10138651-051202LF

BergStak HS™ 0.50mm Mezzanine Connector Superior performance up to 32Gb/s FLEXIBLE SOLUTION FOR HIGH SPEED APPLICATIONS BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-toboard applications with various heights in different sizes. The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirement. §§Available in 50 positions §§Available in 12mm stack height §§5mm and 8mm stack heights, and up to 120 pin configurations available upon request TARGET MARKETS FEATURES BENEFITS §§Housing and terminal profile optimized to 25Gb/s and §§Supports high speed performance up to 32Gb/s 32Gb/s §§Extension of standard BergStak® 0.50mm §§Supports higher speed applications from PCIe® Gen 3, PCIe® Gen 4 to PCIe® Gen 5 §§Vertical versus vertical mating configuration §§Suitable for parallel board stacking applications §§50 position sizes, 12mm stack height available §§Varying positions and height specification meets 25Gb/s and 32Gb/s requirements §§0.50mm double-row contact pitch conserves printed §§High density for all electrical applications needs circuit board space §§Scoop-proof feature housings §§Prevents reverse mating §§Multiple plating options available §§Satisfies different application requirement §§Multiple packaging options available §§Suitable for various feeding processing §§PCB locator pegs §§Facilitates ease and accuracy during manual assembly §§RoHS compliant and lead-free §§Meets environmental, health and safety requirements *The PCIe® mark is a registered trademark of the PCI-SIG Corp www.amphenol-icc.com Amphenol Information Communications and Commercial Products BergStak HS™ 0.50mm Mezzanine Connector TECHNICAL INFORMATION MATERIAL §§ Durability: 100 mating cycles §§ Housing: Glass filled LCP, UL94V-0 §§ Mating Force: 0.9N max./contact §§ Contact Base Metal: §§ Unmating Force: 0.1N min./contact §§ Receptacle: Copper alloy, high spring ENVIRONMENTAL §§ Plug: Copper alloy §§ Operating Temperature Range: -40°C to +125°C §§ Solder Area Finish: Matte pure tin over nickel §§ High Temperature Life: 105°C ±5°C for 1000 hours ELECTRICAL PERFORMANCE §§ Humidity: 90-95% relative Humidity for 240 hours §§ Insulation Resistance: SPECIFICATIONS §§ Initial: 100MΩ min. §§ Product Specification: GS-12-1479 §§ After Test: 50MΩ min. PACKAGING §§ Current Rating: 0.5A/contact §§ Tape & Reel §§ Contact Resistance: §§ Tube §§ Initial: 50mΩ max. TARGET MARKETS/APPLICATIONS §§ After Test: 70mΩ max. §§ Voltage Rating: 50VAC Datacom Telecom §§ Signal Integrity (Differential pairs): §§ As simulated data Server Storage §§ Impedance: Supports both 85Ω and 100Ω applications Embedded Computer Test Category 25Gb/s 32Gb/s Return Loss -24dB @ 12.5GHz -17.5dB @ 8GHz -12dB @ 16GHz Insertion Loss 0.4dB @ 12.5GHz -0.37dB @ 8GHz -1.2dB @ 16GHz Power-summed NEXT -65dB @ 12.5GHz -62.5dB @ 8GHz -56dB @ 16GHz Power-summed FEXT -62.4dB @ 12.5GHz -63dB @ 8GHz -42dB @ 16GHz MECHANICAL PERFORMANCE PART NUMBERS Positions Description Connector Height (mm) Stack Height (mm) Part Numbers 50 BergStak HS 0.5mm board-to-board, vertical header, 50 positions, single GND, 25Gb/s version 10.67 12 10138650-058202SLF 50 BergStak HS™ 0.5mm board-to-board, vertical header, 50 positions, double GND, 32Gb/s version 10.67 12 10138650-058202DLF 50 BergStak HS™ 0.5mm board-to-board, vertical receptacle, 50 positions 3.8 12 10138651-051202LF www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. BASICSBERGHS050919EA4 ™