ASM3P18S19BF-08TT

August 2005 rev 2.1 Notebook LCD Panel EMI Reduction IC Features FCC approved method of EMI attenuation. Provides up to 15dB EMI reduction. Generates a low EMI Spread Spectrum clock and a non-spread reference clock of the input frequency. Optimized for Frequency range from 20 to 40MHz. Internal loop filter minimizes external components and board space. Low Inherent Cycle-to-Cycle jitter. Two spread % selections: -1.25% to -1.75%. 3.3V Operating Voltage. Low power CMOS design. Supports notebook VGA and other LCD timing controller applications. Power Down function for mobile application. Available in Commercial temperature range. Available in 8-pin SOIC and TSSOP Packages. RoHS Compliant ASM3P18S19B allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding, and other passive components that are traditionally required to pass EMI regulations. The ASM3P18S19B modulates the output of a single PLL in order to “spread” the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. This results in significantly lower system EMI compared to the typical narrow band signal produced by oscillators and most frequency generators. Lowering EMI by increasing a signal’s bandwidth is called ‘Spread Spectrum Clock Generation’. The ASM3P18S19B uses the most efficient and optimized modulation profile approved by the FCC and is implemented in a proprietary all digital method. Applications The ASM3P18S19B is targeted towards EMI management for memory and LVDS interfaces in mobile graphic chipsets and high-speed digital applications such as PC peripheral devices, consumer electronics, and embedded controller systems. Product Description The ASM3P18S19B is a Versatile Spread Spectrum Frequency Modulator designed specifically for input clock frequencies from 20 to 40MHz. (Refer Input Frequency and Modulation Rate Table). The ASM3P18S19B reduces electromagnetic interference (EMI) at the clock source, allowing system wide reduction of EMI of down stream clock and data dependent signals. The ASM3P18S19B Block Diagram PD# SRS VDD Modulation XIN/CLKIN Crystal Oscillator Frequency Divider Feedback Divider PLL XOUT Phase Detector Loop Filter VCO Output Divider REF ModOUT VSS Alliance Semiconductor 2575 Augustine Drive • Santa Clara, CA • Tel: 408.855.4900 • Fax: 408.855.4999 • www.alsc.com Notice: The information in this document is subject to change without notice. August 2005 rev 2.1 Pin Configuration XIN/ CLKIN VSS SRS ModOUT 1 2 3 4 8 7 6 5 XOUT VDD PD# REF ASM3P18S19B ASM3P18S19B Pin Description Pin# 1 2 3 4 5 6 7 8 Pin Name XIN / CLKIN VSS SRS ModOUT REF PD# VDD XOUT Type I P I O O I P O Description Crystal Connection or external frequency input.This pin has dual functions. It can be connected to either an external crystal or an external reference clock Ground Connection. Connect to system ground. Spread range select. Digital logic input used to select frequency deviation (Refer Spread Deviation Selection Table). This pin has an internal pull-up resistor. Spread spectrum clock output. (Refer Input Frequency and Modulation Rate Table and Spread Deviation Selection Table) Non-modulated Reference clock output of the input frequency. Power down control pin. Pull LOW to enable Power-Down mode. This pin has an internal pull-up resistor. Power Supply for the entire chip. Crystal Connection. Input connection for an external crystal. If using an external reference, this pin must be left unconnected. Input Frequency and Modulation Rate Part Number ASM3P18S19B Input Frequency Range 20MHz to 40MHz Output Frequency range 20MHz to 40MHz Modulation rate Input Frequency / 512 Spread Deviation Selection Part Number ASM3P18S19B SRS 