EN63A0QI
12A Synchronous Highly Integrated DC-DC
Power SoC
Description
Features
The EN63A0QI is a Power System on a Chip
(PowerSoC) DC to DC converter in a 76 pin QFN
module. It offers highly efficient performance along
with a rich and proven feature set that facilitate ease
of use in systems that are sensitive to beat tones.
The switching frequency can be synchronized to an
external clock or other EN63A0QIs. Other features
include precision Enable threshold, pre-bias
monotonic start-up, and parallel operation.
•
High efficiency, up to 96%.
•
Excellent ripple and EMI performance.
•
Up to 12A continuous operating current.
•
1.2 MHz operating frequency with ability to
synchronize to an external clock source or serve
as the primary source.
•
External programmable Frequency between
0.9MHz and 1.5MHz for application tuning.
•
2% Output Voltage Accuracy over line, load, temp
•
EN63A0QI is a member of a family of devices
between 1A to 12A load capacity with small total
PCB footprints from 156mm2 and 227mm2.
•
Precision Enable threshold for sequencing.
•
Monotonic start-up with pre-bias.
•
Programmable soft-start time. Soft Shutdown.
•
Master/slave configuration for parallel operation.
•
Thermal shutdown, over current, short circuit, and
under-voltage protection.
•
RoHS compliant, MSL level 3, 260C reflow.
The EN63A0QI is specifically designed to meet the
precise voltage and fast transient requirements of
present and future high-performance, low-power
processor, DSP, FPGA, memory boards and system
level applications in distributed power architecture.
The device’s advanced circuit techniques, ultra high
switching frequency, and proprietary integrated
inductor technology deliver high-quality, ultra
compact, non-isolated DC-DC conversion.
Applications
Figure 1: BOM layout of EN63A0QI solution for maximum
performance. Total Area ≈ 227 mm2
The Enpirion integrated inductor solution significantly
helps to reduce noise. The complete power converter
solution enhances productivity by offering greatly
simplified board design, layout and manufacturing
requirements. All Enpirion products are RoHS
compliant and lead-free manufacturing environment
compatible.
Ordering Information
Part Number
EN63A0QI
EN63A0QI-E
Temp Rating
(°C)
Package
-40 to +85
76-pin QFN T&R
QFN Evaluation Board
•
Point of load regulation for low-power processors,
multi-core processors, communication processor,
DSPs, FPGAs, and ASICs
•
Low voltage, distributed power architectures with
0.8, 1.0, 1.2, 2.5V, 3.3V, 5V or 6V rails
•
Blade servers, RAID storage cards, LAN/SAN
adapter cards, wireless base stations, industrial
automation, test and measurement, embedded
computing, communications, and multi-function
printers
•
High efficiency 12V intermediate bus architectures
•
Beat frequency sensitive applications
•
Ripple/Noise Sensitive Applications
www.enpirion.com
June 2011, Rev B1
EN63A0QI Datasheet
Schematic
Pin Assignments (Top View)
56
S_IN
55
BGND
3
54
VDDB
NC
4
53
NC
NC
5
52
NC
NC
6
51
PVIN
NC
7
50
PVIN
NC
8
49
PVIN
NC
9
48
PVIN
NC
10
47
PVIN
NC
11
46
PVIN
NC
12
45
PVIN
NC
13
44
PVIN
NC
14
43
PVIN
NC
15
42
PVIN
NC
16
41
PVIN
NC
17
40
PVIN
NC
18
39
PVIN
NC
1
NC
2
NC
Thermal Pad
77
PGND
EN63A0QI
Figure 2: Simple Application Schematic for maximum
performance. Unless otherwise specified, all passive
components can be 0402 or smaller.
Figure 3: Pin Out Diagram (Top View)
NOTE: All pins must be soldered to PCB.
Pin Description
PIN
NAME
FUNCTION
1-19, 29,
52-53, 7276
20-28
NC
NO CONNECT: These pins must be soldered to PCB but not be electrically connected
to each other or to any external signal, voltage, or ground. These pins may be
connected internally. Failure to follow this guideline may result in device damage.
Regulated converter output. Connect to the load, and place output filter capacitor(s)
between these pins and PGND pins 28-31.
NO CONNECT: These pins are internally connected to the common switching node of
the internal MOSFETs. They must be soldered to PCB but not be electrically connected
to any external signal, ground, or voltage. Failure to follow this guideline may result in
device damage.
Input/Output power ground. Connect these pins to the ground electrode of the input and
output filter capacitors. See VOUT and PVIN descriptions for more details.
Input power supply. Connect to input power supply, place input filter capacitor(s)
between these pins and PGND pins 32-34.
Internal regulated voltage used for the internal control circuitry. Decouple with a 0.1uF
capacitor to BGND for improved efficiency.
See pin 54 description.
Digital Input. Depending on the M/S pin, this pin accepts either an input clock to phase
lock the internal switching frequency or a S_OUT signal from another EN63A0QI. Leave
this pin floating if it is not used.
Digital Output. Depending on the M/S pin, either a clock signal synchronous with the
internal switching frequency or the PWM signal is output on this pin. Leave this pin
floating if it is not used.
POK is a logic high when VOUT is within -10% to +20% of the programmed output
voltage. This pin has an internal pull-up resistor to AVIN with a nominal value of 94K
ohms. This pin can sink a maximum 4mA.
This is the Device Enable pin. Floating this pin or a high level enables the device while a
low level disables the device. A voltage ramp from another power converter may be
applied for precision Enable.
Analog input voltage for the controller circuits. Connect this pin to the input power
supply (PVIN) through a 1 ohm resistor. Can also be connected to an auxiliary supply
within a voltage range that is sequencing.
VOUT
NC(SW)
30-31, 7071
32-38
PGND
39-51
PVIN
54
VDDB
55
56
BGND
S_IN
57
S_OUT
58
POK
59
ENABLE
60
AVIN
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 2
June 2011, Rev B1
PIN
NAME
61
62
AGND
M/S
63
VFB
64
65
EAOUT
SS
66
67
VSENSE
NC
(XREF)
68
FQADJ
69
EN_PB
77
PGND
EN63A0QI Datasheet
FUNCTION
This is the quiet ground for the controller.
This is a Ternary Input put. Floating the pin disables parallel operation. A low level
configures the device as Master and a High level configures the device as a slave.
This is the External Feedback input pin. A resistor divider connects from the output to
AGND. The mid-point of the resistor divider is connected to VFB. (A feed-forward
capacitor is required across the upper resistor.) The output voltage regulates so as to
make the VFB node voltage = 0.600volt.
Optional Error Amplifier output. Allows for customization of the control loop.
A soft-start capacitor is connected between this pin and AGND. The value of the
capacitor controls the soft-start interval.
This pin senses the output voltage when the device is in Back-feed (or Pre-bias) mode.
NO CONNECT: Precision External voltage reference input. Feature is available in a
separate part number. Application of external reference overrides the device’s internal
reference. Contact Enpirion for more information.
This pin must have a resistor to AGND, which sets the free running frequency of the
internal oscillator.
This is the Enable Pre-Bias Input. When this pin is pulled high, the Device will support
monotonic start-up under a pre-biased load. This pin is pulled high internally. Pull this
pin to GND if there is no need to support a pre-bias on the output.
Device thermal pad to be connected to the system GND plane for heat-sinking
purposes. See Layout Recommendations section.
Absolute Maximum Ratings
PARAMETER
SYMBOL
MIN
MAX
UNITS
Voltages on: PVIN, AVIN, VOUT
-0.3
7.0
V
Voltages on: EN, POK, M/S
-0.3
VIN+0.3
V
Voltages on: VFB, EXTREF, EAOUT, SS, S_IN, S_OUT, FQADJ
-0.3
2.5
V
-65
150
°C
150
°C
Reflow Temp, 10 Sec, MSL3 JEDEC J-STD-020A
260
°C
ESD Rating (based on Human Body Model)
2000
V
ESD Rating (based on CDM)
500
V
MAX
UNITS
Storage Temperature Range
TSTG
Maximum Operating Junction Temperature
TJ-ABS Max
Recommended Operating Conditions
PARAMETER
Input Voltage Range
Output Voltage Range
SYMBOL
MIN
VIN
2.5
6.6
V
0.60
VIN 0.05*ILOAD
V
VOUT
Output Current
IOUT
Operating Ambient Temperature
TA
12
- 40
2
+85
A
°C
Thermal Characteristics
PARAMETER
SYMBOL
TYP
UNITS
Thermal Resistance: Junction to Ambient (0 LFM) (Note 1)
θJA
16
°C/W
Thermal Resistance: Junction to Case (0 LFM)
θJC
1.0
°C/W
Thermal Shutdown
TSD
150
°C
Thermal Shutdown Hysteresis
TSDH
20
°C
Note 1: Based on a 2oz. copper board and proper thermal design in line with JEDEC EI/JESD 51 standards.
