Part Number 440SP Revision 1.23 - Sept 26, 2006
Data Sheet
PowerPC 440SP Embedded Processor
Features
• PowerPC‚ 440 processor core operating at up to 667MHz with 32-KB I- and D-caches (with parity checking) • On-chip 256-KB SRAM configurable as L2 Cache or Ethernet Packet/Code store memory • Selectable Processor:Bus clock ratios (Refer to the Clocking chapter in the PPC440SP Embedded Processor User’s Manual for details) • Supports up to 4 GB (2 Chip Selects) of 64-bit/32bit SDRAM with ECC – DDR1 266-333-400 – DDR2 400-533-667 • Three DDR PCI-X interfaces (32-bit or 64-bit) up to 133 MHz (DDR 266) with support for conventional PCI • XOR Accelerator with DMA controller • Processor can boot from PCI memory • Optional: High throughput RAID 6 hardware acceleration, performs XOR and Galois Field P & Q parity computations, supports up to 255 drives • I2O Messaging Unit with two DMA controllers • External Peripheral Bus (24-bit Address, 8-bit Data) for up to three devices • One Ethernet 10/100/1000 Mbps half- or fullduplex interface. Operational modes supported are MII and GMII. • Programmable Interrupt Controller supports interrupts from a variety of sources. • Programmable General Purpose Timers (GPT) • Three serial ports (16750 compatible UART) • Two IIC interfaces • General Purpose I/O (GPIO) interface available • JTAG interface for board level testing
Description
Designed specifically to address high-end embedded applications for storage, the PowerPC 440SP Embedded Processor (PPC440SP) provides a highperformance, low power solution that interfaces to a wide range of peripherals by incorporating on-chip power management features and lower power dissipation. This chip contains a high-performance RISC processor core, a DDR2 SDRAM controller, configurable 256KB SRAM to be used as L2 cache or software-controlled on-chip memory, three DDR PCI-X bus interfaces, an Ethernet interface, an I2O/DMA controller, control for external ROM and peripherals, optional RAID 6 acceleration, an XOR DMA unit, serial ports, IIC interfaces, and general purpose I/O. Technology: CMOS Cu-11, 0.13mm Package: 29mm, 783-ball, 1mm pitch, Flip ChipPlastic Ball Grid Array (FC-PBGA) Power (estimated): Less than 6W @533MHz Supply voltages required: 3.3V, 2.5V, 1.8V, 1.5V
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Revision 1.23 - Sept 26, 2006
PowerPC 440SP Embedded Processor Contents
Data Sheet
Ordering and PVR Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 PPC440SP Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Address Maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 PowerPC 440 Processor Core . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Internal Buses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 On-Chip SRAM/L2 Cache . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DDR PCI-X Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 DDR1/DDR2 SDRAM Memory Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 External Peripheral Bus Controller (EBC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Ethernet Controller Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 I2O/DMA Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Optional RAID 5 and RAID 6 Acceleration Hardware . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 XOR/DMA2 Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Serial Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 IIC Bus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 General Purpose Timers (GPT) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 General Purpose IO (GPIO) Controller . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Universal Interrupt Controller (UIC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 JTAG . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 29mm, 783-Ball FC-PBGA Core Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Signal Lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Signal Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Device Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Clock Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Clock Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Spread Spectrum Clocking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 69 I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Input/Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 DDR SDRAM I/O Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 DDR SDRAM Write Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 DDR SDRAM Read Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Initialization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Strapping . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Serial Bootstrap ROM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83 Document Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
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Data Sheet
Figures
PowerPC 440SP Embedded Processor
Figure 1. Order Part Number Key . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Figure 2. PPC440SP Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3. 29mm, 783-Ball FC-PBGA Core Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 4. Clock Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Figure 5. Input Setup and Hold Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Figure 6. Output Delay and Hold Timing Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71 Figure 7. DDR SDRAM Simulation Signal Termination Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76 Figure 8. DDR SDRAM Write Cycle Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Figure 9. DDR SDRAM Read Data Path. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80 Figure 10. DDR SDRAM Memory Data and DQS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Figure 11. DDR SDRAM Read Cycle Timing Example . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Tables
Table 1. System Memory Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 2. DCR Address Map (4KB of Device Configuration Registers) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 3. Signals Listed Alphabetically . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Table 4. Signals Listed by Ball Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47 Table 5. Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Table 6. Signal Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56 Table 7. Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63 Table 8. Package Thermal Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 9. Recommended DC Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 Table 10. Input Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66 Table 11. DC Power Supply Loads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67 Table 12. Clocking Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Table 13. Peripheral Interface Clock Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70 Table 14. I/O Specifications—All Speeds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Table 15. I/O Specifications—533MHz . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75 Table 16. DDR SDRAM Output Driver Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77 Table 17. DDR SDRAM Read and Write I/O Timing—TSA and THA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 78 Table 18. DDR SDRAM Clock to Write DQS Timing—TDS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 19. DDR SDRAM Write Data to DQS Timing—TSD and THD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 79 Table 20. DDR SDRAM I/O Read Timing—TSD and THD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 81 Table 21. Strapping Pin Assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
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PowerPC 440SP Embedded Processor Ordering and PVR Information
Data Sheet
For information about the availability of the following parts, contact your local AMCC sales office.
Product Name PPC440SP Notes:
Order Part Number (see Notes:) PPC440SP-xpCfffC
Package 29mm, 783 FC-PBGA
Rev Level C
PVR Value 0x53221891
JTAG ID 0x12056049
1. x = Product Feature A = RAID6 not enabled R = RAID6 enabled 2. p = Module Package Type F = leaded FC-PBGA N = lead free FC-PGBA (RoHS compliant) 3. C = Chip Revision Level C 4. fff = Processor Frequency 533 = 533MHz 667 = 667MHz 5. C = Case Temperature Range of -40°C to +100°C
Each part number contains a revision code. This is the die mask revision number and is included in the part number for identification purposes only. The PVR (Processor Version Register) and the JTAG ID register are software accessible (read-only) and contain information that uniquely identifies the part. See the PPC440SP Embedded Processor User’s Manual for details about accessing these registers. Note: Raid-enabled versions (Product Feature = R) require a RAID key license. Figure 1. Order Part Number Key
PPC440SP-RNC667C
AMCC Part Number Product Feature Package Case Temperature Range
Processor Speed Revision Level
Note: The example part number above is a RAID6-enabled, lead-free package, at Chip Revision Level C, capable of running at 667 MHz, and is shipped in tray packaging.
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Data Sheet
PPC440SP Functional Block Diagram
Figure 2. PPC440SP Functional Block Diagram
Clock, Control, Reset Universal Interrupt Controller Timers MMU DCRs
PowerPC 440SP Embedded Processor
Power Mgmt
UART2 IIC1 DCR Bus GPT GPIO IIC0 UART1 UART0
PPC440
Processor Core JTAG 32KB D-Cache Trace 32KB I-Cache
On-chip Peripheral Bus (OPB)
L2 Cache/SRAM
OPB Bridge
PLB
Processor Local Bus (PLB)
Arbiter MAL Ethernet 10/100/ 1000 (EMAC) MII, GMII External Bus Controller (EBC)
Low Latency (LL) Segment High Bandwidth (HB) Segment
I2O/DMA Controller (DMA0 and DMA1)
Memory Queue DDR2 SDRAM Controller
XOR/DMA Accelerator Unit (DMA2)
DDR PCI-X
PCI2 PCI0 PCI1 Host Local Local 64 bits 64 bits 32 bits
The PPC440SP is a System on a chip, which uses IBM® CoreConnect Bus™ Architecture. Implemented with the Crossbar option, the IBM CoreConnect buses provide: • 128-bit Data, 64-bit Address PLB interfaces up to 166.66MHz, 2.6GB/s on both the Read and Write data paths (10.6GB/sec total) • 32-bit OPB interfaces up to 83.33MHz, 333MB/s
Address Maps
The PPC440SP incorporates two address maps. The first is a fixed processor system memory address map. This address map defines the possible contents of various processor accessible address regions. The second address map identifies the system Device Configuration Registers (DCRs). DCRs are accessed by software running on the PPC440SP processor through the use of mtdcr and mfdcr instructions.
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PowerPC 440SP Embedded Processor
Data Sheet
Table 1. System Memory Address Map (Sheet 1 of 2)
Function Sub Function DDR SDRAM Local Memory (LL)1 SRAM Reserved I2O Registers DMA 0 Registers DMA 1 Registers Internal PLB Interfaces (LL) I20/DMA Buffers Reserved XOR/DMA2 Reserved Reserved UART0 Reserved UART1 Reserved IIC0 Reserved IIC1 Reserved Internal OPB Peripherals (LL) UART2 Reserved GPIO Controller Registers Reserved Ethernet Controller Registers Reserved General Purpose Timers Reserved EBC Memory Additional Boot ROM6 Boot ROM2, 3 Reserved Local Memory Alias (HB) Aliased DDR SDRAM Start Address 0000 0000 0000 0000 0000 0001 0000 0000 0000 0001 0004 0000 0000 0001 0010 0000 0000 0001 0010 0100 0000 0001 0010 0200 0000 0001 0010 0300 0000 0001 0010 1000 0000 0001 0020 0000 0000 0001 0020 4000 0000 0001 F000 0000 0000 0001 F000 0200 0000 0001 F000 0208 0000 0001 F000 0300 0000 0001 F000 0308 0000 0001 F000 0400 0000 0001 F000 0420 0000 0001 F000 0500 0000 0001 F000 0520 0000 0001 F000 0600 0000 0001 F000 0608 0000 0001 F000 0700 0000 0001 F000 0780 0000 0001 F000 0800 0000 0001 F000 0900 0000 0001 F000 0A00 0000 0001 F000 0B40 0000 0001 F800 0000 0000 0001 FFC0 0000 0000 0001 FFE0 0000 0000 0002 0000 0000 0000 0008 0000 0000 End Address 0000 0000 FFFF FFFF 0000 0001 0003 FFFF 0000 0001 000F FFFF 0000 0001 0010 00FF 0000 0001 0010 01FF 0000 0001 0010 02FF 0000 0001 0010 0FFF 0000 0001 001F FFFF 0000 0001 0020 3FFF 0000 0001 EFFF FFFF 0000 0001 F000 01FF 0000 0001 F000 0207 0000 0001 F000 02FF 0000 0001 F000 0307 0000 0001 F000 03FF 0000 0001 F000 041F 0000 0001 F000 04FF 0000 0001 F000 051F 0000 0001 F000 05FF 0000 0001 F000 0607 0000 0001 F000 06FF 0000 0001 F000 077F 0000 0001 F000 07FF 0000 0001 F000 08FF 0000 0001 F000 09FF 0000 0001 F000 0B3F 0000 0001 F7FF FFFF 0000 0001 FFBF FFFF 0000 0001 FFDF FFFF 0000 0001 FFFF FFFF 0000 0007 FFFF FFFF 0000 0008 FFFF FFFF 4GB 124MB 2MB 2MB 320B 256B 8B 248B 128B 32B 32B 8B 8B 16KB 256B 256B 256B 3.25KB Size 4GB 256KB
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Data Sheet
Table 1. System Memory Address Map (Sheet 2 of 2)
Function Reserved PCIX0 I/O PCIX1 I/O PCIX2 I/O Sub Function
PowerPC 440SP Embedded Processor
Start Address 0000 0009 0000 0000 0000 0009 0800 0000 0000 0009 1800 0000 0000 0009 2800 0000
End Address 0000 0009 07FF FFFF 0000 0009 0800 FFFF 0000 0009 1800 FFFF 0000 0009 2800 FFFF
Size
64KB 64KB 64KB
PCIX0 Addressing Config. Regs PCIX1 Addressing Config. Regs PCIX2 Addressing Config. Regs
0000 0009 0EC0 0000 0000 0009 1EC0 0000 0000 0009 2EC0 0000
0000 0009 0EC0 0007 0000 0009 1EC0 0007 0000 0009 2EC0 0007
8B 8B 8B
PCIX0 Core Config. Regs PCIX1 Core Config. Regs PCIX2 Core Config. Regs DDR PCI-X Space (HB) PCIX0 Simple Message Passing PCIX1 Simple Message Passing PCIX2 Simple Message Passing
0000 0009 0EC8 0000 0000 0009 1EC8 0000 0000 0009 2EC8 0000
0000 0009 0EC8 0FFF 0000 0009 1EC8 0FFF 0000 0009 2EC8 0FFF
4KB 4KB 4KB
0000 0009 0EC8 1100 0000 0009 1EC8 1100 0000 0009 2EC8 1100
0000 0009 0EC8 11FF 0000 0009 1EC8 11FF 0000 0009 2EC8 11FF
256B 256B 256B
PCIX0 Special Cycle PCIX1 Special Cycle PCIX2 Special Cycle Reserved PCI Memory Reserved PCI Boot ROM (PCI Memory) PCI Memory Reserved4 Reserved5 DDR PCI-X Space (HB) Notes: PCI Memory
0000 0009 0ED0 0000 0000 0009 1ED0 0000 0000 0009 2ED0 0000 0000 0009 2EE0 0000 0000 0009 2F00 0000 0000 0009 FFC0 0000 0000 0009 FFE0 0000 0000 000A 0000 0000 0000 0010 0000 0000 0400 0010 0000 0000 0800 0000 0000 0000
0000 0009 0EDF FFFF 0000 0009 1EDF FFFF 0000 0009 2EDF FFFF 0000 0009 2EFF FFFF 0000 0009 FFBF FFFF 0000 0009 FFDF FFFF 0000 0009 FFFF FFFF 0000 000F FFFF FFFF 03FF FFFF FFFF FFFF 07FF FFFF FFFF FFFF FFFF FFFF FFFF FFFF
1MB 1MB 1MB
3.3GB
2MB 24GB
15.7EB
1. DDR SDRAM and on-chip SRAM can be located anywhere in the Local Memory area of the memory map. 2. The Boot ROM and Expansion ROM areas of the memory map are intended for use by ROM or Flash-type devices. While locating volatile DDR SDRAM and SRAM in this region is supported, use of these regions for this purpose is not recommended. 3. When the optional boot from PCI-X memory is selected, the PCI-X Boot ROM address space begins at 9 FFE0 0000 (128 KB). 4. Never decoded. 5. Unpredictable results on Read and Write operations. 6. Accessed by means of EBC Peripheral Bank Configuration Registers
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PowerPC 440SP Embedded Processor
Data Sheet
Table 2. DCR Address Map (4KB of Device Configuration Registers)
