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A23L83161-70

A23L83161-70

  • 厂商:

    AMICC(欧密格)

  • 封装:

  • 描述:

    A23L83161-70 - 256K X 16 / 512K X 8 BIT CMOS MASK ROM - AMIC Technology

  • 数据手册
  • 价格&库存
A23L83161-70 数据手册
A23L8316/A23L83161 Series Preliminary Document Title 256K X 16 / 512K X 8 BIT CMOS MASK ROM Revision History Rev. No. 0.0 256K X 16 / 512K X 8 BIT CMOS MASK ROM History Initial issue Issue Date July 28, 2004 Remark Preliminary PRELIMINARY (July, 2004, Version 0.0) AMIC Technology, Corp. A23L8316/A23L83161 Series Preliminary Features 256K x 16 bit or 512K x 8 bit organization Supply voltage range: 2.7V~3.6V Access time: 70ns (max.)/3.0V~3.6V 100ns (max.)/2.7V~3.6V Current: Operating: 20mA (typ.)/3.3V Standby: 10µA (typ.)/3.3V Three-state outputs for wired-OR expansion Full static operation All inputs and outputs are directly TTL-compatible Flash memory pinout compatible with AMD (A23L83161) Available in 40-pin SOP, 32-pin PLCC 48-pin TSOP (forward, reverse type and flash memory’s pinouts compatible) packages 512K X 16 / 1M X 8 BIT CMOS MASK ROM Pin Configurations SOP A12 PLCC VCC A15 A16 A18 A17 30 NC 31 A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 A8 A9 A10 A11 A12 A13 A14 A15 A16 BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 A7 A6 A5 A4 A3 A2 A1 A0 O0 32 4 3 2 1 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 28 27 26 A14 A13 A8 A9 A11 OE A10 CE O7 GND O2 O3 O1 TSOP (forward type) BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND A23L8316V O4 PRELIMINARY (July, 2004, Version 0.0) 1 AMIC Technology, Corp. O5 O6 A23L8316M A23L8308 25 24 23 22 21 VCC A23L8316/A23L83161 Series Pin Configurations (continued) TSOP (reverse type) GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE A23L8316R TSOP (forward type) A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0 A23L83161V PRELIMINARY (July, 2004, Version 0.0) 2 AMIC Technology, Corp. A23L8316/A23L83161 Series Block Diagram ROW DECODER DRIVER MEMORY CELL ARRAY (A-1) A0 - A17 ADDRESS INPUTS COLUMN DECODER DRIVER COLUMN SELECTOR CIRCUITRY O0 O1 CE OE BYTE POWER-DOWN DOWN OR OUTPUT ENABLE CIRCUITRY BYTE CIRCUITRY O2 O3 O4 O5 O6 O7 (O8) (O9) (O10) (O11) (O12) (O13) (O14) (O15) PRELIMINARY (July, 2004, Version 0.0) 3 AMIC Technology, Corp. A23L8316/A23L83161 Series Pin Descriptions Pin No. Symbol 32L PLCC (A23L8316) 1-12, 23, 25-30 13-15, 17-21 22 24 40L SOP (A23L8316) 1-9, 32-40 13-20, 22-28 29 10 12 31 48L TSOP (A23L8316) 2-10, 15-23 28-35, 39-45 46 24 27 1 48L TSOP (A23L83161) 1-8, 17-25, 48 29-36, 38-44 45 26 28 47 A0-A17 O0-O14 O15/A-1 Address Inputs Data Outputs Output 15(WORD mode) /LSB Address (BYTE mode) Chip Enable Input Output Enable Input Description CE OE BYTE VCC GND NC BYTE or WORD mode Selection Power Supply Ground No Connection 32 16 31 21 11, 30 - 37-38 12, 25-26, 47-48 11, 13-14, 36 37 27, 46 9-16 Recommended DC Operating Conditions (TA = 0°C to + 70°C) Symbol Parameter Min. Max. Unit VCC GND VIH VIL Supply Voltage Ground Input High Voltage Input Low Voltage 2.7 0 2.2 - 0.3 3.6 0 VCC+0.3 0.6 V V V V PRELIMINARY (July, 2004, Version 0.0) 4 AMIC Technology, Corp. A23L8316/A23L83161 Series Absolute Maximum Ratings* Ambient Operating Temperature . . . . . . . . 0°C to + 70°C Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to + 70°C, VCC = 2.7V~3.6V, GND = 0V for -100, VCC = 3.0V~3.6V, GND = 0 for -70) Symbol Parameter Min. Max. Unit Conditions Note VOH VOL VlH VlL ⎢lLI⎥ ⎢lLO⎥ Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Supply Current Standby Supply Current (TTL) Standby Supply Current (CMOS) 2.4 0.4 2.2 -0.3 VCC + 0.3 0.6 +10 +10 30 1.5 10 V V V V µA µA IOH = -0.4mA (3V) IOL = 1.6mA (3V) VCC = max. VIN = VCC to GND VCC = max. VOUT = VCC to GND tCYC = min. CE = VIH CE ≥ VCC - 0.2V 1 2 ICC ISB ISB1 mA mA µA PRELIMINARY (July, 2004, Version 0.0) 5 AMIC Technology, Corp. A23L8316/A23L83161 Series Capacitance Symbol Parameter Min. Max. Unit Test Conditions Note CI CO Input Capacitance Output Capacitance 10 10 pF pF TA = 25°C f = 1.0MHz 3 AC Characteristics