A49LF040TX-33F

A49LF040 4 Mbit CMOS 3.3Volt-only Low Pin Count Flash Memory Preliminary Document Title 4 Mbit CMOS 3.3 Volt-only Low Pin Count Flash Memory Revision History Rev. No. 0.0 0.1 History Initial issue Add Pb-Free package type Issue Date February 17, 2004 August 20, 2004 Remark Preliminary PRELIMINARY (August, 2004, Version 0.1) AMIC Technology, Corp. A49LF040 4 Mbit CMOS 3.3Volt-only Low Pin Count Flash Memory Preliminary FEATURES • Single Power Supply Operation Low voltage range: 3.0 V - 3.6 V for Read and Write Operations • Standard Intel Low Pin Count Interface Read compatible to Intel® Low Pin Count (LPC) interface • Memory Configuration 512K x 8 (4 Mbit) • Block Architecture 4Mbit: eight uniform 64KByte blocks Supports full chip erase for Address/Address Multiplexed (A/A Mux) mode • Automatic Erase and Program Operation Embedded Byte Program and Block/Chip Erase algorithms Typical 10 µs/byte programming time Typical 1s block erase time • Two Operational Modes Low Pin Count Interface (LPC) Mode for in-system operation Address/Address Multiplexed (A/A Mux) Interface Mode for programming equipment • Low Pin Count (LPC) Mode 33 MHz synchronous operation with PCI bus 5-signal communication interface for in-system read and write operations Standard SDP Command Set Data# Polling (I/O7) and Toggle Bit (I/O6) features 4 ID pins for multi-chip selection 5 GPI pins for General Purpose Input Register TBL# pin for hardware write protection to Boot Block WP# pin for hardware write protection to whole memory array except Boot Block • Address/Address Multiplexed (A/A Mux) Mode 11-pin multiplexed address and 8-pin data I/O interface Supports fast programming on EPROM programmers Standard SDP Command Set Data# Polling (I/O7) and Toggle Bit (I/O6) features • Lower Power Consumption Typical 12mA active read current Typical 24mA program/erase current • High Product Endurance Guarantee 100,000 program/erase cycles for each block Minimum 20 years data retention • Compatible Pin-out and Packaging 32-pin (8 mm x 14 mm) TSOP (TYPE I) 32-pin PLCC GENERAL DESCRIPTION The A49LF040 flash memory device is designed to be readcompatible with the Intel Low Pin Count (LPC) Interface Specification 1.1. This device is designed to use a single low voltage, range from 3.0 Volt to 3.6 Volt power supply to perform in-system or off-system read and write operations. It provides protection for the storage and update of code and data in addition to adding system design flexibility through five general-purpose inputs. Two interface modes are supported by the A49LF040: Low Pin Count (LPC) Interface mode for In-System programming and Address/Address Multiplexed (A/A Mux) mode for fast factory programming of PC-BIOS applications. The memory is divided into eight uniform 64Kbyte blocks that can be erased independently without affecting the data in other blocks. Blocks also can be protected individually to prevent accidental Program or Erase commands from modifying the memory. The Program and Erase operations are executed by issuing the Program/Erase commands into the command interface by which activating the internal control logic to automatically process the Program/Erase procedures. The device can be programmed on a byte-bybyte basis after performing the Erase operation. In addition to the Block Erase operation, the Chip Erase feature is provided in A/A Mux mode that allows the whole memory to be erased in one single Erase operation. The A49LF040 provides the status detection such as Data# Polling and Toggle Bit Functions in both LPC and A/A Mux modes. The process or completion of Program and Erase operations can be detected by reading the status bits. The A49LF040 is offered in 32-lead TSOP and 32-lead PLCC packages. See Figures 1 and 2 for pin assignments and Table 1 for pin descriptions. PRELIMINARY (August, 2004, Version 0.1) 1 AMIC Technology, Corp. A49LF040 PIN CONFIGURATIONS RST# (RST#) R/C# (LCLK) 31 VDD (VDD) A9 (GPI3) 4 3 2 1 32 A7 (GPI1) A6 (GPI0) A5 (WP#) A4 (TBL#) A3 (ID3) A2 (ID2) A1 (ID1) A0 (ID0) I/O0 (LAD0) 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 30 A10 (GPI4) A8 (GPI2) NC 29 28 27 MODE (MODE) VSS (VSS) NC NC VDD (VDD) OE# (INIT#) WE# (LFRAME#) RB# (RES) I/O7 (RES) 32-lead PLCC Top View 26 25 24 23 22 21 VSS (VSS) I/O 4 (RES) I/O 5 (RES) I/O 1 (LAD1) I/O 2 (LAD2) (*) Designates LPC Mode FIGURE 1: Pin Assignments for 32-Lead PLCC I/O 3 (LAD3) I/O 6 (RES) NC NC NC VSS (VSS) MODE (MODE) A10 (GPI4) R/C# (LCLK) VDD (VDD) NC RST# (RST#) A9 (GPI3) A8 (GPI2) A7 (GPI1) A6 (GPI0) A5 (WP#) A4 (TBL#) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 (*) Designates LPC Mode 32-lead TSOP (8MM X 14MM) Top View 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE# (INIT#) WE# (LFRAME#) VDD (VDD) I/O7 (RES) I/O6 (RES) I/O5 (RES) I/O4 (RES) I/O3 (LAD3) VSS (VSS) I/O2 (LAD2) I/O1 (LAD1) I/O0 (LAD0) A0 (ID0) A1 (ID1) A2 (ID2) A3 (ID3) FIGURE 2: Pin Assignments for 32-Lead TSOP PRELIMINARY (August, 2004, Version 0.1) 2 AMIC Technology, Corp. A49LF040 BLOCK DIAGRAM TBL# WP# INIT# LAD[3:0] LCLK LFRAME# ID[3:0] GPI[4:0] A[10:0] I/O7 ~ I/O0 WE# OE# R/C# MODE RST# RB# Address Latch LPC Mode Interface Control Logic Input/Output Buffers A/A Mux Mode Interface High Voltage Generator Data Latch Y-Decoder Y-Gating X-Decoder Cell Matrix PRELIMINARY (August, 2004, Version 0.1) 3 AMIC Technology, Corp. A49LF040 Table 1: Pin Description Interface Symbol Pin Name Type A/A Mux X X X X LPC Descriptions Inputs for addresses during Read and Write operations in A/A Mux mode. Row and column addresses are latched by R/C# pin. To output data during Read cycle and receive input data during Write cycle in A/A Mux mode. The outputs are in tri-state when OE# is high. To control the data output buffers. To control the Write operations. To determine which interface is operational. When held high, A/A Mux mode is enabled and when held low, LPC mode is enabled. This pin must be setup at power-up or before return from reset and not change during device operation. This pin is internally pulled down with a resistor between 20-100 KΩ. This is the second reset pin for in-system use. INIT# and RST# pins are internally combined and initialize a device reset when driven low. These four pins are part of the mechanism that allows multiple LPC devices to be attached to the same bus. To identify the component, the correct strapping of these pins must be set. The boot device must have ID[3:0]=0000 and it is recommended that all subsequent devices should use sequential up-count strapping. These pins are internally pulled down with a resistor between 20100 KΩ. These individual inputs can be used for additional board flexibility. The state of these pins can be read immediately at boot, through LPC internal registers. These inputs should be at their desired state before the start of the PCI clock cycle during which the read is attempted, and should remain in place until the end of the Read cycle. Unused GPI pins must not be floated. To prevent any write operations to the Boot Block when driven low, regardless of the state of the block lock registers. When TBL# is high it disables hardware write protection for the top Boot Block. This pin cannot be left unconnected. I/O Communications in LPC mode. To provide a clock input to the device. This pin is the same as that for the PCI clock and adheres to the PCI specifications. To indicate start of a data transfer operation; also used to abort an LPC cycle in progress. To reset the operation of the device When low, prevents any write operations to all but the highest addressable block. When WP# is high it disables hardware write protection for these blocks. This pin cannot be left unconnected. This pin determines whether the address pins are pointing to the row addresses or the column addresses in A/A Mux mode. To determine if the device is busy in write operations. Valid only in A/A Mux mode. X PWR PWR X X X X Reserved. These pins must be left unconnected. To provide power supply (3.0-3.6Volt). Circuit ground. All VSS pins must be grounded. Unconnected pins. A10-A0 I/O7-I/O0 OE# WE# Address Data Output Enable Write Enable Interface Configuration Pin IN I/O IN IN MODE IN X X INIT# Initialize IN X ID[3:0] Identification Inputs IN X GPI[4:0] General Purpose Inputs IN X TBL# LAD[3:0] LCLK LFRAME# RST# WP# R/C# RB# RES VDD VSS Top Block Lock LPC I/Os Clock Frame Reset Write Protect Row/Column Select Ready/Busy# Reserved Power Supply Ground IN I/O IN IN IN IN IN OUT X X X X X X X X X NC No Connection X X 1. IN=Input, OUT=output, I/O=Input/Output, PWR=Power PRELIMINARY (August, 2004, Version 0.1) 4 AMIC Technology, Corp. A49LF040 ABSOLUTE MAXIMUM RATINGS* Temperature Under Bias . . . . . . . . . .. . . . -55°C to + 125°C Storage Temperature . . . . . . . . . . . . . . . . . -65°C to + 125°C D.C. Voltage on Any Pins with Respect to Ground (1) . . . . . . . . . . . . . . . . . . . . . . . . . ... . . . . . -0.5V to VDD + 0.5V Package Power Dissipation Capability (Ta=25°C) . . . . . . . . . . . . . . . . . . . . . . . . …. . . . . . -0.5V to VDD + 0.5V (2) Output Short Circuit Current . . . . . . . . . .. . . . . . . 50mA *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of these specifications are not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. Operating Ranges Commercial (C) Devices Ambient Temperature (TA) . . . . . . . . ….. . . . . . 0°C to +85°C VDD Supply Voltages VDD for all devices . . . . . . . . . . . . . . . . ….. . +3.0V to +3.6V Operating ranges define those limits between which the functionally of the device is guaranteed. Notes: 1. Minimum DC voltage on input or I/O pins is -0.5V. During voltage transitions, input or I/O pins may undershoot VSS to -2.0V for periods of up to 20ns. Maximum DC voltage on input and I/O pins is VDD + 0.5V. During voltage transitions, input or I/O pins may overshoot to VDD + 2.0V for periods up to 20ns. 2. No more than one output is shorted at a time. Duration of the short circuit should not be greater than one second. MODE SELECTION The A49LF040 flash memory devices can operate in two distinct interface modes: the Low Pin Count Interface (LPC) mode and the Address/Address Multiplexed (A/A Mux) mode. The Mode pin is used to set the interface mode selection. If the Mode pin is set to logic High, the device is in A/A Mux mode; while if the Mode pin is set Low, the device is in the LPC mode. The Mode pin must be configured prior to device operation. The Mode pin is internally pulled down if the pin is not connected. In LPC mode, the device is configured to interface with its host using Intel’s Low Pin Count proprietary protocol. Communication between Host and the A49LF040 occurs via the 4-bit I/O communication signals, LAD[3:0] and the LFRAME#. In A/A Mux mode, the device is programmed via an 11-bit address A10-A0 and an 8bit data I/O7-I/O0 parallel signals. The address inputs are multiplexed in row and column selected by control signal R/C# pin. The column addresses are mapped to the higher internal addresses, and the row addresses are mapped to the lower internal addresses. See the Device Memory Maps in Figure 3 for address assignment. LPC Read Operation LPC Read operations read from the memory cells or specific registers in the LPC device. A valid LPC Read operation starts when LFRAME# is Low as LCLK rises and a START value “0000b” is on LAD[3:0] then the next nibble “010X” is on LAD[3:0]. Addresses and data are transferred to and from the device decided by a series of “fields”. Field sequences and contents are strictly defined for LPC Read operations. Refer to Table 2 for LPC Read Cycle Definition. LPC Write Operation LPC Write operations write to the LPC Interface or LPC registers. A valid LPC Write operation starts when LFRAME# is Low as LCLK rises and a START value “0000b” is on LAD[3:0] then the next nibble “011X” is on LAD[3:0]. Addresses and data are transferred to and from the device decided by a series of “fields”. Field sequences and contents are strictly defined for LPC Write operations. Refer to Table 3 for LPC write Cycle Definition. LPC Abort Operation If LFRAME# is driven low for