MINITEK® HEADERS FOR PIN-IN-PASTE
PROCESSES
PRODUCTS FOR SOLDER-TOBOARD APPLICATIONS
Minitek® is FCI’s brand for board-to-board and
wire/cable-to-board connectors in 2.00mm pitch.
The Minitek® product range includes PCB Card Connectors,
Shrouded and Unshrouded headers and IDC/CTW
receptacles.
FCI is adding five new series of Minitek® Headers to its
product range, dedicated to Pin-in-Paste soldering
processes. This brochure gives additional information
for the correct use of Minitek® PiP connectors in the
application process.
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TARGET MARKETS
Amphenol Information Communications and Commercial Products
MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES
PIN-IN-PASTE
Pin-in-Paste (PiP) technology allows the use of TMT products in SMT manufacturing processes. The connectors are
automatically or manually placed on the board, then soldered in the same operationas the SMT components. Despite
this, the mechanical strenght of the TMT soldering is maintained – still an important requirement for connectors
nowadays in many industrial or automotive applications.
CONNECTOR DESIGN
In order to achieve optimum soldering results, FCI launches dedicated Pin-in-Paste connectors in the basics+
product range. These connectors are fully adapted to Pin-in-Paste processing in all aspects, including plastic
material, housing design, pin length, and packaging.
PLASTIC MATERIAL
HOUSING DESIGN
Minitek PiP headers are moulded in high temperature
thermoplastic and are able to withstand exposure to
260°C peak temperature for 30 seconds maximum in a
convection, infra-red or vapour phase reflow oven.
Standoffs raise the housing body slightly above the
PCB surface and thus allow the molten solder paste
to flow freely from its printed position into the board
hole and around the pin. The standoffs are correctly
positioned for a good solder paste deposit around the
pin. Please respect the stencil design guidelines below
in order to avoid paste deposit around the standoffs.
PIN LENGTH
The connector lead length beyond the bottom of the
PCB is shorter than for traditional TMT products. Thus,
the risk of pushing out the solder paste when inserting
the pin into the PCB hole is very much limited. The
solder paste will not stick on the pin tip or even fall off
completely, but stays around the pin for free flow during
soldering. FCI uses a solder tail length of 2 ± 0.2mm for
Minitek Headers for a standard PCB of 1.6mm thickness.
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PACKAGING
For combining SMT and TMT components not only in
the soldering process, but also in the assembly process,
FCI proposes a choice of pick-and-place packaging for
PiP connectors. The most common part numbers are
available in tape-on-reel packaging, all others in tube.
Disclaimer
Please note that the above information is subject to change without notice.
MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES
TECHNICAL INFORMATION
UNSHROUDED/STACKING
MATERIALS
§
Housing: High temperature thermoplastic
APPROVALS AND CERTIFICATIONS
§
Colour: Black
This product is RoHS compatible according to the
European Union Directive 2002/95/IEC
§
Flammability Rating: UL94V-O
SPECIFICATIONS
§
Pin: Phosphor bronze
§
File Number: E66906
§
Plating: Gold and tin over 1.27µm nickel
§
File Number: LR46923
ELECTRICAL PERFORMANCE
§
Product Drawing: By 8-digit base part number
§
Current Rating: 1A continuous
§
Product Specification: DPS-12-011 and GS-12-163
§
Insulation Resistance: 1000ΩM min.
§
Application Specification: TA-895
§
Dielectric Withstanding Voltage: 650V
§
Reflow Profile: TA-842
MECHANICAL PERFORMANCE
PROCESSING INFORMATION
§ Pin Retention: 7 N min.
§ Compatible with IR reflow soldering processes
ENVIRONMENTAL
§
Operating Temperature Range: -55°C to +125°C
SHROUDED
MATERIALS
§ Housing: High temperature thermoplastic
APPROVALS AND CERTIFICATIONS
§
Colour: Black
This product is RoHS compatible according to the
European Union Directive 2002/95/IEC
§
Flammability Rating: UL94V-O
SPECIFICATIONS
§
Pin: Phosphor bronze
§
File Number: E66906
§
Plating: Gold and tin over 1.27µm nickel
§
File Number: LR46923
ELECTRICAL PERFORMANCE
§
Product Drawing: By 8-digit base part number
§
Current Rating: 2A continuous
§
Product Specification: DPS-12-011 and GS-12-163
§
Insulation Resistance: 1000ΩM min.
§
Application Specification: TA-896
§
Dielectric Withstanding Voltage: 650V
§
Reflow Profile: TA-842
MECHANICAL PERFORMANCE
PROCESSING INFORMATION
§ Pin Retention: 7 N min.
