A23L9308-20

A23L9308 Series Preliminary Document Title 524,288 X 8 BIT CMOS MASK ROM Revision History Rev. No. 0.0 524,288 X 8 BIT CMOS MASK ROM History Initial issue Issue Date October 2, 2001 Remark Preliminary PRELIMINARY (October, 2001, Version 0.0) AMIC Technology, Inc. A23L9308 Series Preliminary Features n 524,288 x 8 bit organization n Wide power supply range: +2.7V to +3.6V n Access time: 150ns (max.)/3V~3.6V 200ns (max.)/2.7V~3.3V n Current: Operating: 15mA (max.)/3V~3.6V 10mA (max.)/2.7V~3.3V Standby: 25ìA (max.)/3V~3.6V 5ìA (max.)/2.7V~3.3V n Mask Programmed for Chip Enable (power-down) CE/ CE , Output Enable OE/ OE /NC n Three-state outputs for wired-OR expansion n Full static operation n All inputs and outputs are directly TTL-compatible n Available in 32-pin DIP, 32-pin SOP, 32-pin PLCC packages or in DICE FORM. 524,288 X 8 BIT CMOS MASK ROM General Description The A23L9308 high-performance Read Only Memory is configured as 524,288 x 8 bits. It is designed to be compatible with all microprocessors and similar applications where high-performance, large-bit storage, and simple interfacing are important design considerations. This device is designed for use with operating voltage from 2.7V to 3.6V. The A23L9308 offers an automatic POWER-DOWN controlled by the Chip Enable CE/ CE input. When CE/ CE goes low/high, the device will automatically POWER-DOWN and remain in a low power STANDBY mode as long as CE/ CE remains low/high. A23L9308 also offers OE/ OE /NC (Active High or Low or No Connection), which eliminates bus contention in multiple bus microprocessor systems. Pin Configurations n P-DIP / SOP n PLCC VCC A12 A15 A16 A18 31 A17 30 NC 1 NC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC A18 32 4 3 2 A17 A14 A13 A8 A9 A11 OE/OE/NC A10 CE/CE O7 O6 O5 A7 A6 A5 A4 A3 A2 A1 A0 O0 5 6 7 8 9 10 11 12 13 29 28 27 26 A14 A13 A8 A9 A11 OE/OE/NC A10 CE/CE O7 14 15 16 17 18 19 O5 GND O2 O1 O3 O3 PRELIMINARY (October, 2001, Version 0.0) 1 AMIC Technology, Inc. O4 O6 O4 20 A23L9308 A23L9308 25 24 23 22 21 A23L9308 Series Block Diagram ROW DECODER DRIVER MEMORY CELL ARRAY 524,288 X 8 A0 - A18 ADDRESS INPUTS COLUMN DECODER DRIVER COLUMN SELECTOR CIRCUITRY O0 O1 CE/CE POWER-DOWN OR OUTPUT ENABLE CIRCUITRY O2 O3 O4 O5 O6 O7 OE/OE/NC PRELIMINARY (October, 2001, Version 0.0) 2 AMIC Technology, Inc. A23L9308 Series Pin Descriptions Pin No. 32L DIP/SOP 2 - 12, 23, 25 - 31 22 24 13 - 15, 17 - 21 32 16 1 32L PLCC 2 - 12, 23, 25 - 31 22 24 13 - 15, 17 - 21 32 16 1 A0 - A18 CE/ CE OE/ OE /NC O0 - O7 VCC GND NC Address Inputs Chip Enable Input (Note 1) Output Enable (Note 1) Data Outputs Power Supply Ground No Connection (Note 2) Symbol Description Notes: 1. This pin is user-definable as active high or active low. 2. NC indicates "No Connection." Recommended DC Operating Conditions (TA = 0°C to + 70°C) Symbol VCC GND VIH VIL Supply Voltage Ground Input High Voltage Input Low Voltage Parameter Min. 2.7 0 0.7* VCC - 0.5 Max. 3.6 0 VCC+0.3 0.8 Unit V V V V PRELIMINARY (October, 2001, Version 0.0) 3 AMIC Technology, Inc. A23L9308 Series Absolute Maximum Ratings* Ambient Operating Temperature . . . . . . . -10°C to + 80°C Storage Temperature . . . . . . . . . . . . . . -65°C to + 150°C Supply Voltage to Ground Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to + 7.0V Output Voltage . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Input Voltage . . . . . . . . . . . . . . . . . . -0.5V to VCC + 0.5V Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . 400mW *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics (TA = 0°C to + 70°C, GND = 0V) Symbol Parameter 3V~3.6V Min. VOH VOL VlH VlL lLI Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current 0.7*VCC 2.7V~3.3V Min. 2.15 Max. Unit Conditions Note Max. 2.15 0.4 VCC+0.5 V 0.4 V V V µA IOH = -0.4mA (3V) IOL = 1.6mA (3V) 0.7*VCC VCC+0.5 -0.5 0.6 +5 -0.5 0.6 +5 VCC = max. VIN = VCC to GND VCC = max. VOUT = VCC to GND tCYC = min. CE = VIH, CE = VIL CE = VCC - 0.2V, CE = 0.2V 1 lLO ICC ISB ISB1 Output Leakage Current +5 +5 µA mA mA µA Operating Supply Current Standby Supply Current (TTL) Standby Supply Current (CMOS) 15 0.5 25 10 0.3 5 2 PRELIMINARY (October, 2001, Version 0.0) 4 AMIC Technology, Inc. A23L9308 Series Capacitance Symbol CI CO Parameter Input Capacitance Output Capacitance Min. Max. 10 10 Unit pF pF Test Conditions TA = 25°C f = 1.0MHz Note 3 AC Characteristics Symbol (TA = 0°C to +70°C, VCC=3.0V~3.6V for -15, VCC=2.7V~3.3V for -20, GND = 0V) Parameter A23L9308-15 Min. Max. A23L9308-20 Min. 200 150 150 90 10 10 70 10 10 70 200 200 160 Max. ns ns ns ns ns ns ns 4, 6 5, 6 Unit Note tCYC tAA tACE tAOE tOH tLZ tHZ Cycle Time Address Access Time Chip Enable Access Time Output Enable Access Time Output Hold after Address Change Output Low Z Delay Output High Z Delay* 150 * tHZ is specified from either OE / OE or CE / CE going disabled, whichever occurs first. Notes: 1. OE/CE = VIL, OE / CE = VIH (Output is unloaded) 2. VIN = VIH/VIL, but OE/CE = VIH, OE / CE = VIL (Output is unloaded) 3. This parameter is periodically sampled and is not 100% tested. All pins, except pins under test, are tied to AC ground. 4. Output LOW impedance delay (tLZ) is measured from CE or OE going active. 5. Output HIGH impedance delay (tHZ) is measured from CE or OE going inactive. 6. This parameter is sampled and not 100% tested. PRELIMINARY (October, 2001, Version 0.0) 5 AMIC Technology, Inc. A23L9308 Series Timing Waveforms Propagation Delay from Address (CE/ CE = Active, OE/ OE = Active) tCYC ADDRESS INPUTS VALID tAA tOH DATA OUT VALID Propagation Delay from Chip Enable or Output Enable (Address Valid) CHIP ENABLE VALID tACE OUTPUT ENABLE VALID tAOE tHZ tLZ DATA OUT tLZ VALID AC Test Conditions Applied Voltage Input Pulse Levels Input Rise and Fall Time Timing Measurement Reference Level Output Load 2.7V~3.6V 0.4V to 2.4V 10 ns VIN = 1.5V VOUT = 1.5V 1 TTL gate and CL = 100pF PRELIMINARY (October, 2001, Version 0.0) 6 AMIC Technology, Inc. A23L9308 Series Function Table CE/ CE A I A OE/ OE /NC A X I O0 - O7 Data Out Hi - Z Hi - Z Mode Read Power-down Output Disable 1. CE/ CE and OE/ OE /NC are mask programmable as either active low, active high, or no connection. 