AME, Inc.
AME8753
n General Description
The AME8753 dual, low dropout, linear regulators operate from V OUT+VDROPOUT to 5.5V input and deliver up to 500mA / 500mA output current each. Low dropout voltage and low quiescent current(70µA typ.)make them ideal for battery applications. The AME8753 is available with a wide variety of voltage options as standard and can be trimmed to 2% accuracy. For protection purpose, AME8753 has both thermal shutdown and current fold-back to prevent device failure under the "Worst" operating conditions.
Low Dropout 500mA / 500mA Dual CMOS LDO Regulator
n Functional Block Diagram
Error Amp1
Current Limit
VOUT1 R11
R12 VIN
GND
Error Amp2
Current Limit
VOUT2 R21
Voltage Reference
R22
n Features
l Very Low Dropout Voltage l Guaranteed 500mA / 500mA Each Output l Accurate to within 2% for both outputs l Typical 70 µA Quiescent Current l Over-Temperature Shutdown l Current Limiting l Short Circuit Current Fold-back l All AME’s Lead Free Products Meet RoHS Standards
n Typical Applications
Fixed Version
VIN
IN OUT1
VOUT1 VOUT2
AME8753A
OUT2 GND
1µF
1µF
1µF
n Applications
l Cellular Phones l Palm / Notebook l Battery Power Equipment l Handheld Instruments
Rev.A.02
1
AME, Inc.
AME8753
n Pin Configuration
SOP-8/PP Top View
8 7 6 5
Low Dropout 500mA / 500mA Dual CMOS LDO Regulator
AME 8753AEZA 1. IN 2. GND
AME8753
3. GND 4. OUT1 5. OUT2 6. GND
1
2
3
4
7. GND 8. GND * Die Attach: Conductive Epoxy
Note: The area enclosed by dashed line represents Exposed Pad and connection to GND.
n Pin Description
Pin Number
1
Pin Name
IN
Description
Regulator Input. Supply voltage can range from Higher VOUT+VDROPOUT to 5.5V. This input also supplies the on-chip reference. Bypass with 1µF capacitor to GND. Ground. This pin also functions as heatsink. Solder to a large pad or the circuitboard ground plane to maximize thermal dissipation. Ground. This pin also functions as heatsink. Solder to a large pad or the circuitboard ground plane to maximize thermal dissipation. Regulator 1 Output. Sources up to 500mA continuous current. Bypass with a 1µF (< 0.5Ω typ ESR) capacitor to GND. Regulator 2 Output. Sources up to 500mA continuous current. Bypass with a 1µF (< 0.5Ω typ ESR) capacitor to GND. Ground. This pin also functions as heatsink. Solder to a large pad or the circuitboard ground plane to maximize thermal dissipation. Ground. This pin also functions as heatsink. Solder to a large pad or the circuitboard ground plane to maximize thermal dissipation. Ground. This pin also functions as heatsink. Solder to a large pad or the circuitboard ground plane to maximize thermal dissipation.
Rev.A.02
2
GND
3
GND
4
OUT1
5
OUT2
6
GND
7
GND
8
2
GND
AME, Inc.
AME8753
n Ordering Information AME8753 x x x x xxxx x
Special Feature Output Voltage Number of Pins Package Type Operating Ambient Temperature Range Pin Configuration
Operating Ambient Temperature Range E: -40OC to 85OC Number of Pins A: 8 Output Voltage (Both LDOs) 2533: VOUT1=2.5V VOUT2=3.3V
Low Dropout 500mA / 500mA Dual CMOS LDO Regulator
Pin Configuration A
(SOP-8/PP)
Package Type Z: SOP/PP
Special Feature
1. IN 2. GND 3. GND 4. OUT1 5. OUT2 6. GND 7. GND 8. GND
Z: Lead free
n Ordering Information
Part Number
AME8753AEZA2533Z
Marking*
AME8753 AEZA2533 yyww
Output Voltage
VOUT1=2.5V VOUT2=3.3V
Package
SOP-8/PP
Operating Ambient Temperature Range
- 40oC to 85oC
Note:yyww represents date code . * a line on top of the first letter represents lead free plating such as AME8753. Please consult AME sales office or authorized Rep./Distributor for voltage accuracy and package type availability.
Rev.A.02
3
AME, Inc.
AME8753 Low Dropout 500mA / 500mA Dual CMOS LDO Regulator
n Absolute Maximum Ratings
Parameter
Input Voltage Output Voltage Output Current ESD Classification
Maximum
-0.3 to 6 -0.3 to VIN + 0.3 PD / [2V IN -(V OUT1+VOUT2)] C*
Unit
V V mA
Caution: Stress above the listed absolute maximum rating may cause permanent damage to the device * HBM C:4000V+
n Recommended Operating Conditions
Parameter
Ambient Temperature Range Junction Temperature Range Storage Temperature Range
Symbol
TA TJ TSTG
Rating
-40 to 85 -40 to 125 -65 to 150
Unit
o
C C C
o
o
n Thermal Information
Parameter
Thermal Resistance * (Junction to Case) Thermal Resistance (Junction to Ambient) Internal Power Dissipation Maximum Junction Temperature Solder Iron (10 Sec)** SOP-8/PP Conductive Epoxy
Package
Die Attach
Symbol
θJC θJA PD
Maximum
19
Unit
o
C/W
84 1450 150 350 mW
o
C C
o
* Measure θJC on center of molding compound if IC has no tab. ** MIL-STD-202G 210F
4
Rev.A.02
AME, Inc.
AME8753
n Electrical Specifications
Unless specified: TJ=25OC, VIN=Higher VOUT+1V, IOUT1=IOUT2=1mA, CIN=COUT=1µF. Typical values are at TJ=25OC
Parameter IN Input Supply Voltage Quiescent Current OUT1, OUT2 IOUT=1mA Output Voltage VOUT 0mA
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