§ Compatible with IR reflow soldering processes
ENVIRONMENTAL
§
Operating Temperature Range: -40°C to +125°C
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Disclaimer
Please note that the above information is subject to change without notice.
MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES
APPLICATION DESIGN GUIDELINES
For application in a Pin-in-Paste process, FCI recommends the application design guidelines below.
STENCIL DESIGN
PASTE APPLICATION
The stencil design is crucial for a good solder joint.
It determines the quantity of paste and the position of
the paste print on the board. Each PCB hole has its own
stencil aperture with enough spacing in between in order
to have separate solder deposits.
The quantity of paste for each hole depends on the
soldering process parameters and the degree of hole
filling. For the squeegee, FCI recommends a 45° angle.
You can use a smaller angle for an even greater degree of
hole filling. The squeegee moves in parallel with with the
shorter sides of the stencil apertures.
This prevents solder robbing from one hole to another
and guarantees the correct quantity of solder paste for
each hole. The print position is slightly asymmetrical so
as to optimise the flow of molten solder paste.
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PASTE APPLICATION
Please use a hole of 0.8mm (right angle headers) or
0.85mm (vertical headers) ± 0.05mm for an optimum
paste deposit. For automatic pick-and-place, lean
towards the upper end of the tolerance. Refer also
to TA-895 (for Headers right angle Shrouded and
Unshrouded) et TA-896 (for Headers vertical Shrouded
and Unshrouded).
Disclaimer
Please note that the above information is subject to change without notice.
MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES
PARTNUMBER SELECTOR - UNSHROUDED HEADERS
8 - DIGIT BASE
PART NUMBER
PLATING
PIN
STYLE
NO. OF POSITIONS
PER ROW
Vertical
10072353
Right Angle
0.76µm (30µin.) Gold on contact
area, 2-6µm (50-150µin.)
Tin on solder side
G
Gold flash on mating area,
2-6µm (50-150µin.)
Tin on solder side
F
3 - DIGIT BASE
PART NUMBER
PLATING
U
Tube without cap from 04 to 25 pos
A
Tape availability on request
Pin Style
Mating Side mm
Solder Side mm
01
4.00
2.00
PIN
STYLE
NO. OF POSITIONS
PER ROW
02 to 25
Minitek® Unshrouded Header
59362
LF
02 to 25
Minitek® Unshrouded Header
10075024
PACKAGING
PACKAGING
STACK
HEIGHT
LF
XXX = mm
Specify mm (i.e., 037=03.7)
in 0.1 mm increments
Vertical
0.76µm (30µin.) Gold on contact
area, 2-6µm (50-150µin.)
Tin on solder side
G
Gold flash on mating area,
2-6µm (50-150µin.)
Tin on solder side
F
U
Tube without cap from 04 to 25 pos
A
Tape availability on request
Pin Style
Oal
Solder
Side mm
22
08.2
2.00
24
09.6
2.00
26
10.2
2.00
28
11.8
2.00
30
13.5
2.00
32
14.1
2.00
34
15.6
2.00
36
17.1
2.00
38
19.1
2.00
40
21.1
2.00
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Disclaimer
Please note that the above information is subject to change without notice.
MINITEK® HEADERS FOR PIN-IN-PASTE PROCESSES
3 - DIGIT BASE
PART NUMBER
PLATING
PIN
STYLE
NO. OF POSITIONS
PER ROW
LF
02 to 25
Minitek® Unshrouded Header
10138654
PACKAGING
Vertical Single Row
Standard packaging in polybags
0.76µm (30µin.) Gold on contact area,
0.76µm (30µin.) Gold on tail
G
Gold flash on mating area,
2-6µm (0.100µin.) Tin on soldier side
T
Pin Style
Oal
Solder Side mm
03
8.00
3.30
04
9.70
2.70
PARTNUMBER SELECTOR - SHROUDED HEADER
8 - DIGIT BASE
PART NUMBER
PLATING
PIN
STYLE
Vertical
10072354
Right Angle
PACKAGING
LF
04 to 50
Minitek® Shrouded Header
10075025
NO. OF POSITIONS
PER ROW
G
Gold flash on mating area,
2-6µm (0.100µin.) Tin on soldier
side
T
ube without cap from 08 to 50 pos
A
Tape availability on request
Pin Style
Mating Side mm
Solder Side mm
01
4.00
2.00
BWBMNTHPIP0621EA4
0.76µm (30µin.) Gold on contact
area, 2-6µm (50-150µin.)
Tin on solder side
U
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Disclaimer
Please note that the above information is subject to change without notice.
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