Note 2: See Table in “Resistor Programmable Frequency” section for allowable Vin, Vout, Switching Frequency.
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 3
June 2011, Rev B1
EN63A0QI Datasheet
Electrical Characteristics
NOTE: VIN=6.6V over operating temperature range unless otherwise noted. Typical values are at TA = 25°C.
PARAMETER
SYMBOL
TEST CONDITIONS
Operating Input Voltage
VIN
See Note 5.
VFB Pin Voltage
VVFB
Internal voltage reference at:
VIN = 5V, TA = 25°C, ILOAD = 0
VFB Pin Voltage
VVFB
2.5V ≤ VIN ≤ 6.6V
0A ≤ ILOAD ≤ 10A,
TA = -40 to 85°C
VFB Pin Input Leakage
Current
IVFB
VFB pin input leakage current
Shut-Down Supply Current
IS
Power Supply current with
Enable=0
Under Voltage Lock-out –
VIN Rising
VUVLOR
Under Voltage Lock-out –
tVIN Falling
MIN
TYP
2.5
MAX
UNITS
6.6
V
0.594
0.600
0.606
V
0.588
0.600
0.612
V
0.2
μA
-0.2
2
mA
Voltage above which UVLO is not
asserted
2.2
V
VUVLOF
Voltage below which UVLO is
asserted
2.1
V
Output Drop Out
Voltage
Resistance (Note 1)
VDO
RDO
VINMIN - VOUT at Full load
Input to Output Resistance
300
50
mV
mΩ
Maximum Continuous
Output Current
IOUT_Max_SRC
Maximum load current. See Note 1
and Note 5.
12
A
Maximum Continuous
Output Sinking Current
IOUT_Max_SNK
Maximum load current. See Note 1.
12
A
Over Current Trip Level
IOCP
Sourcing current
Switching Frequency
FSW
Operating frequency with FQADJ
resistor = 4.42 kΩ at 5Vin
External SYNC Clock
Frequency Lock Range
FPLL_LOCK
SYNC clock input frequency range
S_IN Clock Amplitude –
Low
VS_IN_LO
SYNC Clock Logic Level
S_IN Clock Amplitude –
High
VS_IN_HI
SYNC Clock Logic Level
S_IN Clock Duty Cycle
(PLL)
DCS_INPLL
S_IN Clock Duty Cycle
(PWM)
18.5
A
0.9
1.2
1.5
MHz
0.9*Fsw
Fsw
1.1*Fsw
MHz
0.8
V
1.8
2.5
V
M/S Pin Float or Low
20
80
%
DCS_INPWM
M/S Pin High
10
90
%
Pre-Bias Level
VPB
Allowable pre-bias as a fraction of
programmed output voltage for
monotonic start up. Minimum prebias voltage = 300mV.
20
75
%
Non-Monotonicity
VPB_NM
Allowable non-monotonicity under
pre-bias start up
VOUT Range for POK = High
©Enpirion 2011 all rights reserved, E&OE
Range of output voltage as a
fraction of programmed value when
POK is asserted
Enpirion Confidential
100
90
mV
120
%
www.enpirion.com, Page 4
June 2011, Rev B1
PARAMETER
EN63A0QI Datasheet
SYMBOL
TEST CONDITIONS
POK Deglitch Delay
Falling edge deglitch delay after
output crossing 90% level. FSW=1.0
MHz
VPOK Logic Low level
With 4mA current sink into POK pin
MIN
TYP
MAX
62
UNITS
us
0.4
V
VPOK Logic high level
VIN
V
POK Internal pull-up
resistor
94
kΩ
+/-10
%
Current Balance
ΔIOUT
With 2-4 converters in parallel, the
difference between nominal and
actual current levels. ΔVIN VUVLO and Enable=HIGH.
Note 5: See Table in “Resistor Programmable Frequency” section for allowable Vin, Vout.
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 5
June 2011, Rev B1
EN63A0QI Datasheet
100
100
95
95
90
90
85
85
80
Efficiency (%)
Efficiency (%)
Typical Performance Characteristics
75
70
80
75
70
65
65
60
60
55
55
50
50
0
2
4
6
8
10
0
12
2
4
8
10
Efficiency VIN = 5.0V, Vout = 3.3, 2.5, 1.8, 1.2, 1.0 at
Frequency = 1.00MHz
Efficiency VIN = 3.3V, Vout = 2.5, 1.8, 1.2, 1.0 at
Frequency = 1.00MHz
20 MHz BW limit
500 MHz BW
Output Ripple: VIN = 5.0V, VOUT = 1.0V, Iout = 12A
CIN = 2 x47μF/1206, COUT = 3x47μF/1206
Output Ripple: VIN = 5.0V, VOUT = 1.0V, Iout = 12A
CIN = 2 x 47μF/1206, COUT = 3x47μF/1206
20 MHz BW limit
500 MHz BW
Output Ripple: VIN = 5.0V, VOUT = 2.4V, Iout = 12A
CIN = 2 x 47μF/1206, COUT = 3x47μF/1206
©Enpirion 2011 all rights reserved, E&OE
6
Load (Amps)
Load (Amps)
Output Ripple: VIN = 5.0V, VOUT = 2.4V, Iout = 12A
CIN = 2 x 47μF/1206, COUT = 3x47μF/1206
Enpirion Confidential
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12
June 2011, Rev B1
EN63A0QI Datasheet
Power Up/Down at 12A (0.08 Ω) Load: VIN/VOUT =
5.0V/1.0V,
15nF soft-start capacitor, Ch.3: ENABLE, Ch.1: VOUT
Power Up/Down into 12A (0.194 Ω) load: VIN/VOUT =
5.0V/2.4V,
15nF soft-start capacitor, Ch.3: ENABLE, Ch.1: VOUT
Load Transient: VIN = 6.2V, VOUT = 1.5V
Ch.1: VOUT, Ch.2: ILOAD 0↔12A (slew rate ≥ 10A/µS)
CIN ≈ 2x47μF, COUT ≈ 3x47μF
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 7
June 2011, Rev B1
EN63A0QI Datasheet
Functional Block Diagram
Figure 4: Functional Block Diagram
Functional DescriptionSynchronous Buck Converter
The EN63A0QI is a synchronous, programmable
Buck power supply with integrated power MOSFET
switches and integrated inductor. The switching
supply uses voltage mode control and a low noise
PWM topology. This provides superior impedance
matching to ICs processed in sub 90nm process
technologies. The nominal input voltage range is
2.50 - 6.6 volts. The output voltage is programmed
using an external resistor divider network. The
feedback control loop is a type IV design. Voltagemode control and a low-noise PWM topology offers
superior performance. The device is optimized for
8A with up to 12A continuous output current
©Enpirion 2011 all rights reserved, E&OE
operation. Operating between 0.9MHz and 1.5MHz
switching frequency enables the use of small-size
input and output capacitors.
The power supply has the following protection
features:
•
•
•
•
Over-current protection with hiccup mode.
Short Circuit protection.
Thermal shutdown with hysteresis.
Under-voltage lockout circuit to disable the
converter output when the input voltage is less
than approximately 2.2V
Enpirion Confidential
www.enpirion.com, Page 8
June 2011, Rev B1
EN63A0QI Datasheet
The power supply further supports the following
features:
•
•
•
•
•
•
•
•
Precision enable threshold
Soft-start and Soft-shutdown
Pre-Bias Start-up
Resistor Programmable Switching Frequency
Optional external Voltage Reference
Switching frequency phase lockable to an
external oscillator/another PoL device.
Parallel operation
Power OK
Resistor Programmable Frequency
Precision Enable
The Enable threshold is a precision Analog voltage
rather than a digital logic threshold. A precision
voltage reference and a comparator circuit are kept
powered up even when Enable is de-asserted.
Precision threshold along with a proper choice of
soft-start capacitor helps to accurately sequence
multiple power supplies in a system as desired.
Soft-Start and Soft-Shutdown
The SS pin in conjunction with a small external
capacitor between this pin and AGND provides a
soft-start function to limit in-rush current during
device power-up. When the part is initially powered
up, the output voltage is gradually ramped to its
final value. The gradual output ramp is achieved by
increasing the reference voltage to the error
amplifier. A constant current flowing into the softstart capacitor provides the reference voltage ramp.
When the voltage on the soft-start capacitor
reaches 0.60V, the output has reached its
programmed voltage. The current source will
continue, however, to charge the SS capacitor
beyond 0.60V to about 1.5V in normal operation.
The output ramp rate can be controlled by the
choice of soft-start capacitor value.
When the device is disabled, the soft-start capacitor
is discharged before the controller is powered
down. The EN63A0, however, relies on the output
load current as the primary path to discharge the
output
The Enable signal, internal to the device, is
extended to allow soft-shutdown. In shutdown, the
SS capacitor is discharged in a controlled manner.
The output ramps down correspondingly and when
the output voltage is essentially zero, the controller
is turned off.
Pre-Bias Start-up
The EN63A0QI supports the device start up into a
pre-biased load. A proprietary circuit ensures the
©Enpirion 2011 all rights reserved, E&OE
output voltage ramps up from the pre-bias value to
the programmed output voltage. Start-up is
guaranteed for pre-bias voltages in the range of
20% to 75% of the programmed output voltage with
a minimum pre-bias voltage of 300mV. The PreBias feature is engaged by use of the EN_PB pin.
For this feature to work properly, VIN must be
ramped up first with ENABLE low, and then the
converter has to be turned on using the ENABLE
pin. Please see Electrical Characteristics table for
more details.
The free running frequency of the oscillator may be
altered by connecting a suitable value resistor from
the pin FQADJ to AGND. Frequency can be tuned
to optimize dynamic performance and efficiency.
The tables below show the recommended RFQADJ
values for optimum efficiency for specific Vin/Vout
combinations and 10A and 12A loads. Contact
Enpirion Applications for more information.
Recommended RFQADJ (KΩ) as a Function of
VIN & VOUT for 10A Load
VIN
VOUT
3.3V ±10%
5.0V ±10%
6.0V ±10%
0.8V
1.2V
1.5V
1.8V
2.5V
3.3V
3.57
3.57
3.57
3.57
3.57
3.57
4.42
3.57
3.57
4.42
4.42
4.42
3.57
4.42
4.42
NA
3.57
3.57
Recommended RFQADJ (KΩ) as a Function of
VIN & VOUT for 12A Load
VIN
VOUT
3.3V ±10%
5.0V ±10%
6.0V ±10%
0.8V
1.2V
1.5V
1.8V
2.5V
3.3V
3.57
3.57
20.0
3.57
12.1
20.0
4.42
12.1
20.0
4.42
4.42
NR
4.42
NR
NR
NA
NR
NR
NOTE: NR means device not rated for this
operating condition.
External Voltage Reference (Optional)
This feature is available in a separate part number.
Contact Enpirion for more information.
When a voltage greater than 0.6V is present at the
EXTREF pin the device will detect the presence of
the voltage and automatically switch to this voltage
as the reference for voltage regulation. Bypassing
the internal reference can be used to further
improve overall DC set point accuracy and
temperature drift associated with the internal
reference. EN63A0QI accepts a wide range of
input references between 1.15 and 1.5V directly.
Enpirion Confidential
www.enpirion.com, Page 9
June 2011, Rev B1
EN63A0QI Datasheet
Phase-Lock Operation:
With M/S pin floating or at a logical ‘0,’ the internal
switching clock of the DC/DC converter can be
phase-locked to a clock signal applied to S_IN.
When a clock signal is present at S_IN, an activity
detector recognizes the presence of the clock
signal and the internal oscillator phase locks to the
external clock. The external clock could be the
system clock or the output of another EN63A0QI. A
delayed version of the phase locked clock is output
at S_OUT. The clock frequency should be within
±20% of the free running frequency for guaranteed
phase-lock. Multiple EN63A0QI devices on a
system board may be daisy chained to avoid beat
frequency components. The device switching
frequency can be adjusted with the resistor to
FQADJ as well as by the external clock source for
phase-lock.
Master / Slave (Parallel) Operation:
Two EN63A0QI devices may be connected in a
Master/Slave configuration to handle larger load
currents. The Master device’s switching clock may
be phase-locked to an external clock source or
another EN63A0QI. The device is placed in Master
mode by pulling the M/S pin low or in Slave mode
by pulling M/S pin high. When this pin is in Float
state, parallel operation is not possible. In
master mode, the internal PWM signal is output on
the S_OUT pin. This PWM signal from the Master
is fed to the slave device at its S_IN input. The
Slave device acts like an extension of the power
FETs in the Master. The inductor in the slave
prevents crow-bar currents from Master to slave
due to timing delays.
de-asserted as an over voltage condition. In this
case, the power NFET is turned on resulting in a
large input supply current. This in turn is expected
to trip the upstream power supply powering the
EN63A0QI. The POK pin can sink up to 4mA. No
pull-up resistor required; when POK is asserted
high the output will be pulled up to PVIN.
