AS4C512M8D3LB-12BINTR

AS4C512M8D3LB Revision History 4Gb DDR3L AS4C512M8D3LB Revision Rev 1.0 78ball FBGA PACKAGE Details Preliminary datasheet Date Dec. 2017 Alliance Memory Inc. 511 Taylor Way, San Carlos, CA 94070 TEL: (650) 610-6800 FAX: (650) 620-9211 Alliance Memory Inc. reserves the right to change products or specification without notice Confidential - 1 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB HIGH PERFORMANCE 4Gbit DDR3L SDRAM Specifications - - - Density : 4G bits Organization : - 64M words x 8 bits x 8 banks Package : - 78-ball FBGA - Lead-free (RoHS compliant) and Halogen-free Power supply : VDD, VDDQ = 1.35V (1.283V to 1.45V) - Backward compatible to VDD, VDDQ = 1.5V ± 0.075V Data rate : 1600Mbps 1KB page size - Row address: A0 to A15 - Column address: A0 to A9 ( 512Mb x 8) Eight internal banks for concurrent operation Burst lengths (BL) : 8 and 4 with Burst Chop (BC) Burst type (BT) : - Sequential (8, 4 with BC) - Interleave (8, 4 with BC) CAS Latency (CL) : 5, 6, 7, 8, 9, 10, 11, 13 CAS Write Latency (CWL) : 5, 6, 7, 8 ,9 Precharge : auto precharge option for each burst access Driver strength : RZQ/7, RZQ/6 (RZQ = 240 Ω) Refresh : auto-refresh, self-refresh Refresh cycles : - Average refresh period 7.8 μs at -40°C ≤ Tc ≤ +85°C 3.9 μs at +85°C < Tc ≤ +105°C Operating case temperature range - Commercial Tc = 0°C to +95°C - Industrial Tc = -40°C to +95°C - Automotive Tc = -40°C to +105°C Features - - Double-data-rate architecture; two data transfers per clock cycle The high-speed data transfer is realized by the 8 bits prefetch pipelined architecture Bi-directional differential data strobe (DQS and DQS) is transmitted/ received with data for capturing data at the receiver DQS is edge-aligned with data for READs; center-aligned with data for WRITEs Differential clock inputs (CK and CK) DLL aligns DQ and DQS transitions with CK transitions Commands entered on each positive CK edge; data and data mask referenced to both edges of DQS Data mask (DM) for write data Posted CAS by programmable additive latency for better command and data bus efficiency On-Die Termination (ODT) for better signal quality - Synchronous ODT - Dynamic ODT - Asynchronous ODT Multi Purpose Register (MPR) for pre-defined pattern read out ZQ calibration for DQ drive and ODT Programmable Partial Array Self-Refresh (PASR) RESET pin for Power-up sequence and reset function SRT range : Normal/extended Programmable Output driver impedance control Table 1. Ordering Information Product Part No. Org. Temperature Max Clock (MHz) Package AS4C512M8D3LB-12BCN 512M x 8 0°C to 95°C 800 78-ball FBGA AS4C512M8D3LB-12BIN 512M x 8 -40°C to 95°C 800 78-ball FBGA AS4C512M8D3LB-12BAN 512M x 8 -40°C to 105°C 800 78-ball FBGA Table 2. Speed Grade Information Speed Grade Clock Frequency CAS Latency tRCD (ns) tRP (ns) DDR3L-1600 800 MHz 11 13.75 13.75 Confidential - 2 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Pin Configurations 78-ball FBGA (x8 configuration) 1 2 3 7 8 9 VSS VDD NC NU/TDQS VSS VDD A B VSS C VDDQ VSSQ DQ0 DM/TDQS VSSQ VDDQ B D VSSQ DQ2 DQS DQ1 DQ3 VSSQ C DQ6 DQS VDD VSS VSSQ D E VREFDQ VDDQ DQ4 DQ7 DQ5 VDDQ E F NC VSS RAS CK VSS NC F G ODT VDD CAS CK VDD CKE G A 4 5 6 H NC CS WE A10/AP ZQ NC H J VSS BA0 BA2 A15 VREFCA VSS J K VDD A3 A0 A12/BC BA1 VDD K L VSS A5 A2 A1 A4 VSS L M VDD A7 A9 A11 A6 VDD M N VSS RESET A13 A14 A8 VSS N 1 Ball Locations (x8) 2 3 4 5 6 7 8 9 A B Populated ball C Ball not populated E D F G Top view H (See the balls through the package) J K L M N Confidential - 3 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Signal Pin Description Pin Type Function CK, CK Input Clock : CK and CK are differential clock inputs. All address and control input signals are sampled on the crossing of the positive edge of CK and negative edge of CK. Output (read) data is referenced to the crossings of CK and CK CKE Input Clock Enable : CKE HIGH activates, and CKE Low deactivates, internal clock signals and device input buffers and output drivers. Taking CKE Low provides Precharge Power-Down and Self Refresh operation (all banks idle), or Active Power-Down (Row Active in any bank). CKE is asynchronous for self refresh exit. After VREFCA has become stable during the power on and initialization sequence, it must be maintained during all operations (including Self-Refresh). CKE must be maintained high throughout read and write accesses. Input buffers, excluding CK, CK, ODT and CKE are disabled during powerdown. Input buffers, excluding CKE, are disabled during Self -Refresh. CS Input Chip Select : All commands are masked when CS is registered HIGH. CS provides for external Rank selection on systems with multiple Ranks. CS is considered part of the command code. ODT Input On Die Termination : ODT (registered HIGH) enables termination resistance internal to the DDR3L SDRAM. When enabled, ODT is only applied to each DQ, DQS, DQS and DM/TDQS, NU/TDQS (When TDQS is enabled via Mode Register A11=1 in MR1) signal for x8 configurations. The ODT pin will be ignored if the Mode Register (MR1) is programmed to disable ODT. RAS, CAS, WE Input Command Inputs : RAS, CAS and WE (along with CS) define the command being entered. DM (DMU), (DML) Input Input Data Mask : DM is an input mask signal for write data. Input data is masked when DM is sampled HIGH coincident with that input data during a Write access. DM is sampled on both edges of DQS. For x8 device, the function of DM or TDQS/TDQS is enabled by Mode Register A11 setting in MR1. BA0 - BA2 Input Bank Address Inputs : BA0 - BA2 define to which bank an Active, Read, Write or Precharge command is being applied. Bank address also determines which mode register is to be accessed during a MRS cycle. A0 - A15 Input Address Inputs : Provided the row address for Active commands and the column address for Read / Write commands to select one location out of the memory array in the respective bank. (A10/AP and A12/BC have additional functions, see below) The address inputs also provide the op-code during Mode Register Set commands. A10 / AP Input Autoprecharge : A10 is sampled during Read/Write commands to determine whether Autoprecharge should be per-formed to the accessed bank after the Read/Write operation. (HIGH:Autoprecharge; LOW: No Autoprecharge)A10 is sampled during a Precharge command to determine whether the Precharge applies to one bank (A10 LOW) or all banks (A10 HIGH). if only one bank is to be precharged, the bank is selected by bank addresses. A12 / BC Input Burst Chop : A12 is sampled during Read and Write commands to determine if burst chop(on-the-fly) will be performed. (HIGH : no burst chop, LOW : burst chopped). See command truth table for details. RESET Input Active Low Asynchronous Reset : Reset is active when RESET is LOW, and inactive when RESET is HIGH. RESET must be HIGH during normal operation. RESET is a CMOS rail to rail signal with DC high and low at 80% and 20% of VDD, i.e. 1.20V for DC high and 0.30V for DC low. DQ Input/ Output Data Input/ Output : Bi-directional data bus. DQS, DQS Input/ Output Data Strobe : Output with read data, input with write data. Edge-aligned with read data, centered in write data. The data strobe DQS is paired with differential signals DQS, respectively, to provide differential pair signaling to the system during reads and writes. DDR3L SDRAM supports differential data strobe only and does not support single-ended. Confidential - 4 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Pin Type Function TDQS, TDQS Output Termination Data Strobe : TDQS/TDQS is applicable for x8 DRAMs only. When enabled via Mode Register A11=1 in MR1, DRAM will enable the same termination resistance function on TDQS/TDQS that is applied to DQS/DQS. When disabled via mode register A11=0 in MR1, DM/TDQS will provide the data mask function and TDQS is not used. NC No Connect: No internal electrical connection is present. VDDQ Supply DQ power supply: 1.35V, 1.283 - 1.45V operational; compatible to 1.5+/- 0.075V operation. VSSQ Supply DQ Ground VDD Supply Power Supply: 1.35V, 1.283 - 1.45V operational; compatible to 1.5+/- 0.075V operation. VSS Supply Ground VREFDQ Supply Reference Voltage for DQ VREFCA Supply Reference Voltage for CA ZQ Supply Reference Pin for ZQ calibration NOTE : Input only pins ( BA0-BA2, A0-A15, RAS, CAS, WE, CS, CKE, ODT and RESET ) do not supply termination. Confidential - 5 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Simplified State Diagram CKE L Power applied Power on Reset procedure MRS, MPR, write leveling Initialization SRE ZQCL From any state RESET ZQ calibration Self refresh MRS ZQCL/ZQCS SRX REF Idle Refreshing PDE ACT PDX Active powerdown Precharge powerdown Activating PDX CKE L CKE L PDE Bank active WRITE WRITE WRITE AP Writing WRITE READ READ AP READ Reading WRITE AP READ AP WRITE AP Writing READ READ AP PRE, PREA PRE, PREA PRE, PREA Precharging Reading Automatic sequence Command sequence ACT = ACTIVATE MPR = Multipurpose register MRS = Mode register set PDE = Power-down entry PDX = Power-down exit PRE = PRECHARGE Confidential PREA = PRECHARGE ALL READ = RD, RDS4, RDS8 READ AP = RDAP, RDAPS4, RDAPS8 REF = REFRESH RESET = START RESET PROCEDURE SRE = Self refresh entry - 6 of 47 - SRX = Self refresh exit WRITE = WR, WRS4, WRS8 WRITE AP = WRAP, WRAPS4, WRAPS8 ZQCL = ZQ LONG CALIBRATION ZQCS = ZQ SHORT CALIBRATION Rev.1.0. Dec. 2017 AS4C512M8D3LB Basic Functionality Read and write operation to the DDR3L SDRAM are burst oriented, start at a selected location, and continue for a burst length of four or eight in a programmed sequence. Operation begins with the registration of an Active command, which is then followed by a Read or Write command. The address bits registered coincident with the Active command are used to select the bank and row to be accessed (BA0-BA2 select the bank; A0-A15 select the row).The address bits registered coincident with the Read or Write command are used to select the starting column location for the burst operation, determine if the auto pre-charge command is to be issued (via A10/AP), and the select BC4 or BL8 mode “on the fly” (via A12) if enabled in the mode register. Prior to normal operation, the DDR3L SDRAM must be powered up and initialized in a predefined manner. The following sections provide detailed information covering device reset and initialization, register definition, command descriptions and device operation. Power-up and Initialization Sequence The following sequence is required for POWER UP and Initialization. 