10056098-1050011LF

BACKPLANE CONNECTORS AirMax VS® BACKPLANE/MIDPLANE CONNECTORS OVERVIEW The AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. This technology, invented by FCI, enabled low cost, high performance connectors that are a leading backplane interconnect solution for telecom, networking, server, and storage applications. The shieldless Open Pin Field Design with no pre-assigned ground pins provides the ultimate flexibility in board layout. The AirMax VS® connectors addresse a broad range of system architectures, including backplane, midplane, coplanar, midplane orthogonal, cabled backplane, and mezzanine applications. This is a broad, high volume product family that system continues to earn business when competing with the many more expensive and complex shielded connector systems. This is due in part because of its high density, simple modular construction and low cost. Further enhancements of the AirMax® product family are seeing speeds increase up to 25Gb/s, enabling customers to design electronic systems that are highly functional and cost effective. This enables backward compatibility with legacy systems and forward compatibility with the most advanced designs. FEATURES BENEFITS • Innovative shieldless design and air dielectric between adjacent conductors • Reduces cost, improves flexibility and delivers low insertion loss and crosstalk • Open Pin Field Design • Allows mixing of differential pair signals, single ended signals, power and control lines within a standard connector module • Connector available in modules with 3, 4, or 5 pairs per column and 6, 8, or 10 columns per module. 85 ohm versions also available • Enables system configuration using common, off-theshelf modules • Backward mating-compatible interface • Allows designers to choose the right combination for any specific system using common components, reducing cost and lead times • AirMax signal, power, and guidance modules in stock at most distributors • Assurance of supply, short lead times, and competitive pricing all reduce risk to the OEM and contract manufacturers • Available with headers or receptacles on the backplane • Reduces connector cost, weight, and PCB routing complexity • Adopted by multiple industry standard architectures, including Storage Bridge Bay and Serial CPCI • Standard configuration and part numbers accelerate your design and reduce risk • Innovative shieldless edge couple technology and air dielectric between adjacent conductors • 3mm pitch between columns enables two different pairs to route between columns, reducing board layer count, complexity, and system cost • Simplifies design, supply chain management, inventory, and scheduling AirMax VS® BACKPLANE/MIDPLANE CONNECTORS TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Contacts: Copper Alloy • Product: GS-12-239 • Contact Finish: • Application: GS-20-035 • Performance-based plating over nickel at separable interface APPROVALS AND CERTIFICATIONS • Tin over nickel on press-fit tails on standard lead-free products. Tin-lead option available upon request • Telcordia GR-1217-CORE Central Office • Housings: High Performance Thermoplastic, UL94V–0 PACKAGING • Tubes ELECTRICAL PERFORMANCES • Contact Resistance: ≤35mΩ­ initial, ≤10mΩ­ increase after environmental test • Current Rating (≤30°C rise above ambient in still air): 0.5A/contact with all contacts powered • Trays (vertical receptacle only) TARGET MARKETS/APPLICATIONS • Communications • Switches • Routers 100­Ω CONNECTORS • Differential impedance: 100 ± 8Ω­@ 50 ps (10-90%) rise time • Differential insertion loss: