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20021612-00040T1LF

20021612-00040T1LF

  • 厂商:

    AMPHENOL(安费诺)

  • 封装:

  • 描述:

    HD EJECT RA TH

  • 数据手册
  • 价格&库存
20021612-00040T1LF 数据手册
NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 1 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED Section 1: For the 20021122, 20021323, 20021444, 20021511, 20021512, 20021521, 20021611, 20021612, 20021621, 20021811, 20021813, 20021814, 20021822, 20021824, 20021831, 20021832, 20021833, 20021834 and 20021835 series parts. 1.0 GENERAL This specification defines the performance, tests and quality requirements for the 1.27MM Cable to Board (CTB) and Board to Board (BTB) plug and receptacle connectors. This document is composed of the following sections. 1. General 2. Scope 3. Applicable Documents 4. Requirements  Design and Construction  Material  Finish 5. Test Methods and Requirements 6. Test Plan 7. Applicable Part Number and Product Drawing 8. Revision Record 2.0 SCOPE This specification is applicable to the termination characteristics of the 1.27MM cable to board and board to board connector family. 3.0 APPLICABLE DOCUMENTS 3.1 Military Standards: 3.1.1 MIL-STD-1344A: Test methods for electronic and electrical component parts. 3.1.2 MIL-STD-202: Test methods for electronic and electrical component parts. 3.2 Industry Specification/Other Standards: 3.2.1 UL-94: Tests for flammability of plastic materials. 4.0 REQUIREMENT 4.1 Design and Construction: Product shall be of the design, construction and physical dimensions specified on the applicable product drawing. 4.2 Materials 4.2.1 Housing:  The insulators shall be rated flame retardant V-0 in accordance with UL-94. 4.2.2 Contact  Copper Alloy, Selected plating over Nickel under-plated overall. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE PRODUCT SPECIFICATION GS-12-629 TITLE PAGE REVISION 2 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector C AUTHORIZED BY DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 4.3 Ratings 4.3.1 Rated Voltage (Max.): 125 V AC. 4.3.2 Rated Current (Max.): 1A Max. per contact. 4.3.3 Operating Temperature Range: -40℃ to +105℃.(Including temperature rise caused by application of current ) 4.4 Finish: The finish for applicable components shall be specified on the applicable product drawing 5.0 TEST METHODS AND REQUIREMENTS: TEST REQUIREMENTS AND PROCEDURES SUMMARY TEST DESCRIPTION REQUIREMENT PROCEDURED Examination of product Meets requirements of product drawing and Specification. Visual inspection No physical damage ELECTRICAL Contact Resistance Insulation Resistance Dielectric Withstanding Voltage MECHANICAL Durability 30 mΩ Max. (After Test 50 mΩ MIL-STD-1344A method 3002.1 Max.) 100 MΩ Min. at 500 V DC / 2 MIL-STD-1344A method 3003.1 minute No breakdown at 500 V RMS MIL-STD-1344A method 3001.1 100 Cycles MIL-STD-1344A method 2016 Mating Force Meets requirements of product drawing and electrical specification. 220g Max. /Pin Speed 25±3mm/minute Unmating Force 20g Min. /Pin Speed 25±3mm/minute Contact Retention Force Male 300 g Min./Pin Female 150 g Min./Pin MIL-STD-1344A method 2007.1 Vibration MIL-STD-202 method 201 ENVIRONMENTAL Humidity(Steady state) Thermal Shock Dry Heat Cold Meets requirements of product drawing and electrical specification. Meets requirements of product drawing and electrical specification. Meets requirements of product drawing and electrical specification Meets requirements of product drawing and electrical specification. MIL-STD-1344A method 1002.2, Condition B 90-95%, 40C, 96 hours MIL-STD-1344A method 1003.1, Condition A -55C to 85C, 5 cycle The connector housing shall be store at temperature of 105 ± 2°C for 168 hours ICE-60998-1 The connector housing shall be store at temperature of -25 ± 3°C for 48 hours Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE PRODUCT SPECIFICATION GS-12-629 TITLE PAGE REVISION 3 of 13 AUTHORIZED BY Minitek 1.27MM Board to Board & Cable to Board Connector C DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED PHYSICAL Solderability The test area shall be covered more than 95% of immersed area with flash solder Solder Temperature: 245 Immersion Period: 5 Sec ±5 Test Group Test or Examination Examination of Product Contact Resistance A B 1,10 1,6 E C D Test Sequence 1,3 1,3 1,5 2,7 2,7 2,4 F G 1,7 1,9 2,8 Insulation Resistance 3,8 2,5 3,7 Dielectric Withstanding Voltage 4,9 3,6 4,6 Durability 4 Vibration 3 Mating Force & Unmating Force 3,5 Contact Retention Force 2 Humidity-Cycling Test 6 Thermal Shock 5 Cold 5 Dry heat Solderability 4 2 Figure 2 Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 4 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED Section 2: For the 20021111, 20021112, 20021121, 20021211, 20021212, 20021221, 20021311 and 20021321 series parts. 