.05 min. 14.675 10.4 min. 15.05 min. Eject travel (5) 4-R0 Over travel (1.20) R0 .2 .5 29.35 4-1.9 Connector center 4- 4-2.5 2.1 min. 2.4 27.7 (44.6) 4-1.4 1.3 Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ Card center Connector center 4.65 No No Part Area Part Area Land Land No No Pattern Area Pattern Area 29.2 Push-push type With boss 0.6mm type 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 For CMOS Camera Module 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 9.3 min. 6.7 max. Center of gravity (vacuum point) (1) 1.45 0.6 29.5 φ1 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 4.2 (11) ALPS C0.1 0.6 27.7 23 (44.6) 4-1.4 4 4-0.6 Eject travel (5) 13.65 Hole 13 min. 15.05 min. 14.675 0.5 4-R .2 10.4 min. 15.05 min. 13.65 R0 φ 1. 1 Over travel (1.20) 29.35 Connector center 1.3 Card center Connector center 4.65 No Part Area Land No Pattern Area 29.2 4-1.9 4- 23 27.7 4-0.5 4-1.1 4-2.5 2.1 min. 2.4 30.2 5.1 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 φ1 .4 31 Connector for W-SIM SCZA Series Dimensions No. Push-push type Without boss 1.2mm type For SD Memory Card For microSD™ Card For SIM Card 8pins 30.2 29.5 0.6 (1) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 Center of gravity (vacuum point) 1.45 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 min. 9.3 min. 6.7 min. 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 (11) 4-1.4 For Memory Stick Micro™ For Memory Stick™ Combine Type For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module 4-1.2 Holes 13 min. 15.05 min. 14.675 10.4 min. 15.05 min. Eject travel (5) Over travel (1.20) Connector center 4R0 .2 4-R0 .5 4-1.9 29.35 1.3 Card center Connector center 4.65 No Part Area Land No Pattern Area 29.2 Push-push type With boss 1.2mm type Center of gravity (vacuum point) 0.6 1.45 φ1 29.5 (1) 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 18-0.4 4.2 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 (44.6) 27.7 9.3 min. 6.7 min. 30.2 23 4-0.5 4-1.1 6 4-1.2 Eject travel (5) 13.65 Hole 13min. 15.05min. 14.675 10.4min. 15.05min. Over travel (1.20) 4R0 .2 29.35 Card center Connector center 29.2 32 4.65 No Part Area Land No Pattern Area 4-1.9 φ 1.3 1. 1 Connector center 4-R0 .5 4-2.5 2.1min. 2.4 23 27.7 4-1.4 5.1 C 0.1 0.6 11.775 10.625 9.475 8.325 7.175 6.025 4.875 3.725 2.2 0.4 18-0.8 9.175 8.025 6.875 5.725 4.575 3.425 2.275 1.125 1.1 (11) 27.7 5 4-0.5 4-1.1 4-2.5 2.1 min. 2.4 For W-SIM (44.6) 27.7 Connector for W-SIM SCZA Series Dimensions No. Manual insertion/removal With boss L type 20.95 18.65 16.35 14.05 11.75 9.45 Unit:mm Style PC board mounting hole dimensions （Viewed from the mounting face side） 0.60 27.20 7.15 4.85 1.80 18- 0.40 2-2.40 2.1min. 1.1 7 (43.40) Connector center 2-3min. 4.10max. 5.55 24.80 1.1 2.5min. 1 2-φ 6.70 5.55 7.95 4.85 1.80 18- 0.80 30.60min. 26.30max. 24.80 20.95 18.65 16.35 14.05 11.75 9.45 7.15 φ For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type φ 1. 4 23.40min. 27.80min. Card & Connector center 4.65 0.50 :No Part Area :Land :No Pattern Area 30 For Compact Flash™ For PC cards supporting CardBus Manual insertion/removal Without boss 0.6mm type 20.95 18.65 16.35 14.05 11.75 9.45 For Express Card™ For CMOS Camera Module 0.60 27.20 7.15 4.85 1.80 18- 0.40 26.55 20.95 18.65 16.35 14.05 11.75 9.45 7.15 4.85 1.80 18- 0.80 7.95 6.70 8.05 min. 7.65 min. 5.55 max. 1.45 min. 2- 1.40 2- 0.60 1.10 0.50 1.55 max. (43.40) 8 Connector center 23.40 min. 27.80 min. Card & Connector center 4.65 :No Part Area :Land :No Pattern Area 26.90 1.90 2.50 0 4-R 0.2 33 Small Memory Card Connectors Soldering Conditions Example of Reflow Soldering Condition Reference） （ 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple 0.1 to 0.2φ CA K）or CC T） （ （. 3. Temperature profile Surface of products） （ . For SD Memory Card For microSD™ Card For SIM Card 8pins For W-SIM For Memory Stick Micro™ For Memory Stick™ Combine Type 240℃(max.) Temperature (˚C ) 230℃(min.) 200 180℃ 150℃ 100 Time (s) Pre-heating 90±30 sec. Heating time sec. 10 sec.(max.) Room temperature For Compact Flash™ For PC cards supporting CardBus For Express Card™ For CMOS Camera Module Cautions for using this product 1. When soldering terminals, there is a danger that load placed on the terminals may cause rattle, deformation or electrical degradation to occur depending on the conditions. Caution is therefore required. 2. Avoid use of water-soluble soldering flux, since it may corrode the product. 3. Check and conform to reflow soldering requirements under actual mass production conditions. 4. PC board warping may alter the characteristics. Please take this into consideration when designing patterns and layout. 5. The card specifications are provided by the above manufactures. Products by other manufactures may not be compliant with these specifications and are subject to change without prior notice. 50