ASM3I1819N-08-ST

August 2005 rev 0.2 Low Power Mobile VGA EMI Reduction IC Features FCC approved method of EMI attenuation Provides up to 15dB EMI reduction Generates a low EMI spread spectrum clock and a non-spread Reference Clock of the input frequency Optimized for frequency range from 20MHz to 40MHz Internal loop filter minimizes external components and board space Down Spread Deviation: -1.25% Low inherent Cycle-to-Cycle jitter 3.3V Operating Voltage CMOS/TTL compatible inputs and outputs Low power CMOS design Supports notebook VGA and other LCD timing controller applications Power Down function for mobile application Products are available for industrial temperature range. Available in 8 pin SOIC and TSSOP Packages ASM3P1819N The ASM3P1819N reduces electromagnetic interference (EMI) at the clock source, allowing a system wide EMI reduction for all the down stream clocks and data dependent signals. The ASM3P1819N allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding, and other passive components that are traditionally required to pass EMI regulations. The ASM3P1819N modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, thereby decreasing the peak amplitude of its harmonics. This result in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most clock generators. Lowering EMI by increasing a signal’s bandwidth is called “spread spectrum clock generation”. The ASM3P1819N uses the most efficient and optimized modulation profile approved by the FCC and is implemented by using a proprietary all digital method Applications The ASM3P1819N is targeted towards EMI management Functional Description The ASM3P1819N is a versatile spread spectrum frequency modulator designed specifically for a wide range of input clock frequencies from 20 to 40MHz. The ASM3P1819N can generate an EMI reduced clock from crystal, ceramic resonator, or system clock. for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC peripheral devices, consumer electronics and embedded controller system. Block Diagram PD# VDD XIN Crystal Oscillator XOUT Frequency Divider Feedback Divider Modulation PLL Phase Detector Loop Filter VCO Output Divider REF ModOUT VSS Alliance Semiconductor 2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. August 2005 rev 0.2 Pin Configuration XIN VSS NC ModOUT 1 2 3 4 8 7 6 5 XOUT VDD PD# REF ASM3P1819N ASM3P1819N Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN VSS NC ModOUT REF PD# VDD XOUT Type I P O O I P I Description Connect to externally generated Clock signal or Crystal. Ground Connection. Connect to system ground. No Connect. Spread spectrum clock output. Non-modulated Reference clock output of the input frequency. Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. Connect to +3.3V. Connect to crystal. No connect if externally generated clock signal is used. Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) Parameter Voltage on any pin with respect to Ground Rating -0.5 to +7.0 -65 to +125 0 to 70 260 150 2 Unit V °C °C °C °C KV Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. Output Frequency and Modulation Rate Input Frequency Range (MHz) 20 to 40 Output Frequency Range (MHz) 20 to 40 Modulation Rate Input Frequency / 512 Spread Deviation (%) -1.25 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 August 2005 rev 0.2 DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) ASM3P1819N Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH ICC IDD VDD tON ZOUT Input Low voltage Input High voltage Input Low current Input High current Parameter Min VSS – 0.3 2.0 2.5 7.1 fIN - min - Typ 3 3 4.5 3.3 0.18 50 Max 0.8 VDD + 0.3 -20.0 1.0 0.4 26.9 fIN - max - Unit V V µA µA mA mA V V mA mA V mS Ω XOUT Output low current @ 0.4V, VDD = 3.3V XOUT Output high current @ 2.5V, VDD = 3.3V Output Low voltage VDD = 3.3V, IOL = 20mA Output High voltage VDD = 3.3V, IOH = 20mA Dynamic Supply current 3.3V and 10pF probe loading Static Supply current Operating Voltage Power up time (First locked clock cycle after power up) Clock Output impedance AC Electrical Characteristics Symbol fIN fOUT tLH1 tHL1 tJC tD Input Frequency Output Frequency Output Rise time ( Measured from 0.8V to 2.0V ) Output Fall time ( Measured from 2.0V to 0.8V ) Jitter (Cycle to Cycle) Output Duty cycle Parameter Min 20 20 -200 45 Typ 0.69 0.66 50 Max 40 40 200 55 Unit MHz MHz nS nS pS % Note:1. tLH and tHL are measured into a capacitive load of 15pF Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 August 2005 rev 0.2 Package Information 8-Pin (150-mil) SOIC Package ASM3P1819N E H D A2 A θ e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L θ Inches Max 0.010 0.069 0.059 0.020 0.010 0.004 0.053 0.049 0.012 0.007 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.90 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 August 2005 rev 0.2 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) ASM3P1819N H E D A2 A θ e B A1 L C Dimensions Symbol Min A A1 A2 B c D E e H L θ 0.020 0° 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8° 0.50 0° Inches Max 0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30 Millimeters Min Max 1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 August 2005 rev 0.2 Ordering Information Part number ASM3P1819N -08-ST ASM3P1819N -08-SR ASM3P1819NF-08-ST ASM3P1819NF-08-SR ASM3P1819NG-08-ST ASM3P1819NG-08-SR ASM3I1819N -08-ST ASM3I1819N -08-SR ASM3I1819NF-08-ST ASM3I1819NF-08-SR ASM3I1819NG-08-ST ASM3I1819NG-08-SR ASM3P1819N -08-TT ASM3P1819N -08-TR ASM3P1819NF-08-TT ASM3P1819NF-08-TR ASM3P1819NG-08-TT ASM3P1819NG-08-TR ASM3I1819N -08-TT ASM3I1819N -08-TR ASM3I1819NF-08-TT ASM3I1819NF-08-TR ASM3I1819NG-08-TT ASM3I1819NG-08-TR ASM3P1819N Marking 3P1819N 3P1819N 3P1819NF 3P1819NF 3P1819NG 3P1819NG 3I1819N 3I1819N 3I1819NF 3I1819NF 3I1819NG 3I1819NG 3P1819N 3P1819N 3P1819NF 3P1819NF 3P1819NG 3P1819NG 3I1819N 3I1819N 3I1819NF 3I1819NF 3I1819NG 3I1819NG Package Configuration 8-Pin SOIC,Tube 8-Pin SOIC, Tape and Reel 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin SOIC, Tube 8-Pin SOIC, Tape and Reel 8-Pin SOIC, Tube, Pb Free 8-Pin SOIC, Tape and Reel, Pb Free 8-Pin SOIC, Tube, Green 8-Pin SOIC, Tape and Reel, Green 8-Pin TSSOP, Tube 8-Pin TSSOP, Tape and Reel 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green 8-Pin TSSOP, Tube 8-Pin TSSOP, Tape and Reel 8-Pin TSSOP, Tube, Pb Free 8-Pin TSSOP, Tape and Reel, Pb Free 8-Pin TSSOP, Tube, Green 8-Pin TSSOP, Tape and Reel, Green Temperature Range Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Commercial Commercial Commercial Commercial Commercial Commercial Industrial Industrial Industrial Industrial Industrial Industrial Device Ordering Information ASM3P1819NF-08-SR R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under US patent #5,488,627, #6,646,463 and #5,631,920 Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 August 2005 rev 0.2 ASM3P1819N Alliance Semiconductor Corporation 2575 Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Part Number: ASM3P1819N Document Version: 0.2 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. 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Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Low Power Mobile VGA EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7