54601-906WPLF

1 3 2 LOGO 4 1.5 0.3 5 6 7 8 6.5 0.5 A A 10.0 REF. A 9.90 PLATING 5.08 0.05 0.1 B SEE VIEW A 3.75 0.50 0 1.75 -1.75 NOTE-2 3.50 1.73 0.05 C 4.06 7.88 10.16 2.10 0.254 X Y Material: The housing will withstand exposure to 260-265'C for 5 seconds in a wavesoldering application.Use protective adhesive tape (Kapton or Teflon) or protective metallic devices on the areas which are directly exposed to wave soldering as it is used in classical leaded wave soldering. P.C.B HOLE PATTERN VIEWED FROM TOP Contact: 2.54 TYP. 0.76 POS.NO.5 8.89 POS.NO.2 X 6.35 POS.NO.4 POS.NO.3 18.00 0.46mm Copper Alloy 10.16 surface VIEW A - IS0 1302 tolerance std ISO 406 projection mm ISO 1101 TOLERANCES UNLESS OTHERWISE SPECIFIED rev ecn no dr date E I08-0023 F I08-0081 G I09-0169 - - - - - - - - - - - - - - - - HVN 2008-05-19 NG 2008-07-02 NPM 2009-08-19 Dr NEBU P.M 2008-05-19 Eng NEBU P.M 2008-05-19 Chr NEBU PM 2009-08-19 0 SUDHIR V 2009-08-19 Product family Appr ANGULAR LINEAR 2 0.X 0.3 0.XX 0.15 0.XXX 0.05 6 POL HOUSING TELEJACK - catalog no Scale size A2 ECN F 4:1 I09-0169 MODJACK Spec ref dwg no 1. CONTACT WIRE SHOULD NOT TO BE EXPOSED IN THE WELD AREA. AND WELD FLASH NOT TO EXCEED 0.30 ABOVE -A2. ALL WIRES MUST BE CONTAINED IN THE SHELF. 3. OPTIONAL PROJECTION ADDED TO INCREASE OVERALL HEIGHT OF CONNECTOR. SEE ORDERING INFORMATION. 3:1 12.70 F SCALE www.fciconnect.com title NOTES: E 1.LF Products meet European Union Directives and other country Regulations as described in GS-22-008. 2.The Housing will withstand exposure to 260' peak temperature for 5 sec in a wave solder applicotion with a 1.6mm Min thick circuit board Slight deformation of snap pegs may occur at 260-265'c which will not affect the function of the product. 3.Lead Free or ROHS Directive labelling to be provided as per GS-14-920 for Lead Free version. 3.25 0.10 *OPTIONAL-NOTE 3 SEE SPECIAL CODE D Plating: Active zone: Gold over nickel on contact area Termination zone : SnPb over Nickel (Leaded vesion) : Matte Tin over nickel (Lead Free version) 1.91 POS.NO.6 Copyright FCI. C MATERIAL Housing: THERMOPLASTIC-UL94 V0 BLACK Contact: 0.46 COPPER ALLOY ROUND WIRE WIRE POSITION NO. 2.50 BLANK-CTS. LOADED IN ALL POS. 001-CTS. LOADED IN 3 &4 POS. 002-CTS. LOADED IN 2,3,4 &5 POS. Insulation Resistance - 500 M Ohms min. Dielectric Strength - 1000 V rms , 60 Hz. Contact Resistance - 20 to 30 m Ohms. max. Current Rating - 2.0 amp DC Maximum Total Mating Force - 20 N Retention Force Between Plug & Jack-22.5 N min. Durability - 250 mating cycles SECTION A-A SCALE 4:1 POS.NO.1 CONTACTS LOADED 06-6 POL INSULATOR D E BLANK-WITH PROJECTION NO.OF POS 8.89 6.60 WP-WITHOUT PROJECTION TECHNICAL SPECIFICATION: 1.27 6.35 B *SPECIAL CODE 2-0.08µ Au SELECTIVE MIN. 6-0.8µ Au SELECTIVE MIN. 7-Au FLASH SELECTIVE MIN. 8-1.27µ Au SELECTIVE MIN. 9-0.38µ Au SELECTIVE MIN. A 6.85 8.50 1.016 TYP Y LEAD FREE CAVITY NO. 11.50 B PRODUCT NO. 54601 X 06 XXX WP LF TELEJACK PCB SERIES WELD AREA NOTE-2 13.20 B A Rev. C-BMJ-0082 CUSTOMER COPY sheet G 1 of 1 REV F - 2006-04-17 1 2 3 4 5 6 7 PDM: Rev:G STATUS:Released 8 Printed: Aug 21, 2009.