Symbol (TA = 0°C to +70°C, VCC = 2.7V~3.6V for -100, VCC = 3.0V~3.6V for -70, GND = 0V) Parameter A23L8316/A23L83161 -70 A23L8316/A23L83161 100 Unit Note Min. Max. Min. Max. tCYC tAA tACE tAOE tOH tLZ tHZ Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Output Hold after Address Change Output Low Z Delay Output High Z Delay* 70 70 70 35 10 10 20 100 100 100 50 10 10 20 ns ns ns ns ns ns ns 4, 6 5, 6 * tHZ is specified from either OE or CE going disabled, whichever occurs first. Notes: 1. OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested. PRELIMINARY (July, 2004, Version 0.0) 6 AMIC Technology, Corp. A23L8316/A23L83161 Series Timing Waveforms Propagation Delay from Address ( CE = Active, OE = Active) tCYC ADDRESS INPUTS VALID tAA tOH DATA OUT VALID Propagation Delay from Chip Enable or Output Enable (Address Valid) CHIP ENABLE VALID tACE OUTPUT ENABLE VALID tLZ tAOE tHZ DATA OUT VALID AC Test Conditions Part No. Applied Voltage Input Pulse Levels Input Rise and Fall Time Timing Measurement Reference Level Output Load A23L8316/A23L83161 -70 3.0V~3.6V 0.4V to 2.4V 10 ns VIN = 1.4V, VOUT = 1.4V 1 TTL gate and CL = 100pF A23L8316/A23L83161 -100 2.7V~3.6V 0.4V to 2.4V 10 ns VIN = 1.4V, VOUT = 1.4V 1 TTL gate and CL = 100pF PRELIMINARY (July, 2004, Version 0.0) 7 AMIC Technology, Corp. A23L8316/A23L83161 Series Function Table CE L L H L OE /NC L L X H BYTE H L X X O15/A-1 Data Pin O15 LSB Address A-1 X X O0 - O7 Data Out Data Out Hi - Z Hi - Z O8 - O15 Data out Hi - Z Hi - Z Hi - Z Mode Word Byte Power-down Output Disable Ordering Information Part No. A23L8316M-70 A23L8316M-100 A23L8316V-70 A23L8316V-100 A23L8316R-70 A23L8316R-100 A23L83161V-70 A23L83161V-100 Access Time (ns) 70 100 70 100 70 100 70 100 Package 40L SOP 40L SOP 48L TSOP (Forward) 48L TSOP (Forward) 48L TSOP (Reverse) 48L TSOP (Reverse) 48L TSOP AMD (Flash Compatible) 48L TSOP AMD (Flash Compatible) PRELIMINARY (July, 2004, Version 0.0) 8 AMIC Technology, Corp. A23L8316/A23L83161 Series Package Information PLCC 32L Outline Dimension HD D 13 5 unit: inches/mm 14 4 32 20 30 21 29 A2 A HE 1 E b1 GD y D A1 e b GE θ Dimensions in inches Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0° Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 Max 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10° Symbol A A1 A2 b1 b C D E e GD GE HD HE L y θ Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0° Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 - Max 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (July, 2004, Version 0.0) 9 AMIC Technology, Corp. L c A23L8316/A23L83161 Series Package Information SOP 40L Outline Dimensions unit: inches/mm 40 21 HE E Gauge Plane θ 0.010" 1 b 20 L Detail F D C A2 Seating Plane D S y e A A1 L1 See Detail F Symbol A A1 A2 b C D E e HE L L1 S y Dimensions in inches Min 0.004 0.101 0.014 0.006 1.021 0.440 0.546 0.024 0.047 0° Nom 0.106 0.016 0.008 1.026 0.445 0.050 0.556 0.032 0.055 0.038 Max 0.118 0.111 0.020 0.012 1.031 0.450 0.566 0.040 0.063 0.046 0.004 8° Dimensions in mm Min 0.10 2.57 0.36 0.15 25.93 11.18 13.87 0.61 1.19 0° Nom 2.69 0.41 0.20 26.06 11.30 1.27 14.12 0.80 1.40 0.97 Max 3.00 2.82 0.51 0.31 26.19 11.43 14.38 1.02 1.60 1.17 0.10 8° θ Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (July, 2004, Version 0.0) 10 AMIC Technology, Corp. A23L8316/A23L83161 Series Package Information TSOP 48L (Type I) Outline Dimensions D D1 1 48 A2 A E 25 c 0.25 L Dimensions in inches Dimensions in mm Min 0.05 0.94 0.18 0.12 19.80 18.30 0.40 0° Nom 1.00 0.22 20.00 18.40 12.00 0.50 BASIC 0.024 0.004 8° 0.50 0.28 Typ. 0.10 8° 0.60 Max 1.20 0.15 1.06 0.27 0.20 20.20 18.50 12.10 Min 0.002 0.037 0.007 0.004 0.779 0.720 0.016 0° Nom 0.039 0.009 0.787 0.724 0.472 0.020 BASIC 0.020 0.011 Typ. Max 0.047 0.006 0.042 0.011 0.008 0.795 0.728 0.476 unit: inches/mm 24 θ Detail "A" Detail "A" Symbol A A1 A2 b c D D1 E e L S y θ Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (July, 2004, Version 0.0) 11 AMIC Technology, Corp. S e b y D A1
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