A62S6308G-10SI

A62S6308 Series 64K X 8 BIT LOW VOLTAGE CMOS SRAM Document Title 64K X 8 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. 1.0 1.1 History Initial issue Modify TSOP (TSSOP) pin configuration. Modify SOP 32L, TSOP 32L and TSSOP 32L type packages outline dimensions. Issue Date September 01, 1997 January 16, 1998 Remark Preliminary 1.2 1.3 2.0 Change TSSOP 32L type package to sTSOP 32L. Modify sTSOP 32L type package LE symbol dimensions. Modify 32-pin TSOP package L symbol dimensions. Finalize  Add 36-ball Mini BGA (6X8) package June 16, 1998 June 22, 1998 October 9, 1998 Final (October, 1998, Version 2.0) AMIC Technology, Inc. A62S6308 Series 64K X 8 BIT LOW VOLTAGE CMOS SRAM Features n Power supply range: 2.7V to 3.6V n Access times:70/100 ns (max.) n Current: A62S6308-S series: Operating: 40mA (max.) Standby: 15µA (max.) A62S6308-SI series: *Operating: 40mA (max.) *Standby: 30µA (max.) n Extended operating temperature range:-25°C to 85°C n Full static operation, no clock or refreshing required n All inputs and outputs are directly TTL-compatible n Common I/O using three-state output n Output enable and two chip enable inputs for easy application n Data retention voltage: 2V (min.) n Available in 32-pin SOP, TSOP, sTSOP (8 X 13.4mm) forward type and 36-ball Mini BGA (6X8) packages General Description The A62S6308 is a low operating current 524,288-bit static random access memory organized as 65,536 words by 8 bits and operates on a low power supply voltage from 2.7V to 3.6V. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Two chip enable inputs are provided for POWER-DOWN and a device enable and an output enable input are included for easy interfacing. Data retention is guaranteed at a power supply voltage as low as 2V. Pin Configurations n SOP n TSOP/(sTSOP) (forward type) n Mini BGA (6X8) Top View NC NC A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O0 I/O1 I/O2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 VCC CE2 WE A13 A8 A9 A11 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 ~ A15 A11 A9 A8 A13 WE CE2 A15 VCC NC NC A14 A12 A7 A6 A5 A4 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 1 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 OE A10 CE1 I/O7 I/O6 I/O5 I/O4 I/O3 GND I/O2 I/O1 I/O0 A0 A1 A2 A3 2 A1 A2 3 CE2 WE 4 A3 A4 A5 5 A6 A7 6 A8 I/O0 I/O1 VCC VSS A B C A0 I/O4 I/O5 NC ~ ~ (October, 1998, Version 2.0) A62S6308M A62S6308V (A62S6308X) D VSS E VCC F G H I/O6 I/O7 A9 OE NC CE1 NC NC A12 A15 A13 I/O2 I/O3 A14 A10 A11 1 AMIC Technology, Inc. A62S6308 Series Block Diagram A0 VCC GND A13 A14 A15 ROW DECODER 512 X 1024 MEMORY ARRAY I/O1 INPUT DATA CIRCUIT COLUMN I/O I/O8 CE2 CE1 OE WE CONTROL CIRCUIT Pin Descriptions - SOP Pin No. 1,2 3 - 12, 23, 25 - 28, 31 13 - 15, 17 - 21 16 22 24 29 30 32 Symbol NC A0 - A15 Description No Connection Address Inputs Pin Description - TSOP/sTSOP Pin No. 1 - 4, 7, 11 - 20, 31 5 6 8 9, 10 21 - 23, 25 - 29 24 30 32 Symbol A0 - A15 WE CE2 VCC NC I/O1 - I/O8 GND CE1 OE Description Address Inputs Write Enable Chip Enable Power Supply No Connection Data Inputs/Outputs Ground Chip Enable Output Enable I/O1 - I/O8 GND CE1 OE WE CE2 VCC Data Inputs/Outputs Ground Chip Enable Output Enable Write Enable Chip Enable Power Supply (October, 1998, Version 2.0) 2 AMIC Technology, Inc. A62S6308 Series Recommended DC Operating Conditions (TA = 0°C to + 70°C, -25°C to 85°C) Symbol VCC GND VIH VIL CL TTL Parameter Supply Voltage Ground Input High Voltage Input Low Voltage Output Load Output Load Min. 2.7 0 2.0 -0.3 Typ. 3.0 0 Max. 3.6 0 VCC + 0.3 +0.6 30 1 Unit V V V V pF - Absolute Maximum Ratings* VCC to GND . . . . . . . . . . . . . . . . . . . . . -0.5V to + 4.6V IN, IN/OUT Volt to GND . . . . . . . . . -0.5V to VCC + 0.5V Operating Temperature, Topr . . . . . . . . -25°C to + 85°C Storage Temperature, Tstg . .. . . . . . . . -55°C to + 125°C Power Dissipation, PT . . . . . . . . . . . . . . . . . . . . . . 0.7W Soldering Temp. & Time . . . . . . . . . . . . . 260°C, 10 sec *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics Symbol Parameter (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V, GND = 0V) A62S6308-70S/10S Min. Max. 1 A62S6308-70SI/10SI Min. Max. 1 µA VIN = GND to VCC CE1 = VIH or CE2 = VIL or OE = VIH or W E = VIL VI/O = GND to VCC CE1 = VIL, CE2 = VIH II/O = 0mA Min. Cycle, Duty = 100% CE1 = VIL, CE2 = VIH II/O = 0mA CE1 = VIL, CE2 = VIH VIH = VCC, VIL = 0V f = 1MHZ, II/O = 0mA Unit Conditions ILI Input Leakage Current Output Leakage Current Active Power Supply Current - ILO - 1 - 1 µA ICC - 3 - 3 mA ICC1 Dynamic Operating Current ICC2 - 40 - 40 mA - 5 - 5 mA (October, 1998, Version 2.0) 3 AMIC Technology, Inc. A62S6308 Series DC Electrical Characteristics (continued) Symbol Parameter A62S6308-70S/10S Min. ISB Max. 0.5 A62S6308-70SI/10SI Min. Max. 0.5 mA CE1 = VIH or CE2 = VIL CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V VIN ≥ 0V CE2 ≤ 0.2V VIN ≥ 0V IOL = 2.1mA IOH = -1.0mA Unit Conditions ISB1 Standby Power Supply Current - 15 - 30 µA ISB2 VOL VOH Output Low Voltage Output High Voltage 2.4 15 0.4 - 2.4 30 0.4 - µA V V Truth Table Mode Standby CE1 H X Output Disable Read Write Note: X = H or L L L L CE2 X L H H H OE X X H L X WE X X H H L I/O Operation High Z High Z High Z DOUT DIN Supply Current ISB, ISB1 ISB, ISB2 ICC, ICC1, ICC2 ICC, ICC1, ICC2 ICC, ICC1, ICC2 Capacitance (TA = 25°C, f = 1.0MHz) Symbol CIN* CI/O* Parameter Input Capacitance Input/Output Capacitance Min. Max. 6 8 Unit pF pF Conditions VIN = 0V VI/O = 0V * These parameters are sampled and not 100% tested. (October, 1998, Version 2.0) 4 AMIC Technology, Inc. A62S6308 Series AC Characteristics (TA = 0°C to + 70°C or -25°C to 85°C, VCC = 2.7V to 3.6V) Symbol Parameter A62S6308-70S/SI Min. Read Cycle tRC tAA tACE1 tACE2 tOE tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ tOH Read Cycle tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOW Notes: Write Cycle Time Chip Enable to End of Write Address Setup Time Address Valid to End of Write Write Pulse Width Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Active from End of Write 70 60 0 60 50 0 0 30 0 5 25 100 80 0 80 60 0 0 40 0 5 35 ns ns ns ns ns ns ns ns ns ns Output Disable to Output in High Z Output Hold from Address Change Output Enable to Output in Low Z Chip Disable to Output in High Z CE1 CE2 Output Enable to Output Valid Chip Enable to Output in Low Z CE1 CE2 Read Cycle Time Address Access Time Chip Enable Access Time CE1 CE2 70 10 10 5 0 0 0 10 70 70 70 35 25 25 25 100 10 10 5 0 0 0 10 100 100 100 50 35 35 35 ns ns ns ns ns ns ns ns ns ns ns ns Max. A62S6308-10S/SI Min. Max. Unit tCHZ1, tCHZ2, tOHZ and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. (October, 1998, Version 2.0) 5 AMIC Technology, Inc. A62S6308 Series Timing Waveforms Read Cycle 1 (1, 2, 4) tRC Address tAA tOH tOH DOUT Read Cycle 2 (1, 3, 4, 6) CE1 tACE1 tCLZ15 tCHZ15 DOUT Read Cycle 3 (1, 4, 7 ,8) CE2 tACE2 tCLZ25 tCHZ25 DOUT (October, 1998, Version 2.0) 6 AMIC Technology, Inc. A62S6308 Series Timing Waveforms (continued) Read Cycle 4 (1) tRC Address tAA OE tOE tOLZ5 tOH CE1 tACE1 tCLZ15 CE2 tACE2 tCLZ25 DOUT tCHZ25 tOHZ 5 tCHZ15 Notes: 1. 2. 3. 4. 5. 6. 7. 8. W E is high for Read Cycle. Device is continuously enabled CE1 = VIL and CE2 = VIH. Address valid prior to or coincident with CE1 transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. CE2 is high. CE1 is low. Address valid prior to or coincident with CE2 transition high. (October, 1998, Version 2.0) 7 AMIC Technology, Inc. A62S6308 Series Timing Waveforms (continued) Write Cycle 1 (Write Enable Controlled) (6) tWC Address tAW tCW CE1 (4) 5 tWR3 CE2 (4) tAS1 tWP2 WE tDW tDH DIN tWHZ tOW DOUT (October, 1998, Version 2.0) 8 AMIC Technology, Inc. A62S6308 Series Timing Waveforms (continued) Write Cycle 2 (Chip Enable Controlled) tWC Address tAW tCW5 CE1 tAS1 (4) tWR3 CE2 (4) tCW5 tWP2 WE tDW DIN tDH tWHZ7 DOUT Notes: 1. 2. 3. 4. tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low W E . tWR is measured from the earliest of CE1 or W E going high or CE2 going low to the end of the Write cycle. If the CE1 low transition or the CE2 high transition occurs simultaneously with the W E low transition or after the W E transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write. 6. OE is continuously low. ( OE = VIL) 7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. (October, 1998, Version 2.0) 9 AMIC Technology, Inc. A62S6308 Series AC Test Conditions Input Pulse Levels Input Rise and Fall Time Input and Output Timing Reference Levels Output Load 0.4V to 2.4V 5 ns 1.5V See Figures 1 and 2 TTL TTL CL 30pF CL 5pF * Including scope and jig. * Including scope and jig. Figure 1. Output Load Figure 2. Output Load for tCLZ1, tCLZ2, tOHZ, tOLZ, tCHZ1, tCHZ2, tWHZ, and tOW Data Retention Characteristics Symbol VDR1 (TA = 0°C to + 70°C or -25°C to 85°C) Min. 2.0 Max. 3.6 Unit V Conditions CE1 ≥ VCC - 0.2V CE2 ≤ 0.2V CE1 ≥ VCC - 0.2V or CE1 ≤ 0.2V VCC = 2.0V CE1 ≥ VCC - 0.2V CE2 ≥ VCC - 0.2V VIN ≥ 0V VCC = 2.0V CE2 ≤ 0.2V VIN ≥ 0V ns ns ms See Retention Waveform Parameter VCC for Data Retention VDR2 2.0 3.6 V S-Version ICCDR1 SI-Version Data Retention Current S-Version ICCDR2 SI-Version tCDR tR tVR Chip Disable to Data Retention Time Operation Recovery Time VCC Rise Time from Data Retention Voltage to Operating Voltage 0 tRC 5 10* µA 20** 10* µA 20** - ** A62S6308-70S/10S * A62S6308-70SI/10SI ICCDR: Max. 3µA at TA = 0°C + 40°C ICCDR: Max. 3µA at TA = 0°C + 40°C (October, 1998, Version 2.0) 10 AMIC Technology, Inc. A62S6308 Series Low VCC Data Retention Waveform (1) ( CE1 Controlled) DATA RETENTION MODE VCC 2.7V tCDR VDR ≥ 2V tVR CE1 VIH CE1 ≥ VDR - 0.2V VIH 2.7V tR Low VCC Data Retention Waveform (2) (CE2 Controlled) DATA RETENTION MODE VCC 2.7V tCDR VDR ≥ 2V tVR CE2 2.7V tR VIL CE2 < 0.2V VIL (October, 1998, Version 2.0) 11 AMIC Technology, Inc. A62S6308 Series Ordering Information Part No. A62S6308M-70S A62S6308M-70SI A62S6308V-70S A62S6308V-70SI A62S6308X-70S A62S6308X-70SI A62S6308G-70S A62S6308G-70SI A62S6308M-10S A62S6308M-10SI A62S6308V-10S A62S6308V-10SI A62S6308X-10S A62S6308X-10SI A62S6308G-10S A62S6308G-10SI 100 70 Access Time (ns) Operating Current Max. (mA) 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 40 Standby Current Max. (µA) 15 30 15 30 15 30 15 30 15 30 15 30 15 30 15 30 Package 32L SOP 32L SOP 32L TSOP 32L TSOP 32L sTSOP 32L sTSOP 36B Mini BGA 36B Mini BGA 32L SOP 32L SOP 32L TSOP 32L TSOP 32L sTSOP 32L sTSOP 36B Mini BGA 36B Mini BGA (October, 1998, Version 2.0) 12 AMIC Technology, Inc. A62S6308 Series Package Information SOP (W.B.) 32L Outline Dimensions 32 17 unit: inches/mm HE E θ L 1 b 16 Detail F D c A2 A S Seating Plane y D e A1 LE See Detail F Dimensions in inches Symbol A A1 A2 b c D E e HE L LE S y θ Min 0.004 0.101 0.014 0.006 0.440 0.044 0.546 0.023 0.047 0° Nom 0.106 0.016 0.008 0.805 0.445 0.050 0.556 0.031 0.055 Max 0.118 0.111 0.020 0.012 0.817 0.450 0.056 0.566 0.039 0.063 0.036 0.004 10° Dimensions in mm Min 0.10 2.57 0.36 0.15 11.18 1.12 13.87 0.58 1.19 0° Nom 2.69 0.41 0.20 20.45 11.30 1.27 14.12 0.79 1.40 Max 3.00 2.82 0.51 0.31 20.75 11.43 1.42 14.38 0.99 1.60 0.91 0.10 10° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (October, 1998, Version 2.0) 13 AMIC Technology, Inc. A62S6308 Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions D unit: inches/mm e A2 E A1 c θ L LE HD Detail "A" Detail "A" y D S b Dimensions in inches Symbol A A1 A2 b c D E e HD L LE S y θ 0.779 0.016 0° Min 0.002 0.037 0.007 0.004 0.720 Nom 0.039 0.009 0.724 0.315 0.020 BSC 0.787 0.020 0.032 0.795 0.024 0.020 0.003 5° Max 0.047 0.006 0.041 0.011 0.008 0.728 0.319 Dimensions in mm Min 0.05 0.95 0.18 0.11 18.30 Nom 1.00 0.22 18.40 8.00 0.50 BSC 19.80 0.40 0° 20.00 0.50 0.80 20.20 0.60 0.50 0.08 5° Max 1.20 0.15 1.05 0.27 0.20 18.50 8.10 Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (October, 1998, Version 2.0) 14 AMIC Technology, Inc. A A62S6308 Series Package Information sTSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm e A2 E A1 c θ L LE Detail "A" D1 D Detail "A" D 0.076MM S SEATING PLANE b Dimensions in inches Symbol A A1 A2 b c E e D D1 L LE S θ 0° 0.520 0.461 0.012 0.0275 Min 0.002 0.037 0.007 0.0056 0.311 Nom 0.039 0.008 0.0059 0.315 0.020 TYP 0.528 0.465 0.020 0.0315 0.0109 TYP 3° 5° 0.535 0.469 0.028 0.0355 Max 0.049 0.041 0.009 0.0062 0.319 Dimensions in mm Min 0.05 0.95 0.17 0.142 7.90 Nom 1.00 0.20 0.150 8.00 0.50 TYP 13.20 11.70 0.30 0.700 0° 13.40 11.80 0.50 0.800 0.278 TYP 3° 5° 13.60 11.90 0.70 0.900 Max 1.25 1.05 0.23 0.158 8.10 Notes: 1. The maximum value of dimension D1 includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash. (October, 1998, Version 2.0) 15 AMIC Technology, Inc. A A62S6308 Series Package Information Mini BGA 6X8 (36 BALLS) Outline Dimensions unit : millimeter(mm) Bottom View Pin A1 Index 654 321 Pin A1 Index Top View C1 E F G H A A B1 Diameter D Solder Ball B D Symbol A B B1 C C1 D E E1 E2 Min 5.90 7.90 0.30 1.00 - Typ 0.75 6.00 3.75 8.00 5.25 0.35 1.10 0.36 0.22 Max 6.10 8.10 0.40 1.20 - (October, 1998, Version 2.0) 16 AMIC Technology, Inc. C E2 E A B C D 0.10 E1