Am29LV800B Known Good Die
Data Sheet
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SUPPLEMENT
Am29LV800B Known Good Die
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Boot Sector Flash Memory—Die Revision 2
DISTINCTIVE CHARACTERISTICS
s Single power supply operation — 2.7 to 3.6 V for read, program, and erase operations — Ideal for battery-powered applications s Manufactured on 0.32 µm process technology s High performance — 80, 90, or 120 ns access time s Low power consumption (typical values at 5 MHz) — 200 nA Automatic Sleep mode current — 200 nA standby mode current — 7 mA read current — 15 mA program/erase current s Flexible sector architecture — One 16 Kbyte, two 8 Kbyte, one 32 Kbyte, and fifteen 64 Kbyte sectors (byte mode) — One 8 Kword, two 4 Kword, one 16 Kword, and fifteen 32 Kword sectors (word mode) — Supports full chip erase — Sector Protection features: A hardware method of locking a sector to prevent any program or erase operations within that sector Sectors can be locked in-system or via programming equipment Temporary Sector Unprotect feature allows code changes in previously locked sectors s Unlock Bypass Program Command — Reduces overall programming time when issuing multiple program command sequences s Top or bottom boot block configurations available s Embedded Algorithms — Embedded Erase algorithm automatically preprograms and erases the entire chip or any combination of designated sectors — Embedded Program algorithm automatically writes and verifies data at specified addresses s Minimum 1,000,000 write cycle guarantee per sector s Compatibility with JEDEC standards — Pinout and software compatible with singlepower supply Flash — Superior inadvertent write protection s Data# Polling and toggle bits — Provides a software method of detecting program or erase operation completion s Ready/Busy# pin (RY/BY#) — Provides a hardware method of detecting program or erase cycle completion s Erase Suspend/Erase Resume — Suspends an erase operation to read data from, or program data to, a sector that is not being erased, then resumes the erase operation s Hardware reset pin (RESET#) — Hardware method to reset the device to reading array data s 20-year data retention at 125°C s Tested to datasheet specifications at temperature s Quality and reliability levels equivalent to standard packaged components
Publication# 21356 Rev: E A mendment/0 Issue Date: March 12, 2002
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GENERAL DESCRIPTION
The Am29LV800B in Known Good Die (KGD) form is an 8 Mbit, 3.0 volt-only Flash memory. AMD defines KGD as standard product in die form, tested for functionality and speed. AMD KGD products have the same reliability and quality as AMD products in packaged form. Hardware data protection measures include a low V CC detector that automatically inhibits write operations during power transitions. The hardware sector protection feature disables both program and erase operations in any combination of the sectors of memory. This can be achieved in-system or via programming equipment. The Erase Suspend feature enables the user to put erase on hold for any period of time to read data from, or program data to, any sector that is not selected for erasure. True background erase can thus be achieved. The hardware RESET# pin terminates any operation in progress and resets the internal state machine to reading array data. The RESET# pin may be tied to the system reset circuitry. A system reset would thus also reset the device, enabling the system microprocessor to read the boot-up firmware from the Flash memory. The device offers two power-saving features. When addresses have been stable for a specified amount of time, the device enters the automatic sleep mode. The system can also place the device into the standby mode. Power consumption is greatly reduced in both these modes. AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a se ctor simultaneously via Fowler-Nordheim tunneling. The data is programmed using hot electron injection.
Am29LV800B Features
The Am29LV800B is an 8 Mbit, 3.0 volt-only Flash memory organized as 1,048,576 bytes or 524,288 words. The word-wide data (x16) appears on DQ15– DQ0; the byte-wide (x8) data appears on DQ7–DQ0. To eliminate bus contention the device has separate chip enable (CE#), write enable (WE#) and output enable (OE#) controls. The device requires only a single 3.0 volt power supply f or both read and write functions. Internally generated and regulated voltages are provided for the program and erase operations. No VPP is required for program or erase operations. The device can also be programmed in standard EPROM programmers. The device is entirely command set compatible with the JEDEC single-power-supply Flash standard. Commands are written to the command register using standard microprocessor write timings. Register contents serve as input to an internal state-machine that controls the erase and programming circuitry. Write cycles also internally latch addresses and data needed for the programming and erase operations. Reading data out of the device is similar to reading from other Flash or EPROM devices. Device programming occurs by executing the program command sequence. This initiates the E mbedded Program algorithm—an internal algorithm that automatically times the program pulse widths and verifies proper cell margin. The Unlock Bypass mode facilitates faster programming times by requiring only two write cycles to program data instead of four. Device erasure occurs by executing the erase command sequence. This initiates the E mbedded Erase algorithm—an internal algorithm that automatically preprograms the array (if it is not already programmed) before executing the erase operation. During erase, the device automatically times the erase pulse widths and verifies proper cell margin. The host system can detect whether a program or erase operation is complete by observing the RY/BY# pin, or by reading the DQ7 (Data# Polling) and DQ6 (toggle) status bits. After a program or erase cycle has been completed, the device is ready to read array data or accept another command. The sector erase architecture allows memory sectors to be erased and reprogrammed without affecting the data contents of other sectors. The device is fully erased when shipped from the factory. 2
Electrical Specifications
Refer to the Am29LV800B data sheet, publication number 21490, for full electrical specifications on the Am29LV800B in KGD form.
Am29LV800B Known Good Die
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PRODUCT SELECTOR GUIDE
Family Part Number Speed Option (V CC = 2.7 – 3.6 V) Max Access Time, tACC (ns) Max CE# Access, tCE (ns) Max OE# Access, tOE (ns) -80 80 80 30 Am29LV800B KGD -90 90 90 35 -120 120 120 50
DIE PHOTOGRAPH
DIE PAD LOCATIONS
9 8 7 6 5 4 3 2 1 44 43 42 41 40 39 38 37 36
10 11 12
35 34 33
AMD logo location
13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
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PAD DESCRIPTION
Pads relative to die center.
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Signal VCC DQ4 DQ12 DQ5 DQ13 DQ6 DQ14 DQ7 DQ15/A–1 VSS BYTE# A16 A15 A14 A13 A12 A11 A10 A9 A8 WE# RESET# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# VSS OE# DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 Pad Center (mils) X Y –0.90 127.50 –13.00 127.50 –18.90 127.50 –24.80 127.50 –30.70 127.50 –36.50 127.50 –42.40 127.50 –48.30 127.50 –54.20 127.50 –63.60 125.90 –63.60 115.80 –63.60 105.70 –63.30 –126.00 –57.40 –126.00 –52.00 –126.00 –46.20 –126.00 –40.70 –126.00 –34.90 –126.00 –29.50 –125.80 –23.60 –126.00 –18.10 –126.00 –8.60 –129.80 8.70 –129.80 18.20 –126.00 23.70 –126.00 29.50 –126.00 34.90 –126.00 40.70 –126.00 46.20 –126.00 52.00 –126.00 57.40 –126.00 63.30 –126.00 63.60 105.50 63.60 115.60 63.60 125.70 54.20 129.60 46.60 127.50 40.70 127.50 34.90 127.50 28.90 127.50 23.10 127.50 17.20 127.50 11.40 127.50 5.40 127.50 Pad Center (millimeters) X Y –0.02 3.24 –0.33 3.24 –0.48 3.24 –0.63 3.24 –0.78 3.24 –0.93 3.24 –1.08 3.24 –1.23 3.24 –1.38 3.24 –1.62 3.20 –1.62 2.94 –1.62 2.68 –1.61 –3.20 –1.46 –3.20 –1.32 –3.20 –1.17 –3.20 –1.03 –3.20 –0.89 –3.20 –0.75 –3.20 –0.60 –3.20 –0.46 –3.20 –0.22 –3.30 0.22 –3.30 0.46 –3.20 0.60 –3.20 0.75 –3.20 0.89 –3.20 1.03 –3.20 1.17 –3.20 1.32 –3.20 1.46 –3.20 1.61 –3.20 1.62 2.68 1.62 2.94 1.62 3.19 1.38 3.29 1.18 3.24 1.03 3.24 0.89 3.24 0.73 3.24 0.59 3.24 0.44 3.24 0.29 3.24 0.14 3.24
Note: The coordinates above are relative to the die center and can be used to operate wire bonding equipment.
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PAD DESCRIPTION
Pads relative to VCC.
Pad 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Signal VCC DQ4 DQ12 DQ5 DQ13 DQ6 DQ14 DQ7 DQ15/A–1 VSS BYTE# A16 A15 A14 A13 A12 A11 A10 A9 A8 WE# RESET# RY/BY# A18 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE# VSS OE# DQ0 DQ8 DQ1 DQ9 DQ2 DQ10 DQ3 DQ11 Pad Center (mils) X Y 0.00 0.00 –12.10 0.00 –18.00 0.00 –23.90 0.00 –29.80 0.00 –35.60 0.00 –41.50 0.00 –47.40 0.00 –53.30 0.00 –62.70 –1.60 –62.70 –11.70 –62.70 –21.80 –62.40 –253.50 –56.50 –253.50 –51.10 –253.50 –45.30 –253.50 –39.80 –253.50 –34.00 –253.50 –28.60 –253.30 –22.70 –253.50 –17.20 –253.50 –7.70 –257.30 9.60 –257.30 19.10 –253.50 24.60 –253.50 30.40 –253.50 35.80 –253.50 41.60 –253.50 47.10 –253.50 52.90 –253.50 58.30 –253.50 64.20 –253.50 64.50 –22.00 64.50 –11.90 64.50 –1.80 55.10 2.10 47.50 0.00 41.60 0.00 35.80 0.00 29.80 0.00 24.00 0.00 18.10 0.00 12.30 0.00 6.30 0.00 Pad Center (millimeters) X Y 0.0000 0.0000 –0.3073 0.0000 –0.4572 0.0000 –0.6071 0.0000 –0.7569 0.0000 –0.9042 0.0000 –1.0541 0.0000 –1.2040 0.0000 –1.3538 0.0000 –1.5926 –0.0406 –1.5926 –0.2972 –1.5926 –0.5537 –1.5850 –6.4389 –1.4351 –6.4389 –1.2979 –6.4389 –1.1506 –6.4389 –1.0109 –6.4389 –0.8636 –6.4389 –0.7264 –6.4338 –0.5766 –6.4389 –0.4369 –6.4389 –0.1956 –6.5354 0.2438 –6.5354 0.4851 –6.4389 0.6248 –6.4389 0.7722 –6.4389 0.9093 –6.4389 1.0566 –6.4389 1.1963 –6.4389 1.3437 –6.4389 1.4808 –6.4389 1.6307 –6.4389 1.6383 –0.5588 1.6383 –0.3023 1.6383 –0.0457 1.3995 0.0533 1.2065 0.0000 1.0566 0.0000 0.9093 0.0000 0.7569 0.0000 0.6096 0.0000 0.4597 0.0000 0.3124 0.0000 0.1600 0.0000
Note: The coordinates above are relative to the center of pad 1 and can be used to operate wire bonding equipment.
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ORDERING INFORMATION Standard Products
AMD standard products are available in several packages and operating ranges. The order number (Valid Combination) is formed by a combination of the following: Am29LV800B T -80 DP C 2
DIE REVISION This number refers to the specific AMD manufacturing process and product technology reflected in this document. It is entered in the revision field of AMD standard product nomenclature. TEMPERATURE RANGE C = Commercial (0°C to +70°C) I = Industrial (–40°C to +85°C) PACKAGE TYPE AND MINIMUM ORDER QUANTITY DP = Waffle Pack 140 die per 5 tray stack DG = Gel-Pak® Die Tray 462 die per 6 tray stack DT = Surftape™ (Tape and Reel) 2500 per 7-inch reel DW = Gel-Pak® Wafer Tray (sawn wafer on frame) Call AMD sales office for minimum order quantity SPEED OPTION See Product Selector Guide and Valid Combinations BOOT CODE SECTOR ARCHITECTURE T = Top sector B = Bottom sector DEVICE NUMBER/DESCRIPTION Am29LV800B Known Good Die 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS Flash Memory—Die Revision 2 3.0 Volt-only Program and Erase
Valid Combinations AM29LV800BT-80 AM29LV800BB-80 AM29LV800BT-90 AM29LV800BB-90 AM29LV800BT-120 AM29LV800BB-120
DPC 2, DPI 2, DGC 2, DGI 2, DTC 2, DTI 2, DWC 2, DWI 2
Valid Combinations Valid Combinations list configurations planned to be supported in volume for this device. Consult the local AMD sales office to confirm availability of specific valid combinations and to check on newly released combinations.
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PACKAGING INFORMATION Surftape Packaging
Direction of Feed
Orientation relative to leading edge of tape and reel
16 mm
AMD logo location
Gel-Pak and Waffle Pack Packaging
Orientation relative to top left corner of Gel-Pak and Waffle Pack cavity plate
AMD logo location
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PRODUCT TEST FLOW
Figure 1 provides an overview of AMD’s Known Good Die test flow. For more detailed information, refer to the Am29LV800B product qualification database supplement for KGD. AMD implements quality assurance procedures throughout the product test flow. In addition, an off-line quality monitoring program (QMP) further guarantees AMD quality standards are met on Known Good Die products. These QA procedures also allow AMD to produce KGD products without requiring or implementing burn-in.
Wafer Sort 1
DC Parameters Functionality Programmability Erasability
Bake 24 hours at 250°C
Data Retention
Wafer Sort 2
DC Parameters Functionality Programmability Erasability
Wafer Sort 3 High Temperature
DC Parameters Functionality Programmability Erasability Speed
Packaging for Shipment
Incoming Inspection Wafer Saw Die Separation 100% Visual Inspection Die Pack
Shipment
Figure 1.
AMD KGD Product Test Flow
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PHYSICAL SPECIFICATIONS
Die dimensions . . . . . . . . . . . . . . 140 mils x 279 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 3.56 mm x 7.09 mm Die Thickness . . . . . . . . . . . . . . . . . . . . . . . . .500 µm Bond Pad Size . . . . . . . . . . . . . . 4.69 mils x 4.69 mils . . . . . . . . . . . . . . . . . . . . . . . . . . 115.9 µm x 115.9 µm Pad Area Free of Passivation . . . . . . . . . .13.99 mils2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9,025 µm2 Pads Per Die . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .44 Bond Pad Metalization . . . . . . . . . . . . . . . . . . . . Al/Cu Die Backside . . . . . . . . . . . . . . . . . . . . . . . . No metal, may be grounded (optional) Passivation. . . . . . . . . . . . . . . . . . Nitride/SOG/Nitride
MANUFACTURING INFORMATION
Manufacturing . . . . . . . . . . . . . . . . . . . . . . . . . . . FASL Test . . . . . . . . . . . . . . . . . . . . . . . Penang, Malaysia Manufacturing ID (Top Boot) . . . . . . . . . . . . 98H02AK (Bottom Boot). . . . . . . . 98H02ABK Preparation for Shipment . . . . . . . . Penang, Malaysia Fabrication Process . . . . . . . . . . . . . . . . . . . . CS39S Die Revision . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
SPECIAL HANDLING INSTRUCTIONS
Processing Do not expose KGD products to ultraviolet light or process them at temperatures greater than 250 °C. Failure to adhere to these handling instructions will result in irreparable damage to the devices. For best yield, AMD recommends assembly in a Class 10K clean room with 30% to 60% relative humidity. Storage Store at a maximum temperature of 30°C in a nitrogenpurged cabinet or vacuum-sealed bag. Observe all standard ESD handling procedures.
DC OPERATING CONDITIONS
VCC (Supply Voltage) . . . . . . . . . . . . . . . 2.7 V to 3.6 V Operating Temperature Commercial . . . . . . . . . . . . . . . . . . . 0°C to +70°C Industrial . . . . . . . . . . . . . . . . . . . –40°C to +85°C
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TERMS AND CONDITIONS OF SALE FOR AMD NON-VOLATILE MEMORY DIE
All transactions relating to unpackaged die under this agreement shall be subject to AMD’s standard terms and conditions of sale, or any revisions thereof, which revisions AMD reserves the right to make at any time and from time to time. In the event of conflict between the provisions of AMD’s standard terms and conditions of sale and this agreement, the terms of this agreement shall be controlling. AMD warrants unpackaged die of its manufacture (“Known Good Die” or “Die”) against defective materials or workmanship for a period of one (1) year from date of shipment. This warranty does not extend beyond the first purchaser of said Die. Buyer assumes full responsibility to ensure compliance with the appropriate handling, assembly and processing of Known Good Die (including but not limited to proper Die preparation, Die attach, wire bonding and related assembly and test activities), and compliance with all guidelines set forth in AMD’s specifications for Known Good Die, and AMD assumes no responsibility for environmental effects on Known Good Die or for any activity of Buyer or a third party that damages the Die due to improper use, abuse, negligence, improper installation, accident, loss, damage in transit, or unauthorized repair or alteration by a person or entity other than AMD (“Warranty Exclusions”). The liability of AMD under this warranty is limited, at AMD’s option, solely to repair the Die, to send replacement Die, or to make an appropriate credit adjustment or refund in an amount not to exceed the original purchase price actually paid for the Die returned to AMD, provided that: (a) AMD is promptly notified by Buyer in writing during the applicable warranty period of any defect or nonconformity in the Known Good Die; (b) Buyer obtains authorization from AMD to return the defective Die; (c) the defective Die is returned to AMD by Buyer in accordance with AMD’s shipping instructions set forth below; and (d) Buyer shows to AMD’s satisfaction that such alleged defect or nonconformity actually exists and was not caused by any of the above-referenced Warranty Exclusions. Buyer shall ship such defective Die to AMD via AMD’s carrier, collect. Risk of loss will transfer to AMD when the defective Die is provided to AMD’s carrier. If Buyer fails to adhere to these warranty returns guidelines, Buyer shall assume all risk of loss and shall pay for all freight to AMD’s specified location. The aforementioned provisions do not extend the original warranty period of any Known Good Die that has either been repaired or replaced by AMD. WITHOUT LIMITING THE FOREGOING, EXCEPT TO THE EXTENT THAT AMD EXPRESSLY WARRANTS TO BUYER IN A SEPARATE AGREEMENT SIGNED BY AMD, AMD MAKES NO WARRANTY WITH
RESPECT TO THE DIE’S PROCESSING OF DATE DATA , AND S HALL HAVE NO LIAB ILITY FOR DAMAGES OF ANY KIND, UNDER EQUITY, LAW, OR ANY OTHER THEORY, DUE TO THE FAILURE OF SUCH KNOWN GOOD DIE TO PROCESS ANY PARTICULAR DATA CONTAINING DATES, INCLUDING DATES IN AND AFTER THE YEAR 2000, WHETHER OR NOT AMD RECEIVED NOTICE OF THE POSSIBILITY OF SUCH DAMAGES. THIS WARRANTY IS EXPRESSED IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING THE IMPLIED WARRANTY OF FITNESS FOR A PARTICULAR PURPOSE, THE IMPLIED WARRANTY OF MERCHANTABILITY AND OF ALL OTHER OBLIGATIONS OR LIABILITIES ON AMD’s PART, AND IT NEITHER ASSUMES NOR AUTHORIZES ANY OTHER PERSON TO ASSUME FOR AMD ANY OTHER LIABILITIES. THE FOREGOING CONSTITUTES THE BUYER’S SOLE AND EXCLUSIVE REMEDY FOR THE FURNISHING OF DEFECTIVE OR NON CONFORMING KNOWN GOOD DIE AND AMD SHALL NOT IN ANY EVENT BE LIABLE FOR INCREASED MANUFACTURING COSTS, DOWNTIME COSTS, DAMAGES RELATING TO BUYER ’S PROCUREMENT OF SUBSTITUTE DIE (i.e., “COST OF COVER”), LOSS OF PROFITS, REVENUES OR GOODWILL, LOSS OF USE OF OR DAMAGE TO ANY ASSOCIATED EQUIPMENT, OR ANY OTHER INDIRECT, INCIDENTAL, SPECIAL OR CONSEQUENTIAL DAMAGES BY REASON OF THE FACT THAT SUCH KNOWN GOOD DIE SHALL HAVE BEEN DETERMINED TO BE DEFECTIVE OR NON CONFORMING. Buyer agrees that it will make no warranty representations to its customers which exceed those given by AMD to Buyer unless and until Buyer shall agree to indemnify AMD in writing for any claims which exceed AMD’s warranty. Known Good Die are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of the Die can reasonably be expected to result in a personal injury. Buyer ’s use of Known Good Die for use in life support applications is at Buyer ’s own risk and Buyer agrees to fully indemnify AMD for any damages resulting in such use or sale.
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REVISION SUMMARY Revision A (March 1997)
Initial release. Terms and Conditions Replaced warranty with new version.
Revision B (January 1998)
Formatted to match current template. Updated Distinctive Characteristics and General Description sections using the current main data sheet. Updated for CS39 process technology.
Revision D (December 1998)
Packaging Information Added section. Moved orientation information from die photograph into this section.
Revision B+1 (March 1998)
Distinctive Characteristics Changed read and program/erase current to match data sheet. Pad Description Corrected signal names for pads 13– 44. Replaced values for all pad coordinates.
Revision D+1 (June 14, 1999)
Physical Specifications Corrected the bond pad dimensions. Deleted Si from the bond pad metalization specification.
Revision D+2 (July 2, 1999)
Ordering Information The quantities for each packaging type is now listed. Contacting AMD for this information is no longer required.
Revision C (November 1998)
Die Photograph, Pad Description, Ordering Information, Physical Specifications, Manufacturing Information Updated for CS39S process technology. Ordering Information Changed waffle pack quantity to 140. Changed valid combinations to reflect die revision 2.
Revision E (March 12, 2002)
Global Added 80 ns speed. Pad Description Added table of pad locations relative to die center. Manufacturing Information Changed test facility to Penang, Malaysia (ACN2016).
Trademarks Copyright © 2002 Advanced Micro Devices, Inc. All rights reserved. AMD, the AMD logo, and combinations thereof are registered trademarks of Advanced Micro Devices, Inc. Product names used in this publication are for identification purposes only and may be trademarks of their respective companies.
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