one or more clock cycles during a LPC cycle, the cycle will be terminated and the device will wait for the ABORT command. The host may drive the LAD[3:0] with ‘1111b’ (ABORT command) to return the device to Ready mode. If abort occurs during a Write operation such as checking the operation status with Data# Polling (I/O7) or Toggle Bit (I/O6) pins, the read status cycle will be aborted but the internal write operation will not be affected. In this case, only the reset operation initiated by RST# or INIT# pin can terminate the Write operation.. LPC MODE OPERATION The LPC interface consists of four data signals (LAD[3:0]), one control signal (LFRAME#) and a clock (LCLK). The data signals, control signal and clock comply with PCI specifications. Operations such as Memory Read and Memory Write use Intel LPC propriety protocol. JEDEC Standard SDP (Software Data Protection) Byte-Program and Block-Erase command sequences are incorporated into the LPC memory cycles. Chip-Erase command is only available in A/A Mux mode. The addresses and data are transferred through LAD[3:0] synchronized with the input clock LCLK during a LPC memory cycle. The pulse of LFRAME# is inserted for at least one clock period to indicate the start of a LPC memory cycle. The address or data on LAD[3:0] is latched on the rising edge of LCLK. The device enters standby mode when LFRAME# is high and no internal operation is in progress. The device is in ready mode when LFRAME# is low and no activity is on the LPC bus. Response To Invalid Fields During LPC operations, the LPC will not explicitly indicate that it has received invalid field sequences. The response to specific invalid fields or sequences is as follows: Address out of range: The A49LF040 will only response to address range as specified in Table 4. Address A22 has the special function of directing reads and writes to the flash memory (A22=1) or to the register space (A22=0). PRELIMINARY (August, 2004, Version 0.1) 5 AMIC Technology, Corp. A49LF040 Table 2: LPC Read Cycle Clock Cycle 1 2 Field Name START CYCTYPE + DIR ADDRESS Field Contents LAD[3:0]1 0000 010X LAD[3:0] Direction IN IN Comments LFRAME# must be active (low) for the part to respond. Only the last start field (before LFRAME# transitioning high) should be recognized. Indicates the type of cycle. Bits 3:2 must be “01b” for memory cycle. Bit 1 indicates the type of transfer “0” for Read. Bit 0 is reserved. Address Phase for Memory Cycle. LPC protocol supports a 32-bit address phase. YYYY is one nibble of the entire address. Addresses are transferred most-significant nibble first. See Table 4 for address bits definition and Table 5 for valid memory address range. In this clock cycle, the host has driven the bus to all 1s and then floats the bus. This is the first part of the bus “turnaround cycle.” The A49LF040 takes control of the bus during this cycle. The A49LF040 outputs the value 0000b indicating that data will be available during the next clock cycle. This field is the least-significant nibble of the data byte. This field is the most-significant nibble of the data byte. In this clock, the host has driven the bus to all 1s and then floats the bus. This is the first part of the bus “turnaround cycle.” The A49LF040 takes control of the bus during this cycle. 3-10 YYYY IN IN then Float Float then OUT OUT OUT OUT IN then Float Float then OUT 11 12 13 14 15 16 17 TAR0 TAR1 SYNC DATA DATA TAR0 TAR1 1111 1111(float) 0000 ZZZZ ZZZZ 1111 1111(float) 1. Field contents are valid on the rising edge of the present clock cycle. LPC Single-Byte Read Waveforms 1 LCLK 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 LFRAME# LAD[3:0] START CYCTYPE + DIR ADDRESS TAR0 TAR1 SYNC DATA TAR0 TAR1 PRELIMINARY (August, 2004, Version 0.1) 6 AMIC Technology, Corp. A49LF040 Table 3: LPC Write Cycle Clock Cycle Field Name START CYCTYPE + DIR Field Contents LAD[3:0]1 LAD[3:0] Direction Comments LFRAME# must be active (low) for the part to respond. Only the last start field (before LFRAME# transitioning high) should be recognized. Indicates the type of cycle. Bits 3:2 must be “01b” for memory cycle. Bit 1 indicates the type of transfer “1” for Write. Bit 0 is reserved. Address Phase for Memory Cycle. LPC protocol supports a 32-bit address phase. YYYY is one nibble of the entire address. Addresses are transferred most-significant nibble first. See Table 4 for address bits definition and Table 5 for valid memory address range. This field is the least-significant nibble of the data byte. This field is the most-significant nibble of the data byte. In this clock cycle, the host has driven the bus to all ‘1’s and then floats the bus. This is the first part of the bus “turnaround cycle.” The A49LF040 takes control of the bus during this cycle. The A49LF040 outputs the values 0000, indicating that it has received data or a flash command. In this clock cycle, the A49LF040 has driven the bus to all ‘1’s and then floats the bus. This is the first part of the bus “turnaround cycle.” Host resumes control of the bus during this cycle. 1 2 0000 010X IN IN 3-10 ADDRESS YYYY IN 11 12 13 14 15 16 17 DATA DATA TAR0 TAR1 SYNC TAR0 TAR1 ZZZZ ZZZZ 1111 1111(float) 0000 1111 1111(float) IN IN IN then Float Float then OUT OUT OUT then Float Float then IN 1. Field contents are valid on the rising edge of the present clock cycle. LPC Write Waveforms 1 LCLK 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 LFRAME# LAD[3:0] START CYCTYPE + DIR ADDRESS DATA TAR0 TAR1 SYNC TAR0 TAR1 PRELIMINARY (August, 2004, Version 0.1) 7 AMIC Technology, Corp. A49LF040 ID mismatch: The A49LF040 will compare ID bits in the address field with the hardware ID strapping. If there is a mismatch, the device will ignore the cycle. Refer to Table 6 Multiple Device Selection Configuration for detail. Data# Polling (I/O7) When the A49LF040 device is in the internal Program operation, any attempt to read I/O7 will produce the complement of the true data. Once the Program operation is completed, I/O7 will produce true data. Note that even though I/O7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 µs. During internal Erase operation, any attempt to read I/O7 will produce a ‘0’. Once the internal Erase operation is completed, I/O7 will produce a ‘1’. Proper status will not be given using Data# Polling if the address is in the invalid range. Toggle Bit (I/O6) During the internal Program or Erase operation, any consecutive attempts to read I/O6 will produce alternating ‘0’s and ‘1’s, i.e., toggling between 0 and 1. When the internal Program or Erase operation is completed, the toggling will stop. Device Memory Hardware Write Protection The Top Boot Lock (TBL#) and Write Protect (WP#) pins are provided for hardware write protection of device memory in the A49LF040. The TBL# pin is used to write protect the top boot block (64 Kbytes) at the highest flash memory address range for the A49LF040. WP# pin write protects the remaining blocks in the flash memory. An active low signal at the TBL# pin prevents Program and Erase operations of the top boot block. The WP# pin serves the same function for the remaining blocks of the device memory. The TBL# and WP# pins write protection functions operate independently of one another. Both TBL# and WP# pins must be set to their required protection states prior to starting a Program or Erase operation. A logic level change occurring at the TBL# or WP# pin during a Program or Erase operation could cause unpredictable results. TBL# and WP# pins cannot be left unconnected. Clearing the Write-Lock bit in any register when WP# is low will have no functional effect, even though the register may indicate that the block is no longer locked. Multiple Device Selection The four ID pins, ID[3:0], allow multiple devices to be attached to the same bus by using different ID strapping in a system. When the A49LF040 is used as a boot device, ID[3:0] must be strapped as 0000, all subsequent devices should use a sequential up-count strapping (i.e. 0001, 0010, 0011, etc.). The ID bits in the address field are inverse of the hardware strapping. The address bits [A23, A21:A19] for A49LF004 are used to select the device with proper IDs. See Table 6 for IDs. The A49LF040 will compare the strapping values, if there is a mismatch, the device will ignore the remainder of the cycle and go into standby mode. Since there is no ID support in A/A Mux mode, to program multiple devices a stand-alone PROM programmer is recommended. Reset A VIL on INIT# or RST# pin initiates a device reset. INIT# and RST# pins have the same function internally. It is required to drive INIT# or RST# pins low during a system reset to ensure proper CPU initialization. During a Read operation, driving INIT# or RST# pins low deselects the device and places the output drivers, LAD[3:0], in a high-impedance state. The reset signal must be held low for a minimal duration of time TRSTP. A reset latency will occur if a reset procedure is performed during a Program or Erase operation. See Table 19, Reset Timing Parameters for more information. A device reset during an active Program or Erase will abort the operation and memory contents may become invalid due to data being altered or corrupted from an incomplete Erase or Program operation. In this case, the device can take up to TRSTE to abort a Program or Erase operation. REGISTERS There are two types of registers available on the A49LF040, the General Purpose Inputs Register, and the JEDEC ID Registers. These registers appear at their respective address location in the 4 GByte system memory map. Unused register locations will read as 00H. Any attempt to read or write any register during an internal Write operation will be ignored. Refer to Table 7 for the LPC register memory map. General Purpose Inputs Register The GPI_REG (General Purpose Inputs Register) passes the state of GPI[4:0] pins at power-up on the A49LF040. It is recommended that the GPI[4:0] pins be in the desired state before LFRAME# is brought low for the beginning of the next bus cycle, and remain in that state until the end of the cycle. There is no default value since this is a pass-through register. See Table 8 for the GPI_REG bits and function, and Table 9 for memory address locations for its respective device strapping. Write Operation Status Detection The A49LF040 device provides two software means to detect the completion of a Write (Program or Erase) cycle, in order to optimize the system Write cycle time. The software detection includes two status bits: Data# Polling (I/O7) and Toggle Bit (I/O6). The End-of-Write detection mode is incorporated into the LPC Read cycle. The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or Toggle Bit read may be simultaneous with the completion of the Write cycle. If this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either I/O7 or I/O6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. PRELIMINARY (August, 2004, Version 0.1) 8 AMIC Technology, Corp. A49LF040 Table 4: Address Bit Definition A31:A23 1111 1111b A23 ID[3] A22 1 = Memory access 0 = Register access A21:A19 ID[2:0] A18:A0 Device memory address Table 5: Address Decoding Range ID Strapping Device #0 – 7 Device #8 - 15 Device Access Memory Access Register Access Memory Access Register Access A21:A19 FFFF FFFFH: FFC0 0000H FFBF FFFFH: FF80 0000H FF7F FFFFH: FF40 0000H FF3F FFFFH: FF00 0000H Memory Size 4 MByte 4 MByte 4 MByte 4 MByte Table 6: Multiple Device Selection Configuration Device# 0 (Boot device) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Hardware Strapping ID[3:0] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 Address Bits Decoding A23 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 A21 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 A20 1 1 0 0 1 1 0 0 1 1 0 0 1 1 0 0 A19 1 0 1 0 1 0 1 0 1 0 1 0 1 0 1 0 Table 7: LPC Register Memory Map Memory Address FFBC0100h FFBC0000h FFBC0001h FFBC0003h Mnemonic GPI_REG MANUF_REG DEV_REG CONT_REG Register Name LPC General Purpose Input Register Manufacturer ID Register Device ID Register Continuation ID Register Default N/A 37h 9Dh 7Fh Type R R R R PRELIMINARY (August, 2004, Version 0.1) 9 AMIC Technology, Corp. A49LF040 JEDEC ID Registers The JEDEC ID registers identify the device as A49LF040 and manufacturer as SST in LPC mode. See Table 9 for memory address locations for its respective JEDEC ID location. Table 8: General Purpose Inputs Register Bit 7:5 4 3 2 1 0 Bit GPI[4] GPI[3] GPI[2] GPI[1] GPI[0] Function Reserved GPI_REG Bit 4 GPI_REG Bit 3 GPI_REG Bit 2 GPI_REG Bit 1 GPI_REG Bit 0 Pin Number 32-PLCC 30 3 4 5 6 32-TSOP 6 11 12 13 14 Table 9 Memory Map Register Addresses for A49LF040 Device# 0 (Boot device) 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 Hardware Strapping ID[3:0] 0000 0001 0010 0011 0100 0101 0110 0111 1000 1001 1010 1011 1100 1101 1110 1111 GPI_REG Manufacturer FFBC 0100H FFB4 0100H FFAC 0100H FFA4 0100H FF9C 0100H FF94 0100H FF8C 0100H FF84 0100H FF3C 0100H FF34 0100H FF2C 0100H FF24 0100H FF1C 0100H FF14 0100H FF0C 0100H FF04 0100H FFBC 0000H FFB4 0000H FFAC 0000H FFA4 0000H FF9C 0000H FF94 0000H FF8C 0000H FF84 0000H FF3C 0000H FF34 0000H FF2C 0000H FF24 0000H FF1C 0000H FF14 0000H FF0C 0000H FF04 0000H JEDEC ID Continuation FFBC 0003H FFB4 0003H FFAC 0003H FFA4 0003H FF9C 0003H FF94 0003H FF8C 0003H FF84 0003H FF3C 0003H FF34 0003H FF2C 0003H FF24 0003H FF1C 0003H FF14 0003H FF0C 0003H FF04 0003H Device FFBC 0001H FFB4 0001H FFAC 0001H FFA4 0001H FF9C 0001H FF94 0001H FF8C 0001H FF84 0001H FF3C 0001H FF34 0001H FF2C 0001H FF24 0001H FF1C 0001H FF14 0001H FF0C 0001H FF04 0001H PRELIMINARY (August, 2004, Version 0.1) 10 AMIC Technology, Corp. A49LF040 ADDRESS/ADDRESS MULTIPLEXED (A/A MUX) MODE Device Operation Commands are used to initiate the memory operation functions of the device. The data portion of the software command sequence is latched on the rising edge of WE#. During the software command sequence the row address is latched on the falling edge of R/C# and the column address is latched on the rising edge of R/C#. Refer to Table 8 and Table 9 for operation modes and the command sequence. Reset A VIL on RST# pin initiates a device reset. Byte-Program Operation The A49LF040 device is programmed on a byte-by-byte basis. Before programming, one must ensure that the block, in which the byte which is being programmed exists, is fully erased. The Byte-Program operation is initiated by executing a four-byte command load sequence for Software Data Protection with address and data in the last byte sequence. During the Byte-Program operation, the row address (A10-A0) is latched on the falling edge of R/C# and the column Address (A18-A11) is latched on the rising edge of R/C#. The data bus is latched in the rising edge of WE#. See Figure 11 for Program operation timing diagram, Figure 14 for timing waveforms, and Figure 19 for its flowchart. During the Program operation, the only valid reads are Data# Polling and Toggle Bit. During the internal Program operation, the host is free to perform additional tasks. Any commands written during the internal Program operation will be ignored. Read The Read operation of the A49LF040 device is controlled by OE#. OE# is the output control and is used to gate data from the output pins. Refer to the Read cycle timing diagram, Figure 10 for further details. Table 10: A/A Mux Mode Operation Selection Mode Read Write Standby Output Disable Reset Product Identification RST# VIH VIH VIH VIH VIL VIH OE# VIL VIH VIH VIH X VIL WE# VIH VIL VIH X X VIH Address AIN AIN X X X A18 – A2 = X, A1 = VIL, A0 = VIL A18 – A2 = X, A1 = VIL, A0 = VIH A18 – A2 = X, A1 = VIH, A0 = VIH DOUT DIN High Z High Z High Z Manufacturer ID Device ID Continuation ID I/O Block-Erase Operation The Block-Erase Operation allows the system to erase the device in 64 KByte uniform block size for the A49LF040. The Block-Erase operation is initiated by executing a six-byte command load sequence for Software Data Protection with Block-Erase command (30H or 50H) and block address. The internal Block-Erase operation begins after the sixth WE# pulse. The End-of-Erase can be determined using either Data# Polling or Toggle Bit methods. See Figure 15 for timing waveforms. Any commands written during the BlockErase operation will be ignored. Write Operation Status Detection The A49LF040 device provides two software means to detect the completion of a Write cycle, in order to optimize the system Write cycle time. The software detection includes two status bits: Data# Polling (I/O7) and Toggle Bit (I/O6). The End-of-Write detection mode is enabled after the rising edge of WE# which initiates the internal Write operation. The actual completion of the nonvolatile write is asynchronous with the system; therefore, either a Data# Polling or Toggle Bit read may be simultaneous with the completion of the Write cycle. If this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either I/O7 or I/O6. In order to prevent spurious rejection, if an erroneous result occurs, the software routine should include a loop to read the accessed location an additional two times. If both reads are valid, then the device has completed the Write cycle, otherwise the rejection is valid. Data# Polling (I/O7) When the A49LF040 device is in the internal Program operation, any attempt to read I/O7 will produce the complement of the true data. Once the Program operation is completed, I/O7 will produce true data. Note that even though I/O7 may have valid data immediately following the completion of an internal Write operation, the remaining data outputs may still be invalid: valid data on the entire data bus will appear in subsequent successive Read cycles after an interval of 1 µs. During internal Erase operation, any attempt 11 Chip-Erase The A49LF040 device provides a Chip-Erase operation only in A/A Mux mode, which allows the user to erase the entire memory array to the ‘1’s state. This is useful when the entire device must be quickly erased. The Chip-Erase operation is initiated by executing a six-byte Software Data Protection command sequence with Chip-Erase command (10H) with address 5555H in the last byte sequence. The internal Erase operation begins with the rising edge of the sixth WE#. During the internal Erase operation, the only valid read is Toggle Bit or Data# Polling. See Table 11 for the command sequence, Figure 16 for timing diagram, and Figure 21 for the flowchart. Any commands written during the Chip-Erase operation will be ignored. PRELIMINARY (August, 2004, Version 0.1) AMIC Technology, Corp. A49LF040 to read I/O7 will produce a ‘0’. Once the internal Erase operation is completed, I/O7 will produce a ‘1’. The Data# Polling is valid after the rising edge of fourth WE# pulse for Program operation. For Block- or Chip-Erase, the Data# Polling is valid after the rising edge of sixth WE# pulse. See Figure 12 for Data# Polling timing diagram. Proper status will not be given using Data# Polling if the address is in the invalid range. Toggle Bit (I/O6) During the internal Program or Erase operation, any consecutive attempts to read I/O6 will produce alternating ‘0’s and ‘1’s, i.e., toggling between 0 and 1. When the internal Program or Erase operation is completed, the toggling will stop. The device is then ready for the next operation. The Toggle Bit is valid after the rising edge of fourth WE# pulse for Program operation. For Block- or Chip-Erase, the Toggle Bit is valid after the rising edge of sixth WE# pulse. See Figure 13 for Toggle Bit timing diagram. Software Data Protection (SDP) The A49LF040 provides the JEDEC approved Software Data Protection scheme for all data alteration operation, i.e., Program and Erase. Any Program operation requires the inclusion of a series of three-byte sequences. The three-byte load sequence is used to initiate the Program operation, providing optimal protection from inadvertent Write operations, e.g., during the system power-up or power-down. Any Erase operation requires the inclusion of a six-byte load sequence. The A49LF040 device is shipped with the Software Data Protection permanently enabled. See Table 11 for the specific software command codes. During SDP command sequence, invalid commands will abort the device to Read mode, within TRC. Electrical Specifications The AC and DC specifications for the LPC Interface signals (LAD[3:0], LCLK, LFRAME#, and RST#) as defined in Section 4.2.2 of the PCI Local Bus Specification, Rev. 2.1. Refer to Table 12 for the DC voltage and current specifications. Refer to the specifications on Table 13 to Table 22 for Clock, Read/Write, and Reset operations. Data Protection The A49LF040 device provides both hardware and software features to protect nonvolatile data from inadvertent writes. Hardware Data Protection Noise/Glitch Protection: A WE# pulse of less than 5 ns will not initiate a Write cycle. VDD Power Up/Down Detection: The Write operation is inhibited when VDD is less than 1.5V. Write Inhibit Mode: Forcing OE# low, WE# high will inhibit the Write operation. This prevents inadvertent writes during power-up or power-down. Product Identification The product identification mode identifies the Manufacturer ID, Continuation ID, and Device ID of the A49LF040. See Table 9 for detail information. PRELIMINARY (August, 2004, Version 0.1) 12 AMIC Technology, Corp. A49LF040 Figure 3: System Memory Map and Device Memory Map for A49LF040 A49LF040 Block 7 (64K Bytes) Block 6 (64K Bytes) Block 5 (64K Bytes) Block 4 (64K Bytes) Block 3 (64K Bytes) Block 2 (64K Bytes) Block 1 (64K Bytes) Block 0 (64K Bytes) Device Memory 07FFFF TBL# 070000 06FFFF 060000 05FFFF 050000 04FFFF 040000 03FFFF 030000 02FFFF 020000 01FFFF 010000 00FFFF 000000 WP# for Block 6 ~ 0 Table 11: Software Data Protection Command Definition Command Bus Cycles 6 6 4 3 1 3 1 Cycle Addr (2) st (1) 2 nd Cycle Data 55H 55H 55H 55H 3 Cycle Addr YYYY 5555H YYYY 5555H YYYY 5555H YYYY 5555H rd 4 Cycle Addr YYYY 5555H YYYY 5555H PA(6) th 5 Cycle Addr YYYY 2AAAH YYYY 2AAAH th 6 Cycle Addr BA(4) YYYY 5555H th Data AAH AAH AAH AAH F0H AAH Addr YYYY 2AAAH YYYY 2AAAH YYYY 2AAAH YYYY 2AAAH Data 80H 80H A0H 90H Data AAH AAH PD(6) Data 55H 55H Data 30H/50H(5) 10H Block Erase Chip Erase (3) YYYY 5555H YYYY 5555H YYYY 5555H YYYY 5555H XXXX XXXXH YYYY 5555H Byte Program Product ID Entry Product ID Exit Product ID Exit (7) (7) YYYY 2AAAH 55H YYYY 5555H F0H Notes: 1. LPC Mode uses consecutive Write cycles to complete a command sequence; A/A Mux Mode uses consecutive bus cycles to complete a command sequence. 2. YYYY = A[31:16]. In LPC mode, during SDP command sequence, YYYY must be within memory address range specified in Table 5. In A/A Mux mode, YYYY can be VIL or VIH, but no other value. 3. Chip erase is available in A/A Mux Mode only. 4. BA: Block Erase Address. 5. Either 30H or 50H are acceptable for Block Erase. 6. PA: Program Byte Address; PD: Byte data to be programmed. 7. Both Product ID Exit commands are equivalent. PRELIMINARY (August, 2004, Version 0.1) 13 AMIC Technology, Corp. A49LF040 Operating Range AC Conditions of Test Input Rise/Fall Time . . . . . . . . . . . . . . . . . . . . . . 3ns Output Load . . . . . . . . . . . . . . . . . . . . . . . . . . . . CL = 30pF Range Commercial Ambient Temperature 0°C to +85°C VDD 3.0-3.6V Table 12: DC Operating Characteristics (All Interfaces) Symbol Parameter Min Active VDD Current: IDD Read Active VDD Current: Write ISB IRY(2) II ILI ILO VIHI(3) VILI(3) VIH VIL VOL VOH (1) Limits Max 12 24 100 10 100 1 1 1.0 -0.5 0.5VDD -0.5 0.9VDD VDD+0.5 0.4 VDD+0.5 0.3VDD 0.1VDD Units mA mA µA mA µA µA µA V V V V V V Test Conditions Address Input=VIL/VIH, at F=1/TRCMin, VDD=VDDMax(A/A Mux Mode) OE#=VIH, WE#=VIH LFRAME#=0.9VDD,f=33MHz,VDD=VDDMax, All other inputs ≥ 0.9VDD or ≤ 0.1VDD LFRAME#=VIL,f=33MHz,VDD=VDDMax, All other inputs ≥ 0.9VDD or ≤ 0.1VDD VIN=GND to VDD, VDD=VDDMax VIN=GND to VDD, VDD=VDDMax VOUT=GND to VDD, VDD=VDDMax VDD=VDDMax VDD=VDDMin VDD=VDDMax VDD=VDDMin IOL=1500µA, VDD=VDDMin IOH=-500µA, VDD=VDDMin Standby VDD Current (LPC Mode) Ready Mode VDD Current (LPC Mode) Input Current for Mode and ID[3:0] Pins Input Leakage Current Output Leakage Current INIT# Input High Voltage INIT# Input Low Voltage Input High Voltage Input Low Voltage Output Low Voltage Output High Voltage Notes: 1. IDD active while Erase or Program is in progress. 2. The device is in Ready Mode when no activity is on the LPC bus. 3. Do not violate processor or chipset specification regarding INIT# voltage. Table 13: Recommended System Power-Up Timings Symbol TPU-READ(1) TPU-WRITE (1) Parameter Power-up to Read Operation Power-up to Write Operation Min 100 100 Units µs µs Notes: 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. PRELIMINARY (August, 2004, Version 0.1) 14 AMIC Technology, Corp. A49LF040 Table 14: Pin Impedance (VDD=3.3V, Ta=25°C, f=1MHz, other pins open) Parameter CI/O (1) CIN LPIN (1) (2) Description I/O Pin Capacitance Input Capacitance Pin Inductance Test Condition VI/O = 0V VIN = 0V Max 12pF 12pF 20nH Notes: 1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter. 2. Refer to PCI specifications. Table 15: Clock Timing Parameters Symbol TCYC THIGH TLOW Parameter LCLK Cycle Time LCLK High Time LCLK Low Time LCLK Slew Rate (peak-to-peak) Min 30 11 11 1 4 Max Units ns ns ns V/ns Figure 4: LCLK Waveform TCYC THIGH 0.6 VDD 0.5 VDD 0.4 VDD 0.3 VDD 0.2 VDD 0.4 VDD Peak-to-Peak (Min) TLOW Table 16: LPC Mode Read/Write Cycle Timing Parameters, VDD=3.0-3.6V Symbol TSU TDH TVAL TON TOFF Parameter Input Set Up Time to LCLK Rising LCLK Rising to Data Hold Time LCLK Rising to Data Valid LCLK Rising to Active (Float to Active Delay) LCLK Rising to Inactive (Active to Float Delay) Min 7 0 2 2 Max Units ns ns 11 28 ns ns ns PRELIMINARY (August, 2004, Version 0.1) 15 AMIC Technology, Corp. A49LF040 Table 17: LPC Mode Interface Measurement Condition Parameters Symbol VTH VTL VTEST VMAX Input Signal Edge Rate Value 0.6 VDD 0.2 VDD 0.4 VDD 0.4 VDD 1V/ns Units V V V V Figure 5: Input Timing Parameters VTH LCLK VTEST VTL TSU TDH LAD[3:0] (Valid Input Data) Valid Inputs VMAX Figure 6: Output Timing Parameters VTH LCLK VTEST VTL TVAL LAD[3:0] (Valid Output Data) LAD[3:0] (Float Output Data) TON TOFF PRELIMINARY (August, 2004, Version 0.1) 16 AMIC Technology, Corp. A49LF040 Table 18: LPC Mode Interface AC Input/Output Characteristics Symbol Parameter Test Conditions 0 < VOUT ≤ 0.3VDD IOH (AC) Switching Current High (Test Point) IOL (AC) Switching Current Low (Test Point) ICL ICH slewr slewf Low Clamp Current High Clamp Current Output Rise Slew Rate Output Fall Slew Rate 0.3VDD < VOUT ≤ 0.9VDD 0.7VDD < VOUT ≤ VDD VOUT = 0.7VDD VDD > VOUT ≥ 0.6VDD 0.6VDD > VOUT > 0.1VDD 0.18VDD > VOUT > 0 VOUT=0.18VDD -3 < VIN ≤ -1 VDD+4 > VIN > VDD+1 0.2VDD-0.6VDD load 0.6VDD-0.2VDD load -25+(VIN+1)/0.015 25+(VIN-VDD-1)/0.015 1 1 4 4 16VDD 26.7VOUT Equation D 38VDD Min -12 VDD -17.1(VDD-VOUT) Max Units mA mA Equation C -32 VDD mA mA mA mA mA mA mA mA V/ns V/ns Notes: 1. See PCI specification. 2. PCI specification output load is used. Table 19: LPC Mode Interface Reset Timing Parameters, VDD=3.0-3.6V Symbol TPRST TKRST TRSTP TRSTF TRST(1) TRSTE Parameter VDD Stable to Reset Low Clock Stable to Reset Low RST# Pulse Width RST# Low to Output Float RST# High to LFRAME# Low RST# Low to Reset During Erase or Program RST# or INIT# Slew Rate Min 1 100 100 Max Units ms µs ns 48 1 10 50 ns µs µs mV/ns Notes: 1. There will be a latency of TRSTE if a reset procedure is performed during a Program or Erase operation. Figure 7: Reset Timing Diagram VDD LCLK TKRST RST#/INIT# TRSTF LAD[3:0] TRSTE TRST Program or Erase Operation Aborted TPRST TRSTP LFRAME# PRELIMINARY (August, 2004, Version 0.1) 17 AMIC Technology, Corp. A49LF040 Figure 8: A/A Mux Mode AC Input/Output Reference Waveforms VIHT INPUT VILT AC test inputs are driven at VIHT (0.9VDD) for a logic HIGH and VILT (0.1VDD) for a logic LOW. Measurement reference points for inputs and outputs are VIT (0.5VDD) and VOT (0.5VDD). Input rise and fall times (10% 90%) are < 5ns Note: V IT: VINPUT Test V OT: VOUTPUT Test V IHT: VINPUT HIGH Test V ILT: VINPUT LOW Test VIT Reference Points VOT OUTPUT Figure 9: A/A Mux Mode Test Load Condition TO TESTER TO DUT CL=30pF PRELIMINARY (August, 2004, Version 0.1) 18 AMIC Technology, Corp. A49LF040 A/A MUX MODE AC CHARACTERISTICS Table 20: Read Cycle Timing Parameters VDD=3.0-3.6V Symbol TRC TRST TAS TAH TAA TOE TOLZ TOHZ TOH Parameter Read Cycle Time RST# High to Row Address Setup R/C# Address Set-up Time R/C# Address Hold Time Address Access Time Output Enable Access Time OE# Low to Active Output OE# High to High-Z Output Output Hold from Address Change Min 270 1 45 45 Max Units ns µs ns ns 120 60 0 35 0 ns ns ns ns ns Table 21: Program/Erase Cycle Timing Parameters, VDD=3.0-3.6V Symbol TRST TAS TAH TCWH TOES TOEH TOEP TOET TWP TWPH TDS TDH TIDA TBP TBE TSCE Parameter RST# High to Row Address Setup R/C# Address Setup Time R/C# Address Hold Time R/C# to Write Enable High Time OE# High Setup Time OE# High Hold Time OE# to Data# Polling Delay OE# to Toggle Bit Delay WE# Pulse Width WE# Pulse Width High Data Setup Time Data Hold Time Product ID Access and Exit Time Byte Programming Time Block Erase Time Chip Erase Time Min 1 50 50 50 20 20 Max Units µs ns ns ns ns ns 40 40 100 100 50 5 150 300 8 10 ns ns ns ns ns ns ns µs s s Table 22: Reset Timing Parameters, VDD=3.0-3.6V Symbol TPRST TRSTP TRSTF TRST(1) TRSTE Parameter VDD Stable to Reset Low RST# Pulse Width RST# Low to Output Float RST# High to LFRAME# Low RST# Low to Reset During Erase or Program Min 1 100 Max Units ms ns 48 1 10 ns µs µs 1. There will be a reset latency of TRSTE if a reset procedure is performed during a Program or Erase operation. PRELIMINARY (August, 2004, Version 0.1) 19 AMIC Technology, Corp. A49LF040 Figure 10: A/A Mux Mode Read Cycle Timing Diagram TRSTP RST# TRST Row Address TRC Column Address Row Address Column Address Address TAS R/C# VIH TAH TAS TAH WE# TAA TOH OE# TOE High-Z TOLZ Data Valid TOHZ High-Z I/O7-I/O0 Figure 11: A/A Mux Mode Write Cycle Timing Diagram TRSTP RST# TRST Row Address Column Address Address TAS R/C# TAH TAS TAH TCWH OE# TOES TWP TOEH TWPH WE# TDS I/O7-I/O0 High-Z Data Valid TDH PRELIMINARY (August, 2004, Version 0.1) 20 AMIC Technology, Corp. A49LF040 Figure 12: A/A Mux Mode Data# Polling Timing Diagram Address Row Address Column Address Row Address Column Address Row Address Column Address Row Address Column Address R/C# WE# TOEP OE# High-Z I/O7 Data In Data# Data# Data Final Input Command Status Bit Status Bit Data Command Input Write Operation In Progress Write Operation Complete Figure 13: A/A Mux Mode Toggle Bit Timing Diagram Address Row Address Column Address Row Address Column Address Row Address Column Address Row Address Column Address R/C# WE# TOET OE# High-Z I/O6 Data In Data Final Input Command Status Bit Status Bit Data Command Input Write Operation In Progress Write Operation Complete PRELIMINARY (August, 2004, Version 0.1) 21 AMIC Technology, Corp. A49LF040 Figure 14: A/A Mux Mode Byte Program Timing Diagram Four-Byte Byte Program Command Sequence 5555 Address 2AAA 5555 PA R/C# OE# TWP TWPH TBP WE# High-Z AA 55 A0 PD I/O7-I/O0 Byte Program Command Input PA = Byte Program Address PD = Byte Program Data Byte Program Operation In Progress Figure 15: A/A Mux Mode Block Erase Timing Diagram Six-Byte Block Erase Command Sequence 5555 Address 2AAA 5555 5555 2AAA BA R/C# OE# TWP TWPH TBE WE# High-Z AA 55 80 AA 55 30/50 I/O7-I/O0 Block Erase Command Input BA = Block Address Block Erase Operation In Progress PRELIMINARY (August, 2004, Version 0.1) 22 AMIC Technology, Corp. A49LF040 Figure 16: A/A Mux Mode Chip Erase Timing Diagram Six-Byte Chip Erase Command Sequence 5555 Address 2AAA 5555 5555 2AAA 5555 R/C# OE# TWP TWPH TSCE WE# High-Z AA 55 80 AA 55 10 I/O7-I/O0 Chip Erase Command Input Chip Erase Operation In Progress Figure 17: A/A Mux Mode Product ID Entry and Read Timing Diagram Three-Byte Product ID Entry Command Sequence 5555 Address 2AAA 5555 0000 0001 0003 R/C# OE# TWP TWPH TIDA WE# High-Z AA 55 90 37 TAA 95 7F I/O7-I/O0 Figure 18: A/A Mux Mode Product ID Exit and Reset Timing Diagram Three-Byte Product ID Exit and Reset Command Sequence 5555 Address 2AAA 5555 R/C# OE# TWP TWPH WE# High-Z AA 55 F0 I/O7-I/O0 PRELIMINARY (August, 2004, Version 0.1) 23 AMIC Technology, Corp. A49LF040 Figure 19: Automatic Byte Program Algorithm Start Write Command Address: 5555H Data: AAH Write Command Address: 2AAAH Data: 55H Write Command Address: 5555H Data: A0H Write Command Address: PA Data: PD NO I/O7 = Data ? Or I/O6 Stop Toggle? YES Byte Program Completed PA: Byte Program Address PD: Byte Program Data PRELIMINARY (August, 2004, Version 0.1) 24 AMIC Technology, Corp. A49LF040 Figure 20: Automatic Block Erase Algorithm Start Write Command Address: 5555H Data: AAH Write Command Address: 2AAAH Data: 55H Write Command Address: 5555H Data: 80H Write Command Address: 5555H Data: AAH NO Write Command Address: 2AAAH Data: 55H I/O7 = Data ? Or I/O6 Stop Toggle? YES Write Command Address: BA Data: 30H or 50H Block Erase Completed BA: Block Address PRELIMINARY (August, 2004, Version 0.1) 25 AMIC Technology, Corp. A49LF040 Figure 21: Automatic Chip Erase Algorithm Start Write Command Address: 5555H Data: AAH Write Command Address: 2AAAH Data: 55H Write Command Address: 5555H Data: 80H Write Command Address: 5555H Data: AAH NO Write Command Address: 2AAAH Data: 55H I/O7 = Data ? Or I/O6 Stop Toggle? YES Write Command Address: 5555H Data: 10H Chip Erase Completed PRELIMINARY (August, 2004, Version 0.1) 26 AMIC Technology, Corp. A49LF040 Figure 22: Product ID Command Flowchart Start Start OR Write Command Address: 5555H Data: AAH Write Command Address: 5555H Data: AAH Write Command Address: 2AAAH Data: 55H Write Command Address: 2AAAH Data: 55H Write Command Address: 5555H Data: 90H Write Command Address: 5555H Data: F0H Write Command Address: XXXXH Data: F0H Enter Product ID Mode Exit Product ID Mode PRELIMINARY (August, 2004, Version 0.1) 27 AMIC Technology, Corp. A49LF040 Ordering Information A49LF040T x - 33 C Temperature Range C = Commercial (0°C to +85°C) Clock Frequency 33 = 33MHz Package Type L = PLCC X = TSOP (8mmX14mm) Device Number 4 Mbit LPC Flash Memory Part No. Clock Frequency (MHz) Boot Block Location Top Temperature Range 0°C to +85°C 0°C to +85°C 0°C to +85°C 0°C to +85°C Package Type A49LF040TL-33 32-pin PLCC A49LF040TL-33F Top 33 Top Top 32-pin Pb-Free PLCC 32-pin TSOP (8mm X 14 mm) 32-pin Pb-Free TSOP (8mm X 14 mm) A49LF040TX-33 A49LF040TX-33F PRELIMINARY (August, 2004, Version 0.1) 28 AMIC Technology, Corp. A49LF040 Package Information PLCC 32L Outline Dimension HD D 13 5 unit: inches/mm 14 4 32 20 30 21 29 A2 A HE 1 E b1 GD y D A1 e b GE θ Dimensions in inches Dimensions in mm Min 0.47 2.67 0.66 0.41 0.20 13.89 11.35 1.12 12.45 9.91 14.86 12.32 1.91 0° Nom 2.80 0.71 0.46 0.254 13.97 11.43 1.27 12.95 10.41 14.99 12.45 2.29 Max 3.40 2.93 0.81 0.54 0.35 14.05 11.51 1.42 13.46 10.92 15.11 12.57 2.41 0.075 10° Symbol A A1 A2 b1 b C D E e GD GE HD HE L y θ Min 0.0185 0.105 0.026 0.016 0.008 0.547 0.447 0.044 0.490 0.390 0.585 0.485 0.075 0° Nom 0.110 0.028 0.018 0.010 0.550 0.450 0.050 0.510 0.410 0.590 0.490 0.090 - Max 0.134 0.115 0.032 0.021 0.014 0.553 0.453 0.056 0.530 0.430 0.595 0.495 0.095 0.003 10° Notes: 1. Dimensions D and E do not include resin fins. 2. Dimensions GD & GE are for PC Board surface mount pad pitch design reference only. PRELIMINARY (August, 2004, Version 0.1) 29 AMIC Technology, Corp. L c A49LF040 Package Information TSOP 32L TYPE I (8 X 14mm) Outline Dimensions unit: inches/mm Pin1 0.254 Gage Plane θ L Detail "A" A2 E D1 D Detail "A" A1 c e b y D Dimensions in inches Symbol A A1 A2 b c E e D D1 L y θ Min 0.002 0.037 0.0067 0.004 0.311 0.543 0.484 0.020 0.000 0° Nom 0.039 0.0087 0.315 0.0197 0.551 0.488 0.024 3° Max 0.047 0.006 0.041 0.0106 0.0083 0.319 0.559 0.492 0.028 0.003 5° Dimensions in mm Min 0.05 0.95 0.17 0.10 7.90 13.80 12.30 0.50 0.00 0° Nom 1.00 0.22 8.00 0.50 14.00 12.40 0.60 3° Max 1.20 0.15 1.05 0.27 0.21 8.10 14.20 12.50 0.70 0.076 5° Notes: 1. Dimension E does not include mold flash. 2. Dimension D1 does not include interlead flash. 2. Dimension b does not include dambar protrusion. PRELIMINARY (August, 2004, Version 0.1) 30 AMIC Technology, Corp. A