Function Total DCR Address Space1 By function: Reserved Clocking Power On Reset System DCRs Memory Controller External Bus Controller Reserved SRAM L2 Controller Memory Queue Reserved I2O/DMA PLB PLB to OPB Bridge Out Reserved Reserved Reserved Interrupt Controller 0 Interrupt Controller 1 Power Management Reserved Ethernet MAL Reserved Notes: 1. DCR address space is addressable with up to 10 bits (1024 or 1K unique addresses). Each unique address represents a single 32-bit (word) register. One KW (1024W) equals 4KB (4096 bytes). 000 00C 00E 010 012 014 020 030 040 050 060 080 090 0A0 0B0 0B2 0C0 0D0 0E0 0E8 180 200 00B 00D 00F 011 013 01F 02F 03F 04F 05F 07F 08F 09F 0AF 0B1 0BF 0CF 0DF 0E7 17F 1FF 3FF 12W 2W 2W 2W 2W 12W 16W 16W 16W 16W 32W 16W 16W 16W 2W 14W 16W 16W 8W 152W 128W 512W Start Address 000 End Address 3FF Size 1KW (4KB)1
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Data Sheet
PowerPC 440 Processor Core
PowerPC 440SP Embedded Processor
The PowerPC 440 processor core is designed for high-end applications such as RAID controllers, SAN, iSCSI, routers, switches, printers, set-top boxes, and so on. It is the first processor core to implement the Book E PowerPC embedded architecture and the first to use the 128-bit version of IBM’s on-chip CoreConnect Bus Architecture. Features include: • Up to 667MHz operation • PowerPC Book E architecture • 32KB I-cache, 32KB D-cache – Parity on Data and Tag address - checking of parity with error injection • Three logical regions in D-cache: Locked, Transient, and Normal • D-cache full-line flush capability • 41-bit virtual address, 36-bit (64GB) physical address • Superscalar, out-of-order execution • Seven-stage pipeline • Three execution pipelines • Dynamic branch prediction • Memory management unit – 64-entry, full associative, unified TLB with parity – Separate instruction and data micro-TLBs – Storage attributes for write-through, cache-inhibited, guarded, and big or little endian • Debug facilities – Multiple instruction and data range breakpoints – Data value compare – Single step, branch, and trap events – Non-invasive real-time trace interface • 24 DSP instructions – Single cycle multiply and multiply-accumulate – 32 x 32 integer multiply
Internal Buses
The PowerPC 440SP Embedded Processor features three standard on-chip buses: the Processor Local Bus (PLB), the On-Chip Peripheral Bus (OPB), and the Device Control Register Bus (DCR). The high performance, high bandwidth cores such as the PowerPC 440 processor core, the DDR SDRAM memory controller, and the DDR PCI-X bridge connect to the PLB. The OPB hosts lower data rate peripherals. The daisy-chained DCR provides a lower bandwidth path for passing status and control information between the processor core and the other on-chip cores. The PLB has a Crossbar arbiter that supports data transfer between the PLB master and two slave segments identified as the Low Latency (LL) and High Bandwidth (HB) segments. The LL segment allows PLB masters CPU and I2O, that are adversely affected by latency, to communicate with slave devices with minimal latency. The HB segment allows PLB masters DMA, XOR, and PCI to exchange large blocks of data with SDRAM and PCI without interfering with the low latency PLB masters. Bus features include: • PLB – 128-bit Data implementation of the PLB architecture – Separate and simultaneous read and write data paths – 64-bit address – Simultaneous control, address, and data phases – Four levels of pipelining – Byte enable capability supporting unaligned transfers
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– 32- and 64-byte burst transfers – 166MHz, maximum 5.2GB/s (simultaneous read and write) – Processor:Bus clock ratios of N:1 and N:2 • OPB – Dynamic bus sizing: 32-, 16-, and 8-bit data path – 32-bit address – 83.33MHz, maximum 333MB/s • DCR – 32-bit data path – 10-bit address
Data Sheet
On-Chip SRAM/L2 Cache
Features include: • Four banks of 64KB each for a total of 256KB • Configurable as either L2 cache or SRAM • Memory cycles supported: – Single beat read and write, 1 to 16 bytes – Quadword Read and Write burst for 12-bit master – Guarded memory accesses on 4KB boundaries • Sustainable 2.6GB/s peak bandwidth at 166MHz • Use as an L2 cache improves processor performance and reduces the PLB load – Cache coherency maintained by a hardware snoop mechanism on the Low Latency (LL) PLB or by software – Data Array and Tag Array parity – Unified data and instruction cache – Four-way set associative – 36-bit addressing – Full LRU replacement algorithm – Write through, look aside • Use as Ethernet packet store allows Ethernet packets to be held for processing by the Ethernet core
DDR PCI-X Interface
The DDR PCI-X interface allows connection of PCI and PCI-X devices to the PowerPC processor and local memory. There are three separate interfaces supporting 32- and 64-bit PCI-X buses in DDR mode. All three interfaces can be configured for either host or adapter mode. PCI 32/64-bit legacy mode, compatible with PCI Version 2.3, is also supported. Features include: • PCI-X 2.0 – Split transactions – Frequency to 266MHz – 32- and 64-bit address/data bus – ECC supported for 266MHz Mode 2 only • PCI 2.3 backward compatibility – Frequency to 66MHz – 32- and 64-bit bus • Can be the PCI Host Bus Bridge or an Adapter Device PCI interface • Optional PCI arbitration function with PCI and PCI-X mode 1, supporting up to four external devices, that can be disabled for use with an external arbiter • Support for Message Signaled Interrupts (MSI) on both in- and out-bound interrupts • Simple message passing capability • Asynchronous to the PLB
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Data Sheet
• • • • • •
PowerPC 440SP Embedded Processor
• • • • •
PCI Power Management Version 1.1 PCI arbitration function with PCI-X Mode 2 support (optional) PCI register set addressable both from on-chip processor and PCI device sides Ability to boot from PCI-X bus memory Error tracking/status Supports initiation of transfer to the following address spaces: – Single beat I/O reads and writes – Single beat and burst memory reads and writes – Single beat configuration reads and writes (Type 0 and Type 1) – Single beat special cycles PCI-X initialization sequence support (frequency & mode determination) Support for unexpected split completions Outbound transaction split discard timers Vital Product Data (VPD) support PCI-to-PCI opaque bridge
DDR1/DDR2 SDRAM Memory Controller
The DDR2 SDRAM memory controller supports industry standard 184-pin DIMMs, SO-DIMMs, and other discrete devices. Global memory timings, address and bank sizes, and memory addressing modes are programmable. The DDR2 SDRAM controller interfaces to the PLB through a Memory Queue (MQ) function that includes six highspeed 1KB FIFO buffers. Features include: • Registered and non-registered industry standard DIMMs • DDR1 266-333-400 • DDR2 400-533-667 • 64-and 32-bit memory interfaces with optional 8-bit ECC (SEC/DED) • 5.32GB/s peak bandwidth for the 64-bit interface • 2.66GB/s peak bandwidth for the 32-bit interface • Two chip (bank) select signals supporting two external banks • CAS latencies of 2, 3, 4, 5, 6, and 7 supported • Page mode accesses (up to 32 open pages) with configurable paging policy • Look-ahead request queue with programmable depth of four commands. • Optional optimized command scheduling (activate/precharge non-conflicting banks while accessing the current bank) • Up to 4GB in two external banks • Programmable address mapping and timing • Hardware and software initiated self-refresh • Sync DRAM configuration by means of mode register and extended mode register set commands • Power management (self-refresh, suspend, sleep) • Low Latency & High Bandwidth PLB ports • Selectable PLB read response (immediate or deferred) • Programmable Low Latency & High Bandwidth arbitration schemes • High Bandwidth port has four 1KB read buffers and two1KB write buffers • Low Latency port has four 128B read buffers and two 128B write buffers
External Peripheral Bus Controller (EBC)
Features include: • Support 2MB Boot ROM • Up to three ROM, EPROM, SRAM, Flash memory, and slave peripherals supported • Burst and non-burst devices • 8-bit data bus
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24-bit address, 16MB address space Peripheral Device pacing with external “Ready” Latch data on Ready, synchronous or asynchronous Programmable access timing per device – 256 Wait States for non-burst – 32 Burst Wait States for first access and up to 8 Wait States for subsequent accesses – Programmable CSon, CSoff relative to address – Programmable OEon, WEon, WEoff (1 to 4 clock cycles) relative to CS • Programmable address mapping • • • •
Data Sheet
Ethernet Controller Interface
The Ethernet support interfaces to the physical layer, but the PHY is not included on the chip. Features include: • One 10/100/1000 interface running in full- and half-duplex modes – One full Media Independent Interface (MII) with 4-bit parallel data transfer – One Gigabit Media Independent Interface (GMII)
I2O/DMA Controller
The I20/DMA controller provides support for I20 messaging and two DMA controllers (DMA0 and DMA1). I2O manages message frame address (MFA) FIFOs or queues in memory in response to I2O register reads and writes and transfers message frames. The DMAs provide normal memory access support to ease the CPU burden. I2O features include: • I2O pull- and push-messaging methods • Dynamic message frame size • Programmable FIFO size (4096 64-bit MFAs maximum) • 64-bit and 32-bit MFA sizes • Three interrupt gathering methods • Registered MFA prefetch and posting • 32-bit inbound and outbound doorbell registers • Four 32-bit scratch pad registers DMA features include: • Programmable Command Pointer FIFO and Completion FIFO size (up to 2048 DMA operations queued) • 512-byte/1KB buffering for DMA0/DMA1 • Simultaneous fill and drain (PLB read/write pipelining) • Any source PLB address to any destination address • No memory alignment restrictions on source or destination • 32-byte command descriptor block • Maximum transfer size of 16MB • 64-bit addressing • Prefetch indicators for PCI-X buffer management (DMA1 only)
Optional RAID 5 and RAID 6 Acceleration Hardware
The 440SP provides integrated acceleration hardware that implements high throughput RAID 5 and RAID 6 algorithms to compute the single parity P for RAID 5, and dual parity P & Q for RAID 6. RAID 5 is used to recover data in the case of a single disk drive failure, and RAID 6 provides for data recovery if two disk drives fail. The 440SP offers a choice of two XOR engines for computing the P parity. The first choice is available with the XOR/DMA2 acceleration unit and is used for RAID 5. The second choice for XOR parity computation, along with the RAID 6 Galois Field GF(28)-based polynomial computations, resides inside the Memory Queue functional block
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Data Sheet
of the Memory Controller unit.
PowerPC 440SP Embedded Processor
The RAID 5 and RAID 6 parity computations performed in the Memory Queue are assisted by the two-channel DMA engine of the I2O/DMA controller unit, designated as DMA0 and DMA1. The RAID acceleration hardware also provides various alternatives for balancing load and performance, depending on customer-specific application firmware. The two-way crossbar bus architecture can perform data read and write operations simultaneously, resulting in extremely high throughput. RAID 6 capability is available only with the RAID-enabled part numbers (PPC440SP-RpCfffC) as indicated in the ordering information section of this data sheet. For more information about the RAID 6 implementation, description, and configuration of the acceleration hardware, refer to the following AMCC documents: • PowerPC 440SP/440SPe RAID Support Application Note • PowerPC 440SP RAID Addendum to the User’s Manual
XOR/DMA2 Controller
The XOR/DMA2 controller performs the XOR functions needed to support RAID 5 applications including parity generation and check functions used across data stripes in a RAID 5 system. Features include: • Computes a bit-wise XOR on up to 16 data streams with result stored in designated target • Performs XOR check on up to 16 data streams • Driven by a linked list Command Block structure specifying control information, source operands, target operand, status information, and link • Source and target streams may reside anywhere in PLB address space. • Provides completion status per Command Block to be handled by software at a later time • 96-byte and 160-byte Command Block formats are supported • No memory alignment restrictions on operands or target • Internal register arrays and data buffers are parity protected • Can be used as a DMA controller (DMA2) with single source and target addresses
Serial Port
The serial port is compatible with the NS‚ 16570 UART interface. Features include: • One 8-pin, one 4-pin, and one 2-pin interfaces are provided • Selectable internal or external serial clock to allow wide range of baud rates • Register compatibility with 16750 register set • Complete status reporting capability • Fully programmable serial-interface characteristics
IIC Bus Interface
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Features include: • Two IIC interfaces provided • Support for Philips‚ Semiconductors I2C Specification, dated 1995 • Operation at 100kHz or 400kHz • 8-bit data • 10- or 7-bit address • Slave transmitter and receiver • Master transmitter and receiver • Multiple bus masters • Supports fixed VDD IIC interface • Two independent 4 x 1 byte data buffers • Twelve memory-mapped, fully programmable configuration registers • One programmable interrupt request signal • Full management of all IIC bus protocols • Programmable error recovery • Port 0 supports serial Bootstrap ROM with default parameters override at initialization
Data Sheet
General Purpose Timers (GPT)
Provides a time base counter and system timers additional to those defined in the processor core. • 32-bit time base counter driven by the OPB bus clock • Seven 32-bit compare timers
General Purpose IO (GPIO) Controller
• Controller functions and GPIO registers are programmed and accessed by means of memory-mapped OPB bus master accesses. • The 32 GPIOs are pin-shared with other functions. DCRs control whether a particular pin that has GPIO capabilities acts as a GPIO or is used for another purpose. • Each GPIO output is a separately programmable tri-state driver (pull-up, pull-down, or open-drain).
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Universal Interrupt Controller (UIC)
PowerPC 440SP Embedded Processor
Two cascaded Universal Interrupt Controllers (UIC) process internal on-chip and external processor interrupts. Note: Processor specific interrupts (for example, page faults) do not use UIC resources. Features include: • 6 external interrupts • 56 internal interrupts • Edge-triggered or level-sensitive • Positive- or negative-active • Non-critical or critical interrupt to the on-chip processor core • Programmable interrupt priority ordering • Programmable critical interrupt vector for faster vector processing
JTAG
Features include: • IEEE 1149.1 Test Access Port • IBM RISCWatch Debugger support • JTAG Boundary Scan Description Language (BSDL)
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Figure 3. 29mm, 783-Ball FC-PBGA Core Package
Data Sheet
Top View
A1 Corner A
1
24
®
PPC440SP
xpCfffC
Part Number
Lot Number
AAAAAAAA
AD
Note: All dimensions are in mm.
Bottom View
29.0 ± 0.2
AH
AE AD AC AB AA Y W V U T 29.0 ± 0.2 P R N M L K J H G F E D C B A 01 03 05 07 09 11 13 15 17 19 21 23 25 27 02 04 06 08 10 12 14 16 18 20 22 24 26 28 0.6 ± 0.1 SOLDERBALL x 783 0.4 MIN 3.27 MAX
AF
AG
1.00 TYP
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Signal Lists
This section contains two tables that list external signals.
