10147520-144-THLF

BergStak® FX10 0.50mm Board-to-Board Connector HIGH SPEED HIGH DENSITY MINIATURE CONNECTOR The BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Product position is extendable up to 168positions. BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration. This high density connector saves space on PCB and is highly suitable for high-density applications in automotive, data, medical, communication and industrial markets. §§Licensed to Hirose FX10 series §§Data transmission speed up to 15Gb/s+ §§Suitable for high density applications TARGET MARKETS FEATURES BENEFITS §§Authorized second source to Hirose FX10 series §§Fully compatible with Hirose product offering §§High speed performance up to 15Gb/s+ §§Meets next generation high speed transmission requirements §§Suitable for high-density applications §§Saves space §§OIF MSA-100GLH electrical interface §§Standard connector for OIF §§Hold-down feature §§Robust and steady design for customer application §§Halogen-free and RoHS compliant §§Meets environmental, health and safety requirements www.amphenol-icc.com Amphenol Information Communications and Commercial Products BergStak® FX10 0.50mm Board-to-Board Connector TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL §§ Housing: §§ Industrial Atmosphere: Duration 14days §§ Glass filled LCP (UL94V-0, MSL level 1) §§ Vibration Sinusoidal: 10g §§ High temperature thermoplastic §§ Shock Halfsine: 50g §§ Contact Base Metal: §§ Receptacles: Copper alloy §§ Headers: Copper alloy §§ Plating: §§ Solder area finish in gold flash tin over nickel §§ Contact Area: Gold MECHANICAL PERFORMANCE §§ Durability: 100 cycles §§ Mating and Un-mating Force: 86.4N max. and 11.5N min. ELECTRICAL PERFORMANCE §§ Current Rating: 0.4A per contact §§ Contact Resistance: 60mΩ max. APPROVALS AND CERTIFICATIONS §§ UL/CSA E66906 PACKAGING §§ Tape & Reel TARGET MARKETS/APPLICATIONS Display Module Camera Body Control IP Phones Datacom Telecom Router Drone §§ Voltage Resistance: 150V AC applied for 1 minute §§ Signal Integrity: §§ Data Rate: Up to 15Gb/s+ §§ Differential Impedance: 100Ω §§ Single Ended Impedance: 50Ω SPECIFICATIONS §§ Amphenol Product Specification: GS-12-1529 Server Storage Measurement Equipment POS Equipment Portable Industrial Terminal Security Systems Test Equipment Embedded Computer Laser System www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. BergStak® FX10 0.50mm Board-to-Board Connector Stack Height Dimension ”A” Receptacle 1 10147523-XXX-1HLF Header 1 10147520-XXX-SHLF 4.30mm Header 2 10147520-XXX-THLF 6.00mm XXX denotes the number of positions PART NUMBERS Description Part Numbers BergStak FX10 0.50mm board-to-board header for 4.30mm stack height 10147520-144-SHLF BergStak FX10 0.50mm board-to-board header for 6.00mm stack height 10147520-144-THLF Bergstak® FX10 0.50mm board-to-board receptacle 10147523-144-1HLF ® BASICSBERGFX100819EA4 ® www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice.