LP62S1024BV-55LLIF

LP62S1024B-I Series 128K X 8 BIT LOW VOLTAGE CMOS SRAM Document Title 128K X 8 BIT LOW VOLTAGE CMOS SRAM Revision History Rev. No. 0.0 0.1 1.0 1.1 1.2 History Initial issue Add 32L Pb-Free TSSOP package type Final version release Change ICCDR1, ICCDR2 (max.) from 3μA to 1μA Add Pb-Free package type for all parts Issue Date May 30, 2002 October 2, 2002 July 18, 2003 June 29, 2004 August 9, 2004 Remark Preliminary Final (August, 2004, Version 1.2) AMIC Technology, Corp. LP62S1024B-I Series 128K X 8 BIT LOW VOLTAGE CMOS SRAM Features Power supply range: 2.7V to 3.6V Access times: 55/70 ns (max.) Current: Very low power version: Operating: 30mA(max.) Standby: 5uA (max.) Full static operation, no clock or refreshing required All inputs and outputs are directly TTL-compatible Common I/O using three-state output Output enable and two chip enable inputs for easy application Data retention voltage: 2V (min.) Available in 32-pin SOP, TSOP, TSSOP (8 X 13.4mm) forward type and 36-pin CSP packages General Description The LP62S1024B-I is a low operating current 1,048,576-bit static random access memory organized as 131,072 words by 8 bits and operates on a low power voltage: 2.7V to 3.6V. It is built using AMIC's high performance CMOS process. Inputs and three-state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Two chip enable inputs are provided for POWER-DOWN and device enable and an output enable input is included for easy interfacing. Data retention is guaranteed at a power supply voltage as low as 2V. Product Family Product Family Operating Temperature VCC Range Power Dissipation Speed Data Retention (ICCDR, Typ.) Standby (ISB1, Typ.) Operating (ICC2, Typ.) Package Type 32L SOP LP62S1024B -40°C ~ +85°C 2.7V~3.6V 55ns / 70ns 0.05µA 0.08µA 1.5mA 32L TSOP 32L TSSOP 36B µBGA 1. Typical values are measured at VCC = 3.0V, TA = 25°C and not 100% tested. 2. Data retention current VCC = 2.0V. (August, 2004, Version 1.2) 1 AMIC Technology, Corp. LP62S1024B-I Series Pin Configurations SOP TSOP/TSSOP CSP (Chip Size Package) 36-pin Top View NC A16 A14 A12 A7 A6 A5 A4 A3 A2 A1 A0 I/O1 I/O2 I/O3 GND 1 2 3 4 5 32 31 30 29 28 VCC A15 CE2 WE A13 A B C D E F G H 17 32 1 A0 I/O5 I/O6 GND VCC I/O7 I/O8 A9 OE A10 NC CE1 A11 NC A16 A12 A15 A13 2 A1 A2 3 CE2 WE NC 4 A3 A4 A5 5 A6 A7 6 A8 I/O1 I/O2 VCC GND I/O3 I/O4 A14 16 1 LP62S1024BV-I (LP62S1024BX-I) LP62S1024BM-I 6 7 8 9 10 11 12 13 14 15 16 27 26 25 24 23 22 21 20 19 18 17 A8 A9 A11 OE A10 CE1 I/O8 I/O7 I/O6 I/O5 I/O4 Pin No. Pin Name Pin No. Pin Name 1 A11 17 A3 2 A9 18 A2 3 A8 19 A1 4 A13 20 A0 5 WE 21 I/O 1 6 CE2 22 I/O 2 7 A15 23 I/O 3 8 VCC 24 GND 9 NC 25 I/O 4 10 A16 26 I/O 5 11 A14 27 I/O 6 12 A12 28 I/O 7 13 A7 29 I/O 8 14 A6 30 CE1 15 A5 31 A10 16 A4 32 OE Block Diagram A0 VCC GND A14 A15 A16 ROW DECODER 512 X 2048 MEMORY ARRAY I/O1 INPUT DATA CIRCUIT COLUMN I/O I/O8 CE2 CE1 OE WE CONTROL CIRCUIT (August, 2004, Version 1.2) 2 AMIC Technology, Corp. LP62S1024B-I Series Pin Descriptions - SOP Pin No. 1 2 - 12, 23, 25 - 28, 31 13 - 15, 17 - 21 16 22 Symbol NC A0 - A16 Description No Connection Address Inputs Pin Description – TSOP/TSSOP Pin No. Symbol Description 1 - 4, 7, 10 - 20, 31 5 6 8 9 21 - 23, 25 - 29 24 30 32 A0 - A16 WE CE2 VCC NC I/O1 - I/O8 GND CE1 OE Address Inputs Write Enable Chip Enable Power Supply No Connection Data Input/Outputs Ground Chip Enable Output Enable I/O1 - I/O8 GND Data Input/Outputs Ground CE1 OE WE CE2 VCC Chip Enable Output Enable Write Enable Chip Enable Power Supply 24 29 30 32 Pin Description - CSP Symbol Description Symbol Description A0 - A16 WE OE CE1 CE2 Address Inputs Write Enable Output Enable Chip Enable Chip Enable NC I/O1 - I/O8 VCC GND -- No Connection Data Input/Output Power Supply Ground -- (August, 2004, Version 1.2) 3 AMIC Technology, Corp. LP62S1024B-I Series Recommended DC Operating Conditions (TA = -40°C to +85°C) Symbol Parameter Min. Typ. Max. Unit VCC GND VIH VIL CL TTL Supply Voltage Ground Input High Voltage Input Low Voltage Output Load Output Load 2.7 0 2.2 -0.3 - 3.0 0 - 3.6 0 VCC + 0.3 +0.6 30 1 V V V V pF - Absolute Maximum Ratings* VCC to GND ...............................................-0.5V to +4.6V IN, IN/OUT Volt to GND..................... -0.5V to VCC +0.5V Operating Temperature, Topr ................... -40°C to +85°C Storage Temperature, Tstg..................... -55°C to +125°C Temperature Under Bias, Tbias................ -10°C to +85°C Power Dissipation, PT ............................................... 0.7W *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to this device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied or intended. Exposure to the absolute maximum rating conditions for extended periods may affect device reliability. DC Electrical Characteristics Symbol Parameter (TA = -40°C to +85°C, VCC = 2.7V to 3.6V, GND = 0V) LP62S1024B-55LLI/70LLI Min. Max. Unit Conditions ⎜ILI⎥ Input Leakage Current - 1 µA VIN = GND to VCC CE1 = VIH or CE2 = VIL or OE = VIH or W E = VIL VI/O = GND to VCC CE1 = VIL, CE2 = VIH II/O = 0mA Min. Cycle, Duty = 100% CE1 = VIL, CE2 = VIH II/O = 0mA CE1 = VIL, CE2 = VIH VIH = VCC, VIL = 0V f = 1 MHZ, II/O = 0mA VCC ≤ 3.3V, CE1 = VIH or CE2 =VIL VCC ≤ 3.3V, CE1 ≥ VCC - 0.2V or CE2 ≤ 0.2V, VIN ≥ 0V IOL = 2.1mA IOH = -1.0mA ⎜ILO⎥ Output Leakage Current - 1 µA ICC Active Power Supply Current - 3 mA ICC1 Dynamic Operating Current ICC2 - 30 mA - 3 mA ISB ISB1 Standby Power Supply Current - 0.5 5 mA µA VOL VOH Output Low Voltage Output High Voltage 2.2 0.4 - V V (August, 2004, Version 1.2) 4 AMIC Technology, Corp. LP62S1024B-I Series Truth Table Mode CE1 H X CE2 OE X X H L X WE X X H H L I/O Operation Supply Current Standby X L H H H High Z High Z High Z DOUT DIN ISB, ISB1 ISB, ISB1 ICC, ICC1, ICC2 ICC, ICC1, ICC2 ICC, ICC1, ICC2 Output Disable Read Write Note: X = H or L L L L Capacitance (TA = 25°C, f = 1.0MHz) Symbol CIN* CI/O* Parameter Input Capacitance Input/Output Capacitance Min. Max. 6 8 Unit pF pF Conditions VIN = 0V VI/O = 0V * These parameters are sampled and not 100% tested. (August, 2004, Version 1.2) 5 AMIC Technology, Corp. LP62S1024B-I Series AC Characteristics Symbol (TA = -40°C to +85°C, VCC = 2.7V to 3.6V) Parameter LP62S1024B-55LLI Min. Read Cycle tRC tAA tACE1 tACE2 tOE tCLZ1 tCLZ2 tOLZ tCHZ1 tCHZ2 tOHZ tOH Write Cycle tWC tCW tAS tAW tWP tWR tWHZ tDW tDH tOW Write Cycle Time Chip Enable to End of Write Address Setup Time Address Valid to End of Write Write Pulse Width Write Recovery Time Write to Output in High Z Data to Write Time Overlap Data Hold from Write Time Output Active from End of Write 55 50 0 50 40 0 0 25 0 5 25 70 60 0 60 50 0 0 30 0 5 25 ns ns ns ns ns ns ns ns ns ns Output Disable to Output in High Z Output Hold from Address Change Output Enable to Output in Low Z Chip Disable to Output in High Z CE1 CE2 Output Enable to Output Valid Chip Enable to Output in Low Z CE1 CE2 Read Cycle Time Address Access Time Chip Enable Access Time CE1 CE2 55 10 10 5 0 0 0 5 55 55 55 30 20 20 20 70 10 10 5 0 0 0 10 70 70 70 35 25 25 25 ns ns ns ns ns ns ns ns ns ns ns ns Max. LP62S1024B-70LLI Min. Max. Unit Notes: tCHZ1, tCHZ2, tOHZ, and tWHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. (August, 2004, Version 1.2) 6 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms Read Cycle 1 (1, 2, 4) tRC Address tAA tOH tOH DOUT Read Cycle 2 (1, 3, 4, 6) CE1 tACE1 tCLZ15 tCHZ15 DOUT Read Cycle 3 (1, 4, 7, 8) CE2 tACE2 tCLZ25 tCHZ25 DOUT (August, 2004, Version 1.2) 7 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms (continued) Read Cycle 4 (1) tRC Address tAA OE tOE tOLZ CE1 5 tOH tACE1 tCLZ15 CE2 tACE2 tCLZ25 DOUT tCHZ25 tOHZ5 tCHZ15 Notes: 1. 2. 3. 4. 5. 6. 7. 8. W E is high for Read Cycle. Device is continuously enabled CE1 = VIL and CE2 = VIH. Address valid prior to or coincident with CE1 transition low. OE = VIL. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. CE2 is high. CE1 is low. Address valid prior to or coincident with CE2 transition high. Write Cycle 1 (6) (Write Enable Controlled) tWC Address tAW tCW5 CE1 (4) tWR3 CE2 tAS1 WE (4) tWP2 tDW DIN tWHZ tDH tOW DOUT (August, 2004, Version 1.2) 8 AMIC Technology, Corp. LP62S1024B-I Series Timing Waveforms (continued) Write Cycle 2 (Chip Enable Controlled) tWC Address tAW tCW5 CE1 tAS1 (4) tWR3 CE2 (4) tCW5 tWP2 WE tDW DIN tDH tWHZ7 DOUT Notes: 1. 2. 3. 4. tAS is measured from the address valid to the beginning of Write. A Write occurs during the overlap (tWP) of a low CE1, a high CE2 and a low W E . tWR is measured from the earliest of CE1 or W E going high or CE2 going low to the end of the Write cycle. If the CE1 low transition or the CE2 high transition occurs simultaneously with the W E low transition or after the W E transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE1 going low or CE2 going high to the end of Write. 6. OE is continuously low. ( OE = VIL) 7. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. (August, 2004, Version 1.2) 9 AMIC Technology, Corp. LP62S1024B-I Series AC Test Conditions Input Pulse Levels Input Rise and Fall Time Input and Output Timing Reference Levels Output Load 0.4V to 2.4V 5 ns 1.5V See Figures 1 and 2 TTL TTL CL 30pF CL 5pF * Including scope and jig. * Including scope and jig. Figure 1. Output Load Figure 2. Output Load for tCLZ1, tCLZ2, tOHZ, tOLZ, tCHZ1, tCHZ2, tWHZ, and tOW Data Retention Characteristics (TA = -40°C to 85°C) Symbol VDR1 VCC for Data Retention VDR2 2.0 3.6 V CE2 ≤ 0.2V, VCC = 2V, CE1 ≥ VCC - 0.2V, VIN ≥ 0V VCC = 2V, CE2 ≤ 0.2V, VIN ≥ 0V See Retention Waveform Parameter Min. 2.0 Max. 3.6 Unit V Conditions CE1 ≥ VCC - 0.2V ICCDR1 Data Retention Current - 1* µA ICCDR2 tCDR tR * Chip Disable to Data Retention Time Operation Recovery Time ICCDR: max. - 1* µA 0 5 - ns ms LP62S1024B-55LLI/70LLI 1µA at TA = 0°C to + 40°C (August, 2004, Version 1.2) 10 AMIC Technology, Corp. LP62S1024B-I Series Low VCC Data Retention Waveform (1) ( CE1 Controlled) DATA RETENTION MODE VCC 3.0V tCDR VDR ≥ 2V 3.0V tR CE1 VIH CE1 ≥ VDR - 0.2V VIH Low VCC Data Retention Waveform (2) (CE2 Controlled) DATA RETENTION MODE VCC 3.0V tCDR VDR ≥ 2V 3.0V tR CE2 VIL CE2 ≤ 0.2V VIL (August, 2004, Version 1.2) 11 AMIC Technology, Corp. LP62S1024B-I Series Ordering Information Part No. LP62S1024BM-55LLI LP62S1024BM-55LLIF LP62S1024BV-55LLI LP62S1024BV-55LLIF 55 LP62S1024BX-55LLI LP62S1024BX-55LLIF LP62S1024BU-55LLI LP62S1024BU-55LLIF LP62S1024BM-70LLI LP62S1024BM-70LLIF LP62S1024BV-70LLI LP62S1024BV-70LLIF 70 LP62S1024BX-70LLI LP62S1024BX-70LLIF LP62S1024BU-70LLI LP62S1024BU-70LLIF 30 5 32L TSSOP 32L Pb-Free TSSOP 36L CSP 36L Pb-Free CSP 30 5 32L TSSOP 32L Pb-Free TSSOP 36L CSP 36L Pb-Free CSP 32L SOP 32L Pb-Free SOP 32L TSOP 32L Pb-Free TSOP Access Time (ns) Operating Current Max. (mA) Standby Current Max. (µA) Package 32L SOP 32L Pb-Free SOP 32L TSOP 32L Pb-Free TSOP (August, 2004, Version 1.2) 12 AMIC Technology, Corp. LP62S1024B-I Series Package Information SOP (W.B.) 32L Outline Dimensions 32 17 e1 ~ unit: inches/mm HE E L 1 b 16 Detail F e1 c A2 A D s Seating Plane y D e A1 LE See Detail F Symbol A A1 A2 b c D E e e1 HE L LE S y θ Dimensions in inches 0.118 Max. 0.004 Min. 0.106±0.005 0.016 +0.004 -0.002 0.008 +0.004 -0.002 0.805 Typ. (0.820 Max.) 0.445±0.010 0.050 ±0.006 0.525 NOM. 0.556±0.010 0.031±0.008 0.055±0.008 0.044 Max. 0.004 Max. 0° ~ 1 0 ° Dimensions in mm 3.00 Max. 0.10 Min. 2.69±0.13 0.41 +0.10 -0.05 0.20 +0.10 -0.05 20.45 Typ. (20.83 Max.) 11.30±0.25 1.27±0.15 13.34 NOM. 14.12±0.25 0.79±0.20 1.40±0.20 1.12 Max. 0.10 Max. 0° ~ 1 0 ° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 13 AMIC Technology, Corp. LP62S1024B-I Series Package Information TSOP 32L TYPE I (8 X 20mm) Outline Dimensions D unit: inches/mm e 12.0° A2 E c A GAUGE PLANE A1 θ 0.25 BSC L LE HD Detail "A" Detail "A" y D S b 0.10(0.004) M Symbol A A1 A2 b c D E e HD L LE S Y θ Dimensions in inches 0.047 Max. 0.004±0.002 0.039±0.002 0.008±0.001 0.006±0.001 0.724±0.004 0.315±0.004 0.020 TYP. 0.787±0.007 0.020±0.004 0.031 TYP. 0.0167 TYP. 0.004 Max. 0° ~ 6 ° Dimensions in mm 1.20 Max. 0.10±0.05 1.00±0.05 0.20±0.03 0.15±0.02 18.40±0.10 8.00±0.10 0.50 TYP. 20.00±0.20 0.50±0.10 0.80 TYP. 0.425 TYP. 0.10 Max. 0° ~ 6 ° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 14 AMIC Technology, Corp. LP62S1024B-I Series Package Information TSSOP 32L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm e 12.0° A2 E c GAUGE PLANE A1 θ 0.25 BSC L LE D1 D Detail "A" Detail "A" D 0.10MM S SEATING PLANE b Symbol A A1 A2 b c E e D D1 L LE S y θ Dimensions in inches 0.049 Max. 0.002 Min. 0.039±0.002 0.008±0.001 0.006±0.0003 0.315±0.004 0.020 TYP. 0.528±0.008 0.465±0.004 0.02±0.008 0.0266 Min. 0.0109 TYP. 0.004 Max. 0° ~ 6 ° Dimensions in mm 1.25 Max. 0.05 Min. 1.00±0.05 0.20±0.03 0.15±0.008 8.00±0.10 0.50 TYP. 13.40±0.20 11.80±0.10 0.50±0.20 0.675 Min. 0.278 TYP. 0.10 Max. 0° ~ 6 ° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension e1 is for PC Board surface mount pad pitch design reference only. 4. Dimension S includes end flash. (August, 2004, Version 1.2) 15 AMIC Technology, Corp. A LP62S1024B-I Series Package Information 36LD CSP (6 x 8 mm) Outline Dimensions TOP VIEW BOTTOM VIEW Ball#A1 CORNER 0.10 S C 0.25 S C A B Ball*A1 CORNER 123456 b (36X) 654321 unit: mm A B C D E F G H e A B C D E F G H B A 0.10 C 0.20(4X) E1 E e D1 D SIDE VIEW // 0.25 C A2 C (0.36) SEATING PLANE A1 A Symbol A A1 A2 D E D1 E1 e b Dimensions in mm MIN. 1.00 0.16 0.48 5.80 7.80 ------0.25 NOM. 1.10 0.21 0.53 6.00 8.00 3.75 5.25 0.75 0.30 MAX. 1.20 0.26 0.58 6.20 8.20 ------0.35 Note: 1. THE BALL DIAMETER, BALL PITCH, STAND-OFF & PACKAGE THICKNESS ARE DIFFERENT FROM JEDEC SPEC MO192 (LOW PROFILE BGA FAMILY). 2. PRIMARY DATUM C AND SEATING PLANE ARE DEFINED BY THE SPHERICAL CROWNS OF THE SOLDER BALLS. 3. DIMENSION b IS MEASURED AT THE MAXIMUM. 4. THEERE SHALL BE A MINIMUM CLEARANCE OF 0.25mm BETWEEN THE EDGE OF THE SOLDER BALL AND THE BODY EDGE. (August, 2004, Version 1.2) 16 AMIC Technology, Corp.