LCC

data sheet Leadless Chip Carrier Package (LCC) Amkor Technology is committed to continuing to service this long established standard industry package. This surface mount package consists of a co-fired ceramic base that has metalized terminals / pads on the sides and bottom of the package. An LCC package has terminals / pads on all four edges of the package. The lid for this package can be either ceramic "frit sealed" or metal "solder sealed". This package provides a hermetic environment for the IC inside. Applications: This IC package technology allows application and design engineers to maximize the performance characteristics of semiconductors (silicon, GaAs and S.A.W.). These packages enable end products (pagers, portable audio/video, disc drives, radio, IF & RF devices/components, telecom) to be reduced in size and weight. Semiconductor families such as operational amplifiers, drivers, optoelectronics, controllers, logic, analog, memory, comparators and more using BiCMOS, CMOS or other silicon/GaAs/S.A.W. technologies are well addressed by the LCC product family. Features: CERAMIC / HERMETIC LCC The LCC offers a variety of features. From standard industry, Amkor provides a platform from prototype-to-production: • Flexible lead / pin counts • Variety of body sizes • Hermetic package • Exceptional thermal and electrical performance by design • Multi-layer, ground / power • Cavity Up / Cavity down configurations • Cavity package VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION. www.amkor.com DS810 Rev Date: 08’02