10151114-001TLF

Storage & Server IO MXM 3.0 Connectors LOW POWER, SMALL FORM FACTOR, HIGH-PERFORMANCE GRAPHICS ADAPTER Amphenol’s MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industrystandard sockets. This helps to upgrade the graphics processor in a device, without changing the whole system or relying on proprietary vendor upgrades. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes PCI Express® signal performance with smaller board space. Typical applications include notebook computers, blade and standard rack-mount servers, mobile workstations and alternative form factor PCs including all-in-one home theater, and small form factor PCs. TARGET MARKETS § Accommodates up to 16 lanes on PCIe® 2.0 § Supports up to 8 DDR2, DDR3, GDDR3 or GDDR5 § Up to 4 Dual-MODE DisplayPorts supporting DVI and HDMI § Single 24-bit dual-link LVDS, dual-link DVI and HDMI § Single VGA and TV-out FEATURES BENEFITS § Card edge connector with 314 contacts on a 0.50mm pitch § Fully compliant with MXM 3.0 specification § Compliant with PCIe® 3.0 § Serves multiple high-speed peripheral applications § Small Form Factor 0.50mm pitch solution § Saves board space § Various connector height options § Reduces overall height profile § Supports both single and double-sided modules § Enables higher data rate transmission www.amphenol-icc.com Amphenol Information Communications and Commercial Products MXM 3.0 Connectors TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL § Contact Base Metal: Copper alloy § EIA-364-1000.01. The test groups/sequences and durations are derived from the following requirements: § Contact Area Finish: Gold over nickel § Durability (mating/unmating) rating of 50 cycles § Solder Area Finish: Tin over nickel § Field Temperature: 65°C § Housing Material: High-temperature thermoplastic (UL94V-0) for reflow soldering or thermoplastic (UL94V-0) for wave soldering. Color: Black § Field Life: Seven years § Temperature Life (preconditioning): 92 hours at 105°C § Metal Board Locks: Copper alloy § Temperature Life: 168 hours at 105°C § Board Locks Finish: Tin over nickel § Mixed Flowing Gas: 10 days ELECTRICAL PERFORMANCE § Useful Field Life: Three (3) years § Contact SPECIFICATIONS Resistance: 30mΩ max. initially with 10mΩ max. change after environmental exposures § Current Rating: 1.1A min. per pin for the 8 power pins and 8 nearest ground pins § Industry § PCI Express® Card Electromechanical Specification § Signal integrity summary § PCI Express® Module Electromechanical Specification § The part series shown on this datasheet support PCI § For more information on the applicable PCI-SIG Express® high speed electrical requirements for 2.5Gb/s (PCIe® Gen 1), 5.0Gb/s (PCIe® Gen 2) , 8.0Gb/s (PCIe® Gen3), 16.0Gb/s (PCIe® Gen 4) and 32.0Gb/s (PCIe® Gen5) with the exception of those part series specifically noted as PCIe® Gen 1 in the part number tables. MECHANICAL PERFORMANCE specifications, visit www.pcisig.com. § AFCI § GS-12-1406 PCI Express® group of connectors APPROVALS & CERTIFICATION § UL and CSA approvals § Durability Rating: 50 cycles min. PACKAGING § PCB Insertion Force: 1.15N max. per contact pair § Hard or soft tray § PCB Removal Force: 0.15N min. per contact pair TARGET MARKETS/APPLICATIONS PC-Notebook Servers Workstations PART NUMBERS Part Numbers MXM 3.0, 0.50mm pitch, 5mm stacked height, 314 pin 10151114-001TLF SSIOMXM0300920EA4 Description www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice.