AS7C33256FT18B

December 2004 ® AS7C33256FT18B 3.3V 256K × 18 Flow Through Synchronous SRAM Features • • • • • • • Organization: 262,144 words × 18 bits Fast clock to data access: 6.5/7.5/8.0/10.0 ns Fast OE access time: 3.5/4.0 ns Fully synchronous flow through operation Asynchronous output enable control Availalbe in 100-pin TQFP package Individual byte write and Global write • • • • • • Multiple chip enables for easy expansion 3.3V core power supply 2.5V or 3.3V I/O operation with separate VDDQ Linear or interleaved burst control Snooze mode for reduced power standby Common data inputs and data outputs Logic block diagram LBO CLK ADV ADSC ADSP A[17:0] CLK CS CLR Burst logic 2 2 18 Q D CS Address register CLK 256K × 18 Memory array 18 16 18 18 18 GWE BWb BWE BWa CE0 CE1 CE2 D DQb Q Byte Write registers CLK D DQa Q Byte Write registers CLK D 2 OE Enable register Q CE CLK Output Buffers Input registers CLK ZZ Power down D Enable Q delay register CLK OE 18 DQ [a,b] Selection guide –65 Minimum cycle time Maximum clock access time Maximum operating current Maximum standby current Maximum CMOS standby current (DC) 7.5 6.5 250 120 30 -75 8.5 7.5 225 100 30 -80 10 8.0 200 90 30 -10 12 10.0 175 90 30 Units ns ns mA mA mA 12/10/04; v.1.4 Alliance Semiconductor P. 1 of 19 Copyright © Alliance Semiconductor. All rights reserved. AS7C33256FT18B ® 4 Mb Synchronous SRAM products list1,2 Org 256KX18 128KX32 128KX36 256KX18 128KX32 128KX36 256KX18 128KX32 128KX36 256KX18 128KX32 128KX36 256KX18 128KX32 128KX36 Part Number AS7C33256PFS18B AS7C33128PFS32B AS7C33128PFS36B AS7C33256PFD18B AS7C33128PFD32B AS7C33128PFD36B AS7C33256FT18B AS7C33128FT32B AS7C33128FT36B AS7C33256NTD18B AS7C33128NTD32B AS7C33128NTD36B AS7C33256NTF18B AS7C33128NTF32B AS7C33128NTF36B Mode PL-SCD PL-SCD PL-SCD PL-DCD PL-DCD PL-DCD FT FT FT NTD-PL NTD-PL NTD-PL NTD-FT NTD-FT NTD-FT Speed 200/166/133 MHz 200/166/133 MHz 200/166/133 MHz 200/166/133 MHz 200/166/133 MHz 200/166/133 MHz 6.5/7.5/8.0/10 ns 6.5/7.5/8.0/10 ns 6.5/7.5/8.0/10 ns 200/166/133 MHz 200/166/133 MHz 200/166/133 MHz 6.5/7.5/8.0/10 ns 6.5/7.5/8.0/10 ns 6.5/7.5/8.0/10 ns 1 Core Power Supply: VDD = 3.3V + 0.165V 2 I/O Supply Voltage: VDDQ = 3.3V + 0.165V for 3.3V I/O VDDQ = 2.5V + 0.125V for 2.5V I/O PL-SCD PL-DCD FT NTD1-PL NTD-FT : : : : : Pipelined Burst Synchronous SRAM - Single Cycle Deselect Pipelined Burst Synchronous SRAM - Double Cycle Deselect Flow-through Burst Synchronous SRAM Pipelined Burst Synchronous SRAM with NTDTM Flow-through Burst Synchronous SRAM with NTDTM 1. NTD: No Turnaround Delay. NTDTM is a trademark of Alliance Semiconductor Corporation. All trademarks mentioned in this document are the property of their respective owners. 12/10/04; v.1.4 Alliance Semiconductor P. 2 of 19 AS7C33256FT18B ® Pin arrangement 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 A A CE0 CE1 NC NC BWb BWa CE2 VDD VSS CLK GWE BWE OE ADSC ADSP ADV A A NC NC NC VDDQ VSSQ NC NC DQb0 DQb1 VSSQ VDDQ DQb2 DQb3 NC VDD NC VSS DQb4 DQb5 VDDQ VSSQ DQb6 DQb7 DQpb NC VSSQ VDDQ NC NC NC 12/10/04; v.1.4 LBO A A A A A1 A0 NC NC VSS VDD NC NC A A A A A A A 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 TQFP 14 × 20mm 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 A NC NC VDDQ VSSQ NC DQpa DQa7 DQa6 VSSQ VDDQ DQa5 DQa4 VSS NC VDD ZZ DQa3 DQa2 VDDQ VSSQ DQa1 DQa0 NC NC VSSQ VDDQ NC NC NC Alliance Semiconductor P. 3 of 19 AS7C33256FT18B ® Functional description The AS7C33256FT18B is a high-performance CMOS 4-Mbit synchronous Static Random Access Memory (SRAM) device organized as 262,144 words × 18 bits. Fast cycle times of 7.5/8.5/10/12 ns with clock access times (tCD) of 6.5/7.5/8.0/10 ns. Three chip enable (CE) inputs permit easy memory expansion. Burst operation is initiated in one of two ways: the controller address strobe (ADSC), or the processor address strobe (ADSP). The burst advance pin (ADV) allows subsequent internally generated burst addresses. Read cycles are initiated with ADSP (regardless of WE and ADSC) using the new external address clocked into the on-chip address register when ADSP is sampled low, the chip enables are sampled active, and the output buffer is enabled with OE. In a read operation, the data accessed by the current address registered in the address registers by the positive edge of CLK are carried to the data-out buffer. ADV is ignored on the clock edge that samples ADSP asserted, but is sampled on all subsequent clock edges. Address is incremented internally for the next access of the burst when ADV is sampled low and both address strobes are high. Burst mode is selectable with the LBO input. With LBO unconnected or driven high, burst operations use an interleaved count sequence. With LBO driven low, the device uses a linear count sequence. Write cycles are performed by disabling the output buffers with OE and asserting a write command. A global write enable GWE writes all 18 bits regardless of the state of individual BW[a,b] inputs. Alternately, when GWE is high, one or more bytes may be written by asserting BWE and the appropriate individual byte BWn signals. BWn is ignored on the clock edge that samples ADSP low, but it is sampled on all subsequent clock edges. Output buffers are disabled when BWn is sampled LOW regardless of OE. Data is clocked into the data input register when BWn is sampled low. Address is incremented internally to the next burst address if BWn and ADV are sampled low. Read or write cycles may also be initiated with ADSC instead of ADSP. The differences between cycles initiated with ADSC and ADSP are as follows: • ADSP must be sampled high when ADSC is sampled low to initiate a cycle with ADSC. • WE signals are sampled on the clock edge that samples ADSC low (and ADSP high). • Master chip enable CE0 blocks ADSP, but not ADSC. The AS7C33256FT18B family operates from a core 3.3V power supply. I/Os use a separate power supply that can operate at 2.5V or 3.3V. These devices are available in a 100-pin TQFP package. TQFP capacitance Parameter Input capacitance I/O capacitance *Guaranteed not tested Symbol CIN* CI/O* Test conditions VIN = 0V VOUT = 0V Min - Max 5 7 Unit pF pF TQFP thermal resistance Description Thermal resistance (junction to ambient)1 Thermal resistance (junction to top of case)1 1 This parameter is sampled Conditions 1–layer Test conditions follow standard test methods and procedures for measuring thermal impedance, per EIA/JESD51 4–layer