PowerPC 440SP Embedded Processor
Table 3 lists all the external signals in alphabetical order and shows the ball (pin) number on which the signal appears. Multiplexed signals are shown with the default signal (following reset) not in brackets and the alternate signal or signals in brackets. Multiplexed signals appear alphabetically multiple times in the list—once for each signal name on the ball. The page number listed gives the page in “Signal Functional Description” on page 56 where the signals in the indicated interface group begin. Table 4 on page 47 lists all the external signals in order by ball (pin) number. Signal List—Alphabetic Order
Table 3. Signals Listed Alphabetically (Sheet 1 of 30)
Signal Name A1GND A2GND A1VDD A2VDD AP0GND AP0VDD AP1GND AP1VDD AP2GND AP2VDD BA0 BA1 BA2 BankSel0 BankSel1 CAS ClkEn0 ClkEn1 Ball B01 AG28 C01 AF28 AG01 Power AF01 B28 C28 T01 R01 AD21 AE20 AE25 T23 DDR SDRAM P22 AH25 AE23 AE24 58 62 Interface Group Page
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Table 3. Signals Listed Alphabetically (Sheet 2 of 30)
Signal Name DM0 DM1 DM2 DM3 DM4 DM5 DM6 DM7 DM8 DQS0 DQS0 DQS1 DQS1 DQS2 DQS2 DQS3 DQS3 DQS4 DQS4 DQS5 DQS5 DQS6 DQS6 DQS7 DQS7 DQS8 DQS8 Ball AE26 AA26 V25 P26 K27 M21 R21 U19 AA24 AD26 AD25 AA28 AA27 U26 U25 N27 N28 K25 K26 L25 L26 R26 R25 W27 W26 AB26 AB25 DDR SDRAM Interface Group
Data Sheet
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Table 3. Signals Listed Alphabetically (Sheet 3 of 30)
Signal Name ECC0 ECC1 ECC2 ECC3 ECC4 ECC5 ECC6 ECC7 Ball AC24 Y23 Y21 AC23 DDR SDRAM AD23 AA23 W19 AF20
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Table 3. Signals Listed Alphabetically (Sheet 4 of 30)
Signal Name EMCCD EMCCrS EMCMDClk EMCMDIO EMCRefClk EMCRxClk EMCRxD0 EMCRxD1 EMCRxD2 EMCRxD3 EMCRxD4 EMCRxD5 EMCRxD6 EMCRxD7 EMCRxDV EMCRxErr EMCTxClk EMCGTxClk EMCTxD0 EMCTxD1 EMCTxD2 EMCTxD3 EMCTxD4 EMCTxD5 EMCTxD6 EMCTxD7 EMCTxEn EMCTxErr ExtReset Ball D02 E03 D01 E04 D12 D03 F04 G04 F03 G01 H03 H02 F05 F06 Ethernet F07 J01 E01 B08 F02 F01 H01 G03 H04 K04 K03 A02 C04 A03 H11 External Slave Peripheral Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 5 of 30)
Signal Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ball B02 B05 B09 B20 B24 B27 C13 C16 E02 E07 E11 E18 E22 E27 F14 F15 Power G05 G09 G13 G16 G20 G24 J02 J07 J11 J18 J22 J27 L05 L09 L13 L16
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Table 3. Signals Listed Alphabetically (Sheet 6 of 30)
Signal Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ball L20 L24 N03 N07 N11 N14 N15 N18 N22 N26 P06 P13 P16 P23 R06 R13 R16 Power R23 T03 T07 T11 T14 T15 T18 T22 T26 V05 V09 V13 V16 V20 V24 Y02 Y07 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 7 of 30)
Signal Name GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND Ball Y11 Y18 Y22 Y27 AB05 AB09 AB13 AB16 AB20 AB24 AC14 AC15 AD02 Power AD07 AD11 AD18 AD22 AD27 AF13 AF16 AG02 AG05 AG09 AG20 AG24 AG27
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Table 3. Signals Listed Alphabetically (Sheet 8 of 30)
Signal Name [GPIO00] [TrcClk] PCIX0Req2 [GPIO01] [TrcBS0] PCIX0Req3 [GPIO02] [TrcBS1] PCIX0Gnt2 [GPIO03] [TrcBS2] PCIX0Gnt3 [GPIO04] [TrcES0] PCIX1Req2 [GPIO05] [TrcES1] PCIX1Req3 [GPIO06] [TrcES2] PCIX1Gnt2 [GPIO07] [TrcES3] PCIX1Gnt3 [GPIO08] [TrcES4] PerReady [GPIO09] PerCS1 [TrcTS0] [GPIO10] PerCS2 [TrcTS1] [GPIO11] IRQ0 [TrcTS2] [GPIO12] IRQ1 [TrcTS3] [GPIO13] IRQ2 [TrcTS4] [GPIO14] IRQ3 [TrcTS5] [GPIO15] IRQ4 [TrcTS6] [GPIO16] IRQ5 [UART2_Rx] [GPIO17] PerBE0 [UART2_Tx] [GPIO18] PCIX0Gnt0 [GPIO19] PCIX0Gnt1 [GPIO20] PCIX0Req0 [GPIO21] PCIX0Req1 [GPIO22] PCIX1Gnt0 [GPIO23] PCIX1Gnt1 [GPIO24] PCIX1Req0 [GPIO25] PCIX1Req1 [GPIO26] PCIX2Gnt0 [GPIO27] PCIX2Gnt1 [GPIO28] PCIX2Req0 [GPIO29] PCIX2Req1 [GPIO30] UART1_Rx [GPIO31] UART1_Tx Halt HISRRst Ball AA12 Y12 AC13 AF11 C23 E23 D21 D23 G12 E12 H10 C07 C06 A05 C05 D06 D05 System R09 AF14 AG13 AH11 AG12 B19 C19 C20 C22 P01 P03 U05 N04 A07 A06 K18 B06 Interface Group
Data Sheet
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Table 3. Signals Listed Alphabetically (Sheet 9 of 30)
Signal Name IIC0SClk IIC0SDA IIC1SClk IIC1SDA IRQ0 [GPIO11] [TrcTS2] IRQ1 [GPIO12] [TrcTS3] IRQ2 [GPIO13] [TrcTS4] IRQ3 [GPIO14] [TrcTS5] IRQ4 [GPIO15] [TrcTS6] IRQ5 [GPIO16] [UART2_Rx] MemAddr00 MemAddr01 MemAddr02 MemAddr03 MemAddr04 MemAddr05 MemAddr06 MemAddr07 MemAddr08 MemAddr09 MemAddr10 MemAddr11 MemAddr12 MemAddr13 MemAddr14 MemClkOut0 MemClkOut0 MemClkOut1 MemClkOut1 Ball D09 E08 IIC Peripheral F08 E10 C07 C06 A05 Interrupts C05 D06 D05 AF23 AE21 AD19 AE19 AH22 AH23 AE22 AF21 AF22 AG23 AG21 AF19 AH20 AH21 AF24 AG26 AG25 AH26 AH27 DDR SDRAM
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60
60
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Table 3. Signals Listed Alphabetically (Sheet 10 of 30)
Signal Name MemData00 MemData01 MemData02 MemData03 MemData04 MemData05 MemData06 MemData07 MemData08 MemData09 MemData10 MemData11 MemData12 MemData13 MemData14 MemData15 MemData16 MemData17 MemData18 MemData19 MemData20 MemData21 MemData22 MemData23 MemData24 MemData25 MemData26 MemData27 MemData28 MemData29 MemData30 MemData31 Ball AD28 AE27 AF27 AC26 AC27 AE28 AF25 AC25 Y26 AB28 AC28 Y28 Y25 AA25 AB23 W25 DDR SDRAM U27 V28 W28 T25 T27 V26 W23 T28 N25 P28 R28 M27 M26 P25 U24 M25 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 11 of 30)
Signal Name MemData32 MemData33 MemData34 MemData35 MemData36 MemData37 MemData38 MemData39 MemData40 MemData41 MemData42 MemData43 MemData44 MemData45 MemData46 MemData47 MemData48 MemData49 MemData50 MemData51 MemData52 MemData53 MemData54 MemData55 MemData56 MemData57 MemData58 MemData59 MemData60 MemData61 MemData62 MemData63 MemDCFdbkD MemDCFdbkR Ball J26 K28 L28 H28 H27 J28 P21 H26 P20 M23 M22 N23 N21 K24 M24 N19 U23 DDR SDRAM R22 R24 U22 T19 R20 P24 T21 W22 U20 U21 W24 W21 V23 V21 W20 AB21 AC21
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Table 3. Signals Listed Alphabetically (Sheet 12 of 30)
Signal Name MemODT0 MemODT1 MemVRef0 MemVRef1 No ball OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD OVDD Ball AA22 AC22 DDR SDRAM AA20 AA21 A01 B07 B11 B14 B15 C03 G02 G07 G11 K14 K15 L02 L07 L11 P10 P14 Power A physical ball does not exist at this coordinate Interface Group
Data Sheet
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Table 3. Signals Listed Alphabetically (Sheet 13 of 30)
Signal Name P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P0VDD P1VDD P1VDD P1VDD P1VDD P1VDD P1VDD P1VDD P1VDD P1VDD P1VDD P2VDD P2VDD P2VDD P2VDD P2VDD P2VDD P2VDD P2VDD Ball R14 W14 W15 AB07 AB11 AB18 AB22 AG07 AG11 AG14 AG15 AG18 AG22 B18 B22 C26 G18 G22 G27 L18 L22 L27 P15 P02 R02 R10 V02 V07 V11 AB02 AF03 Power
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Table 3. Signals Listed Alphabetically (Sheet 14 of 30)
Signal Name PCIX0Ack64 [PCIX0ECC1] PCIX0AD00 PCIX0AD01 PCIX0AD02 PCIX0AD03 PCIX0AD04 PCIX0AD05 PCIX0AD06 PCIX0AD07 PCIX0AD08 PCIX0AD09 PCIX0AD10 PCIX0AD11 PCIX0AD12 PCIX0AD13 PCIX0AD14 PCIX0AD15 PCIX0AD16 PCIX0AD17 PCIX0AD18 PCIX0AD19 PCIX0AD20 PCIX0AD21 PCIX0AD22 PCIX0AD23 PCIX0AD24 PCIX0AD25 PCIX0AD26 PCIX0AD27 PCIX0AD28 PCIX0AD29 PCIX0AD30 PCIX0AD31 Ball AH06 AE12 AE11 AE10 AE09 AF10 AH08 AH09 AA11 AC09 AA09 AC08 AD08 AD10 AA10 AB10 AH07 AF06 AF07 AE08 AF05 AF04 AD06 AG04 AF08 AH02 AH03 AF02 AE03 AD04 AE05 AE01 AE02 PCI-X0 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 15 of 30)
Signal Name PCIX0AD32 PCIX0AD33 PCIX0AD34 PCIX0AD35 PCIX0AD36 PCIX0AD37 PCIX0AD38 PCIX0AD39 PCIX0AD40 PCIX0AD41 PCIX0AD42 PCIX0AD43 PCIX0AD44 PCIX0AD45 PCIX0AD46 PCIX0AD47 PCIX0AD48 PCIX0AD49 PCIX0AD50 PCIX0AD51 PCIX0AD52 PCIX0AD53 PCIX0AD54 PCIX0AD55 PCIX0AD56 PCIX0AD57 PCIX0AD58 PCIX0AD59 PCIX0AD60 PCIX0AD61 PCIX0AD62 PCIX0AD63 Ball AE18 AF18 AH19 AG19 AD17 AA18 W18 AC20 AE17 Y17 W17 AA17 AC19 AB17 AC17 AB19 PCI-X0 AC18 AH18 AG16 AF17 AF15 AH15 AE15 AD15 AB14 AB15 AA14 Y15 W16 AA16 AC16 AA15
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Table 3. Signals Listed Alphabetically (Sheet 16 of 30)
Signal Name PCIX0BE0 PCIX0BE1 PCIX0BE2 PCIX0BE3 PCIX0BE4 PCIX0BE5 PCIX0BE6 PCIX0BE7 PCIX0CalG0 PCIX0CalG1 PCIX0CalR0 PCIX0CalR1 PCIX0Cap PCIX0Clk PCIX0DevSel [PCIX0ECC0] PCIX0Par [PCIX0ECC1] PCIX0Ack64 PCIX0ECC2 PCIX0ECC3 PCIX0ECC4 PCIX0ECC5 [PCIX0ECC6] PCIX0Req64 [PCIX0ECC7] PCIX0Par64 PCIX0Frame PCIX0Gnt0 [GPIO18] PCIX0Gnt1 [GPIO19] PCIX0Gnt2 [GPIO02] [TrcBS1] PCIX0Gnt3 [GPIO03] [TrcBS2] PCIX0IDSel PCIX0INTA PCIX0IRDY Ball AF09 AG10 AE07 AE06 AH16 AG17 AE16 AE14 AA08 Y19 AB08 AA19 AA13 AF12 Y10 AG06 AH06 AG03 AH04 AH05 AD03 AG08 AH14 AC12 AF14 AG13 AC13 AF11 Y14 AB12 W13 PCI-X0 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 17 of 30)
Signal Name PCIX0M66En PCIX0Par [PCIX0ECC0] PCIX0Par64 [PCIX0ECC7] PCIX0PErr PCIX0Req0 [GPIO20] PCIX0Req1 [GPIO21] PCIX0Req2 [GPIO00] [TrcClk] PCIX0Req3 [GPIO01] [TrcBS0] PCIX0Req64 [PCIX0ECC6] PCIX0Reset PCIX0SErr PCIX0Stop PCIX0TRDY PCIX0VC PCIX0VRef0 PCIX0VRef1 Ball AD14 AG06 AH14 W11 AH11 AG12 AA12 Y12 PCI-X0 AG08 AH13 AD12 AE13 W12 AH10 AC11 AC10
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Table 3. Signals Listed Alphabetically (Sheet 18 of 30)
Signal Name PCIX1Ack64 [PCIX1ECC1] PCIX1AD00 PCIX1AD01 PCIX1AD02 PCIX1AD03 PCIX1AD04 PCIX1AD05 PCIX1AD06 PCIX1AD07 PCIX1AD08 PCIX1AD09 PCIX1AD10 PCIX1AD11 PCIX1AD12 PCIX1AD13 PCIX1AD14 PCIX1AD15 PCIX1AD16 PCIX1AD17 PCIX1AD18 PCIX1AD19 PCIX1AD20 PCIX1AD21 PCIX1AD22 PCIX1AD23 PCIX1AD24 PCIX1AD25 PCIX1AD26 PCIX1AD27 PCIX1AD28 PCIX1AD29 PCIX1AD30 PCIX1AD31 Ball K23 D18 C18 F18 A19 F16 H20 F20 F21 C17 D16 B17 B16 E17 H19 F19 G19 A15 C14 C15 A16 D15 H17 G17 H18 D13 B13 B12 C12 E15 K16 H16 J15 PCI-X1 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 19 of 30)
Signal Name PCIX1AD32 PCIX1AD33 PCIX1AD34 PCIX1AD35 PCIX1AD36 PCIX1AD37 PCIX1AD38 PCIX1AD39 PCIX1AD40 PCIX1AD41 PCIX1AD42 PCIX1AD43 PCIX1AD44 PCIX1AD45 PCIX1AD46 PCIX1AD47 PCIX1AD48 PCIX1AD49 PCIX1AD50 PCIX1AD51 PCIX1AD52 PCIX1AD53 PCIX1AD54 PCIX1AD55 PCIX1AD56 PCIX1AD57 PCIX1AD58 PCIX1AD59 PCIX1AD60 PCIX1AD61 PCIX1AD62 PCIX1AD63 Ball E28 F28 F27 D28 G28 M20 M19 L23 A27 G26 C27 D27 F26 K22 K21 K20 PCI-X1 H25 J25 E25 B26 E26 J23 J21 H23 B25 C24 D24 C25 A26 A25 D25 F24
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Table 3. Signals Listed Alphabetically (Sheet 20 of 30)
Signal Name PCIX1BE0 PCIX1BE1 PCIX1BE2 PCIX1BE3 PCIX1BE4 PCIX1BE5 PCIX1BE6 PCIX1BE7 PCIX1CalG0 PCIX1CalG1 PCIX1CalR0 PCIX1CalR1 PCIX1Cap PCIX1Clk PCIX1DevSel [PCIX1ECC0] PCIX1Par [PCIX1ECC1] PCIX1Ack64 PCIX1ECC2 PCIX1ECC3 PCIX1ECC4 PCIX1ECC5 [PCIX1ECC6] PCIX1Req64 [PCIX1ECC7] PCIX1Par64 PCIX1Frame PCIX1Gnt0 [GPIO22] PCIX1Gnt1 [GPIO23] PCIX1Gnt2 [GPIO06] [TrcES2] PCIX1Gnt3 [GPIO07] [TrcES3] PCIX1IDSel PCIX1INTA PCIX1IRDY PCIX1M66En Ball F17 D17 D14 E14 D26 F25 G25 F22 L19 G14 L21 H14 G21 E21 D19 K19 PCI-X1 K23 H21 H22 H15 F23 H24 A24 B21 B19 C19 D21 D23 B23 A22 D22 G23 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 21 of 30)
Signal Name PCIX1Par [PCIX1ECC0] PCIX1Par64 [PCIX1ECC7] PCIX1PErr PCIX1Req0 [GPIO24] PCIX1Req1 [GPIO25] PCIX1Req2 [GPIO04] [TrcES0] PCIX1Req3 [GPIO05] [TrcES1] PCIX1Req64 [PCIX1ECC6] PCIX1Reset PCIX1SErr PCIX1Stop PCIX1TRDY PCIX1VC PCIX1VRef0 PCIX1VRef1 Ball K19 A24 D20 C20 C22 C23 E23 H24 A20 A23 C21 E19 A21 J17 K17 PCI-X1
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Table 3. Signals Listed Alphabetically (Sheet 22 of 30)
Signal Name PCIX2AD00 PCIX2AD01 PCIX2AD02 PCIX2AD03 PCIX2AD04 PCIX2AD05 PCIX2AD06 PCIX2AD07 PCIX2AD08 PCIX2AD09 PCIX2AD10 PCIX2AD11 PCIX2AD12 PCIX2AD13 PCIX2AD14 PCIX2AD15 PCIX2AD16 PCIX2AD17 PCIX2AD18 PCIX2AD19 PCIX2AD20 PCIX2AD21 PCIX2AD22 PCIX2AD23 PCIX2AD24 PCIX2AD25 PCIX2AD26 PCIX2AD27 PCIX2AD28 PCIX2AD29 PCIX2AD30 PCIX2AD31 PCIX2BE0 PCIX2BE1 Ball AC03 AC04 AC05 AD01 AB01 AB04 AC01 AC02 Y04 AA01 Y03 Y01 AA03 AA04 AB06 AC06 W02 PCI-X2 W01 W03 W04 V04 Y06 Y08 AA05 V01 U03 T04 T02 U04 W07 W06 W05 AB03 AA02 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 23 of 30)
Signal Name PCIX2BE2 PCIX2BE3 PCIX2CalG0 PCIX2CalR0 PCIX2Cap PCIX2Clk PCIX2DevSel [PCIX2ECC0] PCIX2Par PCIX2ECC1 PCIX2ECC2 PCIX2ECC3 PCIX2ECC4 PCIX2ECC5 PCIX2ECC6 PCIX2Frame PCIX2Gnt0 [GPIO26] PCIX2Gnt1 [GPIO27] PCIX2IDSel PCIX2INTA PCIX2IRDY PCIX2M66En PCIX2Par [PCIX2ECC0] PCIX2PErr PCIX2Req0 [GPIO28] PCIX2Req1 [GPIO29] PCIX2Reset PCIX2SErr PCIX2Stop PCIX2TRDY PCIX2VC PCIX2VRef0 PCIX2VRef1 Ball V03 U02 W08 W09 T08 R03 M03 AC07 W10 AA07 U09 N01 AA06 AE04 U08 P01 PCI-X2 P03 T10 U07 P04 T06 AC07 U06 U05 N04 V06 V08 M02 N02 V10 R04 U10
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Table 3. Signals Listed Alphabetically (Sheet 24 of 30)
Signal Name PerAddr00 PerAddr01 PerAddr02 PerAddr03 PerAddr04 PerAddr05 PerAddr06 PerAddr07 PerAddr08 PerAddr09 PerAddr10 PerAddr11 PerAddr12 PerAddr13 PerAddr14 PerAddr15 PerAddr16 PerAddr17 PerAddr18 PerAddr19 PerAddr20 PerAddr21 PerAddr22 PerAddr23 PerBE0 [GPIO17] [UART2_Tx] PerBLast PerClk PerCS0 PerCS1 [GPIO09] [TrcTS0] PerCS2 [GPIO10] [TrcTS1] Ball J04 K06 K05 M08 L06 M07 L08 K07 K08 M05 N08 N06 P08 P05 P07 External Slave Peripheral L03 L04 L01 M04 K01 K02 R07 R05 R08 R09 B04 A04 M06 E12 H10 Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 25 of 30)
Signal Name PerData0 PerData1 PerData2 PerData3 PerData4 PerData5 PerData6 PerData7 PerErr PerOE PerPar0 PerReady [GPIO08] [TrcES4] PerR/W PerWE PSRO PSRO PSRO PSRO RAS Ball H05 J08 H07 D04 G08 E06 G06 J06 B03 F12 C02 G12 H06 K10 M12 M17 PSRO U12 U17 AH24 DDR SDRAM
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Table 3. Signals Listed Alphabetically (Sheet 26 of 30)
Signal Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Ball D07 F09 F13 H08 H09 H13 J10 J12 J14 K09 K11 K12 K13 L10 L12 L14 L15 L17 M09 M10 M11 M13 M14 M15 M16 M18 N10 N12 N17 P09 P11 P12 P17 Reserved Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 27 of 30)
Signal Name Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved Reserved SVDD SVDD SVDD SVDD SVDD SVDD SVDD SVDD SVDD SVDD SysClk SysErr SysPartSel SysReset Ball P18 R11 R12 R17 R18 T12 T17 U11 U13 U14 U15 U16 U18 V12 V14 V15 V17 P19 P27 R15 R19 R27 Power V18 V22 V27 AB27 AF26 J03 J19 System A14 G15 Reserved
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Table 3. Signals Listed Alphabetically (Sheet 28 of 30)
Signal Name TCK TDI TDO TestEn TmrClk TMS [TrcClk] [GPIO00] PCIX0Req2 [TrcBS0] [GPIO01] PCIX0Req3 [TrcBS1] [GPIO02] PCIX0Gnt2 [TrcBS2] [GPIO03] PCIX0Gnt3 [TrcES0] [GPIO04] PCIX1Req2 [TrcES1] [GPIO05] PCIX1Req3 [TrcES2] [GPIO06] PCIX1Gnt2 [TrcES3] [GPIO07] PCIX1Gnt3 [TrcES4] [GPIO08] PerReady [TrcTS0] PerCS1 [GPIO09] [TrcTS1] PerCS2 [GPIO10] [TrcTS2] [GPIO11] IRQ0 [TrcTS3] [GPIO12] IRQ1 [TrcTS4] [GPIO13] IRQ2 [TrcTS5] [GPIO14] IRQ3 [TrcTS6] [GPIO15] IRQ4 TRST UART0_CTS UART0_DCD UART0_DSR UART0_DTR UART0_RI UART0_RTS UART0_Rx UART0_Tx Ball D10 A10 D11 A18 System D08 C10 AA12 Y12 AC13 AF11 C23 E23 D21 D23 Trace G12 E12 H10 C07 C06 A05 C05 D06 B10 C09 A08 C11 A11 UART Peripheral A13 F11 H12 C08 JTAG JTAG JTAG Interface Group
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Table 3. Signals Listed Alphabetically (Sheet 29 of 30)
Signal Name UART1_DSR/CTS UART1_RTS/DTR UART1_Rx [GPIO30] UART1_Tx [GPIO31] [UART2_Rx] [GPIO16] IRQ5 [UART2_Tx] [GPIO17] PerBE0 UARTSerClk VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD Ball F10 G10 A07 A06 D05 R09 A09 A12 A17 A28 E05 E09 E13 E16 E20 E24 J05 J09 J13 J16 J20 J24 M01 M28 N05 N09 N13 N16 N20 N24 T05 T09 Power UART Peripheral
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Table 3. Signals Listed Alphabetically (Sheet 30 of 30)
Signal Name VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD VDD WE Ball T13 T16 T20 T24 U01 U28 Y05 Y09 Y13 Y16 Y20 Power Y24 AD05 AD09 AD13 AD16 AD20 AD24 AH01 AH12 AH17 AH28 V19 DDR SDRAM Interface Group
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Signal List—Ball Assignment Order
PowerPC 440SP Embedded Processor
In the following table, only the primary (default) signal name is shown for each pin. Multiplexed pins are marked with an asterisk (*). To determine the other signals that share a pin, look up the primary signal name in Table 3 on page 17. Table 4. Signals Listed by Ball Assignment (Sheet 1 of 7)
Ball A01 A02 A03 A04 A05 A06 A07 A08 A09 A10 A11 A12 A13 A14 A15 A16 A17 A18 A19 A20 A21 A22 A23 A24 A25 A26 A27 A28 Signal Name No ball EMCTxD7 EMCTxErr PerClk IRQ2* UART1_Tx* UART1_Rx* UART0_DCD UARTSerClk TDI UART0_DTR VDD UART0_RI SysPartSel PCIX1AD16 PCIX1AD19 VDD TestEn PCIX1AD03 PCIX1Reset PCIX1VC PCIX1INTA PCIX1SErr PCIX1Par64* PCIX1AD61 PCIX1AD60 PCIX1AD40 VDD Ball B01 B02 B03 B04 B05 B06 B07 B08 B09 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 Signal Name A1GND GND PerErr PerBLast GND HISRRst OVDD EMCGTxClk GND TRST OVDD PCIX1AD26 PCIX1AD25 OVDD OVDD PCIX1AD11 PCIX1AD10 P1VDD PCIX1Gnt0* GND PCIX1Frame P1VDD PCIX1IDSel GND PCIX1AD56 PCIX1AD51 GND AP1GND Ball C01 C02 C03 C04 C05 C06 C07 C08 C09 C10 C11 C12 C13 C14 C15 C16 C17 C18 C19 C20 C21 C22 C23 C24 C25 C26 C27 C28 Signal Name A1VDD PerPar0 OVDD EMCTxEn IRQ3* IRQ1* IRQ0* UART0_Tx UART0_CTS TMS UART0_DSR PCIX1AD27 GND PCIX1AD17 PCIX1AD18 GND PCIX1AD08 PCIX1AD01 PCIX1Gnt1* PCIX1Req0* PCIX1Stop PCIX1Req1* PCIX1Req2* PCIX1AD57 PCIX1AD59 P1VDD PCIX1AD42 AP1VDD Ball D01 D02 D03 D04 D05 D06 D07 D08 D09 D10 D11 D12 D13 D14 D15 D16 D17 D18 D19 D20 D21 D22 D23 D24 D25 D26 D27 D28 Signal Name EMCMDClk EMCCD EMCRxClk PerData3 IRQ5* IRQ4* Reserved TmrClk IIC0SClk TCK TDO EMCRefClk PCIX1AD24 PCIX1BE2 PCIX1AD20 PCIX1AD09 PCIX1BE1 PCIX1AD00 PCIX1DevSel PCIX1PErr PCIX1Gnt2* PCIX1IRDY PCIX1Gnt3* PCIX1AD58 PCIX1AD62 PCIX1BE4 PCIX1AD43 PCIX1AD35
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Table 4. Signals Listed by Ball Assignment (Sheet 2 of 7)
Ball E01 E02 E03 E04 E05 E06 E07 E08 E09 E10 E11 E12 E13 E14 E15 E16 E17 E18 E19 E20 E21 E22 E23 E24 E25 E26 E27 E28 Signal Name EMCTxClk GND EMCCrS EMCMDIO VDD PerData5 GND IIC0SDA VDD IIC1SDA GND PerCS1* VDD PCIX1BE3 PCIX1AD28 VDD PCIX1AD12 GND PCIX1TRDY VDD PCIX1Clk GND PCIX1Req3* VDD PCIX1AD50 PCIX1AD52 GND PCIX1AD32 Ball F01 F02 F03 F04 F05 F06 F07 F08 F09 F10 F11 F12 F13 F14 F15 F16 F17 F18 F19 F20 F21 F22 F23 F24 F25 F26 F27 F28 Signal Name EMCTxD1 EMCTxD0 EMCRxD2 EMCRxD0 EMCRxD6 EMCRxD7 EMCRxDV IIC1SClk Reserved UART1_DSR/CTS UART0_RTS PerOE Reserved GND GND PCIX1AD04 PCIX1BE0 PCIX1AD02 PCIX1AD14 PCIX1AD06 PCIX1AD07 PCIX1BE7 PCIX1ECC5 PCIX1AD63 PCIX1BE5 PCIX1AD44 PCIX1AD34 PCIX1AD33 Ball G01 G02 G03 G04 G05 G06 G07 G08 G09 G10 G11 G12 G13 G14 G15 G16 G17 G18 G19 G20 G21 G22 G23 G24 G25 G26 G27 G28 Signal Name EMCRxD3 OVDD EMCTxD3 EMCRxD1 GND PerData6 OVDD PerData4 GND UART1_RTS/DTR OVDD PerReady* GND PCIX1CalG1 SysReset GND PCIX1AD22 P1VDD PCIX1AD15 GND PCIX1Cap P1VDD PCIX1M66En GND PCIX1BE6 PCIX1AD41 P1VDD PCIX1AD36 Ball H01 H02 H03 H04 H05 H06 H07 H08 H09 H10 H11 H12 H13 H14 H15 H16 H17 H18 H19 H20 H21 H22 H23 H24 H25 H26 H27 H28
Data Sheet
Signal Name EMCTxD2 EMCRxD5 EMCRxD4 EMCTxD4 PerData0 PerR/W PerData2 Reserved Reserved PerCS2* ExtReset UART0_Rx Reserved PCIX1CalR1 PCIX1ECC4 PCIX1AD30 PCIX1AD21 PCIX1AD23 PCIX1AD13 PCIX1AD05 PCIX1ECC2 PCIX1ECC3 PCIX1AD55 PCIX1Req64* PCIX1AD48 MemData39 MemData36 MemData35
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Table 4. Signals Listed by Ball Assignment (Sheet 3 of 7)
Ball J01 J02 J03 J04 J05 J06 J07 J08 J09 J10 J11 J12 J13 J14 J15 J16 J17 J18 J19 J20 J21 J22 J23 J24 J25 J26 J27 J28 Signal Name EMCRxErr GND SysClk PerAddr00 VDD PerData7 GND PerData1 VDD Reserved GND Reserved VDD Reserved PCIX1AD31 VDD PCIX1VRef0 GND SysErr VDD PCIX1AD54 GND PCIX1AD53 VDD PCIX1AD49 MemData32 GND MemData37 Ball K01 K02 K03 K04 K05 K06 K07 K08 K09 K10 K11 K12 K13 K14 K15 K16 K17 K18 K19 K20 K21 K22 K23 K24 K25 K26 K27 K28 Signal Name PerAddr19 PerAddr20 EMCTxD6 EMCTxD5 PerAddr02 PerAddr01 PerAddr07 PerAddr08 Reserved PerWE Reserved Reserved Reserved OVDD OVDD PCIX1AD29 PCIX1VRef1 Halt PCIX1Par* PCIX1AD47 PCIX1AD46 PCIX1AD45 PCIX1Ack64* MemData45 DQS4 DQS4 DM4 MemData33 Ball L01 L02 L03 L04 L05 L06 L07 L08 L09 L10 L11 L12 L13 L14 L15 L16 L17 L18 L19 L20 L21 L22 L23 L24 L25 L26 L27 L28
PowerPC 440SP Embedded Processor
Signal Name PerAddr17 OVDD PerAddr15 PerAddr16 GND PerAddr04 OVDD PerAddr06 GND Reserved OVDD Reserved GND Reserved Reserved GND Reserved P1VDD PCIX1CalG0 GND PCIX1CalR0 P1VDD PCIX1AD39 GND DQS5 DQS5 P1VDD MemData34 Ball M01 M02 M03 M04 M05 M06 M07 M08 M09 M10 M11 M12 M13 M14 M15 M16 M17 M18 M19 M20 M21 M22 M23 M24 M25 M26 M27 M28 VDD PCIX2Stop PCIX2DevSel PerAddr18 PerAddr09 PerCS0 PerAddr05 PerAddr03 Reserved Reserved Reserved PSRO Reserved Reserved Reserved Reserved PSRO Reserved PCIX1AD38 PCIX1AD37 DM5 MemData42 MemData41 MemData46 MemData31 MemData28 MemData27 VDD Signal Name
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Table 4. Signals Listed by Ball Assignment (Sheet 4 of 7)
Ball N01 N02 N03 N04 N05 N06 N07 N08 N09 N10 N11 N12 N13 N14 N15 N16 N17 N18 N19 N20 N21 N22 N23 N24 N25 N26 N27 N28 Signal Name PCIX2ECC4 PCIX2TRDY GND PCIX2Req1* VDD PerAddr11 GND PerAddr10 VDD Reserved GND Reserved VDD GND GND VDD Reserved GND MemData47 VDD MemData44 GND MemData43 VDD MemData24 GND DQS3 DQS3 Ball P01 P02 P03 P04 P05 P06 P07 P08 P09 P10 P11 P12 P13 P14 P15 P16 P17 P18 P19 P20 P21 P22 P23 P24 P25 P26 P27 P28 Signal Name PCIX2Gnt0* P2VDD PCIX2Gnt1* PCIX2IRDY PerAddr13 GND PerAddr14 PerAddr12 Reserved OVDD Reserved Reserved GND OVDD P1VDD GND Reserved Reserved SVDD MemData40 MemData38 BankSel1 GND MemData54 MemData29 DM3 SVDD MemData25 Ball R01 R02 R03 R04 R05 R06 R07 R08 R09 R10 R11 R12 R13 R14 R15 R16 R17 R18 R19 R20 R21 R22 R23 R24 R25 R26 R27 R28 Signal Name AP2VDD P2VDD PCIX2Clk PCIX2VRef0 PerAddr22 GND PerAddr21 PerAddr23 PerBE0* P2VDD Reserved Reserved GND P0VDD SVDD GND Reserved Reserved SVDD MemData53 DM6 MemData49 GND MemData50 DQS6 DQS6 SVDD MemData26 Ball T01 T02 T03 T04 T05 T06 T07 T08 T09 T10 T11 T12 T13 T14 T15 T16 T17 T18 T19 T20 T21 T22 T23 T24 T25 T26 T27 T28
Data Sheet
Signal Name AP2GND PCIX2AD27 GND PCIX2AD26 VDD PCIX2M66En GND PCIX2Cap VDD PCIX2IDSel GND Reserved VDD GND GND VDD Reserved GND MemData52 VDD MemData55 GND BankSel0 VDD MemData19 GND MemData20 MemData23
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Table 4. Signals Listed by Ball Assignment (Sheet 5 of 7)
Ball U01 U02 U03 U04 U05 U06 U07 U08 U09 U10 U11 U12 U13 U14 U15 U16 U17 U18 U19 U20 U21 U22 U23 U24 U25 U26 U27 U28 VDD PCIX2BE3 PCIX2AD25 PCIX2AD28 PCIX2Req0* PCIX2PErr PCIX2INTA PCIX2Frame PCIX2ECC3 PCIX2VRef1 Reserved PSRO Reserved Reserved Reserved Reserved PSRO Reserved DM7 MemData57 MemData58 MemData51 MemData48 MemData30 DQS2 DQS2 MemData16 VDD Signal Name Ball V01 V02 V03 V04 V05 V06 V07 V08 V09 V10 V11 V12 V13 V14 V15 V16 V17 V18 V19 V20 V21 V22 V23 V24 V25 V26 V27 V28 Signal Name PCIX2AD24 P2VDD PCIX2BE2 PCIX2AD20 GND PCIX2Reset P2VDD PCIX2SErr GND PCIX2VC P2VDD Reserved GND Reserved Reserved GND Reserved SVDD WE GND MemData62 SVDD MemData61 GND DM2 MemData21 SVDD MemData17 Ball W01 W02 W03 W04 W05 W06 W07 W08 W09 W10 W11 W12 W13 W14 W15 W16 W17 W18 W19 W20 W21 W22 W23 W24 W25 W26 W27 W28
PowerPC 440SP Embedded Processor
Signal Name PCIX2AD17 PCIX2AD16 PCIX2AD18 PCIX2AD19 PCIX2AD31 PCIX2AD30 PCIX2AD29 PCIX2CalG0 PCIX2CalR0 PCIX2ECC1 PCIX0PErr PCIX0TRDY PCIX0IRDY P0VDD P0VDD PCIX0AD60 PCIX0AD42 PCIX0AD38 ECC6 MemData63 MemData60 MemData56 MemData22 MemData59 MemData15 DQS7 DQS7 MemData18 Ball Y01 Y02 Y03 Y04 Y05 Y06 Y07 Y08 Y09 Y10 Y11 Y12 Y13 Y14 Y15 Y16 Y17 Y18 Y19 Y20 Y21 Y22 Y23 Y24 Y25 Y26 Y27 Y28 Signal Name PCIX2AD11 GND PCIX2AD10 PCIX2AD08 VDD PCIX2AD21 GND PCIX2AD22 VDD PCIX0DevSel GND PCIX0Req3* VDD PCIX0IDSel PCIX0AD59 VDD PCIX0AD41 GND PCIX0CalG1 VDD ECC2 GND ECC1 VDD MemData12 MemData08 GND MemData11
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Table 4. Signals Listed by Ball Assignment (Sheet 6 of 7)
Ball AA01 AA02 AA03 AA04 AA05 AA06 AA07 AA08 AA09 AA10 AA11 AA12 AA13 AA14 AA15 AA16 AA17 AA18 AA19 AA20 AA21 AA22 AA23 AA24 AA25 AA26 AA27 AA28 Signal Name PCIX2AD09 PCIX2BE1 PCIX2AD12 PCIX2AD13 PCIX2AD23 PCIX2ECC5 PCIX2ECC2 PCIX0CalG0 PCIX0AD09 PCIX0AD13 PCIX0AD07 PCIX0Req2* PCIX0Cap PCIX0AD58 PCIX0AD63 PCIX0AD61 PCIX0AD43 PCIX0AD37 PCIX0CalR1 MemVRef0 MemVRef1 MemODT0 ECC5 DM8 MemData13 DM1 DQS1 DQS1 Ball AB01 AB02 AB03 AB04 AB05 AB06 AB07 AB08 AB09 AB10 AB11 AB12 AB13 AB14 AB15 AB16 AB17 AB18 AB19 AB20 AB21 AB22 AB23 AB24 AB25 AB26 AB27 AB28 Signal Name PCIX2AD04 P2VDD PCIX2BE0 PCIX2AD05 GND PCIX2AD14 P0VDD PCIX0CalR0 GND PCIX0AD14 P0VDD PCIX0INTA GND PCIX0AD56 PCIX0AD57 GND PCIX0AD45 P0VDD PCIX0AD47 GND MemDCFdbkD P0VDD MemData14 GND DQS8 DQS8 SVDD MemData09 Ball AC01 AC02 AC03 AC04 AC05 AC06 AC07 AC08 AC09 AC10 AC11 AC12 AC13 AC14 AC15 AC16 AC17 AC18 AC19 AC20 AC21 AC22 AC23 AC24 AC25 AC26 AC27 AC28 Signal Name PCIX2AD06 PCIX2AD07 PCIX2AD00 PCIX2AD01 PCIX2AD02 PCIX2AD15 PCIX2Par* PCIX0AD10 PCIX0AD08 PCIX0VRef1 PCIX0VRef0 PCIX0Frame PCIX0Gnt2* GND GND PCIX0AD62 PCIX0AD46 PCIX0AD48 PCIX0AD44 PCIX0AD39 MemDCFdbkR MemODT1 ECC3 ECC0 MemData07 MemData03 MemData04 MemData10 Ball AD01 AD02 AD03 AD04 AD05 AD06 AD07 AD08 AD09 AD10 AD11 AD12 AD13 AD14 AD15 AD16 AD17 AD18 AD19 AD20 AD21 AD22 AD23 AD24 AD25 AD26 AD27 AD28
Data Sheet
Signal Name PCIX2AD03 GND PCIX0ECC5 PCIX0AD28 VDD PCIX0AD21 GND PCIX0AD11 VDD PCIX0AD12 GND PCIX0SErr VDD PCIX0M66En PCIX0AD55 VDD PCIX0AD36 GND MemAddr02 VDD BA0 GND ECC4 VDD DQS0 DQS0 GND MemData00
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Table 4. Signals Listed by Ball Assignment (Sheet 7 of 7)
Ball AE01 AE02 AE03 AE04 AE05 AE06 AE07 AE08 AE09 AE10 AE11 AE12 AE13 AE14 AE15 AE16 AE17 AE18 AE19 AE20 AE21 AE22 AE23 AE24 AE25 AE26 AE27 AE28 Signal Name PCIX0AD30 PCIX0AD31 PCIX0AD27 PCIX2ECC6 PCIX0AD29 PCIX0BE3 PCIX0BE2 PCIX0AD18 PCIX0AD03 PCIX0AD02 PCIX0AD01 PCIX0AD00 PCIX0Stop PCIX0BE7 PCIX0AD54 PCIX0BE6 PCIX0AD40 PCIX0AD32 MemAddr03 BA1 MemAddr01 MemAddr06 ClkEn0 ClkEn1 BA2 DM0 MemData01 MemData05 Ball AF01 AF02 AF03 AF04 AF05 AF06 AF07 AF08 AF09 AF10 AF11 AF12 AF13 AF14 AF15 AF16 AF17 AF18 AF19 AF20 AF21 AF22 AF23 AF24 AF25 AF26 AF27 AF28 Signal Name AP0VDD PCIX0AD26 P2VDD PCIX0AD20 PCIX0AD19 PCIX0AD16 PCIX0AD17 PCIX0AD23 PCIX0BE0 PCIX0AD04 PCIX0Gnt3* PCIX0Clk GND PCIX0Gnt0* PCIX0AD52 GND PCIX0AD51 PCIX0AD33 MemAddr11 ECC7 MemAddr07 MemAddr08 MemAddr00 MemAddr14 MemData06 SVDD MemData02 A2VDD Ball AG01 AG02 AG03 AG04 AG05 AG06 AG07 AG08 AG09 AG10 AG11 AG12 AG13 AG14 AG15 AG16 AG17 AG18 AG19 AG20 AG21 AG22 AG23 AG24 AG25 AG26 AG27 AG28
PowerPC 440SP Embedded Processor
Signal Name AP0GND GND PCIX0ECC2 PCIX0AD22 GND PCIX0Par* P0VDD PCIX0Req64* GND PCIX0BE1 P0VDD PCIX0Req1* PCIX0Gnt1* P0VDD P0VDD PCIX0AD50 PCIX0BE5 P0VDD PCIX0AD35 GND MemAddr10 P0VDD MemAddr09 GND MemClkOut0 MemClkOut0 GND A2GND Ball AH01 AH02 AH03 AH04 AH05 AH06 AH07 AH08 AH09 AH10 AH11 AH12 AH13 AH14 AH15 AH16 AH17 AH18 AH19 AH20 AH21 AH22 AH23 AH24 AH25 AH26 AH27 AH28 VDD PCIX0AD24 PCIX0AD25 PCIX0ECC3 PCIX0ECC4 PCIX0Ack64* PCIX0AD15 PCIX0AD05 PCIX0AD06 PCIX0VC PCIX0Req0* VDD PCIX0Reset PCIX0Par64* PCIX0AD53 PCIX0BE4 VDD PCIX0AD49 PCIX0AD34 MemAddr12 MemAddr13 MemAddr04 MemAddr05 RAS CAS MemClkOut1 MemClkOut1 VDD Signal Name
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Data Sheet
The PPC440SP embedded controller is packaged in a 783-ball flip-chip plastic ball grid array (FC-PBGA). The following table describes the package level pinout. Table 5. Pin Summary
Group
Signal pins, non-multiplexed Signal pins, multiplexed Total Signal Pins AxVDD APxVDD AxGND OVDD (3.3V I/Os) PxVDD (3.3V-1.5V PCI) SVDD G(2.5-1.8V SDRAM) VDD (1.5V Logic) GND Total Power Pins Reserved Total Pins
No. of Pins
496 32 528 2 3 5 15 31 10 47 92 205 50 783
In the table “Signal Functional Description” on page 56, each I/O signal is listed along with a short description of its function. Active-low signals (for example, RAS) are marked with an overline. Please see “Signals Listed Alphabetically” on page 17 for the pin (ball) number to which each signal is assigned.
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Multiplexed Signals
PowerPC 440SP Embedded Processor
Some signals are multiplexed on the same pin so that the pin can be used for different functions. The signal names shown in Signal Functional Description are not accompanied by signal names that might be multiplexed on the same pin. If you need to know what, if any, signals are multiplexed with a particular signal, look up the name in “Signals Listed Alphabetically” on page 17. It is expected that in any single application a particular pin will always be programmed to serve the same function. The flexibility of multiplexing allows a single chip to offer a richer pin selection than would otherwise be possible. Strapping Pins One group of pins is used as strapped inputs during system reset. These pins function as strapped inputs only during reset and are used for other functions during normal operation (see “Strapping” on page 83). Note that these are not multiplexed pins since the function of the pins is not programmable. Multipurpose Signals In addition to multiplexing, some pins are also multi-purpose. For example, the PCIX0Ack can function instead as PCIX0ECC1 depending on the PCI interface mode of operation.
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Table 6. Signal Functional Description (Sheet 1 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name PCI-X0:2 Interfaces Ack64 or ECC1. Normally used as Ack64 indicating that the target can transfer data using 64 bits. or Used as ECC1 for PCI-X mode 2. Address/Data bus (bidirectional) for PCI-X0 and PCI-X1. Address/Data bus (bidirectional) for PCI-X 2. PCI-X Byte Enables for PCI-X0 and PCI-X1. PCI-X Byte Enables for PCI-X2. External calibration resistor pads (G) for PCI-X0:2 (one pad for each 32-bit bus group). External calibration resistor pads (R) for PCIX0:2 (one pad for each 32-bit bus group). Capable of PCI-X operation. This analog input is sampled to configure PCI and determine the state of the PCIX0:2VC output signal: 0.00VDD (0.0V) = Conventional PCI & PCIX0:2VC = 0 0.49VDD (1.6V) = PCI-X DDR 266 Mode 2 & PCIX0:2VC = 1 0.75VDD (2.5V) = PCI-X 66 & PCIX0:2VC = 0 1.00VDD (3.3V) = PCI-X 133 & PCIX0:2VC = 0 Provides timing to the PCI interface for PCI transactions. PCIX0:2Clk Description I/O Type
Data Sheet
Notes
PCIX0:1Ack64/PCIX0:1ECC1
I/O
3.3V PCI or 1.5V PCI for mode 2
4
PCIX0:1AD63:00 PCIX2AD31:00 PCIX0:1BE7:0 PCIX2BE3:0 PCIX0:1CalG0:1 PCIX2CalG0 PCIX0:1CalR0:1 PCIX2CalR0
I/O I/O I I
3.3V PCI or 1.5V PCI for mode 2 3.3V PCI or 1.5V PCI for mode 2 na na
PCIX0:2Cap
I
na
Note: If the PCI-X interface is not being used, drive this
pin with a 3.3V clock signal at a frequency between 1 and 66MHz Indicates the driving device has decoded its address as the target of the current access. ECC check bits 5–2. All ECC bits are valid only for PCIX DDR mode 2.
I
3.3V PCI
PCIX0:2DevSel
I/O
3.3V PCI
4
PCIX0:2ECC5:2 PCIX2ECC1 PCIX2ECC6
Note: See PCIX0:2Par for ECC0.
See PCIX0:1Ack64 for ECC1. See PCIX0:1Req64 for ECC6. See PCIX0:1Par64 for ECC7. Driven by the current master to indicate beginning and duration of an access. Indicates that the specified agent is granted access to the bus. When using an external PCI/PCI-X arbiter, connect the external arbiter's Grant line to this signal. Used as a chip select during configuration read and write transactions. Level sensitive PCI interrupt. Indicates initiating agent’s ability to complete the current data phase of the transaction.
I/O
3.3V PCI or 1.5V PCI for mode 2
PCIX0:2Frame PCIX0:2Gnt0:1 PCIX0:1Gnt2:3 PCIX0:2IDSel PCIX0:2INTA PCIX0:2IRDY
I/O
3.3V PCI
4
I/O
3.3V PCI
4
I O I/O
3.3V PCI 3.3V PCI 3.3V PCI
5
4
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Table 6. Signal Functional Description (Sheet 2 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name PCIX0M66En PCIX1:2M66En Description Capable of 66MHz operation. Capable of 66MHz operation. Even parity indicator or ECC0. Normally used to indicate even parity across PCIAD31:00 and BE3:0. Used as ECC0 for PCIX0:2 mode 2. Even parity indicator or ECC7. Normally used to indicate even parity across PCIAD63:32 and BE7:4 for PCI0 and PCI1. or Used as ECC7 for PCIX0:1 mode 2.
PowerPC 440SP Embedded Processor
I/O I I
Type 3.3V PCI or 1.5V PCI for mode 2 3.3V PCI or 1.5V PCI for mode 2 3.3V PCI or 1.5V PCI for mode 2
Notes
5
PCIX0:2Par/PCIX0:2ECC0
I/O
PCIX0:1Par64/PCIX0:1ECC7
I/O
3.3V PCI or 1.5V PCI for mode 2
PCIX0:2PErr
Reports data parity errors during all PCI transactions except a Special Cycle. An indication to the PCI-X arbiter that the specified agent wishes to use the bus. When using an external PCI/PCI-X arbiter, connect the external arbiter's Request line to this signal. Request 64-bit transfer or ECC6. Normally used by the current bus master to indicate a 64-bit transfer. or Used as ECC6 for PCIX2 mode 2. Sets PCI device registers and logic to a consistent state. Reports address parity errors, data parity errors on the Special Cycle command, or other catastrophic system errors. Indicates the current target is requesting the master to stop the current transaction.
I/O
3.3V PCI
4
PCIX0:2Req0:1 PCIX0:1Req2:3
I/O
3.3V PCI
4
PCIX0:1Req64/PCIX0:1ECC6
I/O
3.3V PCI or 1.5V PCI for mode 2
4
PCIX0:2Reset PCIX0:2SErr
O I/O
3.3V PCI 3.3V PCI 4
PCIX0:2Stop PCIX0:2TRDY
I/O I/O
3.3V PCI 3.3V PCI
4 4
Indicates the target agent’s ability to complete the current data phase of the transaction.
Voltage control output. Used to control the voltage regulator supplying the PCI I/O voltage. See PCI-XCap signal. 0 = 3.3V (PCI I/O) 1 =1.5V (PCI-X DDR) Voltage reference input for PCI-X mode 2/DDR (1.5V) I/O. Not used for PCI or PCI-X mode 1.
PCIX0:2VC
O
3.3(1.5)V PCI
PCIX0:2VRef0:1
I
VPCIXDDR
5
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Table 6. Signal Functional Description (Sheet 3 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name DDR SDRAM Interface BA0:2 BankSel0:1 CAS ClkEn0:1 DM0:8 DQS0:8 DQS0:8 ECC0:7 MemAddr14:00 MemClkOut0:1 MemClkOut0:1 MemData63:00 MemDCFdbkD MemDCFdbkR MemODT0:1 Bank Address supporting up to eight internal banks. Selects up to two external DDR SDRAM banks. Column Address Strobe. Clock Enable. One for each external bank. Memory write data byte lane masks. MEMDM8 is the byte lane mask for the ECC byte lane. Byte lane data strobe. DQS8 is the data strobe for the ECC byte lane. These signals are differential pairs. ECC check bits 0:7. Memory address bus. O O O O O Description I/O Type
Data Sheet
Notes
2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM DIFF 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM DIFF 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM Volt Ref Rcv 2.5(1.8)V DDR SDRAM Volt Ref Sup 2.5(1.8)V DDR SDRAM 2.5(1.8)V DDR SDRAM
I/O
I/O O
Note: MemAddr14 is the most significant bit (msb).
Subsystem clocks. These signals are differential pairs. Memory data bus.
O
Note: MemData63 is the most significant bit (msb).
Feedback driver, for I/O timing measurements. Feedback receiver. Connect externally to MemDCFdbkD. Memory on-die termination control.
I/O O I O
MemVRef0
Memory reference voltage (SVREF) input.
I
MemVRef1
Memory reference voltage (SVREF) supplemental input.
I
RAS WE
Row Address Strobe. Write Enable.
O O
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Table 6. Signal Functional Description (Sheet 4 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name Ethernet Interface EMCCD EMCCrS EMCMDClk EMCMDIO EMCRxD0:7 EMCRxDV EMCRxErr EMCRxClk EMCRefClk EMCTxClk EMCGTxClk EMCTxD0:7 EMCTxEn EMCTxErr, Collision detection. Carrier sense. Management data clock. Description
PowerPC 440SP Embedded Processor
I/O
Type
Notes
I I O I/O I I I I I I O O O O
3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
Transfer command and status information between MII and PHY. Receive data. Receive data valid. Receive error. Receive clock. Reference clock. Transmit clock. Ethernet gigabit transmit clock. Transmit data. Transmit data enabled. Transmit error.
External Slave Peripheral Interface PerAddr00:23 PerBE0 PerBLast PerCS0:2 PerData0:7 Peripheral address bus.
Note: PerAddr00 is the most significant bit (msb).
External peripheral data bus byte enable. Used by the peripheral controller to indicates the last transfer of a memory access. External peripheral device select. Peripheral data bus.
O O O O I/O
3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
1 1
Note: PerData0 is the most significant bit (msb).
Used by peripheral controller or DMA controller depending upon the type of transfer involved. When the PPC440SP is the bus master, it enables the selected device to drive the bus. External peripheral data bus byte parity. Used by a peripheral slave to indicate it is ready to transfer data. Used as output by the peripheral controller. High indicates a read from memory, low indicates a write to memory. Write Enable. Peripheral clock used by synchronous peripheral slaves. External error used as an input to record external slave peripheral errors.
1
PerOE
O
3.3V LVTTL
PerPar0 PerReady
I/O I
3.3V LVTTL 3.3V LVTTL
1
PerR/W PerWE PerClk PerErr
O O O I
3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
1
1, 5
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Table 6. Signal Functional Description (Sheet 5 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name UART Peripheral Interface Serial clock input that provides an alternative to the internally generated serial clock. Used in cases where the allowable internally generated clock rates are not satisfactory. UART0 Receive data. UART0 Transmit data. UART0 Data Carrier Detect. UART0 Data Set Ready. UART0 Clear To Send. UART0 Data Terminal Ready. UART0 Request To Send. UART0 Ring Indicator. UART1 Receive data. UART1 Transmit data. UART1 Data Set Ready or Clear To Send. The choice is determined by a DCR register bit setting. UART1 Request To Send or Data Terminal Ready. The choice is determined by a DCR register bit setting. UART2 Receive data. UART2 Transmit data. Description I/O Type
Data Sheet
Notes
UARTSerClk
I
3.3V LVTTL
1, 4
UART0_Rx UART0_Tx UART0_DCD UART0_DSR UART0_CTS UART0_DTR UART0_RTS UART0_RI UART1_Rx UART1_Tx UART1_DSR/CTS UART1_DTR/RTS UART2_Rx UART2_Tx IIC Peripheral Interface IIC0SClk IIC0SDA IIC1SClk IIC1SDA Interrupts Interface IRQ0:5
I O I I I O O I I O I O I O
3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL w/pull-up 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
1, 4 4 6 6 1, 4 4 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4 1, 4
IIC0 Serial Clock. IIC0 Serial Data. IIC1 Serial Clock. IIC1 Serial Data.
I/O I/O I/O I/O
3.3V IIC 3.3V IIC 3.3V IIC 3.3V IIC
1, 2 1, 2 1, 2 1, 2
External interrupt Requests 0 through 5.
I
3.3V LVTTL
1, 5
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Table 6. Signal Functional Description (Sheet 6 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name System Interface Halt GPIO00:17 GPIO18:29 GPIO30:31 SysClk SysErr SysPartSel Halt from external debugger. Description
PowerPC 440SP Embedded Processor
I/O
Type
Notes
I I/O I/O I/O I O I
3.3V LVTTL 3.3V LVTTL 3.3V PCI 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL na
1, 4
General purpose I/O 0 through 17. To access these functions, software must set DCR register bits. General purpose I/O 18 through 29. To access these functions, software must set DCR register bits. General purpose I/O 30 through 31. To access these functions, software must set DCR register bits. Main system clock input. Set to 1 when a machine check is generated. Not used. Main system reset. External logic can drive this bidirectional pin low (minimum of 16 cycles) to initiate a system reset. A system reset can also be initiated by software. Hardware initiated self-refresh and system reset. External Reset. During the PPC440SP’s reset phase, this signal is at down level. Test Enable. Processor timer external input clock.
3
SysReset
I
3.3V LVTTL
1, 2
HISRRst ExtReset TestEn TmrClk JTAG Interface TCK TDI TDO TMS
I O I I
3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
1, 2
3
Test Clock. Test Data In. Test Data Out. Test Mode Select. Test Reset. During chip power-up, this signal must be low from the start of VDD ramp-up until at least 16 SysClk cycles after VDD is stable in order to initialize the JTAG controller.
I I O I
3.3V LVTTL 3.3V LVTTL w/pull-down 3.3V LVTTL 3.3V LVTTL with pull-up
1 4
1
TRST
I
3.3V LVTTL with pull-up
5
Trace Interface TrcClk TrcBS0:2 TrcES0:4 TrcTS0:6 Trace data capture clock, runs at 1/4 the frequency of the processor. Trace branch execution status. Trace Execution Status is presented every fourth processor clock cycle. Additional information on trace execution and branch status. O O O O 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL 3.3V LVTTL
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Table 6. Signal Functional Description (Sheet 7 of 7)
Notes: 1. Receiver input has hysteresis 2. Must pull up (recommended value is 3kΩ to 3.3V) 3. Must pull down (recommended value is 1kΩ) 4. If not used, must pull up (recommended value is 3kΩ to 3.3V) 5. If not used, must pull down (recommended value is 1kΩ) 6. Strapping input during reset; pull-up or pull-down required
Signal Name Power AxGND Analog ground. Analog voltage—1.5V. Filtered voltages input for PCI PLLs (analog circuits). na na Description I/O Type
Data Sheet
Notes
APxVDD
Note: A separate filter for all analog voltages is
recommended. Analog voltage—1.5V. Filtered voltages input for system PLLs (analog circuits).
na
na
AxVDD
Note: A separate filter for all analog voltages is
recommended. Logic and I/O ground. I/O supply (except DDR SDRAM and PCI-X)— 3.3V. PCI-X I/O voltage supply.
na
na
GND OVDD PxVDD
na na na
na na na
Note: PCI-X operates at 3.3V.
PCI-X 266 DDR operates at 1.5V DDR SDRAM I/O voltage supply.
SVDD VDD PSRO
Note: DDR SDRAM operates at 2.5V
DDR2 SDRAM operates as 1.8V Logic voltage supply—1.5V.
na na
na na
Performance Screen Ring Oscillator. PSRO Reserved Reserved Do not connect voltage, ground, or any signals to these pins. na na
Note: All PSRO signals should be connected to logic
ground (GND).
na
na
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Device Characteristics
Table 7. Absolute Maximum Ratings
PowerPC 440SP Embedded Processor
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device. None of the performance specifications contained in this document are guaranteed when operating at these maximum ratings.
Characteristic 1.5V Supply Voltage (Internal logic) 3.3V Supply Voltage (I/O interface, except DDR SDRAM) 3.3V Supply Voltage (PCI-X I/O) 1.5V Supply Voltage (PCI-X DDR I/O) 1.5V Supply Voltages (System PLLs) 1.5V Supply Voltages (PCI-X PLLs) 2.5V Supply Voltage (DDR SDRAM logic) 1.8V Supply Voltage (DDR2 SDRAM logic) 3.3V LVTTL receivers Input Voltage Storage temperature range Case temperature under bias Notes: 1. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the PPC440SP. A separate filter, as shown below, is recommended for each voltage: VDD L AxVDD, APxVDD Symbol VDD OVDD PxVDD PxVDD AxVDD APxVDD SVDD SVDD VIN TSTG TC Value 0 to +1.6 0 to +3.6 0 to +3.6 0 to +1.6 0 to +1.6 0 to +1.6 0 to +2.7 0 to +1.95 0 to +3.6 -55 to +150 -40 to +120 Unit V V V V V V V V V °C °C 2 1 1 Notes
C
L – SMT ferrite bead chip, Murata BLM31A700S C – 0.1 μF ceramic
2. This value is not a specification of the operational temperature range, it is a stress rating only.
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Data Sheet
Table 8. Package Thermal Specifications
Thermal resistance values for the PPC440SP package in a convection environment are as follows:
Airflow ft/min (m/sec) 0 (0) Junction-to-case thermal resistance Case-to-ambient thermal resistance (w/o heat sink) 100 (0.51) 0.6 13.1 Range Minimum Junction-to-ball (typical) Notes: 1. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. For this part the junction temperature and the case temperature are essentially identical. 2. The case-to-ambient thermal resistance is measured in a JEDEC JESD51-6 standard environment; and may not accurately predict thermal performance in production equipment environments. The operational case temperature must be maintained. 3. 6.5 °C/W is the theoretical θJB using an infinite heat sink. The larger number applies to the module mounted on a 1.8mm thick, 2P card using 1oz. copper power planes, with an effective heat transfer area of 75mm2. Maximum 6.5 °C/W 3 200 (1.02) 0.6 11.9 °C/W °C/W 1 2
Parameter
Symbol
Unit
Notes
θJC θCA
0.6 15.5
θJB
6.5
Table 9. Recommended DC Operating Conditions (Sheet 1 of 3)
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability.
Parameter Logic Supply Voltage 533 MHz Logic Supply Voltage 667 MHz I/O Supply Voltage PCI-X I/O Supply Voltage PCI-X DDR Voltage Reference Input for PCI-X DDR mode 2 DDR1 SDRAM Supply Voltage DDR2 SDRAM System PLL Supply Voltages PCI-X PLL Supply Voltages DDR1 SDRAM Reference Voltage DDR2 SDRAM Reference Voltage Symbol VDD VDD OVDD PxVDD PCIX0VRef0:1 SVDD AxVDD APxVDD SVREF SVREF Minimum +1.4 +1.425 +3.0 +3.0 1.425 +1.425 +2.3 1.7 +1.4 +1.4 +1.15 0.49 x SVDD Typical +1.5 +1.5 +3.3 +3.3 1.5 +1.5 +2.5 (2.6) 1.8 +1.5 +1.5 +1.25 0.50 x SVDD Maximum +1.6 +1.575 +3.6 +3.6 1.575 +1.575 +2.7 1.9 +1.6 +1.6 +1.35 0.51 x SVDD Unit V V V V V V V V V V Notes 4 4 4 4 4 4 3 3 3
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Table 9. Recommended DC Operating Conditions (Sheet 2 of 3)
PowerPC 440SP Embedded Processor
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability.
Parameter Input Logic High (2.5V DDR SDRAM) Input Logic High (1.8V DDR2 SDRAM) Input Logic High (2.5V CMOS, 3.3V tolerant receiver) Input Logic High (3.3V PCI-X) Input Logic High (1.5V PCI-X DDR) Input Logic High (3.3V LVTTL) Input Logic Low (2.5V DDR SDRAM) Input Logic Low (1.8V DDR2 SDRAM) Input Logic Low (2.5V CMOS, 3.3V tolerant receiver) Input Logic Low (3.3V PCI-X) Input Logic Low (1.5V PCI-X DDR) Input Logic Low (3.3V LVTTL) Output Logic High (2.5V DDR SDRAM) Output Logic High (1.8V DDR2 SDRAM) Output Logic High (2.5V CMOS, 3.3V tolerant receiver) Output Logic High (3.3V PCI-X) Output Logic High (1.5V PCI-X DDR) Output Logic High (3.3V LVTTL) Output Logic Low (2.5V DDR SDRAM) Output Logic Low (1.8V DDR2 SDRAM) Output Logic Low (2.5V CMOS, 3.3V tolerant receiver) Output Logic Low (3.3V PCI-X) Output Logic Low (1.5V PCI-X DDR) Output Logic Low (3.3V LVTTL) Input Leakage Current (with no internal pull-up or pull-down) Input Leakage Current (with internal pull-down) Input Leakage Current (with internal pull-up) IIL1 IIL2 IIL3 0 0 0 (LPDL) -150 (LPDL) +0.4 1 200 (MPUL) 0 (MPUL) +2.4 0 0 OVDD 0.45 0.45 0.4 VOL 0.1OVDD V V V μA μΑ μA 5 5 1 1 Symbol Minimum SVREF+0.18 SVREF+0.125 1.7 VIH 0.5OVDD VREF+0.10 +2.0 -0.3 -0.3 OVDD+0.5 VI/O+0.50 +3.6 SVREF-0.18 SVREF-0.125 0.7 VIL -0.5 -0.5 0 +1.95 SVDD-0.45 2.0 VOH 0.9OVDD OVDD V V V V V V 1 1 0.35OVDD VREF-0.10V +0.8 SVDD SVDD V V V V V V 1 1 V V V V V V 1 1 Typical Maximum SVDD+0.3 SVDD+0.3 Unit V V V Notes 2
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Table 9. Recommended DC Operating Conditions (Sheet 3 of 3)
Data Sheet
Device operation beyond the conditions specified is not recommended. Extended operation beyond the recommended conditions can affect device reliability.
Parameter Input Max Allowable Overshoot (3.3V LVTTL) Input Max Allowable Undershoot (3.3V LVTTL) Output Max Allowable Overshoot (3.3V LVTTL) Output Max Allowable Undershoot (3.3V LVTTL) Case Temperature Notes: 1. PCI-X drivers meet PCI-X specifications. 2. SVREF = SVDD/2 3. The analog voltages used for the on-chip PLLs can be derived from the logic voltage, but must be filtered before entering the PPC440SP. See “Absolute Maximum Ratings” on page 63. 4. Power supply sequencing: It is recommended that the 1.5V Vdd of the core reach its nominal value before applying power to the I/Os. Voltage applied to I/Os from an external source must not be allowed to exceed the 0Vdd ramp. A power down cycle must complete (0Vdd and Vdd are below 0.4V) before a new power up cycle is started. 5. LPDL is least positive down level; MPUL is most positive up level. 6. Case temperature, TC, is measured at top center of case surface with device soldered to circuit board. Symbol VIMAO VIMAU VOMAO VOMAU3 TC -0.6 -40 +100 -0.6 +3.9 Minimum Typical Maximum +3.9 Unit V V V V °C 6 Notes
Table 10. Input Capacitance
Parameter Group 1 (2.5V SSTL I/O) Group 2 (3.3V LVTTL I/O) Group 3 (PCI-X I/O) Group 4 (Receivers) Group 5 (3.3V tolerant CMOS I/O) Symbol CIN1 CIN2 CIN3 CIN4 CIN5 Maximum 5.2 7.1 5.7 6.9 3.4 Unit pF pF pF pF pF Notes
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Data Sheet
PowerPC 440SP Embedded Processor
Table 11. DC Power Supply Loads
Parameter VDD (1.5V) active operating current OVDD (3.3V) active operating current PxVDD (3.3V) active operating current PxVDD (1.5V) active operating current SVDD (2.5V) active operating current SVDD (1.8V) active operating current AxVDD (1.5V) input current APxVDD (1.5V) input current Symbol IDD IODD IPDD IPDD ISDD ISDD IADD IAPDD 33 33 Minimum Typical Maximum 3000 40 730 1600 1100 750 Unit mA mA mA mA mA mA mA mA 2 2 1, 2 1, 2 Notes 2 2 2
Notes: 1. See “Absolute Maximum Ratings” on page 63 for filter recommendations. 2. Valid only for CPU/PLB/OPB = 533.33/133.33/66.66 MHz.
Clock Test Conditions
Clock timing and switching characteristics are specified in accordance with operating conditions shown in the table “Recommended DC Operating Conditions.” AC specifications are characterized with VDD = 1.5V, TC = +85 °C and a 10pF test load as shown in the figure to the right.
Output Pin C
10pF
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Table 12. Clocking Specifications
Symbol SysClk Input FC TC TCS TCH TCL Frequency Period Edge stability (cycle-to-cycle jitter) High time Low time 33.33 12 – 40% of nominal period 40% of nominal period 83.33 30 ±0.15 Parameter Min Max
Data Sheet
Units
MHz ns ns ns ns
60% of nominal period 60% of nominal period
Note: Input slew rate ≥ 1 V/ns
PLL VCO FC TC Frequency Period 600 0.75 1333.33 1.66 MHz ns
Processor Clock (CPU Clock) FC TC MemClkOut FC TC TCH Frequency Period High time 200 3 45% of nominal period 333.33 5 55% of nominal period MHz ns ns Frequency Period 400 1.5 666.66 2.5 MHz ns
OPB Clock and PerClk FC TC MAL Clock FC TC Frequency Period 45 12 83.33 22.2 MHz ns Frequency Period – 12 83.33 – MHz ns
Figure 4. Clock Timing Waveform
TCH TC
TCL
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Data Sheet
Spread Spectrum Clocking
PowerPC 440SP Embedded Processor
Care must be taken when using a spread spectrum clock generator (SSCG) with the PPC440SP. This controller uses a PLL for clock generation inside the chip. The accuracy with which the PLL follows the SSCG is referred to as tracking skew. The PLL bandwidth and phase angle determine how much tracking skew there is between the SSCG and the PLL for a given frequency deviation and modulation frequency. When using an SSCG with the PPC440SP the following conditions must be met: • The frequency deviation must not violate the minimum clock cycle time. Therefore, when operating the PPC440SP with one or more internal clocks at their maximum supported frequency, the SSCG can only lower the frequency. • The maximum frequency deviation cannot exceed -1%, and the modulation frequency cannot exceed 40 kHz. In some cases, on-board PPC440SP peripherals impose more stringent requirements. • Use the Peripheral Bus Clock for logic that is synchronous to the peripheral bus since this clock tracks the modulation. • Use the DDR SDRAM MemClkOut since it also tracks the modulation. • For PCI-X and PCI 66 the maximum spread spectrum is -1% modulated between 30kHz and 33kHz. Notes: 1. The serial port baud rates are synchronous to the modulated clock. The serial port has a tolerance of approximately 1.5% on baud rate before framing errors begin to occur. The 1.5% tolerance assumes that the connected device is running at precise baud rates. 2. Ethernet operation is unaffected. 3. IIC operation is unaffected. Important: It is up to the system designer to ensure that any SSCG used with the PPC440SP meets the above requirements and does not adversely affect other aspects of the system.
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PowerPC 440SP Embedded Processor I/O Specifications
Table 13. Peripheral Interface Clock Timings
Parameter PCIXxClk input frequency (asynchronous mode) PCIXxClk period (asynchronous mode) PCIXxClk input high time PCIXxClk input low time EMCMDClk output frequency EMCMDClk period EMCMDClk output high time EMCMDClk output low time EMCTxClk input frequency EMCTxClk period EMCTxClk input high time EMCTxClk input low time EMCRxClk input frequency EMCRxClk period EMCRxClk input high time EMCRxClk input low time PerClk output frequency (for sync. slaves) PerClk period PerClk output high time PerClk output low time UARTSerClk input frequency UARTSerClk period UARTSerClk input high time UARTSerClk input low time TmrClk input frequency TmrClk period TmrClk input high time TmrClk input low time Notes: Min – 7.5 40% of nominal period 40% of nominal period – 400 160 160 2.5 40 35% of nominal period 35% of nominal period 2.5 40 35% of nominal period 35% of nominal period – 12 50% of nominal period 33% of nominal period – 2TOPB+2 TOPB+1 TOPB+1 – 10 40% of nominal period 40% of nominal period Max 133.33 – 60% of nominal period 60% of nominal period 2.5 – – – 25 400 – – 25 400 – – 83.33 – 66% of nominal period 50% of nominal period 1000/(2TOPB+2ns) – – – 100 – 60% of nominal period 60% of nominal period
Data Sheet
Units MHz ns ns ns MHz ns ns ns MHz ns ns ns MHz ns ns ns MHz ns ns ns MHz ns ns ns MHz ns ns ns
Notes 2
1 1 1 1
1. TOPB is the period in ns of the OPB clock. The internal OPB clock runs at an integral divisor ratio of the frequency of the PLB clock. The maximum OPB clock frequency is 83.33 MHz. Refer to the Clocking chapter of the PPC440SP Embedded Processor User’s Manual for details. 2. When the PCI-X interface is used to support a legacy PCI interface, the maximum PCIXClk frequency is 66.66MHz.
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Data Sheet
Input/Output Timing
PowerPC 440SP Embedded Processor
These timing diagrams illustrate the relationship of the timing parameters defined in the I/O Specification tables that follow. Figure 5. Input Setup and Hold Timing Waveform
Clock
TIS min Inputs Valid
TIH min
Figure 6. Output Delay and Hold Timing Waveform
Clock
TOV max Outputs TOH min
TOV max TOH min
TOV max TOH min
High (Drive) Float (High-Z) Low (Drive) Valid Valid
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Table 14. I/O Specifications—All Speeds
Data Sheet
(Sheet 1 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. PCI-X timings are for asynchronous operation up to 133.33MHz. PCI-X input setup time requirement is 1.2ns for 133.33MHz and 1.7ns for 66.66MHz. PCI timings (in parentheses) are for asynchronous operation up to 66.66MHz. PCI output hold time requirement is 1ns for 66.66MHz and 2ns for 33.33MHz. 3. These are DDR signals that can change on both the positive and negative clock transitions.
Input (ns) Signal PCI-X Interfaces PCIX0:2Ack64 PCIX0:1AD63:00 PCIX2AD31:00 PCIX0:1BE7:0 PCIX2BE3:0 PCIX0:2CalG0:1 PCIX0:1CalR0:1 PCIX0:2Cap PCIX0:2Clk PCIX0:2DevSel PCIX0:2ECC5:2 PCIX0:2Frame PCIX0:2Gnt0 PCIX0:2Gnt1 PCIX0:1Gnt2:3 PCIX0:2IDSel PCIX0:2INTA PCIX0:2IRDY PCIX0:1M66En PCIX0:2Par PCIX0:1Par64 PCIX0:2PErr PCIX0:1Req0 PCIX0:1Req1:3 PCIX2Req1 PCIX0:2Req64 PCIX0:2Reset PCIX0:2SErr PCIX0:2Stop PCIX0:2TRDY PCIX0:2VC Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) dc Note 2 (2) Note 2 (2) Note 2 (2) na na na Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) na Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) Note 2 (2) 0.5(0) 0.5(0) 0.5(0) 0.5(0) dc 0.5(0) 0.5(0) 0.5(0) na na na 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) na 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 0.5(0) 3.5(6) 3.5(6) 3.5(6) na na 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) na 3.5(6) 3.5(6) 3.5(6) na na na na 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 3.5(6) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) na na 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) na 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) na na na na 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.7 (Note 2) 0.5 0.5 0.5 na na 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 na 0.5 0.5 0.5 na na na na 0.5 0.5 0.5 0.5 0.5 0.5 1.5 1.5 1.5 na na 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 na 1.5 1.5 1.5 na na na na 1.5 1.5 1.5 1.5 1.5 1.5 PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk PCIX0:2Clk 2 2 2 2 async 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 Setup Time Hold Time (TIS min) (TIH min) Output (ns) Valid Delay (TOV max) Hold Time (TOH min) Output Current (mA) I/O H (minimum) I/O L (minimum) Clock Notes
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Data Sheet
Table 14. I/O Specifications—All Speeds
PowerPC 440SP Embedded Processor
(Sheet 2 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. PCI-X timings are for asynchronous operation up to 133.33MHz. PCI-X input setup time requirement is 1.2ns for 133.33MHz and 1.7ns for 66.66MHz. PCI timings (in parentheses) are for asynchronous operation up to 66.66MHz. PCI output hold time requirement is 1ns for 66.66MHz and 2ns for 33.33MHz. 3. These are DDR signals that can change on both the positive and negative clock transitions.
Input (ns) Signal Ethernet Interface EMCCD EMCCrS EMCMDClk EMCMDIO EMCRxD0:7 EMCRxDV EMCRxErr EMCRxClk EMCRefClk EMCTxClk EMCGTxClk EMCTxD0:7 EMCTxEn EMCTxErr, IIC0SClk IIC0SDA IIC1SClk IIC1SDA UARTSerClk UART0_Rx UART0_Tx UART0_DCD UART0_DSR UART0_CTS UART0_DTR UART0_RI UART0_RTS UART1_Rx UART1_Tx UART1_DSR/CTS UART1_RTS/DTR UART2_Rx UART2_Tx Interrupts Interface IRQ0:5 JTAG Interface TDI TMS TDO TCK TRST n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 19.1 n/a n/a n/a n/a 8.7 n/a n/a async async async async async na na async na na na na na na na na na na na na na na na na na na 19.1 19.1 19.1 19.1 19.1 19.1 19.1 8.7 8.7 8.7 8.7 8.7 8.7 8.7 na na na na na na na na na na na na na na 19.1 19.1 19.1 19.1 19.1 8.7 8.7 8.7 8.7 8.7 na na na na na na na na na na na na na na na na 4 4 1 1 na na na na na na na 15 15 15 na na na na na na na na 2 2 2 na na na na na na na na na 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 15.3 15.3 15.3 15.3 19.1 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 10.2 10.2 10.2 10.2 8.7 UARTSerClk UARTSerClk async async async async async async UARTSerClk UARTSerClk async async UARTSerClk UARTSerClk IIC0SClk IIC0SClk EMCTxClk EMCTxClk EMCTxClk 1, async 1, async EMCMDClk EMCRxClk EMCRxClk EMCRxClk 1, async 1, async 1, async 1, async Setup Time Hold Time (TIS min) (TIH min) Output (ns) Valid Delay (TOV max) Hold Time (TOH min) Output Current (mA) I/O H (minimum) I/O L (minimum) Clock Notes
Internal Peripheral Interface
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Table 14. I/O Specifications—All Speeds
Data Sheet
(Sheet 3 of 3) Notes: 1. Ethernet interface meets timing requirements as defined by IEEE 802.3 standard. 2. PCI-X timings are for asynchronous operation up to 133.33MHz. PCI-X input setup time requirement is 1.2ns for 133.33MHz and 1.7ns for 66.66MHz. PCI timings (in parentheses) are for asynchronous operation up to 66.66MHz. PCI output hold time requirement is 1ns for 66.66MHz and 2ns for 33.33MHz. 3. These are DDR signals that can change on both the positive and negative clock transitions.
Input (ns) Signal System Interface Halt GPIO00:31 SysClk SysErr SysPartSel SysReset HISRRst TestEn TmrClk Trace Interface TrcClk TrcBS0:2 TrcES0:4 TrcTS0:6 n/a n/a 19.1 19.1 19.1 19.1 8.7 8.7 8.7 8.7 n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a n/a 19.1 n/a 19.1 n/a n/a 19.1 n/a n/a n/a 8.7 n/a 8.7 n/a n/a 8.7 n/a n/a async async n/a async async async async async n/a Setup Time Hold Time (TIS min) (TIH min) Output (ns) Valid Delay (TOV max) Hold Time (TOH min) Output Current (mA) I/O H (minimum) I/O L (minimum) Clock Notes
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Table 15. I/O Specifications—533MHz
PowerPC 440SP Embedded Processor
Notes: 1. PerClk rising edge at package pin with a 10pF load trails the internal PLB clock by approximately 1.3ns.