Over Voltage Protection
If the output voltage exceeds 120% of the
programmed value (as sensed at VFB pin), the lowside power FET is turned on. If the over-voltage
condition is due to an input-to-output or a high-side
power FET short, the turn-on of the low-side power
FET will cause a large current draw from the input
supply. This will likely cause the input voltage to
drop, thus protecting the load.
Over Current Protection
The current limit function is achieved by sensing
the current flowing through a sense P-FET. When
the sensed current exceeds the current limit, both
power FETs are turned off for the rest of the
switching cycle. If the over-current condition is
removed, the over-current protection circuit will reenable PWM operation. If the over-current condition
persists, the circuit will continue to protect the load.
The OCP trip point is nominally set as specified in
the Electrical Characteristics table. In the event the
OCP circuit trips consistently in normal operation,
the device enters a hiccup mode. The device is
disabled for a short while and restarted with a
normal soft-start. This cycle can continue
indefinitely as long as the over current condition
persists.
POK Operation
Thermal Overload Protection
The POK signals the output voltage is within the
specified range. The POK signal is asserted high
when the rising output voltage crosses 92%
(nominal) of the programmed output voltage. POK
is de-asserted low for 256 clock cycles (62us at
1MHz) after the falling output voltage crosses 90%
(nominal) of the programmed voltage. POK remains
asserted if the output voltage falls outside the range
of 90% to 120% for a period of time less than the
de-glitch time. POK is also de-asserted if the output
voltage exceeds 120% of the programmed output.
If the feedback loop is broken, POK will remain deasserted (sensed output < 92% of programmed
value!) but the actual output voltage will equal the
input voltage. If however, there is a short across the
PFET, and the feedback is in place, POK will be
Temperature sensing circuits in the controller will
disable operation when the Junction temperature
exceeds approximately 150ºC. Once the junction
temperature drops by approx 20ºC, the converter
will re-start with a normal soft-start.
©Enpirion 2011 all rights reserved, E&OE
Input Under-Voltage Lock-Out
When the input voltage is below a required voltage
level (VUVHI) for normal operation, the converter
switching is inhibited. The lock-out threshold has
hysteresis to prevent chatter. Thus when the device
is operating normally, the input voltage has to fall
below the lower threshold (VUVLO) for the device to
stop switching.
Enpirion Confidential
www.enpirion.com, Page 10
June 2011, Rev B1
EN63A0QI Datasheet
Application Information / Layout Recommendation
Soft-start Capacitor Selection
R A = 48,400 × V IN (R A /VIN in Ω / V)
The output voltage ramp time is controlled by the
choice of the soft-start capacitor value. The ramp
time is defined as the time from when the Enable
signal crosses the threshold and the input voltage
crosses the upper UVLO threshold to the time
when the output voltage reaches 95% of the
programmed value. This time is given by the
following equation:
CA =
(C A /R A in F/Ω)
Round C A down to closest
available value lower than
the calculated value.
RB =
TSS = Css* 65kΩ (seconds)
Output Voltage Programming and loop
Compensation
V FB × R A
(VOUT − V FB )
⎛ V FB is 0.6V
⎜⎜
⎝ nominal
⎞
⎟⎟
⎠
R1 = 12 kΩ
The EN63A0QI output voltage is programmed
using a simple resistor divider network. A phase
lead capacitor plus a resistor are required for
stabilizing the loop. Figure 5 shows the required
components and the equations to calculate their
values.
The EN63A0QI output voltage is determined by the
voltage presented at the VFB pin. This voltage is
set by way of a resistor divider between VOUT and
AGND with the midpoint going to VFB.
The EN63A0QI uses a type IV compensation
network. Most of this network is integrated.
However a phase lead capacitor and a resistor are
required in parallel with upper resistor of the
external feedback network (see Figure 5). Total
compensation is optimized for use with 3X47μF
output capacitance and will result in a wide loop
bandwidth and excellent load transient performance
for most applications. Additional capacitance may
be placed beyond the voltage sensing point outside
the control loop. Voltage mode operation provides
high noise immunity at light load. Further, Voltage
mode control provides superior impedance
matching to ICs processed in sub 90nm
technologies.