0 1 Spread Deviation -1.25% (DOWN) -1.75% (DOWN) Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 2 of 7 August 2005 rev 2.1 Absolute Maximum Ratings Symbol VDD, VIN TSTG TA Ts TJ TDV Storage temperature Operating temperature Max. Soldering Temperature (10 sec) Junction Temperature Static Discharge Voltage (As per JEDEC STD22- A114-B) ASM3P18S19B Parameter Rating -0.5 to +7.0 -65 to +125 0 to 70 260 150 2 Unit V °C °C °C °C KV Voltage on any pin with respect to Ground Note: These are stress ratings only and are not implied for functional use. Exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. DC Electrical Characteristics (Test condition: All parameters are measured at room temperature (+25°C) unless otherwise stated) Symbol VIL VIH IIL IIH IXOL IXOH VOL VOH ICC IDD VDD tON ZOUT Input Low voltage Input High voltage Parameter Min VSS - 0.3 2.0 -60.0 2.5 7.1 fIN - min - Typ 3 3 4.5 3.3 0.18 50 Max 0.8 VDD + 0.3 -20.0 1.0 0.4 26.9 fIN - max - Unit V V µA µA mA mA V V mA mA V mS Ω Input Low current (inputs PD#, SRS) Input High current XOUT Output low current @ 0.4V, VDD = 3.3V XOUT Output high current @ 2.5V, VDD = 3.3V Output Low voltage VDD = 3.3V, IOL = 20mA Output High voltage VDD = 3.3V, IOH = 20mA Dynamic supply current normal mode 3.3V and 25pF probe loading Static supply current standby mode Operating Voltage Power up time (first locked clock cycle after power up) Clock Output impedance AC Electrical Characteristics Symbol Parameter fIN fOUT tLH* tHL* tJC tD Input Frequency Output Frequency Output Rise time Measured from 0.8V to 2.0V Output Fall time Measured from 0.8V to 2.0V Jitter (Cycle to Cycle) Output Duty cycle Min 20 20 -200 45 Typ 0.66 0.65 50 Max 40 40 200 55 Unit MHz MHz nS nS pS % *tLH and tHL are measured into a capacitive load of 15pF Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 3 of 7 August 2005 rev 2.1 Package Information 8-lead (150-mil) SOIC Package ASM3P18S19B E H D A2 A θ e B A 1 C L D Dimensions Symbol Min A1 A A2 B C D E e H L θ Inches Max 0.010 0.069 0.059 0.020 0.01 0.004 0.053 0.049 0.012 0.007 Millimeters Min Max 0.10 1.35 1.25 0.31 0.18 4.9 BSC 3.91 BSC 1.27 BSC 6.00 BSC 0.41 0° 1.27 8° 0.25 1.75 1.50 0.51 0.25 0.193 BSC 0.154 BSC 0.050 BSC 0.236 BSC 0.016 0° 0.050 8° Note: Controlling dimensions are millimeters SOIC – 0.074 grams unit weight Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 4 of 7 August 2005 rev 2.1 ASM3P18S19B 8-lead Thin Shrunk Small Outline Package (4.40-MM Body) H E D A2 A θ e B A1 L C Dimensions Symbol Min A A1 A2 B C D E e H L θ 0.020 0° 0.002 0.033 0.008 0.004 0.114 0.169 0.026 BSC 0.252 BSC 0.028 8° 0.50 0° Inches Max 0.043 0.006 0.037 0.012 0.008 0.122 0.177 0.05 0.85 0.19 0.09 2.90 4.30 Millimeters Min Max 1.10 0.15 0.95 0.30 0.20 3.10 4.50 0.65 BSC 6.40 BSC 0.70 8° Note: Controlling dimensions are millimeters TSSOP – 0.0325 grams unit weight Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 5 of 7 August 2005 rev 2.1 Ordering Information Part Number ASM3P18S19BF-08TT ASM3P18S19BF-08TR ASM3P18S19BF-08ST ASM3P18S19BF-08SR ASM3P18S19B-08TT ASM3P18S19B-08TR ASM3P18S19B-08ST ASM3P18S19B-08SR ASM3P18S19BG-08TT ASM3P18S19BG-08TR ASM3P18S19BG-08ST ASM3P18S19BG-08SR ASM3P18S19B Marking 3P18S19BF 3P18S19BF 3P18S19BF 3P18S19BF 3P18S19B 3P18S19B 3P18S19B 3P18S19B 3P18S19BG 3P18S19BG 3P18S19BG 3P18S19BG Package Type 8-Pin TSSOP, TUBE, RoHS Compliant 8-Pin TSSOP, TAPE & REEL ,RoHS Compliant 8-Pin SOIC, TUBE, RoHS Compliant 8-Pin SOIC, TAPE & REEL, RoHS Compliant 8-Pin TSSOP, TUBE 8-Pin TSSOP, TAPE & REEL 8-Pin SOIC, TUBE 8-Pin SOIC, TAPE & REEL 8-Pin TSSOP, TUBE, Green 8-Pin TSSOP, TAPE & REEL, Green 8-Pin SOIC, TUBE, Green 8-Pin