2. "A" means "Active," "I" means "Inactive," and "X" means "Either." Ordering Information Part No. A23L9308-15 A23L9308M-15 A23L9308L-15 A23L9308H-15 A23L9308-20 A23L9308M-20 A23L9308L-20 A23L9308H-20 Access Time (ns) 150 150 150 150 200 200 200 200 Package 32L DIP 32L SOP 32L PLCC DICE FORM 32L DIP 32L SOP 32L PLCC DICE FORM PRELIMINARY (October, 2001, Version 0.0) 7 AMIC Technology, Inc. A23L9308 Series Pad Configurations VCC VCC A12 A15 A16 A18 A17 A14 A13 8 7 6 5 4 3 2 1 33 32 31 30 29 28 27 26 Y X (0,0) 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 Pad Location Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 Pad Name VCC A16 A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 O0 O1 O2 GND GND Coordinate (um) X Y -73.6 1406.3 -259.9 1419.2 -409.9 1419.2 -532.9 1419.2 -682.9 1419.2 -805.9 1419.2 -955.9 1419.2 -1078.9 1419.2 -1079.3 -1419.7 -956.3 -1419.2 -806.3 -1419.2 -683.3 -1419.2 -529.3 -1419.7 -406.3 -1419.7 -254.8 -1419.7 -131.8 -1419.7 -8.8 -1417.7 Pad No. 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 Pad Name O3 O4 O5 O6 O7 CE/ CE A10 OE/ OE /NC A11 A9 A8 A13 A14 A17 A18 VCC Coordinate (um) X Y 138.7 -1419.7 261.7 -1419.7 413.2 -1419.7 536.2 -1419.7 687.7 -1419.7 810.7 -1419.2 960.7 -1419.2 1083.7 -1419.2 1083.3 1419.2 960.3 1419.2 810.3 1419.2 687.3 1419.2 537.3 1419.2 414.3 1419.2 264.3 1419.2 97.1 1417.7 PRELIMINARY (October, 2001, Version 0.0) 8 AMIC Technology, Inc. OE/OE/NC GND GND CE/CE O0 O1 O2 O3 O4 O5 O6 O7 A10 A3 A2 A1 A0 A11 A4 A5 A6 A7 A8 A9 A23L9308 Series Package Information P-DIP 32L Outline Dimensions unit: inches/mm D 32 17 E 1 16 E1 C A2 A A1 Base Plane L Seating Plane B B1 e θ EA Symbol A A1 A2 B B1 C D E E1 EA e L θ Dimensions in inches Min 0.015 0.149 1.645 0.537 0.590 0.630 0.120 0° Nom 0.154 0.018 0.050 0.010 1.650 0.542 0.600 0.650 0.100 0.130 Max 0.210 0.159 1.655 0.547 0.610 0.670 0.140 15° Dimensions in mm Min 0.381 3.785 41.783 13.64 14.986 16.002 3.048 0° Nom 3.912 0.457 1.270 0.254 41.91 13.767 15.240 16.510 2.540 3.302 Max 5.334 4.039 42.037 13.894 15.494 17.018 3.556 15° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. PRELIMINARY (October, 2001, Version 0.0) 9 AMIC Technology, Inc. A23L9308 Series Package Information SOP (W.B.) 32L Outline Dimensions 32 17 unit: inches/mm HE E θ L 1 b 16 Detail F D c A2 A S Seating Plane y D e A1 LE See Detail F Dimensions in inches Dimensions in mm Min 0.10 2.57 0.36 0.15 11.18 1.12 13.87 0.58 1.19 0° Nom 2.69 0.41 0.20 20.45 11.30 1.27 14.12 0.79 1.40 Max 3.00 2.82 0.51 0.31 20.75 11.43 1.42 14.38 0.99 1.60 0.91 0.10 10° Symbol A A1 A2 b c D E e HE L LE S y θ Min 0.004 0.101 0.014 0.006 0.440 0.044 0.546 0.023 0.047 0° Nom 0.106 0.016 0.008 0.805 0.445 0.050 0.556 0.031 0.055 - Max 0.118 0.111 0.020 0.012 0.817 0.450 0.056 0.566 0.039 0.063 0.036 0.004 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. PRELIMINARY (October, 2001, Version 0.0) 10 AMIC Technology, Inc. A23L9308 Series Package Information PLCC 32L Outline Dimension unit: inches/mm HD D 13 5 14 4 1 32 20 30 21 29 A2 A HE E b1 GD y D θ A1 e b GE Dimensions in inches Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0° Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 Max 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10° Symbol A A1 A2 b1 b C D E e GD GE HD HE L y θ Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0° Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 - Max 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (October, 2001, Version 0.0) 11 AMIC Technology, Inc. L c