10139085-121402LF

BergStak+™ 0.80mm Mezzanine Connector Superior performance up to 16Gb/s BOARD-TO-BOARD SOLUTION FOR HIGH SPEED AND HIGH DENSITY APPLICATIONS BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is fully compatible with the existing BergStak® 0.80mm product recommended by the Open Compute Project (OCP). §§Backward mateable and footprint compatible with existing BergStak® 0.80mm §§Available in 80 and 120 positions. Other position options on request §§Available in 5, 8, 12 and 16mm stack heights TARGET MARKETS FEATURES BENEFITS §§Housing and terminal profile optimized to meet 16Gb/s §§Meets PCIe 4.0 industry standards §§Backward mateable and footprint compatible §§Supports migration path from PCIe 3.0 to PCIe 4.0 §§80 and 120 position sizes §§Comprehensive range of sizes and stack heights to satisfy §§5mm, 8mm, 12mm and 16mm stack heights varying needs §§0.8mm double-row contact pitch §§High density for all electrical applications needs §§Scoop-proof feature housings §§Prevents reverse mating §§Multiple plating options available §§Satisfies different application requirement §§Multiple packaging options available §§Suitable for varies feeding processing §§PCB locator pegs option available §§Facilitates ease and accuracy during manual assembly §§RoHS compliant and lead-free §§Meets environmental, health and safety requirements *The PCIe® mark is a registered trademark of the PCI-SIG Corp Amphenol Information Communications and Commercial Products BergStak+™ 0.80mm Mezzanine Connector TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL §§ Housing: Glass filled LCP, UL94V-0 §§ Temperature Range: -40°C to +125°C §§ Contact Base Metal: §§ High Temperature Life: 105°C ±5°C for 1000 hours §§ Receptacle: Copper Alloy, High Spring §§ Humidity: 80%-98% relative humidity, 24h/ §§ Plug: Brass §§ Solder Area Finish: Matte pure Tin over Nickel MECHANICAL PERFORMANCE cycle, total 10 cycles SPECIFICATIONS §§ Product Specification: GS-12-1354 §§ Durability: 100 mating cycles §§ Application Specification: GS-20-0480 §§ Mating Force: 0.9N max./contact §§ Test Report: TBD §§ Unmating Force: 0.9N max./contact PACKAGING ELECTRICAL PERFORMANCE §§ Tape and Reel §§ Insulation Resistance: 1000MΩ min. §§ Tube §§ Current Rating: 0.8A/contact TARGET MARKETS/APPLICATIONS §§ Contact Resistance: §§ Initial: 30mΩ max. Datacom Telecom §§ After Test: 50mΩ max. §§ Voltage Rating: 100VAC §§ Signal Integrity (Differential pairs, connector and SMT pads only) Server Storage §§ Impedance: 85Ω @30ps (20-80%) Embedded Computer §§ Return Loss: -1dB up to 8GHz §§ NEXT: