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A7101

A7101

  • 厂商:

    AMICC(欧密格)

  • 封装:

  • 描述:

    A7101 - 2.4GHz FSK Transceiver - AMIC Technology

  • 数据手册
  • 价格&库存
A7101 数据手册
A7101 Preliminary Document Title 2.4GHz FSK Transceiver Revision History Rev. No. 0.0 0.1 2.4GHz FSK Transceiver History Initial issue Modify current consumption, Tx output power, sensitivity, RSSI range, frequency deviation, data rate, SPI interface, and pin description. Issue Date August 2, 2002 October 16, 2002 Remark Preliminary Preliminary 0.2 0.3 0.4 Modify X’TAL Settling Time, Tx output power (Hi power) Application Circuit, and delete X’TAL accuracy Modify Tx output power (Hi power) Modify data rate and calibration mode June 9, 2003 Dec. 30 2003 March 10, 2004 Preliminary Preliminary Preliminary Important Notice: AMIC reserves the right to make changes to its products or to discontinue any integrated circuit product or service without notice. AMIC integrated circuit products are not designed, intended, authorized, or warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of AMIC products in such applications is understood to be fully at the risk of the customer. PRELIMINARY (March 2004, Version 0.4) AMIC Technology, Corp. A7101 Preliminary Typical Applications Wireless Mouse and Keyboard 2.4GHz ISM Band Communication System Two way wireless Transceiver Wireless toy Wireless Modem 2.4GHz FSK Transceiver General Description The A7101 is a monolithic CMOS integrated circuit intended for use as a low cost FSK transceiver in wireless applications. The device is provided in 48-lead plastic QFN7X7 packaging and is designed to function as a complete FSK transceiver. It is intended for wireless applications in the 2.4GHz to 2.5GHz ISM band. This chip features a fully programmable frequency synthesizer with integrated VCO circuitry. Pin Configurations CAP2_AFC CAP1_AFC CAP3_AFC LPFOUT EN_AFC CMPVIP LPFINN LPFINP TANK1 TANK2 48 47 46 45 44 43 42 41 38 37 40 39 MUTE RSSI VDD_A RXDATA BR_RX NC RFIO BP_BUF TXDATAIN XTAL1 XTAL2 XTALOUT CAPSW BP_REG 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 36 35 34 33 32 LIM2INN LIM2INP LIM1OUT LIM1INN LIM1INP MIXOUT VDD_VCO BP_VCO VT BR_VCO CHPOUT LD A7101 31 30 29 28 27 26 25 VDD_D SPI_CLOCK EN_REG LVOUT SPI_LATCH MODSEL0 Figure 1. QFN Package Top View SPI_DATA MODSEL1 VUOT LVIN REGFB VIN PRELIMINARY (March 2004, Version 0.4) 1 AMIC Technology, Corp. A7101 Block Diagram 34 LIM1OUT 35 LIM2INP 36 LIM2INN MUTE 37 RSSI 38 39 TANK2 40 LPFINP TANK1 41 LPFINN 42 43 LPFOUT 48 CMPVIP 2 RXDATA 33 32 31 LIM1INN LIM1INP DEMOD Data Slicer LPF Integrator EN_AFC Limiter1 MIXOUT Limiter2 47 46 45 44 29 28 LNA CAP2_AFC CAP1_AFC 5 RFIO PA CAP3_AFC VCO 7 11 8 TXDATAIN CAPSW BP_VCO FSK Modulation Circuit Buffer VT XTAL1 ÷ 32 OSC 33 Bias BR_VCO 27 CHPOUT 9 XTAL2 Counter Phase Detector Charge Pump 26 25 LD 10 XTALOUT 21 REGFB Voltage Regulator & Low voltage detector SPI_DATA EN_REG BP_REG SPI SPI_CLOCK SPI_LATCH Mode Selection MODSEL0 MODSEL1 LVOUT VOUT LVIN 12 13 14 16 22 VIN 23 17 18 19 20 24 Figure 2. System Block Diagram PRELIMINARY (March 2004, Version 0.4) 2 AMIC Technology, Corp. A7101 Specification Parameter General Storage Temperature Operating Temperature Supply Voltage Current Consumption Transceiver Circuit Active (RX Mode) Active (TX Mode @high power) Active (TX Mode @low power) Stand By Mode Sleep Mode Active @VIN = 3.3V Stand By Description Min. -20 0 2.2 2.5 30 17 14 1.5 5 150 5 Typ. Max. 70 50 5 Unit °C °C V mA mA mA mA µA µA µA Current Consumption Embedded Regulator Phase Locked Loop Reference Frequency X’TAL Settling Time Operation Frequency Number of Channels PLL Settling Time RF Front End (TX mode) TX Power RF Output Impedance RF Front End (RX mode) RF Input Impedance Sensitivity Cascaded IIP3 TBM IF Section Intermediate Frequency RSSI Range Modulation / Demodulation Scheme Data rate Frequency Deviation Regulator Supply voltage Output voltage Drop out voltage Load current Battery-Low indicator reference @12MHz, cap. Load = 20pF @ 2MHz spacing @Loop bandwidth = 100KHz High Power Low Power @2.45GHz @2.45GHz @BER=0.001 4,6,8,10,12,14,16 5 2416~2478 32 150 -6 -16 50 50 -80 -30 10.7 MHz ms MHz µs dBm dBm Ohm Ohm dBm dBm MHz dBm @RF input FSK @ Crystal modulation @ VCO modulation @ Crystal modulation @ VCO modulation -90 -50 64 100 50 150 5 2.5 0.2 50 1.2 Kbps Kbps KHz KHz V V V mA V Table 1. PRELIMINARY (March 2004, Version 0.4) 3 AMIC Technology, Corp. A7101 RF - Baseband Interface Pin Number 23 Pin Name VIN GND 7 2 17 18 19 20 24 25 22 13 37 47 TXDATAIN RXDATA SPI_DATA SPI_CLOCK SPI_LATCH MODSEL0 MODSEL1 LD EN_REG LVOUT MUTE EN_AFC Supply voltage. Ground. Transmitter data input. Receiver data output. Data for SPI interface. Clock for SPI interface. Latch for SPI interface. Chip operation mode selection (LSB). Chip operation mode selection (MSB). PLL locked detect Indicator output. Voltage regulator enable pin. Battery-low indicator output. Receiver mute control output pin. AFC circuit control pin. Table 2. Option. Option. Option. Option. Option. Option. Option. Please see Pin Descriptions section for detail. Description Note PRELIMINARY (March 2004, Version 0.4) 4 AMIC Technology, Corp. A7101 Pin Descriptions (I: input O: output OD: open drain output) Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 Symbol VDD_A RXDATA BR_RX NC RFIO BP_BUF TXDATAIN XTAL1 XTAL2 XTALOUT CAPSW BP_REG LVOUT LVIN VDD_D VOUT SPI_DATA SPI_CLOCK SPI_LATCH I/O O I I I O I O O I I O I/OD I I I/O I OD O Analog supply voltage input. Recovered data output. This pin is an open drain output. Receiver band gap bias output. Connect to external resistor to set bias current. This pin must be open. RF input/output port. Noise bypass. Connect to external noise rejection capacitor. Transmitter data input. Colpitts crystal oscillator node 1. Connect to external feedback capacitor. Colpitts crystal oscillator node 2. Connect to external feedback capacitor. Buffered crystal oscillator output. Modulation switch input. Regulator band gap bypass output. Connect to external noise rejection capacitor. Typical output voltage is 1.2V. Battery-Low voltage indicator output. This pin is active low when LVIN is below BP_REG voltage level. Input for battery-low voltage indicator. The indicator compares LVIN with the threshold voltage, BP_REG. Digital supply voltage input. Regulator output voltage. Nominal voltage output is 2.5V. Data for SPI interface. This pin operates as an Input pin when SPI is in Write mode. This pin operates as an open drain output when SPI is in Read mode. Clock input for SPI interface. Latch input for SPI interface. Transceiver (embedded regulator is not included) operation mode selection inputs. 20 24 MODSEL0 MODSEL1 MODSEL[1:0] = 00: Sleep mode. Transceiver circuit is turned off. I MODSEL[1:0] = 01: Stand-by mode. X’TAL oscillator is turned on. MODSEL[1:0] = 10: Transmit mode. MODSEL[1:0] = 11: Receive mode. 21 22 23 25 26 27 28 29 30 REGFB EN_REG VIN LD CHPOUT BR_VCO VT BP_VCO VDD_VCO O I I OD O O I O I Output from regulator feedback network. VOUT is set to nominal voltage when this pin is opened. If other voltage is required, connect it to external resistor to adjust VOUT. Voltage regulator enable pin. Signal is active high. Supply voltage for the internal voltage regulator. Output from PLL lock detector. This pin is active high (Open drain) when PLL is locked. Charge-pump output. This pin charges external capacitor to adjust VCO frequency. VCO band gap bias output. Connect to external resistor to set bias current. VCO tuning voltage input. The VCO frequency increases as VT increases. Noise bypass. Connect to external noise rejection capacitor. VCO supply voltage input. Function Description PRELIMINARY (March 2004, Version 0.4) 5 AMIC Technology, Corp. A7101 Pin Descriptions (I: input O: output OD: open drain output)(continued) Pin No. 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 Symbol MIXOUT LIM1INP LIM1INN LIM1OUT LIM2INP LIM2INN MUTE RSSI TANK2 TANK1 LPFINP LPFINN LPFOUT CAP3_AFC CAP1_AFC CAP2_AFC EN_AFC CMPVIP I/O O I I O I I OD O I I I I O O O O I I Single-ended Mixer output. First Limiter differential positive input. First Limiter differential negative input. First Limiter single-ended output. Second Limiter differential positive input. Second Limiter differential negative input. Receiver mute control output. Open drain output. This pin is active low when received RF signal is under threshold level. Received Signal Strength Indicator output. RSSI output voltage is inversely proportional to the received RF signal power level. Demodulator Tank 2 input. Demodulator Tank 1 input. Low pass filter differential positive input. Low pass filter differential negative input. Low pass filter single-ended output. Auto frequency control circuit output bypass pin3. Connect to external capacitor. Auto frequency control circuit output bypass pin 1. Connect to external capacitor. Auto frequency control circuit output bypass pin 2. Connect to external capacitor. AFC circuit control input. Signal is active high. Positive input for data slicer. Table 3. Function Description PRELIMINARY (March 2004, Version 0.4) 6 AMIC Technology, Corp. A7101 Absolute Maximum Rating* Parameter Supply voltage range (VDD) Other I/O pins range Maximum input RF level Storage temperature range Table 4. *Stresses above those listed under “Absolute Maximum Rating” may cause permanent damage to the device. These are stress ratings only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. With respect to GND GND Rating -0.3 to 5.5 -0.3 to VDD+0.3 0 -20 ~ +70 Unit Vdc Vdc dBm °C PRELIMINARY (March 2004, Version 0.4) 7 AMIC Technology, Corp. A7101 Circuit Description 1. Low Noise Amplifier The first stage of the receiver is a low noise amplifier. The main function of the LNA is to provide enough gain to overcome noise generated by subsequent stages. In order to make the circuit less sensitive to parasitic parameters, and more tolerant to common mode disturbances, differential pair is used. The LNA operates at very low power consumption with modest 20dB voltage gain. It is internally matched to 50ohm. No other external components are required. 2. RF Mixer The RF mixer is designed to translate incoming RF signal to intermediate frequency (IF). The mixer is a conventional double balanced Gilbert cell mixer. Its output impedance is matched to 330ohm. A conventional 330ohm ceramic filter should be connected between the mixer and the first limiter to filter out all un-wanted noise. 3. IF Limiter The IF limiter consists of two stages: The first IF limiter stage consists of 3 differential amplifiers and a single-ended output buffer. The output impedance of the single-ended buffer is matched internally to 330 ohm, permitting direct connection to a 330ohm ceramic filter. A second filter can be connected between the first limiter and the second limiter to increase the receiver selectivity. Minimum input level of approximately 100mVRMS is required at the first limiter to generate a limited signal at the output of the second IF limiter. The first IF limiter provides a gain of approximately 34dB. A by-pass capacitor of 10nF should be used to connect LIM1INN to ground. The second IF limiter consists of 4 differential amplifiers and a differential output buffer. The second IF limiter provides an overall gain of approximately 40 dB. A by-pass capacitor of 10nF should be used to connect LIM2INN to ground. The limiter output is fed directly to the FSK demodulator. 