1.0 Objective This specification defines the performance, test, quality and reliability requirements of the Minitek 1.27MM pitch Board to Board product. 2.0 Scope This specification is applicable to the termination characteristics of the Minitek 1.27MM pitch Board to Board connector family of products which provides interconnections via 0.406m square pins between two printed boards. 3.0 4.0 Ratings 3.1 Operating Voltage Rating (Max.) = 125 VAC 3.2 Operating Current Rating (Max.) = 1A Max. Per contacts. 3.3 Operating Temperature Range = -55oC to +125 oC. (Including temperature rise caused by application of current) Applicable Documents 4.1 FCI Specifications 4.1.1 Engineering drawings 20021111, 20021112, 20021121, 20021211, 20021212, 20021221, 20021311, 20021321 4.1.2 Package specification GS-14-1420 4.1.3 Application specification(s) 4.1.4 FCI Product Shelf life Storage-Solderability GS-20-060 Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 5 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector C AUTHORIZED BY DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 4.2 4.3 4.4 National or International Standards 4.3.1 Flammability: UL94V-0 or similar applicable specification 4.3.2 EIA 364: Electrical Connector/Socket Test Procedures Including Environmental Classifications 4.3.3 IPC/ECA J-STD-002C: Solderability Tests and Measurement Military Standards 4.2.1 MIL-STD-202F: Test methods for electronic and electrical component parts. 4.2.2 MIL-STD-1344A: Test methods for electrical connectors. FCI Laboratory Reports - Supporting Data List lab report numbers that contain the supporting qualification test data 4.5 Safety Agency Approvals List the UL, CSA, TUV other product safety agency certification file numbers. 5.0 Requirements 5.1 Qualification Connectors furnished under this specification shall be capable of meeting the qualification test requirements specified herein. 5.2 Material The material for each component shall be as specified herein or equivalent. 5.2.1 Housing – High Temperature plastic, UL94-V0 Compliant. 5.2.2 Terminal – Copper alloy 5.3 Finish The finish for applicable components shall be as specified herein or equivalent. Contact area: 30u” GXT, 15u” GXT, 10u” Au or Gold flash options, over 50u” Nickel underplating; Solder tail area: 100u” Matte Tin or Gold flash options, over 50u” Nickel underplating. 5.4 Design and Construction Connectors shall be of the design, construction, and physical dimensions specified on the applicable product drawing. There shall be no cracks, burrs, or other physical defects that may impair performance. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 6 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED 5.5 Visual Visual examinations shall be performed using 10X magnification. Parts should be free from blistering, cracks, discoloration, etc. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 7 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED 6.0 Electrical Characteristics 6.1 Low Level Contact Resistance (LLCR) The low level contact resistance shall not exceed 30 milliohms initially. The low level contact resistance shall also not exceed 20 milliohms increase (from the initial measurement) after any treatment and/or environmental exposure. The following details shall apply: a. Test Standard: EIA-364-23. b. Test Voltage: 20 milli-volts DC max open circuit. c. Test Current: Not to exceed 100 milli-amperes. 6.2 Insulation Resistance The insulation resistance of unmated connectors shall not be less than 1000 megohms initially or after environmental exposure. The following details shall apply: a. Test Standard: EIA-364-21. b. Test Voltage: 500 volts DC ±10%. c. Electrification Time: 2 minutes, unless otherwise specified. d. Points of Measurement: Between adjacent contacts. 6.3 Dielectric Withstanding Voltage There shall be no evidence of arc-over, insulation breakdown, or excessive leakage current > 1 milliamperes when unmated connectors are tested. The following details shall apply: a. Test Standard: EIA-364-20. b. Test Voltage: 500 volts (AC RMS), 60Hz. c. Test Duration: 60 seconds. d. Test Condition - 1 (760 Torr - sea level). e. Points of Measurement: Between adjacent contacts. 