In some cases modifications to the compensation
or output capacitance may be required to optimize
device performance such as transient response,
ripple, or hold-up time. The EN63A0QI provides the
capability to modify the control loop response to
allow for customization for such applications. For
more information, contact Enpirion Applications
Engineering support.
©Enpirion 2011 all rights reserved, E&OE
4.6 × 10 − 6
RA
Figure 5: External feedback and compensation network
Enable Operation
With the device input power applied, the device
automatically starts to operate with a normal softstart, provided the input supply voltage is above the
UVLO high threshold of ~2.2 volts. To start device
operation under ENABLE control, the ENABLE pin
has to be initially pulled low and subsequently
pulled high when so desired.
Input Capacitor Selection
The EN63A0QI requires between 80−100µF of
input capacitance. Low ESR ceramic capacitors are
required with X5R or X7R dielectric formulation.
Y5V or equivalent dielectric formulations must not
be used as these lose capacitance with frequency,
temperature and bias voltage.
In some applications, lower value ceramic
capacitors maybe needed in parallel with the larger
capacitors in order to provide high frequency
decoupling.
Recommended Input Capacitors
Description
47uF, 10V, 20%
X5R, 1206
(2 capacitors needed)
Enpirion Confidential
MFG
Taiyo Yuden
P/N
LMK316BJ476ML-T
www.enpirion.com, Page 11
June 2011, Rev B1
EN63A0QI Datasheet
Output Capacitor Selection
Ternary Pin
The EN63A0QI has been optimized for use with
about 150µF of output filter capacitance. Additional
capacitance may be placed beyond the voltage
sensing point outside the control loop. Low ESR
ceramic capacitors are required with X5R or X7R
dielectric formulation. Y5V or equivalent dielectric
formulations must not be used as these lose
capacitance with frequency, temperature and bias
voltage.
M/S is a Ternary pin. This pin can assume 3 states
– A low state, a high state and a float state. Device
operation is controlled by the state of the pin. The
pins may be pulled to ground or left floating without
any special care. However when pulling high, we
recommend tying this pin to VIN with a series
resistor. The resistor value may be optimized to
reduce the current drawn by the pin by following the
equations in 6. The resistance may not be too high
as in that case the pin may not recognize the high
state.
Recommended Output Capacitors
Description
MFG
47uF, 10V, 20%
X5R, 1206
(3 capacitors needed)
47uF, 6.3V, 20%
X5R, 1206
(3 capacitors needed)
10uF, 6.3V, 10%
X7R, 0805
(Optional 1 capacitor in
parallel with 3x47uF)
P/N
2.5V
Taiyo Yuden
LMK316BJ476ML-T
Murata
GRM31CR60J476ME19L
Taiyo Yuden
JMK316BJ476ML-T
Murata
GRM21BR70J106KE76L
Taiyo Yuden
JMK212B7106KG-T
R1
100k
REXT
Output ripple voltage is primarily determined by the
aggregate output capacitor impedance. Placing
multiple capacitors in parallel reduces the
impedance and hence will result in lower ripple
voltage.
1
Z Total
=
1
1
1
+
+ ... +
Z1 Z 2
Zn
†
D1
Vf ~ 2V
R3
7k
R2
100k
Maximum value of
REXT= (VIN-2)*67k
Input pin current
= (VIN -2)/REXT
AGND
EV6360QI
M/S (Master/Slave) Pin States
Typical Output Ripple (mVp-p)
(as measured on device
evaluation board)†
3 x 47 uF
20 MHz bandwidth limit
To Gates
Figure 6: Selection of REXT to connect ternary pins to VIN
Typical Ripple Voltages
Output Capacitor
Configuration
PIN
To VIN
~5mV
M/S Pin
Function
Low
This is the Master mode. Switching phase
locked to S_IN external clock. S_OUT outputs a
delayed version of internal PWM signal
Float
Parallel operation is not feasible. Switching
phase locked to S_IN external clock. S_OUT
outputs a delayed version of switching clock
High
This is the Slave mode. The S_IN signal drives
directly the power FETs. S_OUT outputs a
delayed version of S_IN
Contact Enpirion Application support for parallel
operation of multiple EN63A0QIs for higher output
currents.
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 12
June 2011, Rev B1
EN63A0QI Datasheet
Layout Recommendation
Figure 7: Critical Components and Layer 1 Copper for Minimum Footprint and Layer 2 Ground Plane
Figure 7 above shows critical components and layer 1 traces of the recommended EN63A0 layout for minimum
footprint with ENABLE tied to VIN. Please use this figure as a guide when considering the following
recommendations. Alternate ENABLE configurations, and other small signal pins need to be connected and
routed according to specific customer application. Please see the Gerber files on the Enpirion website
www.enpirion.com for exact dimensions and other layers.
Recommendation 1: Input and output filter capacitors should be placed on the same side of the PCB, and as
close to the EN63A0QI package as possible. They should be connected to the device with very short and wide
traces. Do not use thermal reliefs or spokes when connecting the capacitor pads to the respective nodes. The
+V and GND traces between the capacitors and the EN63A0QI should be as close to each other as possible
so that the gap between the two nodes is minimized, even under the capacitors.
Recommendation 2: The system ground plane should be the first layer immediately below the surface layer.
This ground plane should be continuous and un-interrupted below the converter and the input/output
capacitors.
Recommendation 3: The thermal pad underneath the component must be connected to the system ground
plane through as many vias as possible. The drill diameter of the vias should be 0.33mm, and the vias must
have at least 1 oz. copper plating on the inside wall, making the finished hole size around 0.20-0.26mm. Do not
use thermal reliefs or spokes to connect the vias to the ground plane. This connection provides the path for
heat dissipation from the converter.
Recommendation 4: Multiple small vias (the same size as the thermal vias) should be used to connect ground
terminal of the input capacitor and output capacitors to the system ground plane. It is preferred to put these
vias under the capacitors along the edge of the GND copper closest to the +V copper. These vias connect the
input/output filter capacitors to the GND plane, and help reduce parasitic inductances in the input and output
current loops.
Recommendation 5: AVIN is the power supply for the small-signal control circuits. It should be connected to
the input voltage at a quiet point. In Figure 7 this connection is made at the input capacitor.
Recommendation 6: The layer 1 metal under the device must not be more than shown in Figure 7. See the
section regarding exposed metal on bottom of package. As with any switch-mode DC/DC converter, try not to
run sensitive signal or control lines underneath the converter package on other layers.
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 13
June 2011, Rev B1
EN63A0QI Datasheet
Recommendation 7: The VOUT sense point should be just after the last output filter capacitor. Keep the sense
trace short in order to avoid noise coupling into the node.
Recommendation 8: Keep RA, CA, RB, and R1 close to the VFB pin (see Figures 5 and 7). The VFB pin is a
high-impedance, sensitive node. Keep the trace to this pin as short as possible. Whenever possible, connect
RB directly to the AGND pin instead of going through the GND plane.
Design Considerations for Lead-Frame Based Modules
Exposed Metal on Bottom of Package
Lead-frames offer many advantages in thermal performance, in reduced electrical lead resistance, and in
overall foot print. However, they do require some special considerations.
In the assembly process lead frame construction requires that, for mechanical support, some of the lead-frame
cantilevers be exposed at the point where wire-bond or internal passives are attached. This results in several
small pads being exposed on the bottom of the package, as shown in Figure 8.
Only the thermal pad and the perimeter pads are to be mechanically or electrically connected to the PC board.
The PCB top layer under the EN63A0QI should be clear of any metal (copper pours, traces, or vias) except for
the two thermal pads. The “grayed-out” area in Figure 8 represents the area that should be clear of any metal
on the top layer of the PCB. Any layer 1 metal under the grayed-out area runs the risk of undesirable shorted
connections even if it is covered by soldermask.
Figure 9 shows the package dimensions.
Figure 8: Lead-Frame exposed metal. Grey area highlights exposed metal that is not to be mechanically or electrically
connected to the PCB.
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 14
June 2011, Rev B1
EN63A0QI Datasheet
Package and Mechanical
Figure 9: EN63A0QI Package Dimensions
Contact Information
Enpirion, Inc.
Perryville III Corporate Park
53 Frontage Road - Suite 210
Hampton, NJ 08827 USA
Phone: 1.908.894.6000
Fax: 1.908.894.6090
www.enpirion.com
Enpirion reserves the right to make changes in circuit design and/or specifications at any time without notice. Information furnished by Enpirion is
believed to be accurate and reliable. Enpirion assumes no responsibility for its use or for infringement of patents or other third party rights, which may
result from its use. Enpirion products are not authorized for use in nuclear control systems, as critical components in life support systems or equipment
used in hazardous environment without the express written authority from Enpirion
©Enpirion 2011 all rights reserved, E&OE
Enpirion Confidential
www.enpirion.com, Page 15