20021612-00016T4LF

NOTE: 1. MATERIAL, HOUSING: HIGH TEMP PLASTIC, UL94-V0,BLACK TERMINAL: COPPER ALLOY , SQ=0.40±0.03MM 2. FINISH: TERMINAL: GOLD AT CONTACT, G/F OVER 1um(40u")MIN Ni OVER ALL 3. SPEC.: PRODUCT SPEC: GS-12-629 PACKING SPEC: GS-14-1420 4. THE HSG. WILL WITHSTAND EXPOSURE TO 260C PEAK TEMP. FOR 5 SEC. IN A WAVE SOLDER APPLICATION WITH A PCB. 5. PRODUCT NUMBERING: 20021612 - 0 0 0 XX X X LF LEAD FREE PLATING: 1:GOLD FLASH ALL OVER 4:0.25um(10U")GOLD AT CONTACT 8:0.76um(30U")GOLD AT CONTACT 9:1u" GOLD OVER 30u" PdNi AT CONTACT PACKING T: TUBE PIN COUNT SEE TABLE 1 PDS: Rev :C STATUS:Released Printed: Mar 02, 2012