6.4 Current Rating The temperature rise above ambient shall not exceed 30 °C at any point in the system when all contacts are powered at 1.0 (amperes). The following details shall apply: a. Test Standard: EIA-364-70. b. Ambient Conditions – Still air at 25°C. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 8 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED 7.0 Mechanical Characteristics 7.1 Mating/Unmating Force The force to mate a receptacle connector and compatible header shall not exceed 2.2 Newton per contact. The unmating force shall not be less than 0.2 Newton per contact. The following details shall apply: a. Test Standard: EIA-364-13. b. Cross Head Speed: 25.4 mm per minute. c. Lubrication: None. d. Utilize free floating fixtures. 7.2 Durability The connector pairs shall be capable of withstanding 100 mating/unmating cycles. The following details shall apply: a. Test Standard: EIA-364-09. b. Cycling Rate: 200 cycles Maximum per hour. c. Utilize free floating fixtures. 7.3 Durability (Preconditioning) The connector pairs shall be capable of withstanding 20 mating/unmating cycles. The following details shall apply: a. Test Standard: EIA-364-09. b. Cycling Rate: 200 cycles Maximum per hour. c. Utilize free floating fixtures. 7.4 Contact Retention force Individual contacts shall withstand an axial load (Retention force) and the contacts without dislodging from the housing cavity. The following details shall apply: a. Test Standard: EIA-364-29. b. Contact retention force: Male contact, 5.0 Newton Min. per Pin Female contact, 3.0 Newton Min. per Pin c. Cross Head Speed – Applied at a rate of 5.0 mm (0.2 inch) per minute. 7.5 Reseating: Manually insert/extract the connector 3 cycles, there shall no evidence of physical damage. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 9 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY Andy Zhang C DATE Mar. 28 2013 CLASSIFICATION UNRESTRICTED 8.0 Environmental Conditions After exposure to the following environmental conditions in accordance with the specified test procedure and/or details, the product shall show no physical damage and shall meet the electrical and mechanical requirements per paragraphs 6.0 and 7.0 as specified in the Table 1 test sequences. Unless specified otherwise, assemblies shall be mated during exposure. 8.1 Thermal Shock – EIA-364-32. a. Test Condition: Method A, test condition VII, test duration A-4 b. Temperature Range: Between -55°C and +125 °C c. Number of Cycles: 10 cycles d. Transfer Time: 5 minutes, maximum 8.2 Humidity, Steady State – EIA-364-31. a. Test Condition: Method II, Test condition A (96h) b. Temperature: 40°C c. Relative Humidity: 95% 8.3 High Temperature Life – EIA-364-17. a. Test Condition: Test condition 5, Test time condition B a. Test Temperature: 125°C b. Test Duration: 250 hours 8.4 High Temperature Life (Preconditioning) – EIA-364-17. a. Test Condition: Test condition 5, Test time condition A a. Test Temperature: 125°C b. Test Duration: 96 hours 8.5 Vibration (Random) – EIA-364-28. a. Test Condition: Test condition V, Test condition letter A b. Vibration Amplitude: 5.35 rms G minimum c. Power spectral density: 0.02g²/Hz d. Duration: 15 minutes in each of three mutually perpendicular directions e. Mounting: Rigidly mount assemblies f. No discontinuities greater than 1 microsecond Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE PRODUCT SPECIFICATION GS-12-629 TITLE PAGE REVISION 10 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector C AUTHORIZED BY DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 8.6 Mechanical Shock – EIA-364-27. a. Test Condition: Test condition H b. Shocks: 3 shocks in both directions along each of three orthogonal axes (18 shocks total) c. Mounting: Rigidly mount assemblies d. No discontinuities greater than 1 microsecond 8.7 Mixed Flowing Gas corrosion (MFG) – EIA 364-65. a. Test condition: Class IIA b. Duration: Refer to table 1 for the level and recommended plating thickness Table 1 8.8 Level Total MFG exposure hours Unmated exposure hours Mated exposure hours Application plating thickness (on contact area) Level 1 120 hours 80 40 Gold flash Level 2 168 hours 112 56 10u” Min. Au or GXT Level 3 240 hours 160 80 15u” Min. Au or GXT Level 4 336 hours 224 112 30u” Min. Au