LQFP

data sheet LQFP Features: LEADFRAME Amkor’s LQFP packaging portfolio provides: • 7 x 7 mm to 28 x 28 mm body size • 32 to 256 lead counts • Copper leadframes • Broad selection of die pad sizes • Custom leadframe design available • 1.4 mm body thickness • Low stress die attach adhesive • Rapid cure mold compound  • Power enhancement version - PowerQuad Low Profile Quad Flat Pack (LQFP) Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Applications: Amkor’s LQFPs are an ideal IC package for most IC semiconductor technologies such as ASIC, DSP, controllers, processors, gate arrays (FPGA/PLD), SRAMs and PC chip sets. LQFPs are particularly suited for light weight, portable electronics requiring broad performance characteristics. Such applications are laptop PCs, video/audio, telecom, cordless/RF, data acquisition, office equipment, disc-drives and communication boards. Thermal Resistance: Single-Layer PCB Pkg Body Size (mm) Pad Size (mm) Theta JA (°C/W) by Velocity (LFPM) 0 200 500 32 ld 100 ld 100 ld 144 ld 176 ld 7x7 14 x 14 14 x 20 20 x 20 24 x 24 5x5 8x8 9.5 x 9.5 8.5 x 8.5 8x8 67.8 41.5 39.7 38.0 38.3 55.9 33.4 31.8 31.2 31.9 50.1 29.5 28.3 28.1 29.0 JEDEC Standard Test Boards Multi-Layer PCB Pkg Body Size (mm) Pad Size (mm) Theta JA (°C/W) by Velocity (LFPM) 0 200 500 32 ld 100 ld 100 ld 144 ld 176 ld 208 ld* 7x7 14 x 14 14 x 20 20 x 20 24 x 24 28 x 28 5x5 8x8 9.5 x 9.5 8.5 x 8.5 8x8 16 x 16 Tested @ 1 W 47.9 31.7 30.0 31.7 31.9 18.1 42.1 26.8 25.1 26.9 27.3 15.3 39.4 24.7 23.0 24.9 25.4 14.4 *Pre-JEDEC Standard Test Boards All others - JEDEC Standard Test Boards Electrical: Pkg Body Size PadSize (mm) (mm) Lead Inductance Capacitance Resistance (nH) (pF) 32 ld 48 ld 100 ld 144 ld 176 ld 208 ld 7x7 7x7 14 x 14 20 x 20 24 x 24 28 x 28 Simulated Results @ 100 MHz Longest Shortest 5x5 Longest Shortest 8x8 Longest Shortest 8.5 x 8.5 Longest Shortest 8x8 Longest Shortest 11 x 11 Longest Shortest 5x5 0.904 0.799 1.110 0.962 2.300 1.520 6.430 4.230 9.510 5.200 9.670 6.190 0.211 0.202 0.225 0.200 0.419 0.322 1.100 1.070 1.270 1.340 1.380 1.210 (mΩ) 9.2 7.8 13.8 12.0 26.3 17.8 62.9 52.6 89.0 64.0 86.2 64.8 Reliability: IC chips are assembled in optimized package designs with proven reliable semiconductor materials. • Moisture sensitivity characterization • PCT • Temp cycle • Temp/humidity • High temp storage JEDEC Level 3 30 °C/60%RH, 192 hrs 121 °C, 100%RH, 2 atm, 504 hours -55/+125 ° C, 1000 cycles 85 °C/85% RH, 1000 hours 150 °C, 1000 hours VISIT AMKOR TECHNOLOGY ONLINE FOR LOCATIONS AND TO VIEW THE MOST CURRENT PRODUCT INFORMATION . www.amkor.com DS232B Rev Date: 08’00 data sheet LQFP Cross-section LQFP Mold Compound Gold Wire LEADFRAME Die Attach Adhesive Leadframe Process Highlights Die thickness 14.5 ± .5 mil Strip solder plating 85/15 Sn/Pb Marking Laser Lead inspection Laser/optical Pack/ship options Bar code, dry pack Wafer backgrinding Available Test Services • Program generation/conversion • Product engineering • Wafer sort • 256 Pin x 20 MHz test system available • -55 °C to +165 °C test available • Burn-in Shipping JEDEC outline CO-124 low profile tray Die Attach Pad Configuration Options: LQFP Nominal Package Dimensions (units in mm) Body Size 7x7 10 x 10 14 x 14 14 x 20 20 x 20 24 x 24 28 x 28 Body Tkns 1.40 1.40 1.40 1.40 1.40 1.40 1.40 Lead Form 1.00 1.00 1.00 1.00 1.00 1.00 1.00 Standoff 0.10 0.10 0.10 0.10 0.10 0.10 0.10 Foot Length 0.60 0.60 0.60 0.60 0.60 0.60 0.60 Tip To Tip 9.0 12.0 16.0 16.0 x 22.0 22.0 26.0 30.0 Lead Count 32/48/64 44/52/64/80 44/64/80/100/120/128 100/128 128/144/176 160/176/216 160/208/256 JEDEC MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 MS-026 Tray Matrix 10 x 25 8 x 20 6 x 15 6 x 12 5 x 12 4 x 10 4x9 Units Per Tray 250 160 90 72 60 40 36 www.amkor.com With respect to the information in this document, Amkor makes no guarantee or warranty of its accuracy or that the use of such information will not infringe upon the intellectual rights of third parties. Amkor shall not be responsible for any loss or damage of whatever nature resulting from the use of, or reliance upon it and no patent or other license is implied hereby. This document does not in any way extend or modify Amkor’s warranty on any product beyond that set forth in its standard terms and conditions of sale. Amkor reserves the right to make changes in its product and specifications at any time and without notice.