Symbol θJA θJA θJC Typical 40 22 8 Units °C/W °C/W °C/W 12/10/04; v.1.4 Alliance Semiconductor P. 4 of 19 AS7C33256FT18B ® Signal descriptions Pin CLK A,A0,A1 DQ[a,b] CE0 CE1, CE2 ADSP ADSC ADV GWE BWE BW[a,b] OE LBO ZZ NC I/O I I I/O I I I I I I I I I I I Properties CLOCK SYNC SYNC SYNC SYNC SYNC SYNC SYNC SYNC SYNC SYNC ASYNC STATIC ASYNC - Description Clock. All inputs except OE, ZZ, and LBO are synchronous to this clock. Address. Sampled when all chip enables are active and when ADSC or ADSP are asserted. Data. Driven as output when the chip is enabled and when OE is active. Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0 is inactive, ADSP is blocked. Refer to the “Synchronous truth table” for more information. Synchronous chip enables, active high, and active low, respectively. Sampled on clock edges when ADSC is active or when CE0 and ADSP are active. Address strobe processor. Asserted low to load a new address or to enter standby mode. Address strobe controller. Asserted low to load a new address or to enter standby mode. Advance. Asserted low to continue burst read/write. Global write enable. Asserted low to write all 18 bits. When high, BWE and BW[a,b] control write enable. Byte write enable. Asserted low with GWE high to enable effect of BW[a,b] inputs. Write enables. Used to control write of individual bytes when GWE is high and BWE is low. If any of BW[a,b] is active with GWE high and BWE low, the cycle is a write cycle. If all BW[a,b] are inactive, the cycle is a read cycle. Asynchronous output enable. I/O pins are driven when OE is active and chip is in read mode. Selects Burst mode. When tied to VDD or left floating, device follows interleaved Burst order. When driven Low, device follows linear Burst order. This signal is internally pulled High. Snooze. Places device in low power mode; data is retained. Connect to GND if unused. No connect Snooze Mode SNOOZE MODE is a low current, power-down mode in which the device is deselected and current is reduced to ISB2. The duration of SNOOZE MODE is dictated by the length of time the ZZ is in a High state. The ZZ pin is an asynchronous, active high input that causes the device to enter SNOOZE MODE. When the ZZ pin becomes a logic High, ISB2 is guaranteed after the time tZZI is met. After entering SNOOZE MODE, all inputs except ZZ is disabled and all outputs go to High-Z. Any operation pending when entering SNOOZE MODE is not guaranteed to successfully complete. Therefore, SNOOZE MODE (READ or WRITE) must not be initiated until valid pending operations are completed. Similarly, when exiting SNOOZE MODE during tPUS, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SNOOZE MODE. 12/10/04; v.1.4 Alliance Semiconductor P. 5 of 19 AS7C33256FT18B ® Write enable truth table (per byte) Function Write All Bytes GWE L H BWE X L L L H L BWa X L L H X H BWb X L H L X H Write Byte a Write Byte b Read H H H H Key: X = don’t care, L = low, H = high, n = a, b; BWE, BWn = internal write signal. Asynchronous Truth Table Operation Snooze mode Read Write Deselected ZZ H L L L L OE X L H X X I/O Status High-Z Dout High-Z Din, High-Z High-Z Notes: 1. X means “Don’t Care” 2. ZZ pin is pulled down internally 3. For write cycles that follows read cycles, the output buffers must be disabled with OE, otherwise data bus contention will occur. 4. Snooze mode means power down state of which stand-by current does not depend on cycle times 5. Deselected means power down state of which stand-by current depends on cycle times Burst sequence table Interleaved burst address (LBO = 1) A1 A0 1st Address 2nd Address 3rd Address 4 Address th Linear burst address (LBO = 0) A1 A0 11 10 01 00 1st Address 2nd Address 3rd Address 4 Address th A1 A0 01 00 11 10 A1 A0 10 11 00 01 A1 A0 00 01 10 11 A1 A0 01 10 11 10 A1 A0 10 11 00 01 A1 A0 11 00 01 10 00 01 10 11 12/10/04; v.1.4 Alliance Semiconductor P. 6 of 19 AS7C33256FT18B ® Synchronous truth table[4] CE01 CE1 CE2 ADSP ADSC ADV WRITE[2] OE Address accessed CLK Operation DQ H L L L L L L L L X X X X H H H H L X H X H X L L X X H H H H X X X X X X X X H X X X X X X X H H L L L L X X X X X X X X L X X X X X L H L H L L H H H H H H X X X X H H X H X L X L X L X X L L H H H H H H H H L H H H H X X X X X X X X X L L H H L L H H X L L H H X X X X X X X H H H H H H H H H H L L L L L X X X X X L H L H L H L H L H L H X X X X X NA NA NA NA NA External External External External Next Next Current Current Next Next Current Current External Next Next Current Current L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H L to H Deselect Deselect Deselect Deselect Deselect Begin read Begin read Begin read Begin read Continue read Continue read Suspend read Suspend read Continue read Continue read Suspend read Suspend read Begin write Continue write Continue write Suspend write Suspend write Hi−Z Hi−Z Hi−Z Hi−Z Hi−Z Q Hi−Z Q Hi−Z Q Hi−Z Q Hi−Z Q Hi−Z Q Hi−Z D3 D D D D 1 X = don’t care, L = low, H = high 2 For WRITE, L means any one or more byte write enable signals (BWa or BWb) and BWE are LOW or GWE is LOW. WRITE = HIGH for all BWx, BWE, GWE HIGH. See "Write enable truth table (per byte)," on page 6 for more information. 3 For write operation following a READ, OE must be high before the input data set up time and held high throughout the input hold time 4 ZZ pin is always Low. 12/10/04; v.1.4 Alliance Semiconductor P. 7 of 19 AS7C33256FT18B ® Absolute maximum ratings1 Parameter Power supply voltage relative to GND Input voltage relative to GND (input pins) Input voltage relative to GND (I/O pins) Power dissipation DC output current Storage temperature (plastic) Temperature under bias Symbol VDD, VDDQ VIN VIN PD IOUT Tstg Tbias Min –0.5 –0.5 –0.5 – – –65 –65 Max +4.6 VDD + 0.5 VDDQ + 0.5 1.8 50 +150 +135 Unit V V V W mA °C °C . 1 Stresses greater than those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions outside those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions may affect reliability. Recommended operating conditions at 3.3V I/O Parameter Supply voltage for inputs Supply voltage for I/O Ground supply Symbol VDD VDDQ Vss Min 3.135 3.135 0 Nominal 3.3 3.3 0 Max 3.465 3.465 0 Unit V V V Recommended operating conditions at 2.5V I/O Parameter Supply voltage for inputs Supply voltage for I/O Ground supply Symbol VDD VDDQ Vss Min 3.135 2.375 0 Nominal 3.3 2.5 0 Max 3.465 2.625 0 Unit V V V 12/10/04; v.1.4 Alliance Semiconductor P. 8 of 19 AS7C33256FT18B ® DC electrical characteristics for 3.3V I/O operation Parameter Input leakage current† Sym |ILI| |ILO| VIH Conditions VDD = Max, 0V < VIN < VDD OE ≥ VIH, VDD = Max, 0V < VOUT < VDDQ Address and control pins Input high (logic 1) voltage I/O pins Address and control pins Input low (logic 0) voltage Output high voltage Output low voltage VIL VOH VOL I/O pins IOH = –4 mA, VDDQ = 3.135V IOL = 8 mA, VDDQ = 3.465V Min -2 -2 2* 2* -0.3** -0.5** 2.4 – Max 2 2 VDD+0.3 VDDQ+0.3 0.8 V 0.8 – 0.4 V V Unit µA µA V Output leakage current DC electrical characteristics for 2.5V I/O operation Parameter Input leakage current† Sym |ILI| |ILO| VIH Conditions VDD = Max, 0V < VIN < VDD OE ≥ VIH, VDD = Max, 0V < VOUT < VDDQ Address and control pins Input high (logic 1) voltage I/O pins Address and control pins Input low (logic 0) voltage Output high voltage Output low voltage VIL VOH VOL I/O pins IOH = –4 mA, VDDQ = 2.375V IOL = 8 mA, VDDQ = 2.625V Min -2 -2 1.7* 1.7* -0.3** -0.3** 1.7 – Max 2 2 VDD+0.3 VDDQ+0.3 0.7 0.7 – 0.7 Unit µA µA V V V V V V Output leakage current † LBO and ZZ pins have an internal pull-up or pull-down, and input leakage = ±10 µA. *V max < VDD +1.5V for pulse width less than 0.2 X t IH CYC ** VIL min = -1.5 for pulse width less than 0.2 X tCYC IDD operating conditions and maximum limits Parameter Operating power supply current1 Sym ICC ISB Standby power supply current ISB1 ISB2 Conditions CE0 < VIL, CE1 > VIH, CE2 < VIL, f = fMax, IOUT = 0 mA, ZZ < VIL All VIN ≤ 0.2V or > VDD – 0.2V, Deselected, f = fMax, ZZ < VIL Deselected, f = 0, ZZ < 0.2V, all VIN ≤ 0.2V or ≥ VDD – 0.2V Deselected, f = fMax, ZZ ≥ VDD – 0.2V, all VIN ≤ VIL or ≥ VIH -65 250 -75 225 -80 200 -10 175 Unit mA 120 30 30 100 30 30 90 30 30 90 30 30 mA 1 ICC given with no output loading. ICC increases with faster cycle times and greater output loading. 12/10/04; v.1.4 Alliance Semiconductor P. 9 of 19 AS7C33256FT18B ® Timing characteristics over operating range –65 Parameter Cycle time Clock access time Output enable LOW to data valid Clock HIGH to output Low Z Data output invalid from clock HIGH Output enable LOW to output Low Z Output enable HIGH to output High Z Clock HIGH to output High Z Output enable HIGH to invalid output Clock HIGH pulse width Clock LOW pulse width Address setup to clock HIGH Data setup to clock HIGH Write setup to clock HIGH Chip select setup to clock HIGH Address hold from clock HIGH Data hold from clock HIGH Write hold from clock HIGH Chip select hold from clock HIGH ADV setup to clock HIGH ADSP setup to clock HIGH ADSC setup to clock HIGH ADV hold from clock HIGH ADSP hold from clock HIGH ADSC hold from clock HIGH 1 See “Notes” on page 16. -75 – 8.5 – – 2.5 2.5 0 – – 0 3.0 3.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 2.0 2.0 2.0 0.5 0.5 0.5 – 7.5 3.5 – – – 3.5 3.5 – – – – – – – – – – – – – – – – – 10 – – 2.5 2.5 0 – – 0 4.0 4.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 2.0 2.0 2.0 0.5 0.5 0.5 -80 – 8.0 4.0 – – – 4.0 4.0 – – – – – – – – – – – – – – – – – 12 – – 2.5 2.5 0 – – 0 4.0 4.0 2.0 2.0 2.0 2.0 0.5 0.5 0.5 0.5 2.0 2.0 2.0 0.5 0.5 0.5 –10 Min Max – 10 4.0 – – – 5.0 5.0 – – – – – – – – – – – – – – – – – Unit ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns Notes 1 Sym tCYC tCD tOE tLZC tOH tLZOE tHZOE tHZC tOHOE tCH tCL tAS tDS tWS tCSS tAH tDH tWH tCSH tADVS tADSPS tADSCS tADVH tADSPH tADSCH Min Max Min Max Min Max 7.5 – – 2.5 2.5 0 – – 0 2.5 2.5 1.5 1.5 1.5 1.5 0.5 0.5 0.5 0.5 1.5 1.5 1.5 0.5 0.5 0.5 6.5 3.5 – – – 3.0 3.0 – – – – – – – – – – – – – – – – – 2,3,4 2 2,3,4 2,3,4 2,3,4 5 5 6 6 6,7 6,8 6 6 6,7 6,8 6 6 6 6 6 6 Snooze Mode Electrical Characteristics Description Conditions Symbol Min Max Units Current during Snooze Mode ZZ active to input ignored ZZ inactive to input sampled ZZ active to SNOOZE current ZZ inactive to exit SNOOZE current 12/10/04; v.1.4 ZZ > VIH ISB2 tPDS tPUS tZZI tRZZI 30 2 2 2 0 mA cycle cycle cycle Alliance Semiconductor P. 10 of 19 AS7C33256FT18B ® Key to switching waveforms Rising input Falling input don’t care Undefined Timing waveform of read cycle tCH CLK tADSPS ADSP tADSCS ADSC tAS Address A1 tWS GWE, BWE tCSS CE0, CE2 tCSH tAH A2 tWH LOAD NEW ADDRESS A3 tADSCH tADSPH tCYC tCL CE1 tADVS ADV ADV inserts wait states OE tADVH tOE tLZOE Dout Q(A1) tHZOE tOH Q(A2Ý01) Q(A2Ý10) Q(A2Ý11) Q(A3) Q(A3Ý01) Q(A3Ý10) Q(A3Ý11) tCD Read Q(A1) Suspend Read Q(A1) Read Q(A2) Burst Burst Read Suspend Burst Burst Burst Burst Read Read Q(A3) Read Read Read Read Read Q(A 2Ý01) Q(A 2Ý10) Q(A 2Ý10) Q(A 2Ý11) Q(A 3Ý01) Q(A 3Ý10) Q(A 3Ý11) tHZC DSEL Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low. BW[a:d] is don’t care. 12/10/04; v.1.4 Alliance Semiconductor P. 11 of 19 AS7C33256FT18B ® Timing waveform of write cycle tCYC tCL tCH CLK tADSPS tADSPH ADSP tADSCS tADSCH ADSC tAS tAH Address A1 A2 ADSC LOADS NEW ADDRESS A3 tWS tWH BWE BW[a:b] tCSS tCSH CE0, CE2 CE1 ADV SUSPENDS BURST ADV tADVS tADVH OE tDS tDH Din Read Q(A1) D(A1) D(A2) D(A2Ý01) D(A2Ý01) D(A2Ý10) D(A2Ý11) D(A3) D(A3Ý01) D(A3Ý10) Suspend Write D(A1) Read Q(A2) Suspend Write D(A 2) ADV Suspend ADV ADV Burst Write Burst Burst Write D(A 2Ý01) Write Write D(A 2Ý01) D(A 2Ý10) D(A 2Ý11) Write D(A 3) Burst Write D(A 3Ý01) ADV Burst Write D(A 3Ý10) Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low. 12/10/04; v.1.4 Alliance Semiconductor P. 12 of 19 AS7C33256FT18B ® Timing waveform of read/write cycle (ADSP Controlled; ADSC High) tCH CLK tADSPS tADSPH ADSP tAS tAH Address A1 A2 A3 tWS tWH BWE BW[a:b] CE0, CE2 tCYC tCL CE1 tADVS tADVH ADV OE tDS tDH Din tCD Dout tLZC Q(A1) D(A2) tOE tLZOE Q(A3) tHZOE tOH Q(A3Ý01) Q(A3Ý10) Q(A3Ý11) Read Q(A1) Suspend Read Q(A1) Read Q(A2) Suspend Write D(A 2) Read Q(A3) ADV Burst Read Q(A 3Ý01) ADV Burst Read Q(A 3Ý10) ADV Burst Read Q(A 3Ý11) Suspend Read Q(A 3Ý11) Note: Ý = XOR when LBO = high/no connect; Ý = ADD when LBO = low. 12/10/04; v.1.4 Alliance Semiconductor P. 13 of 19 AS7C33256FT18B ® Timing waveform of read/write cycle(ADSC controlled, ADSP = HIGH) tCYC tCL tCH CLK tADSCS ADSC tADSCH tAS ADDRESS A1 A2 A3 A4 A5 A6 A7 A8 tAH A9 A10 BWE BW[a:b] tCSS CE0,CE2 tCSH tWS tWH CE1 OE tOE tLZOE Dout Q(A1) Q(A2) Q(A3) tCD tHZOE Q(A4) Q(A9) tOH Q(A10) tDS Din D(A5) D(A6) tDH D(A7) D(A8) READ Q(A1) READ Q(A2) READ Q(A3) READ Q(A4) WRITE WRITE WRITE WRITE D(A6) D(A7) D(A8) D(A5) READ Q(A9) READ Q(A10) Note: ADV is don’t care here. 12/10/04; v.1.4 Alliance Semiconductor P. 14 of 19 AS7C33256FT18B ® Timing waveform of power down cycle tCYC tCL tCH CLK tADSPS ADSP tADSPS ADSC ADDRESS BWE BW[a:b] tCSS CE0,CE2 A1 A2 tWS tWH tCSH CE1 ADV OE tOE Din tLZOE tHZOE tHZC Dout Q(A1) Q(A2) tPDS ZZ ZZ Setup Cycle tPUS ZZ Recovery Cycle Normal Operation Mode Q(A2(Ý01)) tZZI Isupply tRZZI ISB2 Sleep State READ Q(A1) READ Q(A1Ý01) READ Q(A2) READ Q(A2Ý01) 12/10/04; v.1.4 Alliance Semiconductor P. 15 of 19 AS7C33256FT18B ® AC test conditions • Output load: see Figure B, except for tLZC, tLZOE, tHZOE, tHZC, see Figure C. • Input pulse level: GND to 3V. See Figure A. • Input rise and fall time (measured at 0.3V and 2.7V): 2 ns. See Figure A. • Input and output timing reference levels: 1.5V. Z0 = 50Ω +3.0V 90% 10% GND 90% 10% DOUT 50Ω VL = 1.5V for 3.3V I/O; 30 pF* = V DDQ/2 for 2.5V I/O DOUT 353Ω / 1538Ω Thevenin equivalent: +3.3V for 3.3V I/O; /+2.5V for 2.5V I/O 319Ω / 1667Ω 5 pF* GND *including scope and jig capacitanc Figure C: Output load (B) Figure A: Input waveform Figure B: Output load (A) Notes 1 For test conditions, see AC Test Conditions, Figures A, B, C. 2 This parameter measured with output load condition in Figure C. 3 This parameter is sampled, but not 100% tested. 4 tHZOE is less than tLZOE; and tHZC is less than tLZC at any given temperature and voltage. 5 tCH measured as HIGH above VIH and tCL measured as LOW below VIL. 6 This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK. All other synchronous inputs must meet the setup and hold times for all rising edges of CLK when chip is enabled. 7 Write refers to GWE, BWE, BW[a,b]. 8 Chip select refers to CE0, CE1, CE2 12/10/04; v.1.4 Alliance Semiconductor P. 16 of 19 AS7C33256FT18B ® Package Dimensions 100-pin quad flat pack (TQFP) Hd D b α L1 L A1 A2 e He E TQFP Min Max A1 A2 b c D E e Hd He L L1 α 0.05 1.35 0.22 0.09 13.90 19.90 15.85 21.80 0.45 0° 0.15 1.45 0.38 0.20 14.10 20.10 16.15 22.20 0.75 7° 0.65 nominal 1.00 nominal Dimensions in millimeters 12/10/04; v.1.4 Alliance Semiconductor P. 17 of 19 AS7C33256FT18B ® Ordering information Package TQFP TQFP Width x18 x18 –65 AS7C33256FT18B65TQC AS7C33256FT18B65TQI -75 AS7C33256FT18B75TQC AS7C33256FT18B75TQI –80 AS7C33256FT18B80TQC AS7C33256FT18B80TQI –10 AS7C33256FT18B10TQC AS7C33256FT18B10TQI Note: Add suffix ‘N’ to the above part numbers for Lead Free Parts (Ex. AS7C33256FT18B-65TQCN) Part numbering guide AS7C 1 33 2 256 3 FT 4 18 5 B 6 –XX 7 TQ 8 C/I 9 X 10 1. Alliance Semiconductor SRAM Prefix 2. Operating voltage: 33=3.3V 3. Organization: 256=256K 4. Flowthrough. 5. Organization: 18=x18 6. Production version: B= product revision 7. Clock access time: [-65 = 6.5 ns; -75 = 7.5 ns; -80 = 8.0 ns; -10 = 10.0] 8. Package type: TQ=TQFP 9. Operating temperature: C=Commercial (0° C to 70° C); I=Industrial (-40° C to 85° C) 10. Lead free part 12/10/04; v.1.4 Alliance Semiconductor P. 18 of 19 AS7C33256FT18B ® ® Alliance Semiconductor Corporation 2575, Augustine Drive, Santa Clara, CA 95054 Tel: 408 - 855 - 4900 Fax: 408 - 855 - 4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Part Number: AS7C33256FT18B Document Version: v.1.4 © Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such lifesupporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use.