1. Apply power and attempt to maintain RESET below 0.2 x VDD (all other inputs may be undefined). RESET needs to be maintained for minimum 200μs with stable power. CKE is pulled “Low” anytime before RESET being de-asserted (min. time 10ns). The power voltage ramp time between 300mV to VDD min must be no longer than 200ms; and during the ramp, VDD > VDDQ and VDD -VDDQ < 0.3 volts. - VDD and VDDQ are driven from a single power converter output, AND - The voltage levels on all pins other than VDD,VDDQ,VSS,VSSQ must be less than or equal to VDDQ and VDD on one side and must be larger than or equal to VSSQ and VSS on the other side. In addition, VTT is limited to 0.95V max once power ramp is finished, AND - Vref tracks VDDQ/2. or - Apply VDD without any slope reversal before or at the same time as VDDQ. - Apply VDDQ without any slope reversal before or at the same time as VTT & Vref. - The voltage levels on all pins other than VDD,VDDQ,VSS,VSSQ must be less than or equal to VDDQ and VDD on one side and must be larger than or equal to VSSQ and VSS on the other side. 2. After RESET is de-asserted, wait for another 500us until CKE becomes active. During this time, the DRAM will start internal initialization; this will bedone independently of external clocks. 3. Clocks (CK, CK) need to be started and stabilized for at least 10ns or 5tCK (which is larger) before CKE goes active. Since CKE is a synchronous signal, the corresponding setup time to clock (tIS) must be met. Also a NOP or Deselect command must be registered (with tIS set up time to clock) before CKE goes active. Once the CKE registered “High” after Reset, CKE needs to be continuously registered “High” until the initialization sequence is finished, including expiration of tDLLK and tZQinit. 4. The DDR3L SDRAM keeps its on-die termination in high-impedance state as long as RESET is asserted. Further, the SDRAM keeps its on-die termination in high impedance state after RESET de-assertion until CKE is registered HIGH. The ODT input signal may be in undefined state until tIS before CKE is registered HIGH. When CKE is registered HIGH, the ODT input signal may be statically held at either LOW or HIGH. If RTT_NOM is to be enabled in MR1 and the on-die termination is required to remain in the high impedance state, the ODT input signal must be statically held LOW. In all cases, the ODT input signal remains static until the power up initialization sequence is finished, including the expiration of tDLLK and tZQinit. 5. After CKE is registered high, wait minimum of Reset CKE Exit time, tXPR, before issuing the first MRS command to load mode register.(tXPR=Max(tXS, 5tCK)] 6. Issue MRS Command to load MR2 with all application settings. (To issue MRS command for MR2, provide “Low” to BA0 and BA2, “High” to BA1.) 7. Issue MRS Command to load MR3 with all application settings. (To issue MRS command for MR3, provide “Low” to BA2, “High” to BA0 and BA1.) 8. Issue MRS Command to load MR1 with all application settings and DLL enabled. (To issue ”DLL Enable” command, provide “Low” to A0, ”High” to BA0 and “Low” to BA1-BA2) 9. Issue MRS Command to load MR0 with all application settings and “DLL reset”. (To issue DLL reset command, provide “High” to A8 and “Low” to BA0-2). 10. Issue ZQCL command to starting ZQ calibration. 11. Wait for both tDLLK and tZQ in it completed. 12. The DDR3L SDRAM is now ready for normal operation. Confidential - 7 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Ta . Tb Tc . Td . Te . Tf . Tg . Th . Ti . Tj . Tk CK,CK t CKSRX VDD /VDDQ 200 us 500 us RESET 10 ns t IS CKE t XPR ** CMD *) BA[2:0] t ZQinit t MOD t MRD t IS t MRD t MRD t DLLK MRS MRS MRS MRS MR2 MR3 MR1 MR0 ZQCL 1) VALID VALID t IS t IS ODT Static LOW in case RTT_Nom is eanbled at time Tg, otherwise static HIGH or LOW VALID DRAM_RTT 1) From time point ‘Td’ until ‘Tk’, NOP or DES commands must be applied between MRS and ZQCL commands Reset and Initialization with Stable Power The following sequence is required for /RESET at no power interruption initialization. 1. Assert /RESET below 0.2 x VDD anytime when reset is needed (all other inputs may be undefined). /RESET needs to be maintained for minimum 100ns. CKE is pulled low before /RESET being de-asserted (minimum time 10ns). 2. Follow Power-Up Initialization Sequence steps 2 to 11. 3. The reset sequence is now completed; L SDRAM is ready for normal operation. Ta . Tb Tc CK,CK . Td . Te . Tf . Tg . Th . Ti . Tj . Tk . t CKSRX VDD /V DDQ 100 ns 500 us RESET 10 ns tIS CKE t XPR t MRD tIS 1) CMD BA[2:0] t ZQin t MOD t MRD t MRD tDLLK MRS MRS MRS MRS MR2 MR3 MR1 MR0 ZQCL 1) VALID VALID t IS ODT Static LOW in case RTT_Nom is eanbled at time Tg, otherwise static HIGH or LOW VALID DRAM_RTT 1) From time point ‘Td’ until ‘Tk’, NOP or DES commands must be applied between MRS and ZQCL commands Confidential - 8 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Mode Register MR0 The Mode Register MR0 stores the data for controlling various operating modes of DDR3L SDRAM. It controls burst length, read burst type, CAS latency, test mode, DLL reset, WR and DLL control for precharge power-down, which include various vendor specific options to make DDR3L SDRAM useful for various appli-cations. The mode register is written by asserting low on CS, RAS, CAS, WE, BA0, BA1 and BA2, while controlling the states of address pins according to the table below. BA2 BA1 0*1 0 BA0 A 15- A 13 0 0*1 PPD A11 A10 A9 WR A8 A7 DLL TM A6 A5 A4 CAS Latency A3 A2 RBT CL A1 A0 Address Field Mode Register 0 BL A8 DLL Reset A7 mode A3 Read Burst Type A1 A0 0 No 0 Normal 0 Nibble Sequential 0 0 8 (Fixed) Test 1 Interleave 0 1 4 or 8(on the fly) 1 0 4 (Fixed) 1 1 Reserved 1 Yes DLL Control for Precharge PD A12 A12 0 Slow exit (DLL off) 1 Fast exit (DLL on) 1 Write recovery for autoprecharge BL CAS Latency A11 A10 A9 WR(cycles) A6 A5 A4 A2 Latency 0 0 0 Reserved 0 0 0 0 Reserved 0 0 1 5*2 0 0 1 0 5 0 1 0 6*2 0 1 0 0 6 0 1 1 0 7 1 0 0 0 8 1 0 1 0 9 BA1 BA0 MRS mode 0 1 1 7*2 0 0 MR0 1 0 0 0 1 MR1 8*2 1 0 MR2 1 0 1 10*2 1 1 0 0 10 1 1 MR3 1 1 0 12*2 1 1 1 0 11 1 1 1 Reserved 0 0 0 1 12 0 0 1 1 13 *1 : BA2, A13, A14 and A15 are reserved for future use and must be programmed to 0 during MRS. *2 : WR(write recovery for autoprecharge)min in clock cycles is calculated by dividing tWR(in ns) by tCK(in ns) and rounding up to the next integer: WRmin[cycles] = Roundup(tWR[ns]/tCK[ns]). The WR value in the mode register must be programmed to be equal or larger than WRmin. The programmed WR value is used with tRP to determine tDAL. Confidential - 9 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Mode Register MR1 The Mode Register MR1 stores the data for enabling or disabling the DLL, output driver strength, RTT_Nom impedance, additive latency, write leveling enable, TDQS enable and Qoff. The Mode Register 1 is written by asserting low on CS, RAS, CAS, WE, high on BA0, low on BA1 and BA2, while controlling the states of address pins according to the table below. BA2 BA1 0*1 0 BA0 A15- A13 A12 1 0*1 Qoff A11 A10 A9 TDQS 0*1 Rtt_Nom A11 TDQS enable 0 Disabled 1 Enabled A7 Write leveling enable A8 A7 0*1 Level A6 Rtt_Nom A5 D.I.C A9 A6 A2 A4 A3 AL A2 Rtt_Nom A1 A0 D.I.C DLL Rtt_Nom *3 0 0 0 ODT disabled 0 0 1 RZQ/4 0 1 0 RZQ/2 0 1 1 RZQ/6 1 0 0 RZQ/12*4 0 Disabled 1 0 1 RZQ/8*4 1 Enabled 1 1 0 Reserved 1 1 1 Reserved Address Field Mode Register 1 A0 DLL Enable 0 Enable 1 Disable Note : RZQ = 240 ohms Additive Latency A4 A3 0 0 0 (AL disabled) 0 1 CL-1 1 0 CL-2 1 1 Reserved Qoff 0 Output buffer enabled 1 *4: If RTT_Nom is used during Writes, only the values RZQ/2,RZQ/4 and RZQ/6 are allowed. *2 A12 Output buffer disabled *3: In Write leveling Mode (MR1[bit7] = 1) with MR1[bit12] = 1, all RTT_Nom settings are allowed; in Write Leveling Mode (MR1[bit7] = 1) with MR1[bit12] = 0, only RTT_Nom settings of RZQ/2, RZQ/4 and RZQ/6 are allowed. A5 A1 *2 *2: Outputs disabled - DQs, DQSs, DQSs. BA1 BA0 MRS mode 0 0 MR0 0 1 MR1 1 0 MR2 1 1 MR3 Output Driver Impedance Control 0 0 RZQ/6 0 1 RZQ/7 1 0 Reserved 1 1 Reserved Note : RZQ = 240 ohms * 1 : BA2, A8, A10, A13, A14 and A15 are reserved for future use (RFU) and must be programmed to 0 during MRS. Confidential - 10 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Mode Register MR2 The Mode Register MR2 stores the data for controlling refresh related features, RTT_WR impedance and CAS write latency (CWL). The Mode Register 2 is written by asserting low on CS, RAS, CAS, WE, high on BA1, low on BA0 and BA2, while controlling the states of address pins according to the table below. BA2 BA1 BA 0 0*1 1 0 A7 A15 - A11 0*1 BA1 A9 Rtt_WR A8 A7 A6 A5 A4 0*1 SRT ASR 0 Normal operating temperature range 1 Extend temperature self-refresh (Optional) A3 A2 A1 A0 PASR*2 CWL A2 A1 A0 Self-refresh temperature range (SRT) Address Field Mode Register 2 Partial Array Self Refresh (Optional) 0 0 0 Full Array 0 0 1 HalfArray (BA[2:0]=000,001,010, &011) 0 1 0 Quarter Array (BA[2:0]=000, & 001) 0 1 1 1/8th Array (BA[2:0] = 000) A6 Auto Self-refresh (ASR) 1 0 0 3/4 Array (BA[2:0] = 010,011,100,101,110, & 111) 0 Manual SR Reference (SRT) 1 0 1 HalfArray (BA[2:0] = 100, 101, 110, &111) 1 1 0 Quarter Array (BA[2:0]=110, &111) 1 1 1 1/8th Array (BA[2:0]=111) 1 A10 A9 A10 ASR enable (Optional) Rtt_WR *2 0 0 Dynamic ODT off (Write does not affect Rtt value) 0 1 RZQ/4 A5 A4 A3 1 0 RZQ/2 1 1 Reserved 0 0 1 6 (2.5ns >tCK(avg) ≥1.875ns) 0 1 0 7 (1.875ns>tCK(avg) ≥ 1.5ns) 0 1 1 8 (1.5ns>tCK(avg) ≥1.25ns) BA0 0 0 0 CAS write Latency (CWL) 0 0 5 (tCK(avg) ≥2.5ns) MRS mode 1 0 0 9 (1.25ns >tCK(avg) ≥1.07ns) MR0 1 0 1 Reserved 1 0 Reserved 1 1 Reserved 0 1 MR1 1 1 0 MR2 1 1 1 MR3 * 1 : BA2, A8, A11 ~ A15 are RFU and must be programmed to 0 during MRS. * 2 : The Rtt_WR value can be applied during writes even when Rtt_Nom is disabled. During write leveling, Dynamic ODT is not available. Confidential - 11 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Mode Register MR3 The Mode Register MR3 controls Multi Purpose Registers (MPR). The Mode Register 3 is written by asserting low on CS, RAS, CAS, WE, high on BA1 and BA0, and low on BA2 while controlling the states of address pins according to the table below. BA 2 BA 1 BA0 0*1 1 1 A15 -A13 A12 BA1 BA0 MRS mode 0 0 MR0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 0*1 MPR MPR Operation MPR Address A2 A1 A0 MPR Loc Address Field Mode Register 3 A1 A0 MPR location 3 0 0 Predefined pattern*2 0 1 RFU 1 0 RFU 1 1 RFU MPR 0 1 MR1 0 Normal operation* 1 0 MR2 1 Dataflow from MPR 1 1 MR3 * 1 : BA2, A3 - A15 are reserved for future use (RFU) and must be programmed to 0 during MRS. * 2 : The predefined pattern will be used for read synchronization. * 3 : When MPR control is set for normal operation, MR3 A[2] = 0, MR3 A[1:0] will be ignored Burst Length (MR0) Read and write accesses to the DDR3L are burst oriented, with the burst length being programmable, as shown in the figure MR0 Programming. The burst length determines the maximum number of column locations that can be accessed for a given read or write command. Burst length options include fixed BC4, fixed BL8, and on the fly which allows BC4 or BL8 to be selected coincident with the registration of a read on write command Via A12 (BC). Reserved states should not be used, as unknown operation or incompatibility with future versions may result. Burst Chop In case of burst length being fixed to 4 by MR0 setting, the internal write operation starts two clock cycles earlier than for the BL8 mode. This means that the starting point for tWR and tWTR will be pulled in by two clocks. In case of burst length being selected on the fly via A12(BC), the internal write operation starts at the same point in time like a burst of 8 write operation. This means that during on-the-fly control, the starting point for tWR and tWTR will not be pulled in by two clocks. Confidential - 12 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Burst Type (MR0) [Burst Length and Sequence] Burst length Operation Starting address (A2, A1, A0) Sequential addressing (decimal) Interleave addressing (decimal) 4 (Burst chop) READ 000 0, 1, 2, 3, T, T, T, T 0, 1, 2, 3, T, T, T, T 8 001 1, 2, 3, 0, T, T, T, T 1, 0, 3, 2, T, T, T, T 010 2, 3, 0, 1, T, T, T, T 2, 3, 0, 1, T, T, T, T 011 3, 0, 1, 2, T, T, T, T 3, 2, 1, 0, T, T, T, T 100 4, 5, 6, 7, T, T, T, T 4, 5, 6, 7, T, T, T, T 101 5, 6, 7, 4, T, T, T, T 5, 4, 7, 6, T, T, T, T 110 6, 7, 4, 5, T, T, T, T 6, 7, 4, 5, T, T, T, T 111 7, 4, 5, 6, T, T, T, T 7, 6, 5, 4, T, T, T, T WRITE 0VV 0, 1, 2, 3, X, X, X, X 0, 1, 2, 3, X, X, X, X 1VV 4, 5, 6, 7, X, X, X, X 4, 5, 6, 7, X, X, X, X READ 000 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 001 1, 2, 3, 0, 5, 6, 7, 4 1, 0, 3, 2, 5, 4, 7, 6 010 2, 3, 0, 1, 6, 7, 4, 5 2, 3, 0, 1, 6, 7, 4, 5 011 3, 0, 1, 2, 7, 4, 5, 6 3, 2, 1, 0, 7, 6, 5, 4 100 4, 5, 6, 7, 0, 1, 2, 3 4, 5, 6, 7, 0, 1, 2, 3 101 5, 6, 7, 4, 1, 2, 3, 0 5, 4, 7, 6, 1, 0, 3, 2 110 6, 7, 4, 5, 2, 3, 0, 1 6, 7, 4, 5, 2, 3, 0, 1 111 7, 4, 5, 6, 3, 0, 1, 2 7, 6, 5, 4, 3, 2, 1, 0 VVV 0, 1, 2, 3, 4, 5, 6, 7 0, 1, 2, 3, 4, 5, 6, 7 WRITE Remark: T: Output driver for data and strobes are in high impedance. V: A valid logic level (0 or 1), but respective buffer input ignores level on input pins. X: Don’t Care. Notes: 1. Page length is a function of I/O organization and column addressing 2. 0...7 bit number is value of CA [2:0] that causes this bit to be the first read during a burst. Confidential - 13 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Command Truth Table (a) Note 1,2,3,4 apply to the entire Command truth table (b) Note 5 applies to all Read/Write commands. [BA=Bank Address, RA=Row Address, CA=Column Address, BC=Burst Chop, X=Don’t care, V=Valid] CKE Function WE BA0 BA2 L L BA L H L L H X L H Abbreviation Previous Cycle Current Cycle CS Mode Register Set MRS H H L L Refresh REF H H L L Self Refresh Entry SRE H L L Self Refresh Exit Single Bank Precharge SRX L H A13 A15 A12 / BC V V V V V H V V V V V X X X X X X X H H V V V V V RAS CAS A10 / AP A0 A9,A11 OP Code PRE H H L L H L BA V V L V PREA H H L L H L V V V H V Bank Activate ACT H H L L H H BA Write (Fixed BL8 or BL4) WR H H L H L L BA RFU V L CA Write (BL4, on the Fly) WRS4 H H L H L L BA RFU L L CA Write (BL8, on the Fly) WRS8 H H L H L L BA RFU H L CA Write with Auto Precharge (Fixed BL8 or BL4) WRA H H L H L L BA RFU V H CA Write with Auto Precharge (BL4, on the Fly) WRAS4 H H L H L L BA RFU L H CA Write with Auto Precharge (BL8, on the Fly) WRAS8 H H L H L L BA RFU H H CA Precharge all Banks Read (Fixed BL8 or BL4) Notes 7,9,12 7,8,9,12 Row Address (RA) RD H H L H L H BA RFU V L CA Read (BL4, on the Fly) RDS4 H H L H L H BA RFU L L CA Read (BL8, on the Fly) RDS8 H H L H L H BA RFU H L CA Read with Auto Precharge (Fixed BL8 or BL4) RDA H H L H L H BA RFU V H CA Read with Auto Precharge (BL4, on the Fly) RDAS4 H H L H L H BA RFU L H CA Read with Auto Precharge (BL8, on the Fly) RDAS8 H H L H L H BA RFU H H CA No Operation NOP H H L H H H V V V V V 10 Device Deselected DES H H H X X X X X X X X 11 ZQ calibration Long ZQCL H H L H H L X X X H X ZQ calibration Short ZQCS H H Power Down Entry PDE H L Power Down Exit PDX L H L H H L X X X L X L H H H V V V V V H X X X X X X X X L H H H V V V V V H X X X X X X X X 6,12 6,12 Note : 1. All DDR3L SDRAM commands are defined by states of CS, RAS, CAS, WE and CKE at the rising edge of the clock. The MSB of BA, RA, and CA are device density and configuration dependant 2. RESET is Low enable command which will be used only for asynchronous reset so must be maintained HIGH during any function. 3. Bank addresses (BA) determine which bank is to be operated upon. For (E)MRS BA selects an (Extended) Mode Register 4. “V” means “H or L (but a defined logic level)” and “X” means either “defined or undefined (like floating) logic level” 5. Burst reads or writes cannot be terminated or interrupted and Fixed/on the fly BL will be defined by MRS 6. The Power Down Mode does not perform any refresh operations. 7. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh. 8. Self refresh exit is asynchronous. 9. VREF(Both VREFDQ and VREFCA) must be maintained during Self Refresh operation. 10. The No Operation command (NOP) should be used in cases when the DDR3L SDRAM is in an idle or a wait state. The purpose of the No Operation command (NOP) is to prevent the DDR3L SDRAM from registering any unwanted commands between operations. A No Operation command will not terminate a previous operation that is still executing, such as a burst read or write cycle. 11. The Deselect command performs the same function as a No Operation command. 12. Refer to the CKE Truth Table for more detail with CKE transition Confidential - 14 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB CKE Truth Table (a) Note 1~7 apply to the entire Command truth table (b) CKE low is allowed only if tMRD and tMOD are satisfied CKE Current State 2 Previous Cycle (N-1) 1 Command (N) Current Cycle (N) 3 1 RAS, CAS, WE, CS Action (N) 3 Notes 14, 15 L L X Maintain Power-Down L H DESELECT or NOP Power Down Exit 11, 14 L L X Maintain Self Refresh 15, 16 L H DESELECT or NOP Self Refresh Exit 8, 12, 16 Bank(s) Active H L DESELECT or NOP Active Power Down Entry 11, 13, 14 Reading H L DESELECT or NOP Power Down Entry 11, 13, 14, 17 Power Down Self Refresh Writing H L DESELECT or NOP Power Down Entry 11, 13, 14, 17 Precharging H L DESELECT or NOP Power Down Entry 11, 13, 14, 17 Refreshing All Banks Idle H L DESELECT or NOP Precharge Power Down Entry 11 H L DESELECT or NOP Precharge Power Down Entry 11,13, 14, 18 H L REFRESH Self Refresh Entry 9, 13, 18 For more details with all signals See “Command Truth Table,” on previous page 10 Notes: 1. CKE (N) is the logic state of CKE at clock edge N; CKE (N–1) was the state of CKE at the previous clock edge. 2.Current state is defined as the state of the DDR3L SDRAM immediately prior to clock edge N 3. COMMAND (N) is the command registered at clock edge N, and ACTION (N) is a result of COMMAND (N), ODT is not included here 4. All states and sequences not shown are illegal or reserved unless explicitly described elsewhere in this document 5. The state of ODT does not affect the states described in this table. The ODT function is not available during Self Refresh 6. CKE must be registered with the same value on tCKEmin consecutive positive clock edges. CKE must remain at the valid input level the entire time it takes to achieve the tCKEmin clocks of registeration. Thus, after any CKE transition, CKE may not transition from its valid level during the time period of tIS + tCKEmin + tIH. 7. DESELECT and NOP are defined in the Command truth table 8. On Self Refresh Exit DESELECT or NOP commands must be issued on every clock edge occurring during the tXS period. Read or ODT commands may be issued only after tXSDLL is satisfied. 9. Self Refresh mode can only be entered from the All Banks Idle state. 10. Must be a legal command as defined in the Command Truth Table. 11. Valid commands for Power Down Entry and Exit are NOP and DESELECT only. 12. Valid commands for Self Refresh Exit are NOP and DESELECT only. 13. Self Refresh can not be entered while Read or Write operations. See ‘Self-Refresh Operation” and ‘Power-Down Modes” on later section for a detailed list of restrictions. 14. The Power Down does not perform any refresh operations. 15. “X” means “don’t care (including floating around VREF)” in Self Refresh and Power Down. It also applies to Address pins 16. VREF (Both VREFDQ and VREFCA) must be maintained during Self Refresh operation. 17. If all banks are closed at the conclusion of the read, write or precharge command, then Precharge Power Down is entered, otherwise Active Power Down is entered 18. ‘Idle state’ means that all banks are closed(tRP,tDAL,etc. satisfied) and CKE is high and all timings from previous operations are satisfied (tMRD,tMOD,tRFC,tZQinit,tZQoper,tZQCS,etc)as well as all SRF exit and Power Down exit parameters are satisfied (tXS,tXP,tXPDLL,etc) Confidential - 15 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Absolute Maximum DC Ratings Symbol Parameter Rating Units Notes VDD Voltage on VDD pin relative to Vss -0.4 V ~ 1.975 V V 1,3 VDDQ Voltage on VDDQ pin relative to Vss -0.4 V ~ 1.975 V V 1,3 VIN, VOUT Voltage on any pin relative to Vss -0.4 V ~ 1.975 V V 1 TSTG Storage Temperature -55 to +150 °C 1,2 NOTE : 1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability. 2. Storage Temperature is the case surface temperature on the center/top side of the DRAM. For the measurement conditions, please refer to JESD51-2 standard. 3. VDD and VDDQ must be within 300mV of each other at all times;and VREF must be not greater than 0.6 x VDDQ, When VDD and VDDQ are less than 500mV; VREF may be equal to or less than 300mV. Operating Temperature Condition Symbol Parameter Rating Units Notes 0 to +95 °C 1,2,3 Operating temperature-Industrial -40 to +95 °C 1,2,3 Operating temperature-Automotive -40 to +105 °C 1,2,3 Operating temperature -Commercial TC NOTE : 1. Operating temperature is the case surface temperature on the center/top side of the DRAM. 2. The Normal Temperature Range specifies the temperatures where all DRAM specifications will be supported. During operation, the DRAM case temperature must be maintained between 0°C to +85°C under all operating conditions. 3. Some applications require operation of the DRAM in the Extended Temperature Range between +85°C and +95°C case temperature. Full specifications are guaranteed in this range, but the following additional conditions apply: a) Refresh commands must be doubled in frequency, therefore reducing the refresh interval tREFI to 3.9μs. (This double refresh requirement may not apply for some devices.) b) If Self-refresh operation is required in the Extended Temperature Range, then it is mandatory to either use the Manual Self-Refresh mode with Extended Temperature Range capability (MR2 bit [A6, A7] = [0, 1]) or enable the optional Auto Self-Refresh mode (MR2 bit [A6, A7] = [1, 0]). Recommended DC Operating Conditions Rating Symbol Parameter Operation Voltage VDD Supply voltage 1.35 1.283 1.35 1.45 V 1,2,3 1.5 1.425 1.5 1.575 V 1,2,3 1.35 1.283 1.35 1.45 V 1,2,3 1.5 1.425 1.5 1.575 V 1,2,3 VDDQ Supply voltage for Output Min. Typ. Max. Units Notes NOTE : 1. Under all conditions VDDQ must be less than or equal to VDD. Confidential - 16 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB 2. VDDQ tracks with VDD. AC parameters are measured with VDD and VDDQ tied together. 3. VDD and VDDQ rating are determined by operation voltage. AC and DC Input Measurement Levels Single-Ended AC and DC Input Levels for Command and Address(1.35V) Symbol Parameter Min. Max. Units Notes VIHCA (DC90) DC input logic high VREF + 0.090 VDD V 1,5(a) VILCA (DC90) DC input logic low VSS VREF - 0.090 V 1,6(a) VIHCA (AC160) AC input logic high DDR3L-1600 VREF + 0.160 - V 1,2 VILCA (AC160) AC input logic low DDR3L-1600 - VREF - 0.160 V 1,2 VIHCA (AC135) AC input logic high VREF + 0.135 - V 1,2 VILCA (AC135) AC input logic low - VREF - 0.135 V 1,2 VIHCA (AC125) AC input logic high DDR3L-1600 - - V 1,2 AC input logic low DDR3L-1600 - - V 1,2 0.49 * VDD 0.51 * VDD V 3,4 VILCA (AC125) VREFCA (DC) Reference voltage for ADD, CMD inputs Single-Ended AC and DC Input Levels for Command and Address(1.5V) Symbol Parameter Min. Max. Units Notes VIHCA (DC100) DC input logic high VREF + 0.100 VDD V 1 VILCA (DC100) DC input logic low VSS VREF - 0.100 V 1 VIHCA (AC175) AC input logic high DDR3L-1600 VREF + 0.175 - V 1,2 VILCA (AC175) AC input logic low DDR3L-1600 - VREF - 0.175 V 1,2 VIHCA (AC150) AC input logic high DDR3L-1600 VREF + 0.150 - V 1,2 Confidential - 17 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Symbol Parameter Min. Max. Units Notes VILCA (AC150) AC input logic low DDR3L-1600 - VREF - 0.150 V 1,2 VIHCA (AC135) AC input logic high DDR3L-1600 - - V 1,2 VILCA (AC135) AC input logic low DDR3L-1600 - - V 1,2 VIHCA (AC125) AC input logic high DDR3L-1600 - - V 1,2 VILCA (AC125) AC input logic low DDR3L-1600 - - V 1,2 0.49 * VDD 0.51 * VDD V 3,4 VREFCA (DC) Reference voltage for ADD, CMD inputs NOTE : 1. For input only pins except /RESET : VREF = VREFCA (DC). 2. See Overshoot and Undershoot Specifications section. 3. The AC peak noise on VREF may not allow VREF to deviate from VREFCA (DC) by more than ±1% VDD (for reference : approx. ±15 mV). 4. For reference : approx. VDD/2 ±15 mV. 5. VIH(dc) is used as a simplified symbol for VIH.CA(a) 1.35V : DC90, b) 1.5V : DC100) 6. VIL(dc) is used as a simplified symbol for VIL.CA(a) 1.35V : DC90, b) 1.5V : DC100) 7. VIH(ac) is used as a simplified symbol for VIH.CA(AC175) and VIH.CA(AC150); VIH.CA(AC175) value is used when VREF + 175mV is referenced and VIH.CA(AC150) value is used when VREF + 150mV is referenced. 8. VIL(ac) is used as a simplified symbol for VIL.CA(AC175) and VIL.CA(AC150); VIL.CA(AC175) value is used when VREF - 175mV is referenced and VIL.CA(AC150) value is used when VREF - 150mV is referenced. Confidential - 18 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Single-Ended AC and DC Input Levels for DQ and DM(1.35V) Symbol Parameter Min. Max. Units Notes VIHDQ (DC90) DC input logic high VREF + 0.090 VDD V 1,5(a) VILDQ (DC90) DC input logic low VSS VREF - 0.090 V 1,6(a) VIHDQ (AC160) AC input logic high DDR3L-1600 - - V 1,2 VILDQ (AC160) AC input logic low DDR3L-1600 - VREF - 0.160 V 1,2 VIHDQ (AC135) AC input logic high VREF + 0.135 - V 1,2 VILDQ (AC135) AC input logic low - VREF - 0.135 V 1,2 VIHDQ (AC130) AC input logic high DDR3L-1600 - - V 1,2 VILDQ (AC130) AC input logic low DDR3L-1600 - - V 1,2 0.49 * VDD 0.51 * VDD V 3,4 VREFDQ (DC) Reference voltage for DQ, DM inputs Single-Ended AC and DC Input Levels for DQ and DM(1.5V) Symbol Parameter Min. Max. Units Notes VIHDQ (DC100) DC input logic high VREF + 0.100 VDD V 1 VILDQ (DC100) DC input logic low VSS VREF - 0.100 V 1 VIHDQ (AC175) AC input logic high DDR3L-1600 - - V 1,2 VILDQ (AC175) AC input logic low DDR3L-1600 - - V 1,2 VIHDQ (AC150) AC input logic high DDR3L-1600 VREF + 0.150 - V 1,2 VILDQ (AC150) AC input logic low DDR3L-1600 - VREF - 0.150 V 1,2 Confidential - 19 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Symbol Parameter Min. Max. Units Notes VIHDQ (AC135) AC input logic high DDR3L-1600 - - V 1,2 VILDQ (AC135) AC input logic low DDR3L-1600 - - V 1,2 0.49 * VDD 0.51 * VDD V 3,4 VREFDQ (DC) Reference voltage for DQ, DM inputs NOTE : 1. For DQ and DM : VREF = VREFDQ (DC). 2. See Overshoot and Undershoot Specifications section. 3. The AC peak noise on VREF may not allow VREF to deviate from VREFDQ (DC) by more than ±1% VDD (for reference: approx. ±15 mV). 4. For reference: approx. VDD/2 ±15 mV. 5. VIH(dc) is used as a simplified symbol for VIH.DQ(a) 1.35V : DC90, b) 1.5V : DC100) 6. VIL(dc) is used as a simplified symbol for VIL.DQ(a) 1.35V : DC90, b) 1.5V : DC100) 7. VIH(ac) is used as a simplified symbol for VIH.DQ(AC175), VIH.DQ(AC150) ; VIH.DQ(AC175) value is used when VREF + 175mV is referenced, VIH.DQ(AC150) value is used when VREF + 150mV is referenced. 8. VIL(ac) is used as a simplified symbol for VIL.DQ(AC175), VIL.DQ(AC150) ; VIL.DQ(AC175) value is used when VREF - 175mV is referenced, VIL.DQ(AC150) value is used when VREF - 150mV is referenced. Confidential - 20 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB VREF Tolerances The dc-tolerance limits and ac-noise limits for the reference voltages VREFCA and VREFDQ are illustrate in figure VREF(DC) tolerance and VREF AC-Noise limits. It shows a valid reference voltage VREF(t) as a function of time. (VREF stands for VREFCA and VREFDQ likewise). VREF(DC) is the linear average of VREF(t) over a very long period of time (e.g. 1 sec). This average has to meet the min/max requirement in Table of “Single-Ended AC and DC Input Levels for Command and Address”. Furthermore VREF(t) may temporarily deviate from VREF(DC) by no more than +/- 1% VDD. voltage VDD VSS time VREF(DC) tolerance and VREF AC-Noise limits The voltage levels for setup and hold time measurements VIH(AC), VIH(DC), VIL(AC) and VIL(DC) are dependent on VREF. "VREF" shall be understood as VREF(DC), as defined in figure above, VREF(DC) tolerance and VREF ACNoise limits. This clarifies, that DC-variations of VREF affect the absolute voltage a signal has to reach to achieve a valid high or low level and therefore the time to which setup and hold is measured. System timing and voltage budgets need to account for VREF(DC) deviations from the optimum position within the data-eye of the input signals. This also clarifies that the DRAM setup/hold specification and derating values need to include time and voltage associated with VREF AC-noise. Timing and voltage effects due to AC-noise on VREF up to the specified limit (+/- 1% of VDD) are included in DRAM timings and their associated deratings. Confidential - 21 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB AC and DC Logic Input Levels for Differential Signals Differential signals definition tDVAC Differential Input Voltage (i.e. DQS-DQS, CK-CK) VIH.DIFF.AC.MIN VIH.DIFF.MIN 0.0 half cycle VIL.DIFF.MAX VIL.DIFF.AC.MAX tDVAC time Definition of differential ac-swing and "time above ac level" tDVAC Differential swing requirement for clock (CK - CK) and strobe (DQS - DQS) Differential AC and DC Input Levels(1.35V) Symbol Parameter Min. Max. Units Notes VIHdiff Differential input high +0.18 NOTE 3 V 1 VILdiff Differential input low NOTE 3 -0.18 V 1 VIHdiff(AC) Differential input high AC 2 x (VIH(AC) - VREF) NOTE 3 V 2 VILdiff(AC) Differential input low AC NOTE 3 2 x (VIL(AC) - VREF) V 2 Differential AC and DC Input Levels(1.5V) Symbol Parameter Min. Max. Units Notes VIHdiff Differential input high +0.2 NOTE 3 V 1 VILdiff Differential input low NOTE 3 -0.2 V 1 VIHdiff(AC) Differential input high AC 2 x (VIH(AC) - VREF) NOTE 3 V 2 VILdiff(AC) Differential input low AC NOTE 3 2 x (VIL(AC) - VREF) V 2 Confidential - 22 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB NOTE : 1. Used to define a differential signal slew-rate. 2. for CK - CK use VIH/VIL(AC) of address/command and VREFCA; for strobes (DQS, DQS) use VIH/VIL(AC) of DQs and VREFDQ; if a reduced ac-high or ac-low level is used for a signal group, then the reduced level applies also here. 3. These values are not defined, however the single-ended signals CK, CK, DQS, DQS need to be within the respective limits (VIH(DC) max, VIL(DC)min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to "Overshoot and Undershoot specification". Allowed time before ringback (tDVAC) for CK - CK and DQS - DQS(1.35V) DDR3L-1600 Slew Rate [V/ns] Confidential tDVAC [ps] @ |VIH/ Ldiff(AC)| = 320mV tDVAC [ps] @ |VIH/ Ldiff(AC)| = 270mV Min. Min. Max. Max. > 4.0 189 - 201 - 4.0 189 - 201 - 3.0 162 - 179 - 2.0 109 - 134 - 1.8 91 - 119 - 1.6 69 - 100 - 1.4 40 - 76 - 44 - 1.2 Note1 - 1.0 Note1 - Note1 - < 1.0 Note1 - Note1 - - 23 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Allowed time before ringback (tDVAC) for CK - CK and DQS - DQS(1.5V) Slew Rate [V/ns] tDVAC [ps] @ |VIH/Ldiff(AC)| = 350mV tDVAC [ps] @ |VIH/Ldiff(AC)| = 300mV Min. Max. Min. Max. > 4.0 75 - 175 - 4.0 57 - 170 - 3.0 50 - 167 - 2.0 38 - 163 - 1.8 34 - 162 - 1.6 29 - 161 - 1.4 22 - 159 - 1.2 13 - 155 - 1.0 0 - 150 - < 1.0 0 - 150 - NOTE:1.Rising input signal shall become equal to or greater than VIH(ac) level and Falling inputsignal shall become equal to or less than VIL(ac) level. Single-ended requirements for differential signals Each individual component of a differential signal (CK, DQS, CK, DQS) has also to comply with certain requirements for single-ended signals. CK and CK have to approximately reach VSEH min / VSEL max [ approximately equal to the AC-levels ( VIH(AC) / VIL(AC) ) for Address/command signals ] in every half-cycle. DQS, DQS have to reach VSEH min / VSEL max [ approximately the ac-levels ( VIH(AC) / VIL(AC) ) for DQ signals ] in every half-cycle proceeding and following a valid transition. Note that the applicable AC-levels for Address/command and DQ’s might be different per speed-bin etc. E.g. if VIH150(AC) / VIL150(AC) is used for Address/command signals, then these AC-levels apply also for the single-ended components of differential CK and CK. Confidential - 24 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB VDD or VDDQ VSEH min VSEH VDD/2 or VDDQ/2 CK or DQS VSEL max VSEL VSS or VSSQ time Single-ended requirement for differential signals Note that while Address/command and DQ signal requirements are with respect to VREF, the single-ended components of differential signals have a requirement with respect to VDD/2; this is nominally the same. The transition of single-ended signals through the AC-levels is used to measure setup time. For singleended components of differential signals the requirement to reach VSEL max, VSEH min has no bearing on timing, but adds a restriction on the common mode characteristics of these signals. Single-ended levels for CK, DQS, CK, DQS Symbol VSEH VSEL Parameter Min. Max. Units Notes Single-ended high-level for strobes (VDD/2) + 0.175 NOTE 3 V 1,2 Single-ended high-level for CK, CK (VDD/2) + 0.175 NOTE 3 V 1,2 Single-ended low-level for strobes NOTE 3 (VDD/2) - 0.175 V 1,2 Single-ended low-level for CK, CK NOTE 3 (VDD/2) - 0.175 V 1,2 NOTE : 1. For CK, CK use VIH/VIL(AC) of address/command; for strobes (DQS, DQS) use VIH/VIL(AC) of DQs. 2. VIH(AC)/VIL(AC) for DQs is based on VREFDQ; VIH(AC)/VIL(AC) for address/command is based on VREFCA; if a reduced AC-high or AC-low level is used for a signal group, then the reduced level applies also here. 3. These values are not defined, however the single-ended components of differential signals CK, CK, DQS, DQS need to be within the respective limits (VIH(DC) max, VIL(DC) min) for single-ended signals as well as the limitations for overshoot and undershoot. Refer to "Overshoot and Undershoot specifications”. Confidential - 25 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB To guarantee tight setup and hold times as well as output skew parameters with respect to clock and strobe, each cross point voltage of differential input signals (CK, CK and DQS, DQS) must meet the requirements in below table. The differential input cross point voltage VIX is measured from the actual cross point of true and complement signal to the mid level between of VDD and VSS. VDD CK, DQS VIX VDD/2 VIX VIX CK, DQS VSS VIX Definition Cross point voltage for differential input signals ( CK, DQS ): 1.35V Symbol Parameter Min. Max. Units Notes 1 VIX Differential Input Cross Point Voltage relative to VDD/2 for CK, CK -150 150 mV VIX Differential Input Cross Point Voltage relative to VDD/2 for DQS, DQS -150 150 mV Min. Max. Units -150 150 mV -175 175 mV -150 150 mV NOTE :1. The relation between Vix Min/Max and VSEL/VSEH should satisfy following. (VDD/2) + Vix(Min) - VSEL >= 25mV VSEH - ((VDD/2) + Vix(Max)) >= 25mV Cross point voltage for differential input signals ( CK, DQS ): 1.5V Symbol Parameter VIX Differential Input Cross Point Voltage relative to VDD/2 for CK, CK VIX Differential Input Cross Point Voltage relative to VDD/2 for DQS, DQS Notes 1 NOTE :1. Extended range for VIX is only allowed for clock and if single-ended clock input signals CKand CK are monotonic, have a single-ended swing VSEL / VSEH of at least VDD/2 +/- 250 mV, and the differential slew rate of CK-CK is larger than 3 V/ ns. Refer to the table of Cross point voltage for differential input signals (CK, DQS) for VSEL and VSEH standard values. Confidential - 26 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Differential input slew rate definition Measured Description Defined by From To Differential input slew rate for rising edge ( CK-CK and DQS-DQS ) VILdiff (max) VIHdiff (min) VIHdiff (min) - VILdiff (max) Delta TRdiff Differential input slew rate for falling edge ( CK-CK and DQS-DQS ) VIHdiff (min) VILdiff (max) VIHdiff (min) - VILdiff (max) Delta TFdiff NOTE : The differential signal (i.e. CK - CK and DQS - DQS) must be linear between these thresholds. VIHdiffmin 0 VILdiffmax delta TFdiff delta TRdiff Differential Input Slew Rate definition for DQS, DQS, and CK, CK Confidential - 27 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB AC and DC Output Measurement Levels Single-ended AC & DC Output Levels Symbol Parameter DDR3L- 1600 Units Notes VOH(DC) DC output high measurement level (for IV curve linearity) 0.8 x VDDQ V VOM(DC) DC output mid measurement level (for IV curve linearity) 0.5 x VDDQ V VOL(DC) DC output low measurement level (for IV curve linearity) 0.2 x VDDQ V VOH(AC) AC output high measurement level (for output SR) VTT + 0.1 x VDDQ V 1 VOL(AC) AC output low measurement level (for output SR) VTT - 0.1 x VDDQ V 1 NOTE : 1. The swing of +/-0.1 x VDDQ is based on approximately 50% of the static single ended output high or low swing with a driver impedance of 40Ω and an effective test load of 25Ω to VTT=VDDQ/2. Differential AC & DC Output Levels Symbol Parameter DDR3L- 1600 Units Notes VOHdiff(AC) AC differential output high measurement level (for output SR) +0.2 x VDDQ V 1 VOLdiff(AC) AC differential output low measurement level (for output SR) -0.2 x VDDQ V 1 NOTE : 1. The swing of +/-0.2xVDDQ is based on approximately 50% of the static single ended output high or low swing with a driver impedance of 40Ω and an effective test load of 25Ω to VTT=VDDQ/2 at each of the differential outputs. Single-ended Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOL(AC) and VOH(AC) for single ended signals. Measured Description Defined by From To Single ended output slew rate for rising edge VOL(AC) VOH(AC) VOH(AC)-VOL(AC) Delta TRse Single ended output slew rate for falling edge VOH(AC) VOL(AC) VOH(AC)-VOL(AC) Delta TRse NOTE : Output slew rate is verified by design and characterization, and may not be subject to production test. Single-ended Output Slew Rate definition Confidential - 28 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Parameter DDR3L-1600 Symbol Voltage Single ended output SRQse slew rate Units Min Max 1.35V 1.75 5(1) V/ns 1.5V 2.5 5 V/ns Description : SR : Slew Rate Q : Query Output (like in DQ, which stands for Data-in, Query-Output) se : Single-ended Signals For Ron = RZQ/7 setting NOTE : (1) In two cased, a maximum slew rate of 6V/ns applies for a single DQ signal within a byte lane. - Case_1 is defined for a single DQ signal within a byte lane which is switching into a certain direction (either from high to low of low to high) while all remaining DQ signals in the same byte lane are static (i.e they stay at either high or low). - Case_2 is defined for a single DQ signals in the same byte lane are switching into the opposite direction (i.e. from low to high or high to low respectively). For the remaining DQ signal switching into the opposite direction, the regular maximum limit of 5 V/ns applies. Differential Output Slew Rate With the reference load for timing measurements, output slew rate for falling and rising edges is defined and measured between VOLdiff(AC) and VOH-diff(AC) for differential signals. Measured Description Defined by From To Differential output slew rate for rising edge VOLdiff(AC) VOHdiff(AC) VOHdiff(AC)-VOLdiff(AC) Delta TRdiff Differential output slew rate for falling edge VOHdiff(AC) VOLdiff(AC) VOHdiff(AC)-VOLdiff(AC)) Delta TFdiff NOTE : Output slew rate is verified by design and characterization, and may not be subject to production test. Differential Output Slew Rate definition Parameter Differential output slew rate Confidential Symbol Voltage SRQdiff DDR3L-1600 Units Min Max 1.35V 3.5 12 V/ns 1.5V 5 10 V/ns - 29 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Description : SR : Slew Rate Q : Query Output (like in DQ, which stands for Data-in, Query-Output) diff : Differential Signals For Ron = RZQ/7 setting Reference Load for AC Timing and Output Slew Rate Figure represents the effective reference load of 25 ohms used in defining the relevant AC timing parameters of the device as well as output slew rate measurements. It is not intended as a precise representation of any particular system environment or a depiction of the actual load presented by a production tester. Sys-tem designers should use IBIS or other simulation tools to correlate the timing reference load to a system environment. Manufacturers correlate to their production test conditions, generally one or more coaxial transmission lines terminated at the tester electronics. Reference Load for AC Timing and Output Slew Rate Overshoot/Undershoot Specification Address and Control Overshoot and Undershoot specifications Specification Parameter DDR3L-1600 Unit Maximum peak amplitude allowed for overshoot area 0.4V V Maximum peak amplitude allowed for undershoot area 0.4V V Maximum overshoot area above VDD 0.33V-ns V-ns Maximum undershoot area below VSS 0.33V-ns V-ns Address and Control Overshoot and Undershoot Definition Confidential - 30 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Clock, Data, Strobe and Mask Overshoot and Undershoot Specifications Parameter Specification DDR3L-1600 Unit Maximum peak amplitude allowed for overshoot area 0.4V V Maximum peak amplitude allowed for undershoot area 0.4V V Maximum overshoot area above VDD 0.13V-ns V-ns Maximum undershoot area below VSS 0.13V-ns V-ns Clock, Data, Strobe, Mask Overshoot and Undershoot Definition Confidential - 31 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB IDD Specification VDD, VDDQ = 1.35V (1.283V to 1.45V) Data rate IDD max. (Mbps) Conditions Symbol Operating One Bank Active-Precharge Current; CKE: High; External clock: On; tCK, nRC, nRAS, CL: see timing used table; BL: 8; AL: 0; CS: High between ACT and PRE; Command, Address: partially toggling; Data IO: FLOATING; DM:stable at 0; Bank Activity: Cycling with one bank active at a time; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 IDD0 1600 45 mA Operating One Bank Active-Read-Precharge Current; CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, CL: see timing used table; BL: 81; AL: 0; CS: High between ACT, RD and PRE; Command, Address, Data IO: partially toggling; DM:stable at 0; Bank Activity: Cycling with one bank active at a time; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 IDD1 1600 60 mA Precharge Power-Down Current Slow Exit; CKE: Low; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: stable at 0; Data IO: FLOATING; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0; Pre-charge Power Down Mode: Slow Exit IDD2P0 1600 10 mA Precharge Power-Down Current Fast Exit; CKE: Low; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: stable at 0; Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0; Pre-charge Power Down Mode: Fast Exit IDD2P1 1600 16 mA IDD2N 1600 20 mA IDD2NT 1600 30 mA IDD2Q 1600 25 mA IDD3P 1600 15 mA Precharge Standby Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: partially toggling; Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 Precharge Standby ODT Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: partially toggling; Data IO: FLOATING; DM:stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: toggling Precharge Quiet Standby Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: stable at 0; Data IO: FLOATING; DM: stable at 0; Bank Activity: all banks closed; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 Active Power-Down Current; CKE: Low; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: stable at 0; Data IO: FLOATING; DM: stable at 0; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 Confidential - 32 of 47 - Unit Rev.1.0. Dec. 2017 AS4C512M8D3LB Conditions Symbol Active Standby Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: stable at 1; Command, Address: partially toggling; Data IO: FLOATING; DM: stable at 0; Bank Activity: all banks open; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 Data rate IDD max. (Mbps) Unit IDD3N 1600 30 mA Operating Burst Read Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: High between RD; Command, Address: partially toggling; Data IO: seamless read data burst with different data between one burst and the next one; DM: stable at 0; Bank Activity: all banks open, RD commands cycling through banks: 0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 IDD4R 1600 85 mA Operating Burst Write Current; CKE: High; External clock: On; tCK, CL: see timing used table; BL: 8; AL: 0; CS: High between WR; Command, Address: partially toggling; Data IO: seamless write data burst with different data between one burst and the next one; DM: stable at 0; Bank Activity: all banks open, WR commands cycling through banks: 0,0,1,1,2,2,...; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at HIGH IDD4W 1600 90 mA IDD5B 1600 160 mA IDD6 1600 10 mA Self Refresh Current: Extended Temperature Range; TCASE: 0- 105°C; Auto SelfRe-fresh (ASR): Disabled; Self-Refresh Temperature Range (SRT): Extended; CKE: Low; Ex-ternal clock: Off; CK and CK: LOW; CL: see timing used table; BL: 8; AL: 0; CS, IDD6ET Command, Address, Data IO: FLOATING; DM: stable at 0; Bank Activity: Extended Temperature Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: FLOATING 1600 15 mA Operating Bank Interleave Read Current; CKE: High; External clock: On; tCK, nRC, nRAS, nRCD, nRRD, nFAW, CL: see timing used table; BL: 8; AL: CL-1; CS: High between ACT and RDA; Command, Address: partially toggling; Data IO: read data bursts with different data between one burst and the next one; DM: stable at 0; Bank Activity: two times interleaved cycling through banks (0, 1, ...7) with different addressing; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 IDD7 1600 150 mA IDD8 1600 10 mA Burst Refresh Current; CKE: High; External clock: On; tCK, CL, nRFC: see timing used table; BL: 8; AL: 0; CS: High between REF; Command, Address: partially toggling; Data IO: FLOATING; DM:stable at 0; Bank Activity: REF command every nRFC; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: stable at 0 Self Refresh Current: Normal Temperature Range; TCASE: 0- 85°C; Auto Self-Refresh (ASR): Disabled; Self-Refresh Temperature Range (SRT): Normal; CKE: Low; External clock: Off; CK and CK: LOW; CL: see timing used table; BL: 8; AL: 0; CS, Command, Address, Data IO: FLOATING; DM: stable at 0; Bank Activity: Self-Refresh operation; Output Buffer and RTT: Enabled in Mode Registers; ODT Signal: FLOATING RESET Low Current; RESET: Low; External clock: off; CK and CK: LOW; CKE: FLOATING; CS, Command, Address, Data IO: FLOATING; ODT Signal : FLOATING NOTE : 1) Burst Length: BL8 fixed by MRS: set MR0 A[1,0]=00B 2) Output Buffer Enable: set MR1 A[12] = 0B; set MR1 A[5,1] = 01B; RTT_Nom enable: set MR1 A[9,6,2] = 011B; Confidential - 33 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB RTT_Wr enable: set MR2 A[10,9] = 10B 3) Precharge Power Down Mode: set MR0 A12=0B for Slow Exit or MR0 A12=1B for Fast Exit 4) Auto Self-Refresh (ASR): set MR2 A6 = 0B to disable or 1B to enable feature 5) Self-Refresh Temperature Range (SRT): set MR2 A7=0B for normal or 1B for extended temperature range 6) Refer to DRAM supplier data sheet and/or DIMM SPD to determine if optional features or requirements are supported by DDR3L SDRAM 7) Read Burst type : Nibble Sequential, set MR0 A[3]=0B Timing used for IDD and IDDQ Measured - Loop Patterns Speed DDR3L-1600 CL-nRCD-nRP 11-11-11 tCKmin 1.25 ns CL 11 nCK tRCDmin 11 nCK tRCmin 39 nCK tRASmin 28 nCK tRPmin 11 nCK tFAW 24 nCK tRRD 5 nCK tRFC 208 nCK Confidential - 34 of 47 - Unit Rev.1.0. Dec. 2017 AS4C512M8D3LB Input/Output Capacitance Parameter Symbol DDR3L-1600 Min Max Units NOTE 1.35V Input/output capacitance (DQ, DM, DQS, DQS) CIO 1.2 2.3 pF 1,2,3 Input capacitance (CK and CK) CCK 0.8 1.4 pF 2,3 CDCK 0 0.15 pF 2,3,4 CI 0.75 1.3 pF 2,3,6 CDDQS 0 0.15 pF 2,3,5 CDI_CTRL -0.4 0.2 pF 2,3,7,8 CDI_ADD_CMD -0.4 0.4 pF 2,3,9,10 