ETCSP

data sheet Features: L AMINATE • • • • • • • • Up to 176 ball count 7-12 mm body size Thinnest CSP available at 0.5 mm max mounted height JEDEC Level 1 Reliability to 260 °C reflow temperature Conventional process flow with proven wirebond technology Standardized footprints at 0.5 mm pitch Package stacking potential of tested packages Two stacked die potential etCSP® et CSP® Package: Amkor's et CSP® package is the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. This package can squeeze into applications requiring a thin form factor. The et CSP® package is constructed using conventional IC processing including standard wire bonding, molding and substrate infrastructure. The resulting package consists of one or two peripheral rows of 0.3 mm diameter solder balls to allow common SMT processing. There are many advantages as a direct result of the unique et CSP® design. One key advantage is the 0.5 mm mounted height of the package, the result of solder ball diameter and thin core laminate substrate. Every other aspect of the package, die, wires and moldcap are within the dimensions of the substrate and solderballs. Another direct result of the et CSP® design is the superior moisture resistance. Since die attach materials are not used to mount the die, there is reduced capability to trap moisture. Therefore, popcorn induced delamination is reduced. The et CSP® package can also be designed with the capability of stacking completely tested packages, i.e., packaged memory, into a single footprint on the motherboard. In this manner, two stacked et CSP™ packages can be tested before mounting and the combined height is less than 1.0 mm. Thermal Performance: 12 x 12 mm body; 176 I/O; Typical 39 °C/W Amkor’s initial et CSP® packages are offered for low power applications. Higher thermal performance can be achieved by adding a heat spreader or heat sink to the die's exposed backside. In addition, future die-up configurations will provide a direct heat dissipation path into the product motherboard through the die backside. Electrical: Inductance (nH) Capacitance (pF) Resistance (mOhms) Min 0.735 0.176 47.9 Max 1.546 0.319 89.83 Package Dimensions: 7 x 7 mm body; 89 I/O; 0.3 mm ball diameter; 100 MHz Package Level*: • Moisture sensitivity JEDEC Level 1 @ 260 °C • Temp Cycle -55° C/+125 °C, 1000 cycles • Temp/Humidity 85 °C/ 85% RH, 1000 hrs • High Temp Storage 150 °C, 1000 hrs • PCT/HAST 130 °C, 85% RH, 96 hrs *Data for 12 x 12 mm body; 176 I/O; 7.62 mm DC die, 0.15 mm thick Board Level: • Thermal cycle -55 °C / 125 °C 2 cycles / hour, 1000 cycles • First failure 1100 cycles • Lead free solder Reliability: Applications: Amkor's et CSP® design makes this package type ideal for PCMCIA card applications, mini disk drives, thin wireless handsets, Flash or EEPROM memory and other portable products where vertical height is limited. Because of the unique design of the et CSP® package, stacking is easily achieved with proper substrate designs. This creates an opportunity to multiply memory capacity without increasing board area. VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS578F Rev Date: 07’03 data sheet etCSP® Cross-section etCSP® LAMINATE Process Highlights Die thickness (max) 150 µm Wire bonding Standard; low loop Die attach adhesive Not required Package marking Laser Standard Materials Package substrate Thin core FR5 or equivalent Au wire 20 µm diameter Encapsulant Standard EMC Solder balls 0.3 mm dia. 63 Sn/37Pb & SnAgCu Top coating Conductive epoxy (option) Shipping et CSP® packages are shipped in JEDEC trays or tape and reel if final electrical testing is performed. Daisy Chain Availability et CSP® 80, 7 x 7, 0.5 mm ball pitch et CSP® 176, 12 x 12, 0.5 mm ball pitch Configuration Options: etCSP® Standard Package Offering (units in mm) Package Size 7x7 8x8 9x9 10 x 10 11 x 11 *Maximum die size may increase +1 mm. Max Die Size 3.6 4.6 5.6 6.6 7.6 Max I/O (2 rows) 96 112 128 144 160 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.