A67L73361E-10

A67L83161/A67L83181/ A67L73321/A67L73361 Series 256K X 16/18, 128K X 32/36 Preliminary Document Title 256K X 16/18, 128K X 32/36 LVTTL, Flow-through DBATM SRAM Revision History Rev. No. 0.0 0.1 LVTTL, Flow-through DBATM SRAM History Initial issue Change fast access time from 7.5/8.0/8.5/9.0 ns to 10/11/12 ns Change set-up time from 2.0/2.2/2.5 ns to 2.5 ns Fix pin assignment error for pin 14 and pin 16 Issue Date April 7, 1999 September 15, 1999 Remark Preliminary PRELIMINARY (September, 1999, Version 0.1) AMIC Technology, Inc. DBA and Direct Bus Alternation are trademarks of AMIC Technology, Inc A67L83161/A67L83181/ A67L73321/A67L73361 Series 256K X 16/18, 128K X 32/36 Preliminary Features n Fast access time: 10/11/12 ns (100, 90, 83 MHz) n Direct Bus Alternation between READ and WRITE cycles allows 100% bus utilization n Signal +3.3V ± 5% power supply n Individual Byte Write control capability n Clock enable ( CEN ) pin to enable clock and suspend operations n Clock-controlled and registered address, data and control signals n Registered output for pipelined applications n Three separate chip enables allow wide range of options for CE control, address pipelining n Internally self-timed write cycle n Selectable BURST mode (Linear or Interleaved) n SLEEP mode (ZZ pin) provided n Available in 100 pin LQFP package LVTTL, Flow-through DBATM SRAM General Description The AMIC Direct Bus Alternation™ (DBA™) SRAM family employs high-speed, low-power CMOS designs using an advanced CMOS process. The A67L83161, A67L83181, A67L73321, A67L73361 SRAMs integrate a 256K X 16, 256K X 18, 128K X 32 or 128K X 36 SRAM core with advanced synchronous peripheral circuitry and a 2-bit burst counter. These SRAMs are optimized for 100 percent bus utilization without the insertion of any wait cycles during WriteRead alternation. The positive edge triggered single clock input (CLK) controls all synchronous inputs passing through the registers. The synchronous inputs include all address, all data inputs, active low chip enable ( CE ), two additional chip enables for easy depth expansion (CE2, CE2 ), cycle start input (ADV/ LD ), synchronous clock enable ( CEN ), byte write enables ( BW1, BW2 , BW3 , BW4 ) and read/write (R/ W ). Asynchronous inputs include the output enable ( OE ), clock (CLK), SLEEP mode (ZZ, tied LOW if unused) and burst mode (MODE). Burst Mode can provide either interleaved or linear operation, burst operation can be initiated by synchronous address Advance/Load (ADV/ LD ) pin in Low state. Subsequent burst address can be internally generated by the chip and controlled by the same input pin ADV/ LD in High state. Write cycles are internally self-time and synchronous with the rising edge of the clock input and when R/ W is Low. The feature simplified the write interface. Individual Byte enables allow individual bytes to be written. BW1 controls I/Oa pins; BW2 controls I/Ob pins; BW3 controls I/Oc pins; and BW4 controls I/Od pins. Cycle types can only be defined when an address is loaded, i.e., when ADV/ LD is LOW. Parity/ECC bits are only available on the X18/36 version. The SRAM operates from a +3.3V power supply, and all inputs and outputs are LVTTL-compatible. The device is ideally suited for high bandwidth utilization systems. PRELIMINARY (September, 1999, Version 0.1) 1 AMIC Technology, Inc. DBA and Direct Bus Alternation are trademarks of AMIC Technology, Inc A67L83161/A67L83181/ A67L73321/A67L73361 Series Pin Configuration OE ADV/ LD BW4 BW3 BW2 BW1 VCC CEN VSS CLK CE2 CE2 R/W 128K X 36/32 CE A6 A7 NC NC A8 A8 82 BW2 BW1 CEN OE ADV/ LD VCC VSS CLK CE2 CE2 R/W NC NC NC NC CE 256K X 18/16 A6 A7 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 I/Oc0 /NC I/Oc1 I/Oc2 VCCQ VSSQ I/Oc3 I/Oc4 I/Oc5 I/Oc6 VSSQ VCCQ I/Oc7 I/Oc8 VSS VCC VCC VSS I/Od 0 I/Od 1 VCCQ VSSQ I/Od 2 I/Od 3 I/Od 4 I/Od 5 VSSQ VCCQ I/Od6 I/Od7 I/Od 8/NC NC NC NC VCCQ VSSQ NC NC I/Ob0 I/Ob1 VSSQ VCCQ I/Ob 2 I/Ob3 VSS VCC VCC VSS I/Ob 4 I/Ob 5 VCCQ VSSQ I/Ob6 I/Ob7 I/Ob8/NC NC VSSQ VCCQ NC NC NC 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 100 81 80 79 78 77 76 75 74 73 72 71 70 69 A9 A9 A17 NC NC VCCQ VSSQ NC I/Oa 8 /NC I/Oa 7 I/Oa 6 VSSQ VCCQ I/Oa 5 I/Oa 4 VSS VSS VCC ZZ I/Oa 3 I/Oa 2 VCCQ VSSQ I/Oa 1 I/Oa 0 NC NC VSSQ VCCQ NC NC NC I/Ob8 /NC I/Ob7 I/Ob6 VCCQ VSSQ I/Ob5 I/Ob4 I/Ob3 I/Ob2 VSSQ VCCQ I/Ob1 I/Ob0 VSS VSS VCC ZZ I/Oa8 I/Oa7 VCCQ VSSQ I/Oa6 I/Oa5 I/Oa4 I/Oa3 VSSQ VCCQ I/Oa2 I/Oa1 I/Oa0/ NC A67L83161E A67L83181E A67L73321E A67L73361E 68 67 66 65 64 63 62 61 60 59 58 57 56 55 54 53 52 51 MODE MODE A10 A11 A12 A13 A14 A15 A15 VSS VCC A10 A1 A11 A12 A13 A14 VSS VCC A16 A5 A4 A3 A2 A0 NC NC NC NC A16 A5 A4 A3 A2 A1 A0 NC NC NC NC PRELIMINARY (September, 1999, Version 0.1) 2 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Block Diagram (128K X 32/36) ZZ MODE MODE LOGIC ADV/LD CEN CLK CLK LOGIC BURST LOGIC ADDRESS COUNTER CLR A0-A16 ADDRESS REGISTERS WRITE ADDRESS REGISTER 8/9 BYTEa WRITE DRIVER 8/9 ADV/LD R/W BWE BW1 BW2 BW3 BW4 WRITE REGISTRY & CONTROL LOGIC BYTEb WRITE DRIVER BYTEc WRITE DRIVER BYTEd WRITE DRIVER 8/9 8/9 128KX8/X9X4 MEMORY SENSE AMPS OUTPUT BUFFERS I/Os 8/9 8/9 ARRAY 8/9 8/9 DATA-IN REGISTERS CE CE2 CE2 CHIP ENABLE LOGIC PIPELINED ENABLE LOGIC OUTPUT ENABLE LOGIC OE PRELIMINARY (September, 1999, Version 0.1) 3 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Block Diagram (256K X 16/18) ZZ MODE MODE LOGIC ADV/LD CEN CLK CLK LOGIC BURST LOGIC ADDRESS COUNTER CLR A0-A17 ADDRESS REGISTERS WRITE ADDRESS REGISTER 8/9 ADV/LD R/W BWE BW1 BW2 WRITE REGISTRY & CONTROL LOGIC BYTEa WRITE DRIVER 8/9 256KX8/X9X2 MEMORY SENSE AMPS OUTPUT BUFFERS I/OS 8/9 BYTEb WRITE DRIVER 8/9 ARRAY DATA-IN REGISTERS CE CE2 CE2 CHIP ENABLE LOGIC PIPELINED ENABLE LOGIC OUTPUT ENABLE LOGIC OE PRELIMINARY (September, 1999, Version 0.1) 4 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Pin Description Pin No. LQFP (X16/X18) 37 36 35,34,33,32, 100,99,82,81, 44,45,46,47, 48,49,50 80 93 ( BW1) 94 ( BW2 ) LQFP (X32/X36) 37 36 35,34,33,32, 100,99,82,81, 44,45,46,47, 48,49,50 A0 A1 A2 - A16 Synchronous Address Inputs : These inputs are registered and must meet the setup and hold times around the rising edge of CLK. Pins 83 and 84 are reserved as address bits for higher-density 9Mb and 18Mb DBA SRAMs, respectively. A0 and A1 are the two lest significant bits (LSB) of the address field and set the internal burst counter if burst is desired. Synchronous Byte Write Enables : These active low inputs allow individual bytes to be written when a WRITE cycle is active and must meet the setup and hold times around the rising edge of CLK. BYTE WRITEs need to be asserted on the same cycle as the address, BWs are associated with addresses and apply to subsequent data. BW1 controls I/Oa pins; BW2 controls I/Ob pins; BW3 controls I/Oc pins; BW4 controls I/Od pins. Clock : This signal registers the address, data, chip enables, byte write enables and burst control inputs on its rising edge. All synchronous inputs must meet setup and hold times around the clock’s rising edge. Synchronous Chip Enable : This active low input is used to enable the device. This input is sampled only when a new external address is loaded (ADV/ LD LOW). Synchronous Chip Enable : This active low input is used to enable the device and is sampled only when a new external address is loaded (ADV/ LD LOW). This input can be used for memory depth expansion. Synchronous Chip Enable : This active high input is used to enable the device and is sampled only when a new external address is loaded (ADV/ LD LOW). This input can be used for memory depth expansion. Output Enable : This active low asynchronous input enables the data I/O output drivers. Synchronous Address Advance/Load : When HIGH, this input is used to advance the internal burst counter, controlling burst access after the external address is loaded. When HIGH, R/ W is ignored. A LOW on this pin permits a new address to be loaded at CLK rising edge. Symbol Description A17 93 ( BW1) 94 ( BW2 ) 95 ( BW3 ) 96 ( BW4 ) BW1 BW2 BW3 BW4 89 89 CLK 98 98 CE 92 92 CE2 97 97 CE2 86 86 OE 85 85 ADV/ LD PRELIMINARY (September, 1999, Version 0.1) 5 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Pin Description (continued) Pin No. LQFP (X16/X18) 87 LQFP (X32/X36) 87 CEN Symbol Description Synchronous Clock Enable : This active low input permits CLK to propagate throughout the device. When HIGH, the device ignores the CLK input and effectively internally extends the previous CLK cycle. This input must meet setup and hold times around the rising edge of CLK. Snooze Enable : This active high asynchronous input causes the device to enter a low-power standby mode in which all data in the memory array is retained. When active, all other inputs are ignored. Read/Write : This active input determines the cycle type when ADV/ LD is LOW. This is the only means for determining READs and WRITEs. READ cycles may not be converted into WRITEs (and vice versa) other than by loading a new address. A LOW on this pin permits BYTE WRITE operations and must meet the setup and hold times around the rising edge of CLK. Full bus width WRITEs occur if all byte write enables are LOW. SRAM Data I/O : Byte “a” is I/Oa pins; Byte “b” is I/Ob pins; Byte “c” is I/Oc pins; Byte “d” is I/Od pins. Input data must meet setup and hold times around CLK rising edge. 64 64 ZZ 88 88 R/ W (a) 58, 59, 62, 63, 68, 69, 72, 73 (b) 8,9,12,13, 18, 19, 22,23 (a) 52, 53, 56, 57, 58, 59, 62, 63 (b) 68, 69, 72, 73, 74, 75, 78, 79 (c) 2, 3, 6, 7, 8, 9, 12, 13, (d) 18, 19, 22, 23, 24, 25, 28, 29 51 80 1 30 31 I/Oa I/Ob I/Oc I/Od 74 24 NC/I/Oa NC/I/Ob NC/I/Oc NC/I/Od MODE No Connect/Data Bits : On the X16/32 version, these pins are no connect (NC) and can be left floating or connected to GND to minimize thermal impedance. On the X18/36 version, these bits are I/Os. Mode : This input selects the burst sequence. A LOW on this pin selects linear burst. NC or HIGH on this pin selects interleaved burst. Do not alter input state while device is operating. No Connect : These pins can be left floating or connected to GND to minimize thermal impedance. 31 1, 2, 3, 6, 7, 25, 28, 29, 30, 38, 39, 42, 43, 51, 52, 53, 56, 57, 75, 78, 79, 83, 84, 95, 96 38,39,42,43 83,84 NC PRELIMINARY (September, 1999, Version 0.1) 6 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Pin Description (continued) Pin No. LQFP (X16/X18) 15, 16, 41, 65, 91 4, 11, 20, 27, 54, 61, 70, 77 14, 17, 40, 66, 90 5,10,21,26, 55,60,71,76 LQFP (X32/X36) 15, 16, 41, 65, 91 4, 11, 20, 27, 54, 61, 70, 77 14, 17, 40, 66, 90 5,10,21,26, 55,60,71,76 VCC VCCQ VSS VSSQ Power Supply Isolated Output Buffer Supply Ground : GND. Isolated Output Buffer Ground Symbol Description PRELIMINARY (September, 1999, Version 0.1) 7 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Truth Table (Notes 5 - 7) Operation Address Used None CE CE2 CE2 ZZ Deselected Cycle, H X X L X X X L L→H High-Z Power-down Deselected Cycle, None X H X L L X X X L L→H High-Z Power-down Deselected Cycle, None X X L L L X X X L L→H High-Z Power-down Continue Deselect None X X X L H X X X L L→H High-Z 1 Cycle READ Cycle External L L H L L H X L L L→H Q (Begin Burst) READ Cycle Next X X X L H X X L L L→H Q 1,7 (Continue Burst) NOP/Dummy READ External L L H L L H X H L L→H High-Z 2 (Begin Burst) Dummy READ Next X X X L H X X H L L→H High-Z 1,2,7 (Continue Burst) WRITE Cycle External L L H L L L L X L L→H D 3 (Begin Burst) WRITE Cycle Next X X X L H X L X L L→H D 1,3,7 (Continue Burst) NOP/WRITE Abort None L L H L L L H X L L→H High-Z 2,3 (Begin Burst) WRITE Abort Next X X X L H X H X L L→H High-Z 1,2,3,7 (Continue Burst) IGNORE Clock Current X X X L X X X X H L→H 4 Edge (Stall) SLEEP Mode None X X X H X X X X X X High-Z Notes: 1. Continue Burst cycles, whether READ or WRITE, use the same control inputs. The type of cycle performed (READ or WRITE) is chosen in the initial Begin Burst cycle. A Continue Deselect cycle can only be entered if a Deselect cycle is executed first. 2. Dummy READ and WRITE Abort cycles can be considered NOPs because the device performs no operation. A WRITE Abort means a WRITE command is given, but no operation is performed. 3. OE may be wired LOW to minimize the number of control signals to the SRAM. The device will automatically turn off the output drivers during a WRITE cycle. Some users may use OE when the bus turn-on and turn-off times do not meet their requirements. 4. If an Ignore Clock Edge command occurs during a READ operation, the I/O bus will remain active (Low-Z). If it occurs during a WRITE cycle, the bus will remain in High-Z. No WRITE operations will be performed during the Ignored Clock Edge cycle. 5. X means “Don’t Care.” H means logic HIGH. L means logic LOW. BWx = H means all byte write signals ( BW1, BW2 , BW3 and BW4 ) are HIGH. BWx = L means one or more byte write signals are LOW. 6. BW1enables WRITEs to Byte “a” (I/Oa pins); BW2 enables WRITEs to Byte “b” (I/Ob pins); BW3 enables WRITEs to Byte “c” (I/Oc pins); BW4 enables WRITEs to Byte “d” (I/Od pins). 7. The address counter is incremented for all Continue Burst cycles. ADV/ LD L R/ W BWx OE CEN CLK I/O Notes PRELIMINARY (September, 1999, Version 0.1) 8 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Partial Truth Table for READ/WRITE Commands (X16/X18) Operation READ WRITE Byte “a” WRITE Byte “b” WRITE all bytes WRITE Abort/NOP R/ W H L L L L BW1 BW2 X L H L H X H L L H Note : Using R/ W and BYTE WRITE(s), any one or more bytes may be written. Partial Truth Table for READ/WRITE Commands (X32/X36) Operation READ WRITE Byte “a” WRITE Byte “b” WRITE Byte “c” WRITE Byte “d” WRITE all bytes WRITE Abort/NOP R/ W H L L L L L L BW1 BW2 BW3 BW4 X L H H H L H X H L H H L H X H H L H L H X H H H L L H Note : Using R/ W and BYTE WRITE(s), any one or more bytes may be written. Linear Burst Address Table (MODE = LOW) First Address (External) X . . . X00 X . . . X01 X . . . X10 X . . . X11 Second Address (Internal) X . . . X01 X . . . X10 X . . . X11 X . . . X00 Third Address (Internal) X . . . X10 X . . . X11 X . . . X00 X . . . X01 Fourth Address (Internal) X . . . X11 X . . . X00 X . . . X01 X . . . X10 Interleaved Burst Address Table (MODE = HIGH or NC) First Address (External) X . . . X00 X . . . X01 X . . . X10 X . . . X11 Second Address (Internal) X . . . X01 X . . . X00 X . . . X11 X . . . X10 Third Address (Internal) X . . . X10 X . . . X11 X . . . X00 X . . . X01 Fourth Address (Internal) X . . . X11 X . . . X10 X . . . X01 X . . . X00 PRELIMINARY (September, 1999, Version 0.1) 9 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Absolute Maximum Ratings* Power Supply Voltage (VCC) . . . . . . . . . . -0.5V to +4.6V Voltage Relative to GND for any Pin Except VCC (Vin, Vout) . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to VCC +0.5V Operating Temperature (Topr) . . . . . . . . . . . 0°C to 70°C Storage Temperature (Tbias) . . . . . . . . . . -10°C to 85 °C Storage Temperature (Tstg) . . . . . . . . . . -55°C to 125°C *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics and Operating Conditions (0°C ≤ TA ≤ 70°C, VCC, VCCQ = +3.3V± 5% unless otherwise noted) Symbol VIH VIL ILI ILO Parameter Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current 0V ≤ VIH ≤ VCC Output(s) disabled, 0V ≤ VIN≤ VCC VOH VOL VCC VCCQ Output High Voltage Output Low Voltage Supply Voltage Isolated Output Buffer Supply IOH = -4.0mA IOL = 8.0mA 3.135 3.135 2.4 0.4 3.465 VCC V V V V 1,4 1,4 1 1,5 Conditions Min. 2.0 -0.3 -1.0 -1.0 Max. VCC+0.3 0.8 1.0 1.0 Unit V V µA µA Note 1,2 1,2 3 Capacitance Symbol CI CO CA Parameter Control Input Capacitance Input/Output Capacitance (I/O) Address Capacitance Conditions TA = 25°C; f = 1MHz VCC = 3.3V Typ. 3 4 3 Max. 4 5 3.5 Unit pF pF pF Note 6 6 6 Note : 1. All voltages referenced to VSS (GND). 2. Overshoot : VIH ≤ +4.6V for t ≤ tKHKH/2 for I ≤ 20mA Undershoot : VIL ≥ -0.7V for t ≤ tKHKH/2 for I ≤ 20mA Power-up : VIH ≤ +3.456V and VCC ≤ 3.135V for t ≤ 200ms 3. MODE pin has an internal pull-up and exhibits an input leakage current of ±10µA. 4. The load used for VOH, VOL testing is shown in Figure 2. AC load current is higher than the shown DC values. AC I/O curves are available upon request. 5. VCC and VCCQ can be externally wired together to the same power supply. 6. This parameter is sampled. PRELIMINARY (September, 1999, Version 0.1) 10 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series ICC Operating Condition and Maximum Limits Max. Symbol Parameter -10 -11 -12 Unit Conditions Device selected; All inputs ≤ VIL or ≥ VIH; Cycle time ≥ tKC (MIN); VCC = MAX; Output open Device selected; VCC = MAX; CEN ≥ VIH; All inputs ≤ VSS+0.2 or ≥VCC-0.2; Cycle time ≥ tKC (MIN) Device deselected; VCC = MAX; All inputs ≤VSS+0.2 or ≥ VCC-0.2; All inputs static; CLK frequency=0 Device deselected; VCC = MAX; All inputs ≤ VIL; or ≥ VIH; All inputs static; CLK frequency=0 Device deselected; VCC = MAX; All inputs ≤ VSS+0.2 or ≥ VCC-0.2; Cycle time ≥ tKC (MIN) ZZ ≥ VIH ICC Power Supply Current : Operating 400 300 250 mA ICC1 Power Supply Current : Idle 18 12 10 mA ISB2 CMOS Standby 10 10 10 mA ISB3 TTL Standby 25 25 25 mA ISB4 Clock Running 85 65 60 mA ISB2Z SLEEP Mode 10 10 10 mA PRELIMINARY (September, 1999, Version 0.1) 11 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series AC Characteristics (Note 4) (0°C ≤ TA ≤ 70°C, VCC = 3.3V± 5%) Symbol Parameter Min. Clock tKHKH tKF tKHKL tKLKH Clock cycle time Clock frequency Clock HIGH time Clock LOW time 10 3.0 3.0 100 11 3.5 3.5 90 12 4.0 4.0 83 ns MHz ns ns -10 Max. Min. -11 Max. Min. -12 Max. Unit Note Output Times tKHQV tKHQX tKHQX1 tKHQZ tGLQV tGLQX tGHQZ Clock to output valid Clock to output invalid Clock to output in Low-Z Clock to output in High-Z OE to output valid OE to output in Low-Z OE to output in High-Z 3.0 4.0 1.5 0 - 10 5.0 5.0 5.0 3.0 4.0 1.5 0 - 11 5.0 5.0 5.0 3.0 4.0 1.5 0 - 12 5.0 5.0 5.0 ns ns ns ns ns ns ns 1,2,3 1,2,3 4 1,2,3 1,2,3 Setup Times tAVKH tEVKH tCVKH tDVKH Address Clock enable ( CEN ) Control signals Data-in 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 2.5 ns ns ns ns 5 5 5 5 Hold Times tKHAX tKHEX tKHCX tKHDX Address Clock enable ( CEN ) Control signals Data-in 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 0.5 ns ns ns ns 5 5 5 5 Notes: 1. This parameter is sampled. 2. Output loading is specified with C1=5pF as in Figure 2. 3. Transition is measured ±200mV from steady state voltage. 4. OE can be considered a “Don’t Care” during WRITE; however, controlling OE can help fine-tune a system for turnaround timing. 5. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK when ADV/ LD is LOW and chip enabled. All other synchronous inputs meet the setup and hold times with stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at each rising edge of CLK (when ADV/ LD is LOW) to remain enabled. PRELIMINARY (September, 1999, Version 0.1) 12 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series AC Test Conditions Input Pulse Levels Input Rise and Fall Times Input Timing Reference Levels Output Reference Levels Output Load GND to 3V 1.5ns 1.5V 1.5V See Figures 1 and 2 +3.3V Q Q ZO=50Ω 50Ω 351Ω 5pF 317Ω VT=1.5V Figure 1 Output Load Equivalent Figure 2 Output Load Equivalent PRELIMINARY (September, 1999, Version 0.1) 13 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series SLEEP Mode SLEEP Mode is a low current “Power-down” mode in which the device is deselected and current is reduced to ISB2Z. This duration of SLEEP Mode is dictated by the length of time the ZZ is in a HIGH state. After entering SLEEP Mode, all inputs except ZZ become disabled and all outputs go to High-Z. The ZZ pin is asynchronous, active high input that causes the device to enter SLEEP Mode. When the ZZ pin becomes logic HIGH, ISB2Z is guaranteed after the time tZZI is met, Any operation pending when entering SLEEP Mode is not guaranteed to successfully complete. Therefore, SLEEP Mode (READ or WRITE) must not be initiated until valid pending operations are completed. Similarly, when exiting SLEEP Mode during tRZZ, only a DESELECT or READ cycle should be given while the SRAM is transitioning out of SLEEP Mode. SLEEP Mode Electrical Characteristics (VCC, VCCQ = +3.3V±5%) Symbol ISB2Z tZZ tRZZ tZZI tRZZI Parameter Current during SLEEP Mode ZZ active to input ignored ZZ inactive to input sampled ZZ active to snooze current ZZ inactive to exit snooze current Conditions ZZ ≥ VIH Min. 0 0 0 Max. 10 2(tKHKH) 2(tKHKH) 2(tKHKH) Unit mA ns ns ns ns 1 1 1 1 Note Note : 1. This parameter is sampled. SLEEP Mode Waveform CLK tZZ tRZZ ZZ tZZI ISUPPLY IISB2Z tRZZI ALL INPUTS (except ZZ) DESELECT or READ Only Output (Q) High-Z : Don't Care PRELIMINARY (September, 1999, Version 0.1) 14 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series READ/WRITE Timing 1 CLK tEVK H 2 tKHKH 3 4 5 6 7 8 9 10 tKHE X tKHKL tKLKH CEN tCVKH CE ADV/ LD R/W tKHCX BWx ADDRESS tAVKH A1 tKHAX tDVKH A2 A3 tKHQV tKHQX1 tKHDX A4 A5 A6 A7 tKHQX Q(A3) tGLQV Q(A4) tGHQZ tGLQX Q(A4+1) tKHQZ D(A5) tKHQX Q(A6) D(A7) I/O D(A1) D(A2) D(A2+1) OE COMMAND BURST WRITE D(A2+1) BURST READ Q(A4+1) WRITE D(A1) WRITE D(A2) READ Q(A3) READ Q(A4) WRITE D(A5) READ Q(A6) : Don't Care WRITE D(A7) DESELECT : Undefined Note : 1. For this waveform, ZZ is tied LOW. 2. Burst sequence order is determined by MODE (0 = linear, 1 = interleaved). BRST operations are optional. 3. CE represents three signals. When CE = 0, it represents CE = 0, CE2 = 0, CE2 = 1. 4. Data coherency is provided for all possible operations. If a READ is initiated the most current data is used. The most recent data may be from the input data register. PRELIMINARY (September, 1999, Version 0.1) 15 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series NOP, STALL and Deselect Cycles 1 CLK 2 3 4 5 6 7 8 9 10 CEN CE ADV/ LD R/W BWx ADDRESS A1 A2 A3 A4 A5 tKHQZ I/O D(A1) Q(A2) Q(A3) D(A4) Q(A5) tKHQX COMMAND WRITE D(A1) READ Q(A2) STALL READ Q(A3) WRITE D(A4) STALL NOP READ Q(A5) : Don't Care CONTINUE DESELECT DESELECT : Undefined Note : 1. The IGNORE CLOCK EDGE or STALL cycle (clock 3) illustrates CEN being used to create a “pause.” A WRITE is not performed during this cycle. 2. For this waveform, ZZ and OE are tied LOW. 3. CE represents three signals. When CE = 0, it represents CE = 0, CE2 = 0, CE2 = 1. 4. Data coherency is provided for all possible operations. If a READ is initiated, the most current data is used. The most recent data may be from the input data register. PRELIMINARY (September, 1999, Version 0.1) 16 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Ordering Information Part No. A67L83161E-10 A67L83161E-11 256K X 16 A67L83161E-12 A67L83181E-10 A67L83181E-11 256K X 18 A67L83181E-12 A67L73321E-10 A67L73321E-11 128K X 32 A67L73321E-12 A67L73361E-10 A67L73361E-11 128K X 36 A67L73361E-12 12ns / 12ns 12ns / 12ns 10ns / 10ns 11ns / 11ns 100L LQFP 12ns / 12ns 10ns / 10ns 11ns / 11ns 100L LQFP 12ns / 12ns 10ns / 10ns 11ns / 11ns 100L LQFP Configure Cycle Time / Access Time 10ns / 10ns 11ns / 11ns 100L LQFP Package PRELIMINARY (September, 1999, Version 0.1) 17 AMIC Technology, Inc. A67L83161/A67L83181/ A67L73321/A67L73361 Series Package Information LQFP 100L Outline Dimensions unit: inches/mm HE E 80 51 A2 A1 y D 81 50 HD D 100 31 1 30 e b c θ Symbol A1 A2 b c HE E HD D e L L1 y θ Dimensions in inches Min. 0.002 0.053 0.011 0.005 0.860 0.783 0.624 0.547 Nom. 0.055 0.013 0.866 0.787 0.630 0.551 0.026 BSC 0.018 0.024 0.039 REF 0° 3.5° 0.004 7° 0.030 Max. 0.057 0.015 0.008 0.872 0.791 0.636 0.555 Dimensions in mm Min. 0.05 1.35 0.27 0.12 21.85 19.90 15.85 13.90 Nom. 1.40 0.32 22.00 20.00 16.00 14.00 0.65 BSC 0.45 0.60 1.00 REF 0° 3.5° 0.1 7° 0.75 Max. 1.45 0.37 0.20 22.15 20.10 16.15 14.10 Notes: 1. Dimensions D and E do not include mold protrusion. 2. Dimensions b does not include dambar protrusion. Total in excess of the b dimension at maximum material condition. Dambar cannot be located on the lower radius of the foot. L L1 PRELIMINARY (September, 1999, Version 0.1) 18 AMIC Technology, Inc.