Input/output capacitance delta (DQ, DM, DQS, DQS) CDIO -0.5 0.3 pF 2,3,11 Input/output capacitance of ZQ pin CZQ - 3 pF 2,3,12 Input capacitance delta (CK and CK) Input capacitance (All other input-only pins) Input capacitance delta (DQS and DQS) Input capacitance delta (All control input-only pins) Input capacitance delta (all ADD and CMD input-only pins) 1.5V Input/output capacitance (DQ, DM, DQS, DQS) CIO 1.4 2.3 pF 1,2,3 Input capacitance (CK and CK) CCK 0.8 1.4 pF 2,3 CDCK 0 0.15 pF 2,3,4 CI 0.75 1.3 pF 2,3,6 CDDQS 0 0.15 pF 2,3,5 CDI_CTRL -0.4 0.2 pF 2,3,7,8 CDI_ADD_CMD -0.4 0.4 pF 2,3,9,10 Input/output capacitance delta (DQ, DM, DQS, DQS) CDIO -0.5 0.3 pF 2,3,11 Input/output capacitance of ZQ pin CZQ - 3 pF 2,3,12 Input capacitance delta (CK and CK) Input capacitance (All other input-only pins) Input capacitance delta (DQS and DQS) Input capacitance delta (All control input-only pins) Input capacitance delta (all ADD and CMD input-only pins) Confidential - 35 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB NOTE : 1. Although the DM pin has different function, the loading matches DQ and DQS 2. This parameter is not subject to production test. It is verified by design and characterization. The capacitance is measured according to JEP147("PROCEDURE FOR MEASURING INPUT CAPACITANCE USING A VECTOR NETWORK ANALYZER( VNA)") with VDD, VDDQ, VSS, VSSQ applied and all other pins floating (except the pin under test, CKE, RESET and ODT as necessary). VDD=VDDQ=1.5V, VBIAS=VDD/2 and on-die termination off. 3. This parameter applies to monolithic devices only; stacked/dual-die devices are not covered here 4. Absolute value of CCK-CCK 5. Absolute value of CIO(DQS)-CIO(DQS) 6. CI applies to ODT, CS, CKE, A0-A15, BA0-BA2, RAS, CAS, WE 7. CDI_CTRL applies to ODT, CS and CKE 8. CDI_CTRL=CI(CTRL)-0.5*(CI(CLK)+CI(CLK)) 9. CDI_ADD_CMD applies to A0-A15, BA0-BA2, RAS, CAS and WE 10. CDI_ADD_CMD=CI(ADD_CMD) - 0.5*(CI(CLK)+CI(CLK)) 11. CDIO=CIO(DQ,DM) - 0.5*(CIO(DQS)+CIO(DQS)) 12. Maximum external load capacitance on ZQ pin: 5pF Confidential - 36 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB DDR3L-1600 Speed Bins Speed Bin DDR3L-1600 CL-nRCD-nRP Parameter 11-11-11 Unit Notes 20 ns 10 13.75 (13.125) - ns 10 tRP 13.75 (13.125) - ns 10 tRC 48.75 (48.125) - ns 10 Symbol Min Max tAA 13.75 (13.125) tRCD Precharge command period Active to active/auto-refresh command time Internal read command to first data Active to read or write delay time Active to precharge command period Average Clock Cycle Time CL = 5 CL = 6 CL = 7 CL = 8 CL = 9 CL = 10 CL = 11 tRAS 35 9 * tREFI ns 9 CWL = 5 tCK(avg) 3.0 3.3 ns 1,2,3,7 CWL = 6,7 tCK(avg) Reserved Reserved ns 4 CWL = 5 tCK(avg) 2.5 3.3 ns 1,2,3,7 CWL = 6 tCK(avg) Reserved Reserved ns 4 CWL = 7 tCK(avg) Reserved Reserved ns 4 CWL = 5 tCK(avg) Reserved Reserved ns 4 CWL = 6 tCK(avg) 1.875 < 2.5 ns 1,2,3,7 CWL = 7 tCK(avg) Reserved Reserved ns 4 CWL = 5 tCK(avg) Reserved Reserved ns 4 CWL = 6 tCK(avg) 1.875 < 2.5 ns 1,2,3,7 CWL = 7 tCK(avg) Reserved Reserved ns 4 CWL = 5, 6 tCK(avg) Reserved Reserved ns 4 CWL = 7 tCK(avg) 1.5 1.875 ns 1,2,3,7 CWL = 5, 6 tCK(avg) Reserved Reserved ns 4 CWL = 7 tCK(avg) 1.5 1.875 ns 1,2,3,7 CWL = 8 tCK(avg) Reserved Reserved ns 4 CWL = 5, 6,7 tCK(avg) Reserved Reserved ns 4 CWL = 8 tCK(avg) 1.25 1.5 ns 1,2,3 Supported CL setting Supported CWL setting Confidential - 37 of 47 - 5, 6, 7, 8, 9, 10,11 nCK 5, 6, 7, 8 nCK Rev.1.0. Dec. 2017 AS4C512M8D3LB Speed Bin Table Notes NOTE : 1. The CL setting and CWL setting result in tCK(avg) Min and tCK(avg) Max requirements. When making a selection of tCK(avg), both need to be fulfilled: Requirements from CL setting as well as requirements from CWL setting. 2. tCK(avg) Min limits: Since CAS Latency is not purely analog - data and strobe output are synchronized by the DLL all possible intermediate frequencies may not be guaranteed. An application should use the next smaller JEDEC standard tCK(avg) value (2.5, 1.875, 1.5, or 1.25 ns) when calculating CL [nCK] = tAA [ns] / tCK(avg) [ns], rounding up to the next "Supported CL". 3. tCK(avg) Max limits: Calculate tCK(avg) = tAA Max / CL Selected and round the resulting tCK(avg) down to the next valid speed bin (i.e. 3.3ns or 2.5ns or 1.875 ns or 1.25 ns). This result is tCK(avg) Max corresponding to CL selected. 4. "Reserved" settings are not allowed. User must program a different value. 5. Any DDR3L-1600 speed bin also supports functional operation at lower frequencies as shown in the table which are not subject to production tests but verified by design/characterization. 6. tREFI depends on operating case temperature (Tc). 7. For devices supporting optional downshift to CL=7 and CL=9, tAA/tRCD/tRP min must be 13.125 ns or lower. SPD settings must be programmed to match. For example, DDR3L-1333(CL9) devices supporting downshift to DDR3L-1066(CL7) should program 13.125 ns in SPD bytes for tAAmin (Byte 16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3L-1600(CL11) devices supporting downshift to DDR3L-1333(CL9) or DDR3L-1066(CL7) should program 13.125 ns in SPD bytes for tAAmin (Byte16), tRCDmin (Byte 18), and tRPmin (Byte 20). DDR3L-1600 devices supporting down binning to DDR3L-1333 or DDR3L-1066 should program 13.125ns in SPD byte for tAAmin (Byte 16), tRCDmin (Byte 18) and tRPmin (Byte 20). Once tRP (Byte 20) is programmed to 13.125ns, tRCmin (Byte 21,23) also should be programmed accod-ingly. For example, 49.125ns, (tRASmin + tRPmin = 36ns + 13.125ns) for DDR3L-1333 and 48.125ns (tRASmin + tRPmin = 35ns + 13.125ns) for DDR3L-1600. 8. For devices supporting optional down binning to CL=11, CL=9 and CL=7, tAA/tRCD/tRPmin must be 13.125ns. SPD setting must be programed to match. For example, DDR3L-1600 devices supporting down binning to DDR3L-1333 or 1066 should program 13.125ns in SPD bytes for tAAmin(byte16), tRCDmin(Byte18) and tRP-min (byte20). Once tRP (Byte20) is programmed to 13.125ns, tRCmin (Byte21,23) also should be programmed accordingly. For example, 47.125ns (tRASmin + tRPmin = 34ns + 13.125ns) Confidential - 38 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB AC Characteristics DDR3L-1600 Parameter Symbol Max Min Unit Note Average clock cycle time tCK(avg) Minimum clock cycle time (DLL-off mode) tCK (DLL-off) 8 - ns Average CK high level width tCH(avg) 0.47 0.53 tCK(avg) 0.47 0.53 tCK(avg) 6 - ns 4 - nCK 30 - ns - ps 16 - ps 16 - ps 16 - ps 16 - ps 16 - ps 16,24 - ps 17 - ps 17 - ps 17 - ps 17 Average CK low level width tCL(avg) Active Bank A to Active Bank B command period tRRD Four activate window tFAW Address and Control input hold time (VIH/VIL (DC) levels) ps Please refer Speed Bins 6 1.35V tIH(base) DC90 130 1.5V tIH(base) DC100 Address and Control input setup time (VIH/VIL (AC) levels) 120 1.35V tIS(base) AC160 60 1.5V tIS(base) AC175 Address and Control input setup time (VIH/VIL (AC) levels) 45 1.35V tIS(base) AC135 185 1.5V tIS(base) AC150 DQ and DM input hold time (VIH/VIL (DC) levels) 170 1.35V tDH(base) DC90 55 1.5V tDH(base) DC100 DQ and DM input setup time (VIH/VIL (AC) levels) 45 1.35V tDS(base) AC160 1.5V tDS(base) AC175 Confidential - - 39 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB DDR3L-1600 Parameter DQ and DM input setup time (VIH/VIL (AC) levels) Symbol Min Max Unit Note - ps 17 1.35V tDS(base) AC135 25 1.5V tDS(base) AC150 10 - ps 17 Control and Address Input pulse width for each input tIPW 560 - ps 25 DQ and DM Input pulse width for each input tDIPW 360 - ps 25 DQ high impedance time tHZ(DQ) - 225 ps 13,14 DQ low impedance time tLZ(DQ) -450 225 ps 13,14 DQS, DQS high impedance time (RL + BL/2 reference) tHZ(DQS) - 225 ps 13,14 DQS, DQS low impedance time (RL - 1 reference) tLZ(DQS) -450 225 ps 13,14 tDQSQ - 100 ps 12,13 CAS to CAS command delay tCCD 4 - nCK DQ output hold time from DQS, DQS tQH 0.38 - tCK(avg) 12,13 DQS, DQS rising edge output access time from rising CK, CK tDQSCK -225 225 ps 12,13 DQS latching rising transitions to associated clock edges tDQSS -0.27 0.27 tCK(avg) DQS falling edge hold time from rising CK tDSH 0.18 - tCK(avg) 29 DQS falling edge setup time to rising CK tDSS 0.18 - tCK(avg) 29 DQS input high pulse width tDQSH 0.45 0.55 tCK(avg) 27,28 DQS input low pulse width tDQSL 0.45 0.55 tCK(avg) 26,28 DQS output high time tQSH 0.40 - tCK(avg) 12,13 DQS output low time tQSL 0.40 - tCK(avg) 12,13 4 - nCK 15 - ns 12 - nCK 0.9 - tCK(avg) 13,19 tCK(avg) 11,13 DQS, DQS to DQ Skew, per group, per access Mode register set command cycle time tMRD Mode register set command update delay tMOD Read preamble time tRPRE Read postamble time tRPST 0.3 - Write preamble time tWPRE 0.9 - tCK(avg) 1 Write postamble time tWPST 0.3 - tCK(avg) 1 tWR 15 - ns Write recovery time Auto precharge write recovery + Precharge time Confidential tDAL(min) WR + roundup [tRP / tCK(avg)] - 40 of 47 - nCK Rev.1.0. Dec. 2017 AS4C512M8D3LB DDR3L-1600 Parameter Multi-purpose register recovery time Internal write to read command delay Internal read to precharge command delay Symbol tMPRR tWTR tRTP Min Max Unit Note 1 - nCK 22 7.5 - ns 18 4 - nCK 18 7.5 - ns nCK 4 - tCKE(min) +1nCK - 10 - ns 5 - nCK 10 - ns 5 - nCK tRFC(min) +10 - 5 - tXSDLL tDLLK (min) - Auto-refresh to Active/Auto-refresh command time tRFC 260 - Average Periodic Refresh Interval -40°C < Tc < +85°C tREFI - 7.8 Average Periodic Refresh Interval +85°C < Tc < +105°C tREFI - 3.9 CKE minimum high and low pulse width tCKE Minimum CKE low width for Self-refresh entry to exit timing tCKESR Valid clock requirement after Selfrefresh entry or Power-down entry tCKSRE Valid clock requirement before Selfrefresh exit or Power-down exit tCKSRX Exit Self-refresh to commands not requiring a locked DLL Exit Self-refresh to commands requiring a locked DLL tXS ns nCK nCK ns μs μs 5 - ns 3 - nCK tRFC(min) +10 - 5 - nCK nCK ns Exit reset from CKE high to a valid command tXPR DLL locking time tDLLK 512 - tPD tCKE(min) 9*tREFI 24 - ns 2 10 - nCK 2 6 - ns 3 - nCK - nCK Power-down entry to exit time Exit precharge power-down with DLL frozen to commands requiring a locked DLL Exit power-down with DLL on to any valid command; Exit precharge power-down with DLL frozen to commands not requiring a locked DLL Command pass disable delay tXPDLL tXP tCPDED 1 Timing of ACT command to Power-down entry tACTPDEN 1 Timing of PRE command to Power-down entry tPRPDEN 1 Timing of RD/RDA command to Power-down entry tRDPDEN RL+4+1 Confidential - 41 of 47 - - 15 nCK 20 nCK 20 nCK Rev.1.0. Dec. 2017 AS4C512M8D3LB DDR3L-1600 Parameter Symbol Timing of WR command to Power-down entry (BL8OTF, BL8MRS, BL4OTF) tWRPDEN (min) Timing of WR command to Power-down entry (BC4MRS) tWRPDEN (min) Min Max Unit Note WL + 4 + [tWR/tCK(avg)] nCK 9 WL + 2 + [tWR/tCK(avg)] nCK 9 nCK 10 nCK 10 nCK 20,21 7 Timing of WRA command to Power-down tWRAPDEN entry (BL8OTF, BL8MRS, BL4OTF) WL+4 +WR+1 - Timing of WRA command to Power-down tWRAPDEN entry (BC4MRS) WL+2 +WR+1 - Timing of REF command to Power-down entry 1 tREFPDEN - Timing of MRS command to Power-down tMRSPDEN entry tMOD (min) - RTT turn-on tAON -225 225 ps tAONPD 2 8.5 ns tAOF 0.3 0.7 tCK(avg) tAOFPD 2 8.5 ns Asynchronous RTT turn-on delay (Power-down with DLL frozen) RTT_Nom and RTT_WR turn-off time from ODTLoff reference Asynchronous RTT turn-off delay (Power-down with DLL frozen) ODT high time without write command or with write command and BC4 ODTH4 ODT high time with Write command and BL8 ODTH8 4 6 - 8 nCK nCK RTT dynamic change skew tADC 0.3 0.7 tCK(avg) Power-up and reset calibration time tZQinit 512 - nCK Normal operation full calibration time tZQoper 256 - nCK Normal operation short calibration time tZQCS 64 - nCK 23 First DQS pulse rising edge after write leveling mode is programmed tWLMRD 40 nCK 3 tWLDQSEN 25 nCK 3 Write leveling setup time from rising CK, CK crossing to rising DQS, DQS crossing tWLS 165 Write leveling hold time from rising DQS, DQS crossing to rising CK, CK crossing tWLH 165 Write leveling output delay tWLO 0 Write leveling output error tWLOE Absolute clock period DQS, DQS delay after write leveling mode is pro-grammed - ps ps 7.5 ns 0 2 ns tCK(abs) tCK(avg)min + tJIT(per)min tCK(avg)max + tJIT(per)max ps Absolute clock high pulse width tCH(abs) 0.43 - tCK(avg) 30 Absolute clock low pulse width tCL(abs) 0.43 - tCK(avg) 31 tJIT(per) -70 70 ps tJIT(per,lck) -60 60 ps Clock period jitter Clock period jitter during DLL locking period Confidential - 42 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB DDR3L-1600 Parameter Symbol Min Max Unit Cycle to cycle period jitter tJIT(cc) - 140 ps Cycle to cycle period jitter during DLL locking period tJIT(cc,lck) - 120 ps Cumulative error across 2 cycles tERR(2per) -103 103 ps Cumulative error across 3 cycles tERR(3per) -122 122 ps Cumulative error across 4 cycles tERR(4per) -136 136 ps Cumulative error across 5 cycles tERR(5per) -147 147 ps Cumulative error across 6 cycles tERR(6per) -155 155 ps Cumulative error across 7 cycles tERR(7per) -163 163 ps Cumulative error across 8 cycles tERR(8per) -169 169 ps Cumulative error across 9 cycles tERR(9per) -175 175 ps 180 ps Cumulative error across 10 cycles tERR(10per) -180 Cumulative error across 11 cycles tERR(11per) -184 184 ps Cumulative error across 12 cycles tERR(12per) -188 188 ps Cumulative error across n = 13,14,...49,50 cycles tERR(nper) Confidential tERR(nper)min = (1 + 0.68ln(n))*tJIT(per)min tERR(nper)max = (1 + 0.68ln(n))*tJIT(per)max - 43 of 47 - ps Note 32 Rev.1.0. Dec. 2017 AS4C512M8D3LB Notes for AC Electrical Characteristics NOTE : 1. Actual value dependant upon measurement level definitions which are TBD. 2. Commands requiring a locked DLL are: READ (and READA) and synchronous ODT commands. 3. The max values are system dependent. 4. WR as programmed in mode register. 5. Value must be rounded-up to next higher integer value. 6. There is no maximum cycle time limit besides the need to satisfy the refresh interval, tREFI. 7. ODT turn on time (min.) is when the device leaves high impedance and ODT resistance begins to turn on. ODT turn on time (max.) is when the ODT resistance is fully on. Both are measured from ODTLon. 8. ODT turn-off time (min.) is when the device starts to turn-off ODT resistance. ODT turn-off time (max.) is when the bus is in high impedance. Both are measured from ODTLoff. 9. tWR is defined in ns, for calculation of tWRPDEN it is necessary to round up tWR / tCK to the next integer. 10. WR in clock cycles as programmed in MR0. 11. The maximum read postamble is bound by tDQSCK(min) plus tQSH(min) on the left side and tHZ(DQS)max on the right side. 12. Output timing deratings are relative to the SDRAM input clock. When the device is operated with input clock jitter, this parameter needs to be derated by TBD. 13. Value is only valid for RON34. 14. Single ended signal parameter. Refer to the section of tLZ(DQS), tLZ(DQ), tHZ(DQS), tHZ(DQ) Notes for definition and measurement method. 15. tREFI depends on operating case temperature (Tc). 16. tIS(base) and tIH(base) values are for 1V/ns command/addresss single-ended slew rate and 2V/ns CK, CK differential slew rate, Note for DQ and DM signals, VREF(DC) = VREFDQ(DC). For input only pins except RESET, VREF(DC) = VREFCA(DC). See Address / Command Setup, Hold and Derating section. 17. tDS(base) and tDH(base) values are for 1V/ns DQ single-ended slew rate and 2V/ns DQS, DQS differential slew rate. Note for DQ and DM signals,VREF(DC)= VREFDQ(DC). For input only pins except RESET, VREF(DC) = VREFCA(DC). See Data Setup, Hold and and Slew Rate Derating section. 18. Start of internal write transaction is defined as follows ; For BL8 (fixed by MRS and on-the-fly) : Rising clock edge 4 clock cycles after WL. For BC4 (on-the-fly) : Rising clock edge 4 clock cycles after WL. For BC4 (fixed by MRS) : Rising clock edge 2 clock cycles after WL. 19. The maximum read preamble is bound by tLZDQS(min) on the left side and tDQSCK(max) on the right side. 20. CKE is allowed to be registered low while operations such as row activation, precharge, autoprecharge or refresh are in progress, but power-down IDD spec will not be applied until finishing those operation. 21. Although CKE is allowed to be registered LOW after a REFRESH command once tREFPDEN(min) is satisfied, there are cases where additional time such as tXPDLL(min) is also required. 22. Defined between end of MPR read burst and MRS which reloads MPR or disables MPR function. 23. One ZQCS command can effectively correct a minimum of 0.5 % (ZQCorrection) of RON and RTT impedance error within 64 nCK for all speed bins assuming the maximum sensitivities specified in the “Output Driver Voltage and Temperature Sensitivity” and “ODT Voltage and Temperature Sensitivity” tables. The appropriate interval between ZQCS commands can be determined from these tables and other application specific parameters. One method for calculating the interval between ZQCS commands, given the temperature (Tdriftrate) and voltage (Vdriftrate) drift rates that the SDRAM is subject to in the application, is illustrated. The interval could be defined by the following formula: ZQCorrection (TSens x Tdriftrate) + (VSens x Vdriftrate) where TSens = max(dRTTdT, dRONdTM) and VSens = max(dRTTdV, dRONdVM) define the SDRAM temperature and voltage sensitivities. 24. The tIS(base) AC150 specifications are adjusted from the tIS(base) specification by adding an additional 100 ps of Confidential - 44 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB derating to accommodate for the lower alternate threshold of 150 mV and another 25 ps to account for the earlier reference point [(175 mv - 150 mV) / 1 V/ns]. 25. Pulse width of a input signal is defined as the width between the first crossing of VREF(DC) and the consecutive crossing of VREF(DC). 26. tDQSL describes the instantaneous differential input low pulse width on DQS - DQS, as measured from one falling edge to the next consecutive rising edge. 27. tDQSH describes the instantaneous differential input high pulse width on DQS - DQS, as measured from one rising edge to the next consecutive falling edge. 28. tDQSH,act + tDQSL,act = 1 tCK,act ; with tXYZ,act being the actual measured value of the respective timing parameter in the application. 29. tDSH,act + tDSS,act = 1 tCK,act ; with tXYZ,act being the actual measured value of the respective timing parameter in the application. 30. tCH(abs) is the absolute instantaneous clock high pulse width, as measured from one rising edge to the following falling edge. 31. tCL(abs) is the absolute instantaneous clock low pulse width, as measured from one falling edge to the following rising edge. 32. n = from 13 cycles to 50 cycles. This row defines 38 parameters. Confidential - 45 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB Package Diagram (x8) 78-Ball Fine Pitch Ball Grid Array Outline 21/71!,0.!1/2 :/1!,0.!1/2 voju;nn Confidential - 46 of 47 - Rev.1.0. Dec. 2017 AS4C512M8D3LB PART NUMBERING SYSTEM AS4C 512M8D3LB DRAM 512M8=512Mx8 D3L=LPDDR3 B=B die version 12 B C/I/A N XX C=Commercial (0° C~+95° C) 12=800MHz B = FBGA I=Industrial (-40° C~+95° C) A=Automotive Indicates Pb and Halogen Free Packing Type None:Tray TR:Reel (-40° C~+105° C) Alliance Memory, Inc. 511 Taylor Way, San Carlos, CA 94070 Tel: 650-610-6800 Fax: 650-620-9211 www.alliancememory.com Copyright © Alliance Memory All Rights Reserved © Copyright 2007 Alliance Memory, Inc. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Confidential - 47 of 47 - Rev.1.0. Dec. 2017