REVISIONS
LTR
DESCRIPTION
DATE
APPROVED
A
Correct typing errors in truth table and table I. Reword paragraph
4.3.1c. Update vendors part numbers.
1987 July 13
M. A. Frye
B
Add one vendor, CAGE 18324 and their part numbers. Add
programming procedure and waveforms for circuit B.
1988 May 17
M. A. Frye
C
Change vendor similar part numbers from 82523B/BEA and
82523B/BFA to 82S123B/BEA and 82S123B/BFA respectively. Table
I changed VOL max limit from 0.45 volt to 0.5 volt and IOS max limit
from -90 mA to -100 mA. Editorial changes throughout.
1989 Jan 12
M. A. Frye
D
Updated boilerplate. Removed programming specifics from drawing,
including table III. Separated source bulletin from body of drawing. glg
00-08-09
Raymond Monnin
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
D
D
D
D
D
D
D
D
D
D
1
2
3
4
5
6
7
8
9
10
PREPARED BY
Steve Duncan
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY All DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
CHECKED BY
Ray Monnin
APPROVED BY
Michael. A. Frye
MICROCIRCUITS, MEMORY, DIGITAL,
32 x 8-BIT PROM, MONOLITHIC SILICON
DRAWING APPROVAL DATE
1986 July 17
REVISION LEVEL
D
SIZE
A
CAGE CODE
67268
5962-86703
SHEET
1 OF
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
10
5962-E476-00
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN shall be as shown in the following example:
5962-86703
|
|
|
Drawing number
01
|
|
|
Device type
(see 1.2.1)
E
|
|
|
Case outline
(see 1.2.2)
X
|
|
|
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) shall identify the circuit function as follows:
Device type
01
02
Generic number
Circuit
Access time
1/
1/
32 x 8-bit PROM, T.S.
32 x 8-bit PROM, T.S.
50 ns
35 ns
1.2.2 Case outline(s). The case outline(s) shall be as designated in MIL-STD-1835, and as follows:
Outline letter
E
F
2
Descriptive designator
Terminals
GDIP1-T16 or CDIP2-T16
GDFP2-F16 or CDFP3-F16
CQCC1-N20
Package style
16
16
20
dual-in-line package
flat package
square leadless chip carrier package
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range.........................................................
Input voltage range ...........................................................
Storage temperature range ..............................................
Maximum power dissipation (PD): 2/.................................
Lead temperature (soldering, 10 seconds) .......................
Thermal resistance, junction-to-case (4JC) ......................
DC voltage applied to outputs during programming ..........
DC voltage applied to outputs (except during
programming)........................................................
Output current into outputs during programming
(maximum duration of one second)
DC input current
-0.5 V dc to +7.0 V dc
-0.5 V dc to +5.5 V dc
-65qC to +150qC
633 mW
+300 qC
See MIL-STD-1835
21 V dc
-0.5 V dc to +VCC maximum
250 mA
-30 mA to +5 mA
1.4 Recommended operating conditions.
Case operating temperature range (TC).................................
Maximum low level input low voltage (VIL) .............................
Minimum high level input high voltage (VIH)...........................
Supply voltage range (V CC)
-55qC to +125qC
0.8 V dc
2.0 V dc
4.5 V dc to 5.5 V dc
1/ Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
2/ Must withstand the added PD due to short-circuit test; e.g., IOS.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the
issue listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto,
cited in the solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-973 - Configuration Management.
MIL-STD-1835 - Interface Standard For Microcircuit Case Outlines.
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 - List of Standard Microcircuit Drawings (SMD's).
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing shall take precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for nonJAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF38535 may be processed as QML product in accordance with the manufacturer's approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect the PIN as described herein. A "Q" or "QML"
certification mark in accordance with MIL-PRF-38535 is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.3.1 Unprogrammed devices. The truth table for unprogrammed devices for contracts involving no altered item drawing
shall be as specified on figure 3. When testing is required per 4.3 herein, the devices shall be programmed by the
manufacturer prior to test in a checkerboard pattern (a minimum of 50 percent of the total number of bits programmed) or to
any altered item drawing pattern which includes at least 25 percent of the total number of bits programmed.
3.2.3.2 Programmed devices. The truth table for programmed devices shall be specified by an altered item drawing.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
3
TABLE I. Electrical performance characteristics.
Test
|Symbol
|
|
|
High level output voltage |VOH 1/
|
|
Low level output voltage |VOL 1/
|
|
Input high level voltage |VIH 1/
|
Input low level voltage
|VIL 1/
|
High level input current |IIH
|
Low level input current |IIL
|
Output short-circuit
|
current
|IOS
|
Power supply current
|ICC
|
|
Input clamp voltage
|VI 1/
|
|
|
|
Output leakage current |ICEX
|
|
|
Address access time
|tAA
|
|
|
Enable access time
|tEA
|
|
Enable recovery time
|tER
|
|
|
Conditions
|
-55qC < TC < +125qC
|
4.5 V < VCC < 5.5 V
| unless otherwise specified
|VIN = VIL or VIH
|IOH = -2.0 mA, VCC = min.
|
|VIN = VIL or VIH
|IOL = 16 mA, VCC = min.
|
|Guaranteed input logical high
|voltage for all inputs.
|Guaranteed input logical low
|voltage for all inputs.
|VCC = max., VIN = 2.7 V
|
|VCC = max., VIN = 0.45 V
|
|
|VCC = 5.5 V, VO = 0 V 2/
|
|VCC = max.
|All inputs = GND
|
|VCC = min., IIN = -18 mA
|
VO = 4.5 V
|VCC = max. |
|VCS = 2.4 V |
|
|
VO = 2.4 V
|
|
|
|
VO = 0.4 V
|
|
|
|See figures 3 and 4 3/
|
|
|
|See figures 3 and 4 4/
|
|
|See figures 3 and 4 4/
|
|
| Group A
|subgroups
|
|
| 1, 2, 3
|
|
| 1, 2, 3
|
|
| 1, 2, 3
|
| 1, 2, 3
|
| 1, 2, 3
|
| 1, 2, 3
|
|
| 1, 2, 3
|
| 1, 2, 3
|
|
| 1, 2, 3
|
|
|
|
| 1, 2, 3
|
|
|
| 9, 10, 11
|
|
|
| 9, 10, 11
|
|
| 9, 10, 11
|
|
|Device
| type
|
|
| All
|
|
| All
|
|
| All
|
| All
|
| All
|
| All
|
|
| All
|
| All
|
|
| All
|
|
|
|
| All
|
|
|
| 01
| 02
|
|
| 01
| 02
|
| 01
| 02
|
| Limits
|
|
|Unit
| Min | Max |
|
|
|
| 2.4 |
| V
|
|
|
|
|
|
|
| 0.5 | V
|
|
|
|
|
|
| 2.0 |
| V
|
|
|
|
| 0.8 | V
|
|
|
|
| 25 | PA
|
|
|
|
| -250| PA
|
|
|
|
|
|
|-20 |-100 | mA
|
|
|
|
| 115 | mA
|
|
|
|
|
|
|
| -1.2 | V
|
|
|
|
| 40 |
|
|
|
|
| 40 |
|
|
| PA
|
| -40 |
|
|
|
|
|
|
|
| 50 | ns
|
| 35 |
|
|
|
|
|
|
|
| 30 | ns
|
| 25 |
|
|
|
|
| 30 | ns
|
| 25 |
|
|
|
1/ These are absolute voltages with respect to device ground pin and include all overshoots due to system or tester noise or
both. Do not attempt to test these values without suitable equipment.
2/ Not more than one output should be shorted at a time. Duration of the short circuit should not be more than 1 second.
3/ Parameter tAA is tested with switch S1 closed and CL = 30 pF.
4/ Parameter tEA is tested with CL = 30 pF to the 1.5 V; S1 is open for high impedance to high tests and closed for high
impedance to low tests. Parameter tER is tested with CL = 5 pF. High to high impedance tests are made with S1 open to an
output voltage of VOH -0.5 V. Low to high impedance tests are made with S1 closed to the VOL +0.5 V level.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
4
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
in 1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-HDBK-103 (see 6.6 herein). For
packages where the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not
marking the "5962-" on the device.
3.5.1 Certification/compliance mark. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
Appendix A.
3.6 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to be listed as an
approved source of supply in MIL-HDBK-103 (see 6.6 herein). The certificate of compliance submitted to DSCC-VA prior to
listing as an approved source of supply shall affirm that the manufacturer's product meets the requirements of MIL-PRF-38535,
appendix A and the requirements herein.
3.7 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38535, appendix A shall be provided
with each lot of microcircuits delivered to this drawing.
3.8 Notification of change. Notification of change to DSCC-VA shall be required in accordance with MIL-PRF-38535,
appendix A.
3.9 Verification and review. DSCC, DSCC's agent and the acquiring activity retain the option to review the manufacturer's
facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the
reviewer.
3.10 Processing options. Since the PROM is an unprogrammed memory capable of being programmed by either the
manufacturer or the user to result in a wide variety of PROM configurations, two processing options are provided for the
selection in the contract, using an altered item drawing.
3.10.1 Unprogrammed PROM delivered to the user. All testing shall be verified through group A testing as defined in 3.2.3.1
and table II. It is recommended that users perform subgroups 7 and 9 after programming to verify the specific program
configuration.
3.10.2 Manufacturer-programmed PROM delivered to the user. All testing requirements and quality assurance provisions
herein, including the requirements of the altered item drawing shall be satisfied by the manufacturer prior to delivery.
4. QUALITY ASSURANCE PROVISIONS
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A.
4.2 Screening. Screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices
prior to quality conformance inspection. The following additional criteria shall apply:
a. Burn-in test (method 1015 of MIL-STD-883).
(1)
Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified
in test method 1015 of MIL-STD-883.
(2)
TA = +125qC, minimum.
b. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter
tests prior to burn-in are optional at the discretion of the manufacturer.
c. All devices processed to an altered item drawing may be programmed either before or after burn-in at the discretion of
the manufacturer. The required electrical testing shall include, as a minimum, the final electrical tests for programmed
devices as specified in table II.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
5
All device types
Case
Outlines
E, F
Terminal
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Terminal
Symbol
O0
O1
O2
O3
O4
O5
O6
GND
O7
A0
A1
A2
A3
A4
15
16
17
18
19
20
CS
VCC
---------
2
Terminal
Number
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
Terminal
Symbol
NC
O0
O1
O2
O3
NC
O4
O5
O6
GND
NC
O7
A0
A1
A2
NC
A3
A4
19
20
CS
VCC
FIGURE 1. Terminal connections.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
6
Word
number
N/A
CS
L
H
A4
X
X
A3
X
X
Address
A2
X
X
A1
X
X
A0
X
X
O7
5/
OC
O6
5/
OC
O5
5/
OC
Data
O4
O3
5/
5/
OC
OC
O2
5/
OC
O1
5/
OC
O0
5/
OC
Notes:
1. NA = not applicable.
2. X = Input may be high level, low level, or open circuit.
3. OC = Open circuit (high resistance output).
4. Program readout can only be accomplished with enable input at low level.
5. The outputs for an unprogrammed device shall be low.
FIGURE 2. Truth table.
FIGURE 3. Switching test circuit.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
7
FIGURE 4. Switching waveforms.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
8
TABLE II. Electrical test requirements.
| MIL-STD-883 test requirements
|
|
| Interim electrical parameters
| (method 5004)
|
| Final electrical test parameters
|(method 5004)
|
| Group A test requirements
| (method 5005)
|
| Groups C and D end-point
| electrical parameters
| (method 5005)
|
| Subgroups (per method
| 5005, table I)
|
|
--|
|
|
|
1*, 2, 3, 7*, 8, 9,10**,11**
|
|
|
1, 2, 3, 7, 8, 9, 10**, 11**
|
|
|
1, 2, 3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
* PDA applies to subgroups 1 and 7.
** Subgroups 10 and 11, if not tested, shall be guaranteed to the limits specified in table I.
4.3 Quality conformance inspection. Quality conformance inspection shall be in accordance with method 5005 of MIL-STD883 including groups A, B, C, and D inspections. The following additional criteria shall apply.
