SPEF220200

SPEF 1.5mm-travel Vertical Type Surface mountable lead-free soldering push switch Detector ■ Typical Specifications Items Specifications Slide Rating（max.）（ / min.） （Resistive load） 1A 14.5V DC / 50μA 3V DC Contact resistance （Initial / After operating life） 100mΩ max. /1Ω max. Operating force 3N, 5N Push Operating life（With load） 30,000 cycles（1A 14.5V DC） Poles-position 1-pole, 2-position Rotary Product Line Power Changeover timing Total travel Operating （mm） force Travel （mm） Mounting method 3N Dual-in-line Package Type 1.5 Latching 5N 2.7 Non shorting PC board 3N − Alternate 5N Minimum order unit（pcs.） Product No. Drawing No. 1,320 SPEF210101 1 1,050 4,200 SPEF110100 2 Reflow 660 1,320 SPEF210200 1 Dip 1,050 4,200 SPEF110200 2 Reflow 660 1,320 SPEF220100 1 Dip 1,050 4,200 SPEF120100 2 Reflow 660 1,320 SPEF220200 1 Dip 1,050 4,200 SPEF120200 2 Operating Terminal type Japan Export Reflow 660 Dip Horizontal Type Packing Specifications Vertical Type Taping Unit:mm Product No. SPEF210101 SPEF210200 SPEF220100 SPEF220200 Number of packages（pcs.） 1 reel 165 1 case / Japan 1 case / export packing 660 Tape width Export package （mm） measurements（mm） 1,320 32 Reel size 403×403×360 ø380 Tray Product No. SPEF110100 SPEF110200 SPEF120100 SPEF120200 Number of packages（pcs.） 1 case / Japan 1 case / export packing Export package measurements（mm） 1,050 4,200 540×360×230 33.5 Refer to P.130 for soldering conditions. 124 SPEF／1.5mm-travel Vertical Type Unit:mm No. PC board mounting hole dimensions （Viewed from the direction A） Style Slide Reflow soldering type Detector Dimensions Terminal No.1 2 1.2 Terminal No.2 Rotary 2.1 4.6 Push 2.1 Terminal No. C 1.2 A 1 11.3 9 3.5 2.5 Full stroke position （ ） Dual-in-line Package Type 6.9 14.6 ） 11.86 13.1 （ 2.5 2.5 Lock position Power 13.6 9.4 3.5 2.5 6.7 1.3 ø0.9 ø1.4 6 Terminal No. C Horizontal Type Dip soldering type Terminal No.1 Terminal No.2 Vertical Type A 9.4 3.5 2.5 （ 6 9.8 12.2 PC board mounting face （ ） ） ） 2.5 2.5 （ 11.86 13.1 14.6 3.2 3.5 ø0.9 1.3 ø1.4 （ Lock position 6.9 2 9 3.5 2.5 Full stroke position ） 1 1 5.7 6.7 1.2 Circuit Diagram（Viewed from Direction A） 1 C 2 125 Push Switches List of Varieties Vertical Detector Series SPEF SPED2 SPED3 SPED4 SPED5 Photo Slide W 9.4 D 9 16.8 H 6.9 18.3 13.2 13.17 14.3 Travel（mm） 1.5 — — — — Total travel（mm） 2.7 4.5 3.8 Number of poles 1 1 2 1 Dimensions （mm） Push Rotary Power Operating temperature range Automotive use 14 18 −40℃ to ＋85℃ ● ● 13.5 18.2 −40℃ to ＋95℃ ● ● ● ● Dual-in-line Package Type Life cycle Rating（max.） （Resistive load） 1A 14.5V DC Rating（min.） （Resistive load） Durability Horizontal Type Vertical Type Electrical performance Operating life without load 50μA 3V DC — — 2A 14.5V DC — — — — — — — — Operating life with load （at max. rated load） 30,000 cycles 100mΩ max. Initial contact resistance 100mΩ max. Insulation resistance 3MΩ min. 100V DC Voltage proof Terminal strength Mechanical Operating performance Actuator direction strength Pulling direction 3MΩ min. 500V DC 100V AC for 1minute — — — 90N 30N — Cold Environmental performance Dry heat — Wire strength 30N 98N 90N 98N — — — −40℃ 96h 85℃ 96h Damp heat Page — 85℃ 96h (Connector type) 105℃ 192h (Dip type) 105℃ 192h 40℃, 90 to 95%RH  96h 124 126 128 Push Switches Soldering Conditions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 130 Push Switches Cautions・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・・ 131 Note ● Indicates applicability to all products in the series. 110 Push Switches / Soldering Conditions Detector Example of Reflow Soldering Condition 1. Heating method: Double heating method with infrared heater. 2. Temperature measurement: Thermocouple φ 0.1 to 0.2 CA (K) or CC (T) at soldering portion (copper foil surface). A heat resisting tape should be used for fixed measurement. 3. Temperature profile Push Temperature (˚C ) Slide 300 A max. B 200 D E 100 Rotary Room temperature Time (s) Pre-heating F max. C Power Dual-in-line Package Type Series（Reflow type） A（℃） 3s max. B（℃） C（s） D（℃） E（℃） F（s） 260 230 40 180 150 120 SPEJ SPEF SPEH Horizontal Type Notes 1. The condition mentioned above is the temperature on the mounting surface of a PC board. There are cases where the PC board's 　 temperature greatly differs from that of the switch, depending on the PC board's material, size, thickness, etc. The above-stated conditions shall also apply to switch surface temperatures. 2. Soldering conditions differ depending on reflow soldering machines. Prior verification of soldering condition is highly recommended. Vertical Type Reference for Hand Soldering Series Soldering temperature Soldering time SPPJ3, SPPJ2, SPUN, SPUJ, SPPH4, SPPH1 350±10℃ 3+1/0s SPED2, SPED4 350±10℃ 3±0.5s SPEJ 350±10℃ 4s max. SPEF 350±5℃ 3s max. SPEH 350℃ max. 3s max. Reference for Dip Soldering (For PC board terminal types) Series 130 For PC board　端子タイプに適用 Items Dip soldering Preheating temperature Preheating time Soldering temperature Duration of immersion SPPJ3 100℃ max. 60s max. 260±5℃ 5±1s SPUN 100℃ max. 60s max. 260±5℃ 10±1s SPUJ, SPPH4 — 260±5℃ 5±1s SPPJ2, SPPH1, SPED2, SPED4, SPEF — 260±5℃ 10±1s