Input (ns) Signal Setup Time Hold Time (TIS min) (TIH min) n/a n/a n/a 1.2 n/a 1.7 3.6 n/a n/a n/a n/a 1.2 1 1 n/a 1 n/a 1 1 1 n/a n/a n/a Output (ns) Valid Delay (TOV max) 6.2 5.7 5.9 6 5.8 5.7 n/a 5.7 5.7 n/a n/a n/a Hold Time (TOH min) 0 n/a 0 0 0 n/a n/a n/a 0 n/a n/a n/a Output Current (mA) I/O H (minimum) 19.1 27.7 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 19.1 I/O L (minimum) 8.7 12.8 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 8.7 Clock Notes
External Slave Peripheral Interface PerAddr00:23 PerBE0 PerBLast PerCS0:2 PerData0:7 PerOE PerPar0 PerReady PerR/W PerWE ExtReset PerClk PerErr PerClk PerClk PerClk PerClk PerClk PerClk PerClk PerClk PerClk n/a PerClk PLB clk PerClk
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PowerPC 440SP Embedded Processor DDR SDRAM I/O Specifications
Data Sheet
The DDR SDRAM controller times its operation with internal PLB clock signals and generates MemClkOut0 from the PLB clock. The PLB clock is an internal signal that cannot be directly observed. However MemClkOut0 is the same frequency as the PLB clock signal and is in phase with the PLB clock signal. Note: MemClkOut0 can be advanced with respect to the PLB clock by means of the SDRAM0_CLKTR programming register. In a typical system, users advance MemClkOut by 90×. This depends on the specific application and requires a thorough understanding of the memory system in general (refer to the DDR SDRAM controller chapter in the PPC440SP Embedded Processor User’s Manual). In the following sections, the label MemClkOut0(0) refers to MemClkOut0 when it has not been phase-shifted, and MemClkOut0(90) refers to MemClkOut0 when it has been phase-advanced 90°. Advancing MemClkOut0 by 90° creates a 3/4 cycle setup time and 1/4 cycle hold time for the address and control signals in relation to MemClkOut0(90). The rising edge of MemClkOut0(90) aligns with the first rising edge of the DQS signal. The following DDR data is generated by means of simulation and includes logic, driver, package RLC, and lengths. It is not to be used as a circuit design recommendation. Values are calculated over best case and worst case processes with speed, temperature, and voltage as follows: Best Case = Fast process, -40×C, +1.6V Worst Case = Slow process, +85×C, +1.4V Note: In all the following DDR tables and timing diagrams, minimum values are measured under best case conditions and maximum values are measured under worst case conditions. The signals are terminated as indicated in the figure below for the DDR timing data in the following sections. Figure 7. DDR SDRAM Simulation Signal Termination Model
MemClkOut0 10pF 120W 10pF MemClkOut0
PPC440SP
VTT = SVDD/2
50W Addr/Ctrl/Data/DQS
30pF
Note: This diagram illustrates the model of the DDR SDRAM interface used when generating simulation timing data. It is not a recommended physical circuit design for this interface. An actual interface design will depend on many factors, including the type of memory used and the board layout.
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Data Sheet
Table 16. DDR SDRAM Output Driver Specifications
PowerPC 440SP Embedded Processor
Output Current (mA) Signal Path I/O H (maximum) Write Data MemData00:07 MemData08:15 MemData16:23 MemData24:31 MemData32:39 MemData40:47 MemData48:55 MemData56:63 ECC0:7 DM0:8 MemClkOut0 MemAddr00:12 BA0:1 RAS CAS WE BankSel0:3 ClkEn0:3 DQS0:8 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 15.2 I/O L (minimum)
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PowerPC 440SP Embedded Processor DDR SDRAM Write Operation
Data Sheet
The following timing chart shows the relationship between the signals involved in a DDR write operation. Figure 8. DDR SDRAM Write Cycle Timing
PLB Clk
MemClkOut TSA Addr/Cmd THA TDS
DQS TSD MemData THD THD TSD
TSA = Setup time for address and command signals to MemClkOut THA = Hold time for address and command signals from MemClkOut TSD = Setup time for data signals (minimum time data is valid before rising/falling edge of DSQ) THD = Hold time for data signals (minimum time data is valid after rising/falling edge of DSQ) TDS = Delay from rising/falling edge of clock to the rising/falling edge of DQS
DDR SDRAM Read and Write I/O Timing—TSA and THA
Note 1: Clock speed is 333 MHz. TSA and THA are referenced to MemClkOut. Note 2: Memory clock signal is shifted by 90° from the internal clock. Table 17. DDR SDRAM Read and Write I/O Timing—TSA and THA
Signal Name MemAddr00:12 BA0:1 BankSel0:3 ClkEn0:3 CAS RAS WE TSA (ns) Minimum 1.32 1.15 1.12 1.29 1.24 1.29 1.35 THA (ns) Minimum 1.2 1.49 1.52 1.45 1.14 1.48 1.43
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Data Sheet
DDR SDRAM Clock to Write DQS Timing—TDS
Note 1: All of the DQS signals are referenced to MemClkOut. Note 2: Clock speed is 333 MHz.
PowerPC 440SP Embedded Processor
Note 3: The TDS values in the table include 1.5 × 3ns cycle at 333 MHz (3 ns × 1.5 = 4.5 ns). Note 4: To obtain adjusted values for lower clock frequencies, subtract 4 ns from the values in the following table and add × 1.5 of the cycle time for the lower clock frequency (TDS - 4.5 + 1.5 TCYC).
Table 18. DDR SDRAM Clock to Write DQS Timing—TDS
TDS (ns) Signal Name Minimum DQS0 DQS1 DQS2 DQS3 DQS4 DQS5 DQS6 DQS7 DQS8 4.76 4.78 4.78 4.76 4.79 4.80 4.81 4.79 4.77 Maximum 5.07 5.09 5.10 5.07 5.11 5.13 5.11 5.11 5.07
DDR SDRAM Write Data to DQS Timing—TSD and THD
Note 1: TSD and THD are measured under worst-case conditions. Note 2: Clock speed for the values in the following table is 333 MHz.
Table 19. DDR SDRAM Write Data to DQS Timing—TSD and THD
Signal Name MemData00:07, DM0 MemData08:15, DM1 MemData16:23, DM2 MemData24:31, DM3 MemData32:39, DM4 MemData40:47, DM5 MemData48:55, DM6 MemData56:63, DM7 ECC0:7, DM8 Reference Signal DQS0 DQS1 DQS2 DQS3 DQS4 DQS5 DQS6 DQS7 DQS8 TSD (ns) 0.58 0.62 0.62 0.63 0.68 0.67 0.62 0.65 0.63 THD (ns) 0.64 0.55 0.60 0.57 0.54 0.52 0.61 0.55 0.61
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PowerPC 440SP Embedded Processor DDR SDRAM Read Operation
Data Sheet
The read of the incoming data from the SDRAM is done on the rising and falling edges of the differential DQS signal. The data must be centered on these edges for correct operation. The PPC440SP can delay in very small increments the DQS by means of the programming of the MCIF0_RODC[RQFD] register field. DDR SDRAM MemClkOut0 and Read Clock Delay To accommodate timing variations introduced by the system designs using this chip, the three-stage data path shown in Figure 9, below, is used to eliminate metastability and allow data sampling to be adjusted for minimum latency. The data is stored in the eight Flip Flops of Stage 1, so that it can be transferred later, within an 8X period. Figure 9. DDR SDRAM Read Data Path.
Ext FeedBack Signals
DDR 1X Clock
FF: Flip-Flop
MemDCFdbkD Driver
Coarse Delay
FeedBack Signal Gen
CAS Lat Delay
Read Start Read Latency adjust circuit
MCIF0_RFDC[RFFD]
Rec Fine Delay
DDR 1X Clock
Stage 2 Store Oversampling Fine Delay
MemDCFdbkR
Feedback Data Capture Window 0
DQS aligned FBK signal
Cycles Delay
+1
MCIF0_RFDC[RFOS]
T1 T2 T3 T4
MCIF0_RDCC[RDSS]
adjust Oversampling Clock
1 7 Q2_Ovs 0 2 4 6
Package pins
Mux FF
D
FF FF
C
Q2
Compare
(x64) Mux
Read FIFO Upper
PLB bus [0:63]
DQ Data (x64)
DQS Rising Edge Sync Stage 1 FF
1 3 5 7
Stage 2 FF FF (x64)
C
Lower
Stage 3
Q3
D
FF
PLB bus [64:127]
DQS (Diff)
Programmed Read DQS Delay
DQS Falling Edge Sync DDR 1X Clock PLB 1X Clock
MCIF0_RQDC[RQFD]
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Data Sheet
Table 20. DDR SDRAM I/O Read Timing—TSD and THD
PowerPC 440SP Embedded Processor
Notes: 1. TSD and THD are measured under worst case conditions. 2. Clock speed for the values in the table is 333.33MHz. 3. The time values in the table include 1/4 of a cycle at 166MHz (3ns x 0.25 = 0.75 ns). 4. To obtain adjusted TSD and THD values for lower clock frequencies, subtract 0.75 ns from the values in the table and add 1/4 of the cycle time for the lower clock frequency (e.g., TSD - 0.75 + 0.25TCYC).
Signal Names MemData00:07 MemData08:15 MemData16:23 MemData24:31 MemData32:39 MemData40:47 MemData48:55 MemData56:63 ECC0:7 Reference Signal DQS0 DQS1 DQS2 DQS3 DQS4 DQS5 DQS6 DQS7 DQS8 Read Data vs DQS Setup TSD (ns) 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 0.00 Read Data vs DQS Hold THD (ns) 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00 1.00
Figure 10 shows the data strobe (DQS) and the data to be coincident. There is actually a slight skew as specified by the SDRAM specifications, and there can be additional skew due to loading and signal routing. It is recommended that the signal length for all of the eight DQS signals be matched. Figure 10. DDR SDRAM Memory Data and DQS
DQS TSD MemData THD
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PowerPC 440SP Embedded Processor
Data Sheet
The following figure shows the timing relationship between SDRAM DDR Data at the input pin and the store of the data in stage 1. Figure 11. DDR SDRAM Read Cycle Timing Example
Oversampling Guard Band DDR 1X Clock DDR 2X Clock Memclk (Diff.) DQS at MemCntl pin Data at pin D0 D1 D2 D3 D4 D5 D6 D7 D8 D9
FeedBack output 1X DDR Clk cycle Delayed DQS T1 T2
Store 1st Data in Stage 2
T3
T4
Data out Stage 1 (0) Data out Stage 1 (1)
Data out Stage 1 (2) Valid High Data out Stage 2 Low D1 D0 D2 D3
PLB 1X Clock
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Data Sheet
Initialization
PowerPC 440SP Embedded Processor
The PPC440SP provides an option for setting initial parameters based on default values or by reading them from a serial “bootstrap” ROM attached to the IIC0 bus. These options are defined by strapping on three external pins (see “Strapping” below).
Strapping
While the SysReset input pin is low (system reset), the state of certain I/O pins is read to enable certain default initial conditions prior to PPC440SP start-up. The actual capture instant is the nearest SysClk edge before the deassertion of reset. These pins must be strapped using external pull-up (logical 1) or pull-down (logical 0) resistors to select the desired default conditions. They are used for strap functions only during reset. Following reset they are used for normal functions. Figure 21 lists the strapping pins along with their functions and strapping options:
Table 21. Strapping Pin Assignments
Pin Strapping Function Option Bit 0 A08 (UART0_DCD) 0 0 1 1 1 1 Bit 1 C11 (UART0_DSR) 0 1 0 1 0 1 0 0 1 1 Bit2 C09 (UART0_CTS)
Serial Bootstrap ROM is disabled (Bit 0 off). Refer to the IIC Bootstrap Controller chapter in the PPC440SP Embedded Processor User’s Manual for details. Serial Bootstrap ROM is enabled (Bit 0 on). The options being selected are the IIC0 slave address that responds with strapping data and reading 128 bits from the Bootstrap ROM. Serial Bootstrap ROM is enabled (Bit 0 on). The options being selected are the IIC0 slave address that responds with strapping data and reading 256 bits from the Bootstrap ROM.
Boot from EBC Boot from PCI 0x54 0x50 0x54 0x50
Serial Bootstrap ROM
During reset, if the serial device is enabled, initial conditions can be read from a ROM connected to the IIC0 port. In this case, at the de-assertion of SysReset, the PPC440SP sequentially reads up to 32 bytes from the ROM device on the IIC0 port and sets the SDR0_SDSTP0 - SDR0_SDSTP7 registers accordingly. The initialization settings and their default values are described in detail in the PPC440SP Embedded Processor User’s Manual.
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PowerPC 440SP Embedded Processor Document Revision History
Revision
1.23 1.22 1.21 1.20 1.19 1.18 1.17 1.16 1.15 1.14 1.13
Data Sheet
Date
Sept 26, 2006 Sept 22, 2006 Sept 12, 2006 June 27, 2006 June 14, 2006 May 23, 2006 May 1, 2006 March 8, 2006 March 7, 2006 March 6, 2006 February 9, 2006
Description
Corrected Package Thermal Specifications table where the letter q appeared instead of the symbol for theta. Updated Recommended DC Operating Conditions table. Updated Processor Clock values in Clocking Specifications table. Updated Recommended DC Op Conditions and Signal Functional Description tables for PCI-X DDR mode 2. Updated signal lists. Fixed doc issue for PEROE signal in Signal Functional Description table. Updated Clocking Specifications table and Serial Bootstrap ROM paragraph. Updated core package graphic in Figure 3. Added RAID acceleration section to Features, Description, and functional details sections. Updated ordering and PVR information, part number list, and package diagram. GJG Removed DMA statement from Serial Port feature statement. Removed reference to notes from PERBLAST entry in signal functional description table. GJG Updated description of On-Chip SRAM/L2 Cache in Introduction. GJG Updated Signal Function Description table per JB, updated mailing address and copyright date in disclaimer. GJG Clarified information about DDR SDRAM I/O specifications, updated note in system memory address map table per GB, updated ordering and PVR information, part number list, and package diagram, deleted Preliminary from running head. GJG Updated leakage current info, case temp range, DDR SDRAM Signal Termination graphic. GJG Changed PVR numbers for pass 2. Corrected functional block diagram. Updated Write timing diagrams. GJG Changed part numbers in Ordering and PVR Information section to reflect pass 2. Removed text for unsupported COLA component. GJG Added table to document muxed usage of GPIO signals. Removed additional references to unsupported COLA serial interface. Reformatted LOF and LOT to comply with AMCC style. Updated Description information on first page, sections on DC power supply loads and recommended DC operating conditions. GJG Remove references to unsupported COLA serial interface. GJG Update max case temp in Recommended DC Op Conditions table to match Ordering and PVR Information table. GJG Update Order Part Number Key information, DDR SDRAM Read data Path block diagram, and DDR SDRAM Read Cycle Timing example diagram per GB. GJG Update Ordering and PVR information. GJG Update table in Recommended DC Operating Conditions section per Docs Issue Database ID #12. GJG Update functional block diagram and text, signal functional description table, and recommended DC operating conditions section with GB’s comments. GJG First official draft. GJG Create initial data sheet.
1.12 1.11 1.10 1.09
Nov 15, 2005 July 12, 2005 May 23, 2005 Mar 8, 2005
1.08
Feb 16, 2005
1.07 1.06 1.05 1.04 1.03 1.02 1.01 1.00
Jan 19, 2005 Dec 21, 2004 Dec 14, 2004 Dec 01, 2004 Oct 19, 2004 Oct 12, 2004 Sept 08, 2004 Dec 31, 2003
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Data Sheet
PowerPC 440SP Embedded Processor
Applied Micro Circuits Corporation
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