4.3.1 Group A inspection.
a. Tests shall be as specified in table II herein.
b. Subgroups 4, 5 and 6 in table I, method 5005 of MIL-STD-883 shall be omitted.
c. Unprogrammed devices shall be tested for programmability and ac performance compliance to the requirements of
group A, subgroups 9. 10, and 11. Either of two techniques is acceptable.
(1)
Testing the entire lot using additional built-in test circuitry which allows the manufacturer to verify programmability
and ac performance without programming the user array. If this is done, the resulting test patterns shall be
verified on all devices during subgroups 9, 10, and 11, group A testing per the sampling plan specified in MILSTD-883, method 5005.
(2)
If such compliance cannot be tested on an unprogrammed device, a sample shall be selected to satisfy
programmability requirements prior to performing subgroups 9, 10, and 11. Twelve devices shall be submitted to
programming (see 3.2.3.1). If more than 2 devices fail to program, the lot shall be rejected. At the manufacturer's
option, the sample may be increased to 24 total devices with no more than 4 total device failures allowable. Ten
devices from the programmability sample shall be submitted to the requirements of group A, subgroups 9, 10, and
11. If more than 2 total devices fail, the lot shall be rejected. At the manufacturer's option, the sample may be
increased to 20 total devices with no more than 4 total device failures allowable.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
9
4.3.2 Groups C and D inspections.
a. End-point electrical parameters shall be as specified in table II herein.
b. Steady-state life test conditions, method 1005 of MIL-STD-883.
(1) Test condition C or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to the preparing or procuring activity upon request. The test circuit shall specify
the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in test
method 1005 of MIL-STD-883.
(2) TA = +125qC, minimum.
(3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883
c. The group C, subgroup 1 sample shall include devices tested in accordance with 4.3.1c.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535, appendix A.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for
the individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692,
Engineering Change Proposal.
6.4 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list
will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices
(FSC 5962) should contact DSCC-VA, telephone (614) 692-0525.
6.5 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43216-5000, or telephone 614692-0674.
6.6 Approved source of supply. An approved source of supply is listed herein. Additional sources will be added as they
become available. The vendor listed herein has agreed to this drawing and a certificate of compliance (see 3.6 herein ) has
been submitted to DSCC-VA.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
5962-86703
A
REVISION LEVEL
D
SHEET
10
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 00-08-09
Approved sources of supply for SMD 5962-86703 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next
dated revisions of MIL-HDBK-103 and QML-38535.
|
|
| Standard
| Vendor
| microcircuit 1/ | CAGE
| drawing PIN
| number
|
| 0C7V7
|5962-8670301EA| 3/
|
| 58625
|
| 3/
|
| 0C7V7
|5962-8670301FA | 3/
|
| 58625
|
| 3/
|
|
|5962-86703012A | 3/
|
|
|
| 0C7V7
|5962-8670302EA| 3/
|
| 58625
|
| 3/
|
| 0C7V7
|5962-8670302FA | 3/
|
| 58625
|
| 3/
|
|
|5962-86703022A | 3/
|
|
|
|
Vendor
|
similar PIN 2/
|
| 82S123A/BEA
| 82S123A/BEA
| SL82S123A/BEA
| AM27S19/BEA
| 82S123A/BFA
| 82S123A/BFA
| SL82S123A/BFA
| AM27S19/BFA
|
| AM27S19/B2A
|
| 82S123B/BEA
| 82S123B/BEA
| SL82S123B/BEA
| AM27S19A/BEA
| 82S123B/BFA
| 82S123B/BFA
| SL82S123B/BFA
| AM27S19A/BFA
|
| AM27S19A/B2A
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1/ The lead finish shown for each PIN representing a hermetic package
is the most readily available from the manufacturer listed for that part.
If the desired lead finish is not listed contact the Vendor to determine
its availability.
2/ Caution. Do not use this number for item acquisition. Items acquired
to this number may not satisfy the performance requirements of this
drawing.
3/ No longer available from an approved source.
Vendor CAGE
number
Vendor name
and address
0C7V7
QP LABS
3605 Kifer Road
Santa Clara, CA 95051
58625
Lansdale Semiconductor Inc.
2412 W. Huntington Drive
Tempe, AZ 85282-3134
The information contained herein is disseminated for convenience only and the
Government assumes no liability whatsoever for any inaccuracies in the
information bulletin.
