A23L8316/A23L83161 Series
Preliminary
Document Title 256K X 16 / 512K X 8 BIT CMOS MASK ROM Revision History
Rev. No.
0.0
256K X 16 / 512K X 8 BIT CMOS MASK ROM
History
Initial issue
Issue Date
July 28, 2004
Remark
Preliminary
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(July, 2004, Version 0.0)
AMIC Technology, Corp.
A23L8316/A23L83161 Series
Preliminary
Features
256K x 16 bit or 512K x 8 bit organization Supply voltage range: 2.7V~3.6V Access time: 70ns (max.)/3.0V~3.6V 100ns (max.)/2.7V~3.6V Current: Operating: 20mA (typ.)/3.3V Standby: 10µA (typ.)/3.3V Three-state outputs for wired-OR expansion Full static operation All inputs and outputs are directly TTL-compatible Flash memory pinout compatible with AMD (A23L83161) Available in 40-pin SOP, 32-pin PLCC 48-pin TSOP (forward, reverse type and flash memory’s pinouts compatible) packages
512K X 16 / 1M X 8 BIT CMOS MASK ROM
Pin Configurations
SOP
A12
PLCC
VCC A15 A16 A18 A17 30 NC 31
A17 A7 A6 A5 A4 A3 A2 A1 A0 CE GND OE O0 O8 O1 O9 O2 O10 O3 O11
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21
A8 A9 A10
A11 A12 A13 A14 A15 A16 BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4
A7 A6 A5 A4 A3 A2 A1 A0 O0
32
4
3
2
1
5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20
29 28 27 26
A14 A13 A8 A9 A11 OE A10 CE O7
GND
O2
O3
O1
TSOP (forward type)
BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND
A23L8316V
O4
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AMIC Technology, Corp.
O5
O6
A23L8316M
A23L8308
25 24 23 22 21
VCC
A23L8316/A23L83161 Series
Pin Configurations (continued)
TSOP (reverse type)
GND GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC VCC NC O11 O3 O10 O2 O9 O1 O8 O0 OE GND GND 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 BYTE A16 A15 A14 A13 A12 A11 A10 A9 A8 NC GND NC NC A17 A7 A6 A5 A4 A3 A2 A1 A0 CE
A23L8316R
TSOP (forward type)
A15 A14 A13 A12 A11 A10 A9 A8 NC NC NC NC NC NC NC NC A17 A7 A6 A5 A4 A3 A2 A1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 A16 BYTE GND O15/A-1 O7 O14 O6 O13 O5 O12 O4 VCC O11 O3 O10 O2 O9 O1 O8 O0 OE GND CE A0
A23L83161V
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Block Diagram
ROW DECODER DRIVER
MEMORY CELL ARRAY
(A-1) A0 - A17 ADDRESS INPUTS
COLUMN DECODER DRIVER COLUMN SELECTOR CIRCUITRY
O0 O1 CE OE BYTE POWER-DOWN DOWN OR OUTPUT ENABLE CIRCUITRY BYTE CIRCUITRY O2 O3 O4 O5 O6 O7 (O8) (O9) (O10) (O11) (O12) (O13) (O14) (O15)
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Pin Descriptions
Pin No. Symbol 32L PLCC (A23L8316) 1-12, 23, 25-30 13-15, 17-21 22 24 40L SOP (A23L8316) 1-9, 32-40 13-20, 22-28 29 10 12 31 48L TSOP (A23L8316) 2-10, 15-23 28-35, 39-45 46 24 27 1 48L TSOP (A23L83161) 1-8, 17-25, 48 29-36, 38-44 45 26 28 47 A0-A17 O0-O14 O15/A-1 Address Inputs Data Outputs Output 15(WORD mode) /LSB Address (BYTE mode) Chip Enable Input Output Enable Input Description
CE OE
BYTE VCC GND NC
BYTE or WORD mode Selection Power Supply Ground No Connection
32 16 31
21 11, 30 -
37-38 12, 25-26, 47-48 11, 13-14, 36
37 27, 46 9-16
Recommended DC Operating Conditions
(TA = 0°C to + 70°C)
Symbol Parameter Min. Max. Unit
VCC GND VIH VIL
Supply Voltage Ground Input High Voltage Input Low Voltage
2.7 0 2.2 - 0.3
3.6 0 VCC+0.3 0.6
V V V V
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Absolute Maximum Ratings*
Ambient Operating Temperature . . . . . . . . 0°C to + 70°C Storage Temperature . . . . . . . . . . . . . . -65°C to + 125°C Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V
*Comments
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability.
DC Electrical Characteristics
(TA = 0°C to + 70°C, VCC = 2.7V~3.6V, GND = 0V for -100, VCC = 3.0V~3.6V, GND = 0 for -70)
Symbol Parameter Min. Max. Unit Conditions Note
VOH VOL VlH VlL
⎢lLI⎥ ⎢lLO⎥
Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current Operating Supply Current Standby Supply Current (TTL) Standby Supply Current (CMOS)
2.4 0.4 2.2 -0.3 VCC + 0.3 0.6 +10 +10 30 1.5 10
V V V V
µA µA
IOH = -0.4mA (3V) IOL = 1.6mA (3V)
VCC = max. VIN = VCC to GND VCC = max. VOUT = VCC to GND tCYC = min. CE = VIH CE ≥ VCC - 0.2V 1 2
ICC ISB ISB1
mA mA
µA
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Capacitance
Symbol Parameter Min. Max. Unit Test Conditions Note
CI CO
Input Capacitance Output Capacitance
10 10
pF pF
TA = 25°C f = 1.0MHz
3
AC Characteristics
Symbol
(TA = 0°C to +70°C, VCC = 2.7V~3.6V for -100, VCC = 3.0V~3.6V for -70, GND = 0V)
Parameter
A23L8316/A23L83161 -70 A23L8316/A23L83161 100
Unit
Note
Min.
Max.
Min.
Max.
tCYC tAA tACE tAOE tOH tLZ tHZ
Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Output Hold after Address Change Output Low Z Delay Output High Z Delay*
70 70 70 35 10 10 20
100 100 100 50 10 10 20
ns ns ns ns ns ns ns 4, 6 5, 6
* tHZ is specified from either OE or CE going disabled, whichever occurs first. Notes: 1. OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested.
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Timing Waveforms
Propagation Delay from Address ( CE = Active, OE = Active)
tCYC ADDRESS INPUTS VALID
tAA
tOH
DATA OUT
VALID
Propagation Delay from Chip Enable or Output Enable (Address Valid)
CHIP ENABLE
VALID
tACE
OUTPUT ENABLE
VALID
tLZ
tAOE
tHZ
DATA OUT
VALID
AC Test Conditions
Part No. Applied Voltage Input Pulse Levels Input Rise and Fall Time Timing Measurement Reference Level Output Load A23L8316/A23L83161 -70 3.0V~3.6V 0.4V to 2.4V 10 ns VIN = 1.4V, VOUT = 1.4V 1 TTL gate and CL = 100pF A23L8316/A23L83161 -100 2.7V~3.6V 0.4V to 2.4V 10 ns VIN = 1.4V, VOUT = 1.4V 1 TTL gate and CL = 100pF
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(July, 2004, Version 0.0)
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Function Table
CE L L H L OE /NC L L X H BYTE H L X X O15/A-1 Data Pin O15 LSB Address A-1 X X O0 - O7 Data Out Data Out Hi - Z Hi - Z O8 - O15 Data out Hi - Z Hi - Z Hi - Z Mode Word Byte Power-down Output Disable
Ordering Information
Part No. A23L8316M-70 A23L8316M-100 A23L8316V-70 A23L8316V-100 A23L8316R-70 A23L8316R-100 A23L83161V-70 A23L83161V-100 Access Time (ns) 70 100 70 100 70 100 70 100 Package 40L SOP 40L SOP 48L TSOP (Forward) 48L TSOP (Forward) 48L TSOP (Reverse) 48L TSOP (Reverse) 48L TSOP AMD (Flash Compatible) 48L TSOP AMD (Flash Compatible)
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Package Information PLCC 32L Outline Dimension
HD D 13 5
unit: inches/mm
14
4
32
20
30
21
29
A2
A
HE
1
E
b1 GD y D
A1
e
b
GE θ
Dimensions in inches
Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0° Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 Max 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10°
Symbol
A A1 A2 b1 b C D E e GD GE HD HE L y θ
Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0°
Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 -
Max 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10°
Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only.
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AMIC Technology, Corp.
L
c
A23L8316/A23L83161 Series
Package Information
SOP 40L Outline Dimensions unit: inches/mm
40
21
HE
E
Gauge Plane
θ
0.010" 1 b 20 L
Detail F
D C A2 Seating Plane D S y
e
A
A1
L1 See Detail F
Symbol A A1 A2 b C D E e HE L L1 S y
Dimensions in inches Min 0.004 0.101 0.014 0.006 1.021 0.440 0.546 0.024 0.047 0° Nom 0.106 0.016 0.008 1.026 0.445 0.050 0.556 0.032 0.055 0.038 Max 0.118 0.111 0.020 0.012 1.031 0.450 0.566 0.040 0.063 0.046 0.004 8°
Dimensions in mm Min 0.10 2.57 0.36 0.15 25.93 11.18 13.87 0.61 1.19 0° Nom 2.69 0.41 0.20 26.06 11.30 1.27 14.12 0.80 1.40 0.97 Max 3.00 2.82 0.51 0.31 26.19 11.43 14.38 1.02 1.60 1.17 0.10 8°
θ
Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.
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AMIC Technology, Corp.
A23L8316/A23L83161 Series
Package Information
TSOP 48L (Type I) Outline Dimensions
D D1 1 48 A2 A E 25 c 0.25 L
Dimensions in inches Dimensions in mm Min 0.05 0.94 0.18 0.12 19.80 18.30 0.40 0° Nom 1.00 0.22 20.00 18.40 12.00 0.50 BASIC 0.024 0.004 8° 0.50 0.28 Typ. 0.10 8° 0.60 Max 1.20 0.15 1.06 0.27 0.20 20.20 18.50 12.10 Min 0.002 0.037 0.007 0.004 0.779 0.720 0.016 0° Nom 0.039 0.009 0.787 0.724 0.472 0.020 BASIC 0.020 0.011 Typ. Max 0.047 0.006 0.042 0.011 0.008 0.795 0.728 0.476
unit: inches/mm
24
θ Detail "A"
Detail "A"
Symbol
A A1 A2 b c D D1 E e L S y
θ
Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.
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AMIC Technology, Corp.
S
e
b
y D
A1