SOIC, TAPE & REEL, Green Temperature Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Commercial Products are available for industrial temperature range operation. Please contact factory for more information. Device Ordering Information ASM3P18S19BF-08TR R = Tape & reel, T = Tube or Tray O = SOT S = SOIC T = TSSOP A = SSOP V = TVSOP B = BGA Q = QFN DEVICE PIN COUNT F = LEAD FREE AND RoHS COMPLIANT PART G = GREEN PACKAGE PART NUMBER X= Automotive I= Industrial P or n/c = Commercial (-40C to +125C) (-40C to +85C) (0C to +70C) 1 = Reserved 2 = Non PLL based 3 = EMI Reduction 4 = DDR support products 5 = STD Zero Delay Buffer 6 = Power Management 7 = Power Management 8 = Power Management 9 = Hi Performance 0 = Reserved U = MSOP E = TQFP L = LQFP U = MSOP P = PDIP D = QSOP X = SC-70 ALLIANCE SEMICONDUCTOR MIXED SIGNAL PRODUCT Licensed under US patent #5,488,627, #6,646,463 and #5,631,920. Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 6 of 7 August 2005 rev 2.1 ASM3P18S19B Alliance Semiconductor Corporation 2575 Augustine Drive, Santa Clara, CA 95054 Tel# 408-855-4900 Fax: 408-855-4999 www.alsc.com Copyright © Alliance Semiconductor All Rights Reserved Preliminary Information Part Number: ASM3P18S19B Document Version: v2.1 Note: This product utilizes US Patent # 6,646,463 Impedance Emulator Patent issued to Alliance Semiconductor, dated 11-11-2003 © Copyright 2003 Alliance Semiconductor Corporation. All rights reserved. Our three-point logo, our name and Intelliwatt are trademarks or registered trademarks of Alliance. All other brand and product names may be the trademarks of their respective companies. Alliance reserves the right to make changes to this document and its products at any time without notice. Alliance assumes no responsibility for any errors that may appear in this document. The data contained herein represents Alliance's best data and/or estimates at the time of issuance. Alliance reserves the right to change or correct this data at any time, without notice. If the product described herein is under development, significant changes to these specifications are possible. The information in this product data sheet is intended to be general descriptive information for potential customers and users, and is not intended to operate as, or provide, any guarantee or warrantee to any user or customer. Alliance does not assume any responsibility or liability arising out of the application or use of any product described herein, and disclaims any express or implied warranties related to the sale and/or use of Alliance products including liability or warranties related to fitness for a particular purpose, merchantability, or infringement of any intellectual property rights, except as express agreed to in Alliance's Terms and Conditions of Sale (which are available from Alliance). All sales of Alliance products are made exclusively according to Alliance's Terms and Conditions of Sale. The purchase of products from Alliance does not convey a license under any patent rights, copyrights; mask works rights, trademarks, or any other intellectual property rights of Alliance or third parties. Alliance does not authorize its products for use as critical components in life-supporting systems where a malfunction or failure may reasonably be expected to result in significant injury to the user, and the inclusion of Alliance products in such life-supporting systems implies that the manufacturer assumes all risk of such use and agrees to indemnify Alliance against all claims arising from such use. Notebook LCD Panel EMI Reduction IC Notice: The information in this document is subject to change without notice. 7 of 7