or GXT Solderability – IPC/ECA J-STD-002C a. Test Method: S1 b. Minimum solders coverage: 95 % 8.9 Resistance to Solder Heat – EIA-364-56 a. Test Standard: Thru Hold: EIA 364-56, Procedure 3, Condition E Surface Mount: EIA 364-56, Procedure 5, Level 3 b. Acceptance Criteria: There shall be no evidence of physical or mechanical damage Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 11 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector AUTHORIZED BY C DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 9.0 QUALITY ASSURANCE PROVISIONS 9.1 Equipment Calibration All test equipment and inspection facilities used in the performance of any test shall be maintained in a calibration system in accordance with ANSI Z-540 and ISO 9000. 9.2 Inspection Conditions Unless otherwise specified herein, all inspections shall be performed under the following ambient conditions: a. Temperature: 25 +/- 5 deg C b. Relative Humidity: 30% to 60% c. Barometric Pressure: Local ambient 9.3 The sample size is listed for each test in section 9.7 Qualification Test Table. 9.4 Acceptance 9.4.1 Electrical and mechanical requirements placed on test samples as indicated in paragraphs 6.0 and 7.0 shall be established from test data using appropriate statistical techniques or shall otherwise be customer specified, and all samples tested in accordance with this product specification shall meet the stated requirements. 9.4.2 Failures attributed to equipment, test setup, or operator error shall not disqualify the product. If product failure occurs, corrective action shall be taken and samples resubmitted for qualification. 9.5 Qualification Testing Qualification testing shall be performed on sample units produced with equipment and procedures normally used in production. The test sequences shall be as shown in the qualification test table. 9.6 Re-Qualification Testing If any of the following conditions occur, the responsible product engineer shall initiate requalification testing consisting of all applicable parts of the qualification test matrix. a. A significant design change is made to the existing product which impacts the product form, fit or function. Examples of significant changes shall include, but not be limited to, changes in the plating material composition or thickness, contact force, contact surface geometry, insulator design, contact base material, or contact lubrication requirements. b. A significant change is made to the manufacturing process which impacts the product form, fit or function. c. A significant event occurs during production or end use requiring corrective action to be taken relative to the product design or manufacturing process. Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE PRODUCT SPECIFICATION GS-12-629 TITLE PAGE REVISION 12 of 13 C AUTHORIZED BY Minitek 1.27MM Board to Board & Cable to Board Connector DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 9.7 Qualification Test Table Table 2 – Qualification test sequence TEST DESCRIPTION PARA. 1 2 3 Examination of Product 5.5 Low Level Contact Resistance 6.1 1 8 2 5 7 1 10 2 5 7 9 1 10 2 5 7 9 Insulation Resistance 6.2 Dielectric Withstanding Voltage Current Rating Mating/Unmating Force 6.3 Durability Durability (Preconditioning,20 cycles) Contact Retention force Reseating Thermal Shock Humidity, Steady state Temperature Life Temperature Life (Preconditioning) Vibration Mechanical Shock Mixed Flowing Gas Solderability Resistance to Solder Heat Sample Size Test Group 5 6 Test Sequence 1 1 1 10 7 8 2 2 5 6 7 9 2 6 3 7 4 6.4 7.1 7.2 7.3 7.4 7.5 8.1 8.2 8.3 8.4 7 8 9 10 1 3 1 3 1 3 1 3 2 3 5 4 3 3 6 8 4 6 3 3 2 8 4 5 4 4 8.5 8.6 8.7 8.8 8.9 4 6 8 6 2 2 5 5 5 5 5 5 5 5 5 5 Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013 NUMBER TYPE GS-12-629 PRODUCT SPECIFICATION TITLE PAGE REVISION 13 of 13 Minitek 1.27MM Board to Board & Cable to Board Connector C AUTHORIZED BY DATE Andy Zhang Mar. 28 2013 CLASSIFICATION UNRESTRICTED 6.0 REVISION RECORD: REVISION RECORD Rev Page A B ALL 2,3 C 4~13 Description NEW RELEASE Change operator temperature from 85ºC to 105ºC; Change dry heat test from 85ºC,96H to 105 ºC 168H; Erase the contact resistance in test group F. Add section 2 in the spec. EC# Date T09-1154 15 Sep. 2009 30 Nov. 2009 ECN-ELX-N14364 28 Mar. 2013 Copyright FCI. Form E-3701 – Revision C GS-01-029 PDS: Rev :C STATUS:Released Printed: May 08, 2013
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