4. Demodulator The demodulator demodulates the FSK signal. It consists of a quadrature multiplier, external LC tank circuit and a tuning circuit to adjust the tank resonant frequency. 5. Low Pass Filter (LPF) An internal operational amplifier connected with external RC components makes up the LPF. The bandwidth of LPF can be determined by external RC values. 6. Data Slicer The data slicer compares the output of low pass filter with internal reference voltage threshold, VREF and provides binary logic signals. The data slicer output is open drain type and will be pull high when data is muted. 7. RESET When SPI_CLOCK and SPI _LATCH are both held high simultaneously, bit 4 through bit 9 of the Mode Select Register will be reset to “Low” state. PRELIMINARY (March 2004, Version 0.4) 8 AMIC Technology, Corp. A7101 8. Serial to Parallel Interface (SPI) The SPI bus consists of three signals: SPI_DATA, SPI_CLOCK, and SPI_LATCH. This interface is used for external baseband controller to communicate with transmitter’s internal data and control registers. The contents of the registers are shown in the following register description sections. After setting SPI_LATCH signal to “Low” state, data on SPI_DATA is shifted into the internal shift register on the rising edge of SPI_CLOCK with MSB going in first. SPI_LATCH should be asserted at the end to latch the data packet into the register according to the address bits, bit 0 through bit 3, for each of the registers. All registers can only be written into except the Status Register which can only be read. When the content of the Status Register need to be fetched by external controller, external baseband controller need to make sure that the address bits are pointing to address location 0x0 for proper read operation. After the address bits are shifted into the SPI interface and latched by asserting SPI_LATCH, the SPI interface will be in Read Mode and the content of the Status Register will be shifted out on SPI_DATA pin. When all 12 status bits have been shifted out, the SPI bus will be put back to Write Mode automatically. A. Register Description Note: Convention used: 1: Logic level “ONE”. 0: Logic level “ZERO”. X: Don’t care. Synthesizer Configuration Register I (Write only / Address 0xf) Bit 15 Bit 14 Bit 13 MB6 MB5 MB4 Bit12 MB3 Bit11 MB2 Bit10 MB1 Bit9 MB0 Bit8 MA4 Bit7 MA3 Bit6 MA2 Bit5 MA1 Bit4 MA0 Bit3 1 Bit2 1 Bit 1 1 Bit 0 1 Synthesizer Configuration Register II (Write only / Address 0x7) Bit 15 Bit 14 Bit 13 X MB9 MB8 Bit12 MB7 Bit11 R7 Bit10 R6 Bit9 R5 Bit8 R4 Bit7 R3 Bit6 R2 Bit5 R1 Bit4 R0 Bit3 0 Bit2 1 Bit 1 1 Bit 0 1 Synthesizer Configuration Register I and Synthesizer Configuration Register II control synthesizer frequency settings where MA[4:0]: A counter[4:0], MB[9:0]: B counter[9:0], R[7:0]: R counter[7:0]. Valid range is from 2 to 255. The content of A, B and R registers are in unsigned binary format (i.e., 111112 = 3110). The equation for setting the synthesizer frequency is: (B must be greater than A). fvco = fcrystal * (32*B + A) / R fref =fcrystal / R Crystal Control Register (Write only / Address 0xb) Bit 15 Bit 14 Bit 13 Bit12 Bit11 Bit10 0 DP TXH2 TXH1 TXH0 TXL2 Bit9 TXL1 Bit8 TXL0 Bit7 FX3 Bit6 FX2 Bit5 FX1 Bit4 FX0 Bit3 1 Bit2 0 Bit 1 1 Bit 0 1 DP: Data Polarity. This control bit sets data output polarity. 0: Data is inverted. 1: Normal. TXH[2:0]: Reserved. Must be set to 0x0 for proper operation. TXL[2:0]: Reserved. Must be set to 0x0 for proper operation. FX[3:0]: Reserved. Must be set to 0x0 for proper operation. PRELIMINARY (March 2004, Version 0.4) 9 AMIC Technology, Corp. A7101 VCO Control Register (Write only / Address 0x3) Bit 15 Bit 14 Bit 13 VTH2 VTH1 VTH0 Bit12 T1 Bit11 T0 Bit10 HP0 Bit9 CP2 Bit8 CP1 Bit7 CP0 Bit6 VC2 Bit5 VC1 Bit4 VC0 Bit3 0 Bit2 0 Bit 1 1 Bit 0 1 VTH[2:0]: Set VCO tuning voltage range. Valid range is from 0x7 to 0x0. The setting of VTH varies inversely with the tuning voltage range such that when VTH = 0x0 tuning voltage range is from 0.3V to VDD-0.3V and when VTH = 0x7 tuning voltage range is from 1V to VDD-1V. T[1:0]: Reserved. Must be set to 0x0 for proper operation. HP0: RF output power level control. 0: Low power output (-16 dBm). 1: High power output (-6 dBm). CP[2]: Reserved. Must be set to 0x0 for proper operation. CP[1:0]: Charge pump output current control. Valid range is from 0x3 to 0x0. The setting of CP varies linearly with the output current level such that when CP = 0x0 output current = 100uA and when CP = 0x3 output current = 700uA. VC[2:0]: VCO band selection. RX Control Register (Write only / Address 0xd) Bit 15 Bit 14 Bit 13 T2 T1 T0 Bit12 MT2 Bit11 MT1 Bit10 MT0 Bit9 MTC Bit8 DM4 Bit7 DM3 Bit6 DM2 Bit5 DMI Bit4 DM0 Bit3 1 Bit2 1 Bit 1 0 Bit 0 1 T[2:0]: Reserved. Must be set to 0x3 for proper operation. MT[2:0]: Internal voltage threshold level for mute output (pin 37). Valid range is from 0x7 to 0x0. The setting of MT varies linearly with the voltage reference level such that when MT = 0x0 voltage reference = 1.44V and when MT = 0x7 voltage reference = 0.32V. MTC: RXDATA mute function enable. 0: Disable mute function. 1: Enable mute function. When RSSI output voltage level is higher than the threshold set by MT[2:0], RXDATA becomes inactive and pull high. DM[4:0]: Reference voltage level for demodulator tank center frequency tuning. Valid range is from 0x1f to 0x6. The setting of DM varies with the voltage reference level such that when DM = 0x6 voltage reference = 0.9V and when DM = 0x1f voltage reference = 2.4V. Note: When AFC function is used, set DM[4:0] to 0x0. PRELIMINARY (March 2004, Version 0.4) 10 AMIC Technology, Corp. A7101 Mode Select Register (Write only / Address 0x5) Bit 15 Bit 14 Bit 13 X X X Bit12 X Bit11 X Bit10 SC1 Bit9 SC0 Bit8 XOE Bit7 CM Bit6 EXTB Bit5 MD1 Bit4 MD0 Bit3 0 Bit2 1 Bit 1 0 Bit 0 1 SC[1:0]: Status Register bit 6 control. Depends on the setting of SC[1:0], bit 6 of the Status Register can represent system error flag, Battery-low detect or PLL lock detect. [1:0] = 10: System Error. [1:0] = 11: Battery-low detect. [1:0] = 0X: PLL lock detect. XOE: Crystal oscillator buffer output enable. 0: Output enable. 1: Output disable. The output will be forced to low level at this setting. CM: Calibration mode setting for VCO band selection. 0: manual calibration mode. Please see application note for detail description. 1: auto calibration mode. EXTB: Operating mode selection. 0: external mode. Operation mode is determined by external pin MODSEL0 and MODSEL1. 1: internal mode. Operation mode is determined by setting of MD[1:0]. MD[1:0]: Internal mode selection. [1:0] = 00: Sleep mode. Transceiver circuit is turned off. [1:0] = 01: Stand-by mode. X’TAL oscillator is turned on. [1:0] = 10: Transmit mode. [1:0] = 11: Receive mode. Status Register (Read only / Address 0x0) SR15 SR14 SR13 SR12 SR11 SR10 X X X X X X SR9 X SR8 X SR7 X SR6 S/B/P SR5 X SR4 X SR3 0 SR2 0 SR1 0 SR0 0 S/B/P: Depends on the setting of SC[1:0] in Mode Select Register, this bit can be used to reflect the status of System Error, Battery-low detect or PLL lock detect. System Error: 0: Normal; 1: Error. Battery-low detect: 0: Battery supply voltage below threshold. 1: Normal. PLL lock detect: 0: Unlock. 1: Lock. SR[3:0] address bits. PRELIMINARY (March 2004, Version 0.4) 11 AMIC Technology, Corp. A7101 B. SPI Timing Diagram Bit15 Bit14 Bit13 Bit12 Bit11 Bit10 Bit9 Bit5 Bit4 Bit3 Bit2 Bit1 Bit0 VH VI SPI_DATA SPI_CLOCK tCS tCH tCWH tCWL tEW tES SPI_LATCH Figure 3. SPI WRITE mode timing diagram After reading 12 bits, SPI is set to write mode SR0 SR1 SR2 SR3 SR4 SR5 SR6 SR7 SR11 SR12 SR13 SR14 SR15 Bit15 Bit14 SPI_DATA SPI_CLOCK SPI_LATCH Figure 4. SPI READ mode timing diagram PRELIMINARY (March 2004, Version 0.4) 12 AMIC Technology, Corp. A7101 C. SPI Timing Specification Value Symbol VH Vl tCE tCH tCWH tCWL tES tEW Parameter The High level of voltage The low level of voltage SPI_DATA to SPI_CLOCK setup time SPI_CLOCK to SPI_DATA hold time SPI_CLOCK pulse width high SPI_CLOCK pulse width low SPI_CLOCK to SPI_LATCH setup time SPI_LATCH pulse width Conditions Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Three wire SPI_CLOCK, SPI_DATA, SPI_LATCH timing diagram Table 5. 50 10 50 50 50 50 Min VCC-0.4 0.4 Typ Max V V ns ns ns ns ns ns Units 9. PLL Section The sub-block diagram of PLL is shown in the following: Input from reference crystal OSC. M Counter VCO input PRESCALER 32/33 R Counter 8 bit A Counter 5 bit B Counter 10 bit Phase Detector CHPOUT Charge Pump Control Logic Figure 5. Phase Lock Loop Block Diagram PRELIMINARY (March 2004, Version 0.4) 13 AMIC Technology, Corp. A7101 A. M Counter The M counter consists of a 32/33 pre-scalar, a 5-bit A counter and a 10-bit B counter (where M = B*32+A). B. A and B counters A and B counters can be programmed through the Synthesizer Configuration Register I and II. The corresponding relations between the division ratio counters and Synthesizer Configuration Register are shown in the following table: M counter (DEC) 24000 24001 . 24031 24032 24033 . 24063 24064 . . 24992 24993 24994 24995 24996 24997 24998 24999 25000 C. R counter R counter division R (DEC) 2 3 . 100 101 102 . 120 . 255 R counter R4 R3 0 0 0 0 . . 0 0 0 0 0 0 . . 1 1 . . 1 1 Table 7. B counter A counter B counter (binary) A counter (binary) (DEC) (DEC) MB9 MB8 MB7 MB6 MB5 MB4 MB3 MB2 MB1 MB0 MA4 MA3 MA2 MA1 MA0 750 0 1 0 1 1 1 0 1 1 1 0 0 0 0 0 0 750 1 1 0 1 1 1 0 1 1 1 0 0 0 0 0 1 . . . . . . . . . . . . . . . . . 750 31 1 0 1 1 1 0 1 1 1 0 1 1 1 1 1 751 0 1 0 1 1 1 0 1 1 1 1 0 0 0 0 0 751 1 1 0 1 1 1 0 1 1 1 1 0 0 0 0 1 . . . . . . . . . . . . . . . . . 751 31 1 0 1 1 1 0 1 1 1 1 1 1 1 1 1 752 0 1 0 1 1 1 1 0 0 0 0 0 0 0 0 0 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 781 0 1 1 0 0 0 0 1 1 0 1 0 0 0 0 0 781 1 1 1 0 0 0 0 1 1 0 1 0 0 0 0 1 781 2 1 1 0 0 0 0 1 1 0 1 0 0 0 1 0 781 3 1 1 0 0 0 0 1 1 0 1 0 0 0 1 1 781 4 1 1 0 0 0 0 1 1 0 1 0 0 1 0 0 781 5 1 1 0 0 0 0 1 1 0 1 0 0 1 0 1 781 6 1 1 0 0 0 0 1 1 0 1 0 0 1 1 0 781 7 1 1 0 0 0 0 1 1 0 1 0 0 1 1 1 781 8 1 1 0 0 0 0 1 1 0 1 0 1 0 0 0 Table 6. R7 0 0 . 0 0 0 . 0 . 1 R6 0 0 . 1 1 1 . 1 . 1 R5 0 0 . 1 1 1 . 1 . 1 R2 0 0 . 1 1 1 . 0 . 1 R1 1 1 . 0 0 1 . 1 . 1 R0 0 1 . 0 1 0 . 1 . 1 Note: Valid range of R counter is from 2 to 255. The equation for setting the synthesizer frequency is: fvco = fcrystal X (32 X B + A) / R (B must be greater than A). PRELIMINARY (March 2004, Version 0.4) 14 AMIC Technology, Corp. A7101 D. Phase Frequency Detector (PFD) and Charge Pump Phase Frequency Detector takes inputs from R counter and M counter, and produces an output proportional to the phase and frequency difference. The following shows a simplified schematic: VDD D1 Q1 DN VCK CLR Delay Element Charge Pump CHPOUT VDD RCK CLR D1 Q1 UP Figure 6. Phase Detector Block Diagram The PFD output waveform is shown below. VCK RCK UP DN CHPOUT LD Locked Figure 7. The PFD output waveform PRELIMINARY (March 2004, Version 0.4) 15 AMIC Technology, Corp. A7101 10. Crystal Oscillator and FSK modulation Section As shown in the following figure, it is a Colpitts type Crystal oscillator(XOSC). The FSK modulation is achieved by switching the external capacitor CX in the XOSC circuit. External Internal Output buffer XTALOUT XTAL1 Cx XTAL2 TXDATAIN CAPSW Figure 8. Crystal Oscillator and FSK modulation Circuit PRELIMINARY (March 2004, Version 0.4) 16 AMIC Technology, Corp. A7101 12.Chip setup procedure: (1) Auto calibration: For Transmitter Operation Step 1: Supply DC voltage to Pin 23, VIN. Step 2: Set Pin 20, MODSEL0 and Pin 24, MODSEL1 to logic 0 (ground) to ensure the IC is operating in external sleep mode after reset. Step 3: Reset IC by setting Pin 18, SPI_CLOCK and Pin 19, SPI _LATCH to logic high simultaneously for more than 1 us. Step 4: Setup IC’s internal control registers by configuring the followings: Synthesizer Configuration Register I, Synthesizer Configuration Register II, Crystal Control Register, and VCO Control Register. All registers should be written to in the order specified above. a. Synthesizer Configuration Register I and II: Set VCO center frequency. b. Crystal Control Register: Set TXDATA polarity. c. VCO Control Register: Set VCO tuning range and charge pump output current. Step 5: Set IC to TX mode. For internal mode operation, set Mode Select Register to 0x05E5. For external mode operation, set Pin 24, MODSEL1 to “logic 1”, Pin 20, MODSEL0 to “logic 0” and set Mode Select Register to 0x05A5. Whenever frequency is to be changed, or system error has been detected (by reading from the Status Register) the IC must be reset by repeating step 2, 3, 4-a, and 5. For Receiver Operation Step 1: Supply DC voltage to Pin 23, VIN. Step 2: Set Pin 20, MODSEL0 and Pin 24, MODSEL1 to logic 0 (ground) to ensure the IC is operating in external sleep mode after reset. Step 3: Reset IC by setting Pin 18, SPI_CLOCK and Pin 19, SPI _LATCH to logic high simultaneously for more than 1 us. Step 4: Setup IC’s internal control registers by configuring the followings: Synthesizer Configuration Register I, Synthesizer Configuration Register II, VCO Control Register, RX Control Register, and the Mode Select Register. All registers should be written to in the order specified above. a. Synthesizer Configuration Register I and II: Set VCO center frequency. b. VCO Control Register: Set VCO tuning range and charge pump output current. c. RX Control Register: Set mute threshold level, RXDATA mute function and reference voltage for demodulator tank center frequency tuning. When AFC function is used, DM[4:0] must be set to 0x0 for proper operation. Step 5: Set IC to RX mode. For internal mode operation, set Mode Select Register to 0x05F5. For external mode operation, set Pin 24, MODSEL1 to “logic 1”, Pin 20, MODSEL0 to “logic 1” and set Mode Select Register to 0x05B5. Whenever frequency is to be changed, or system error has been detected (by reading from the Status Register) the IC must be reset by repeating step 2, 3, 4-a, and 5. (2) Manual calibration: Please see application note (AN_CAL_A7101) for detail description. PRELIMINARY (March 2004, Version 0.4) 17 AMIC Technology, Corp. A7101 Application Circuit C26 NC R14 0 C22 56p C20 NC C19 27p R13 68K L1 4.7u R12 C25 NC C23 1n C18 1n TP1 C24 C21 10n VDD R2 NC 46 45 44 48 47 43 42 41 NC R11 30K TP2 4.7K U1 R9 LIM2INN LIM2INP LIM1OUT LIM1INN LIM1INP 36 35 34 33 32 31 30 C12 29 C11 28 27 26 25 100n R4 100K R5 0 R6 82K C10 56p TP3 C9 NC J1 CON16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MODSEL1(option) MODSEL0(option) VIN EN_REG(option) SPI_LATCH SPI_CLOCK SPI_DATA GND LVOUT(option) LD(option) GND TXDATAIN MUTE(option) EN_AFC(option) XTALOUT(option) RXDATA 5.6p + C13 10u/16V C15 10n C17 10n 330 CF2 1 2 3 SK107MA R8 330 CF1 1 2 3 SK107MA C14 10n C16 10n 38 RSSI 40 EN_AFC CAP2_AFC CAP1_AFC CAP3_AFC CMPVIP LPFINN LPFINP 39 LPFOUT TANK1 VDD C1 1 100n ANTENNA R1 U2 2 OUT BPF IN 1 C4 1n 5 6 7 C29 470P R20 10K X1 12M C33 C28 22p C30 30p R21 3.9K 100n C5 47p C6 100p 8 9 10 11 12 100K 1% 2 3 4 VDD_A RXDATA BR_RX NC RFIO BP_BUF TXDATAIN XTAL1 XTAL2 XTALOUT CAPSW A7101 TANK2 MUTE MIXOUT VDD_VCO BP_VCO VT BR_VCO CHPOUT 37 R7 82 VDD SPI_CLOCK SPI_DATA MODSEL0 13 14 15 16 17 18 19 20 21 22 23 VDD TP4 C7 100n C27 10u 16V R18 75K 24 MODSEL1 BP_REG VDD_D LVOUT VOUT LVIN SPI_LATCH LD EN_REG REGFB VIN C31 100p C8 100n R19 100K Figure 10. Application Circuit for Transceiver (Data rate = 64Kbps) C3 10p C5 C1 20p R2 68K L1 5.6p 4.7u R3 C4 1n TP1 TP2 C2 10n R4 30K C7 1n 680 U1 R6 LIM2INN LIM2INP LIM1OUT LIM1INN LIM1INP 36 35 34 33 32 31 30 C12 29 C18 28 27 26 25 R13 47K C27 20p 10n R11 100K R12 1K 100n R9 1M C19 20p R29 18K C14 10n C11 10n C13 10n 470 CF1 1 2 3 IF FILTER R7 470 C16 R30 10n 62K C26 10p C15 10n 40 47 43 48 42 46 45 44 41 39 EN_AFC CAP2_AFC CAP1_AFC CAP3_AFC CMPVIP LPFINP LPFINN RSSI 38 LPFOUT TANK1 VDD C10 1 RXDATA R5 100n 100K 1% 2 3 4 1 ANTENNA 7 8 C20 22p X1 12M C21 68p 9 10 11 12 TRX_OUT C9 10n 5 6 VDD_A RXDATA BR_RX NC RFIO BP_BUF TXDATAIN XTAL1 XTAL2 XTALOUT CAPSW TANK2 MUTE 37 R8 82 C17 10U/16V VDD A7101 MIXOUT VDD_VCO BP_VCO VT BR_VCO CHPOUT SPI_CLOCK SPI_DATA MODSEL0 100n 13 14 VDD 15 16 17 18 19 20 21 22 23 24 VIN C22 MODSEL1 BP_REG VDD_D LVOUT VOUT LVIN SPI_LATCH LD EN_REG REGFB C25 470p J1 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 CON15 C23 100n C24 10u/16V R17 NC R16 NC C28 100n RXDATA VIN EN_REG SPI_LATCH SPI_CLOCK SPI_DATA LVOUT LD(option) TXDATA MUTE EN_AFC XTALOUT RXDATA GND Figure 11. Application Circuit for Transceiver (Data rate = 250Kbps) PRELIMINARY (March 2004, Version 0.4) 18 AMIC Technology, Corp. A7101 C26 NC R14 0 C22 56p C20 NC C19 27p R13 68K L1 4.7u R12 C25 NC C23 1n C18 1n TP1 C24 C21 10n VDD R2 NC 48 42 47 43 41 46 45 44 NC R11 30K TP2 4.7K U1 R9 LIM2INN LIM2INP LIM1OUT LIM1INN LIM1INP 36 35 34 33 32 31 30 C12 29 C11 28 27 26 25 10n R4 100K R5 0 R6 56K C10 220p TP3 C9 NC J1 CON16 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MODSEL1(option MODSEL0(option VIN EN_REG(option) SPI_LATCH SPI_CLOCK SPI_DATA GND LVOUT(option) LD(option) GND TXDATAIN MUTE(option) EN_AFC(option) XTALOUT(option RXDATA 22p + C13 10u/16V C15 10n C17 10n 330 CF2 1 2 3 SK107MA R8 330 CF1 1 2 3 SK107MA C14 10n C16 10n 38 RSSI 40 39 LPFOUT TANK1 EN_AFC CAP2_AFC CAP1_AFC CAP3_AFC CMPVIP VDD C1 1 100n ANTENNA R1 U2 2 OUT BPF IN 1 C4 0.1u 5 6 7 C29 470P R20 10K X1 12M C33 C28 NC C30 47p R21 NC 100n C5 47p C6 100p 8 9 10 11 12 100K 1% 2 3 4 VDD_A RXDATA BR_RX NC RFIO BP_BUF TXDATAIN XTAL1 XTAL2 XTALOUT CAPSW A7101 LPFINN LPFINP TANK2 MUTE MIXOUT VDD_VCO BP_VCO VT BR_VCO CHPOUT 37 R7 82 VDD SPI_CLOCK SPI_DATA MODSEL0 13 14 15 16 17 18 19 20 21 22 23 VDD TP4 C7 100n C27 10u 16V R18 75K 24 MODSEL1 BP_REG VDD_D LVOUT VOUT LVIN SPI_LATCH LD EN_REG REGFB VIN C31 100p C8 100n R19 100K Figure 12. Application Circuit for Receiver PRELIMINARY (March 2004, Version 0.4) 19 AMIC Technology, Corp. A7101 Ordering Information Part No. A71P024P01Q Package QFN 48L PRELIMINARY (March 2004, Version 0.4) 20 AMIC Technology, Corp. A7101 Package Information QFN 48L (7 x 7mm) Outline Dimensions aaa C unit: inches/mm B D D1 θ A E E1 C C L b A1 A3 Detail B See Detail B C D 0.05 C A A2 Seating Plane bbb M C A B D2 A A2 E2 See Detail A 0.6max b Detail A e Symbol A A1 A2 A3 b D D1 D2 E E1 E2 e L θ aaa bbb Dimensions in inches Min 0.031 0.000 0.007 Nom 0.033 0.001 0.026 0.008 0.009 0.276 BSC 0.266 BSC 0.089 0.185 0.276 BSC 0.266 BSC 0.089 0.012 0° 0.185 0.020 BSC 0.016 0.020 12° 0.010 0.004 0.207 0.207 Max 0.039 0.002 0.039 0.012 Dimensions in mm Min 0.80 0.00 0.18 Nom 0.85 0.02 0.65 0.20 0.23 7.00 BSC 6.75 BSC 2.25 4.70 7.00 BSC 6.75 BSC 2.25 0.30 0° 4.70 0.5 BSC 0.40 0.50 12° 0.25 0.10 5.25 5.25 Max 1.00 0.05 1.00 0.30 PRELIMINARY (March 2004, Version 0.4) 21 AMIC Technology, Corp. 0.6max b D
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