64991-S15-4RLF

BergStik® 2.54mm Unshrouded Headers BergStik® 2.54mm pitch unshrouded headers provide Boardto-Board, Wire-to-Board and Cable-to-Board interconnect solutions for all types of electronic equipment and devices. www.fci.com/products/bergstik CONTENT PAGE BERGSTIK® 2.54MM UNSHROUDED HEADERS 3 Overview For Pin-in-Paste Processes 4-7 Vertical Headers Standard sizes 8-9 Vertical Headers Special sizes 10-11 Continuous Headers 12-13 Right Angle Headers Standard sizes 14-15 Right Angle Headers Special sizes 16-17 Stacking Headers 18-19 For more information, please contact: Communications@fci.com or visit us at www.fci.com Disclaimer Please note that the above information is subject to change without notice. 2 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® 2.54MM UNSHROUDED HEADERS OVERVIEW BergStik® 2.54mm unshrouded headers are available in surface-mount (SMT), through-hole (THT), press-fit, stacking and pin-in-paste (PIP) versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions. Featuring a “breakaway” design, each connector can be cut or broken to length to suit the application profile. The maximum current rating is 3A per contact. This product range is extended with BergStik® 2.54mm unshrouded vertical headers in 0.25µm plating, available in standard sizes. It offers an economical solution for various applications. It is also specified up to 100 mating cycles. BergStik® product range provides Board-to-Board, Wireto-Board and Cable-to-Board interconnect solutions for all electronic equipment and devices. FEATURES BENEFITS • High temperature thermoplastic material • Reflow compatible • Variable spacing height for stacking headers • Cater to a wide range of applications • Allow dual entry; mating from top or bottom   • Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements • Blank 0.64mm square contacts presents 4 surfaces of equal quality • Can be used for wire wrapping • Standoff design • Allows cleaning to remove soldering contamination • Duplex plating • Cost-efficient • Tin-lead plating in press-fit area • Easy pin insertion onto PCB • Retention legs option • High retention force onto PCB • Press-fit designed to fit 1.02mm diameter hole, solder-toboard product • Same layout on THT and press-fit • Meets DIN 41651 specification, HE13 and BT D2632 • Qualified product www.fci.com/products/bergstik 3 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES Pin-in-Paste (PIP) technology allows the use of THT products in SMT manufacturing processes. THT connectors are automatically or manually soldered to PCB, and soldered in the same operation as the SMT connectors. Mechanical strength is retained through THT leads. This process is critical for applications in industrial and automotive markets. PRODUCT PLASTIC MATERIAL BergStik® PIP headers are moulded in high temperature thermoplastic. The headers are able to withstand exposure to 260°C peak temperature for 30 seconds maximum in a convection, infrared or vapor phase reflow oven. HOUSING DESIGN A special housing has been developed for the double row straight product. A row of higher standoffs has been placed in the longitudinal center axis, between both rows of pins for a good solder paste deposit around the pin. Please follow the stencil design guidelines TA-894 and TA-897 on the following page in order to avoid solder paste deposit under the standoffs. 4 BERGSTIK® UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES APPLICATION FCI’s application guideline helps to achieve optimum performance for BergStik® PIP process. STENCIL DESIGN The stencil design is crucial for a good solder joint. It determines the amount of paste and the position of the paste print on the board. Each PCB hole has its own stencil aperture with enough spacing in between to allow separate solder deposits. This prevents solder robbing from one hole to another and ensures the correct amount of solder paste for each hole. The print position is placed asymmetrical to optimize the flow of molten solder paste. PASTE APPLICATION The amount of paste for each hole depends on the soldering process parameters and the degree of hole filling. It is recommended to apply the squeegee at a 45° angle. You can use a smaller angle for an even greater degree of hole filling. The squeegee moves in parallel with the shorter sides of the stencil apertures. BOARD LAYOUT Please use a hole of 1.00 +/– 0.05 mm for an optimum paste deposit. For automatic pick-and place, lean towards the upper end of the tolerance. Refer to TA-894 for further information. www.fci.com/products/bergstik 5 BERGSTIK® UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES TECHNICAL INFORMATION MATERIALS MECHANICAL PERFORMANCE • Housing: PCT • Retention Force: 8.8N min • Color: Black SPECIFICATIONS • Flammability Rating: UL94V-O • Pins: Copper Alloy • Plating: Selective Gold or GXT or full Tin over 1.2μm Nickel • • File no. E66906 File no. LR46923 • Product Drawing: 10076801/ 10082201/ 10082202 ELECTRICAL PERFORMANCE • Product Specification: BUS-12-019 • Current Rating: 3A per contact APPROVALS AND CERTIFICATIONS • Insulation Resistance: 5000MΩ min. • RoHS compliant according to the European Union Directive 2002/95/IEC • Dielectric Withstanding Voltage: 1500V ENVIRONMENTAL • Operating Temperature: -65°C to +130°C 6 BERGSTIK® UNSHROUDED HEADERS FOR PIN-IN-PASTE PROCESSES PART NUMBER SELECTOR X XX XX X XX PLATING CODE PIN STYLE LENGTH* TOTAL POSITIONS PACKAGING OPTION LEAD-FREE XXXXXXXX BASE PART NUMBER - LF Straight Double row 10076801 0.76mm (30µin.) or GXT PdNi with gold flash on contact area, tin on solder side 1 Tin 4 Double row 04 to 72 Mating Solder Overall Pin Style 5.84 2.50 10.8 01 6.75 2.50 11.5 02 Standard product = plastic bag 1 Tape reel with pick up cap (contact FCI for availability) 4 *Other pin style are available upon request XXXXXXXX BASE PART NUMBER - X XX XX X XX PLATING CODE PIN STYLE LENGTH* TOTAL POSITIONS PACKAGING OPTION LEAD-FREE LF Right Angle Single row 10082201 Double row 10082202 0.76µm (30µin.) Gold or GXT on contact area, tin on solder side 1 Tin 4 Single row 03 to 36 Double row 04 to 72 Mating Solder Pin Style 5.84 2.5 01 6.75 2.5 02 Standard product = plastic bag 1 Tape reel with pick up cap (contact FCI for availability) 4 *Other pin style are available upon request www.fci.com/products/bergstik 7 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED VERTICAL HEADERS STANDARD SIZES APPLICATION 7.20mm for increased board density PRODUCT 0.62 square pin 0.62 square pin 0.62 square pin Recommended PCB Layouts Dimensions in mm 8 BERGSTIK® UNSHROUDED VERTICAL HEADERS STANDARD SIZES TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: 77311/ 77313/ 98401/ 95278 • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-114 ELECTRICAL PERFORMANCE • Tape and Reel Packaging Data: TA-840 • Current Rating: 3A per contact APPROVALS AND CERTIFICATIONS • Insulation Resistance: 5000MΩ min. • Dielectric Withstanding Voltage: 1500V • R  oHS compatible according to the European Union Directive 2002/95/IEC ENVIRONMENTAL PACKAGING • Operating Temperature: -65°C to +125°C • Bags MECHANICAL PERFORMANCE • Optional: Tubes or tape-and-reel with pick-up cap (only applicable for SMT pin style 01) • Retention Force: 9N min. PROCESSING INFORMATION • Compatible with wave, vapor-phase, and (for SMT) IR reflow soldering processes • Recommended IR profile TA 842 for SMT PART NUMBER SELECTOR XXXXX BASE PART NUMBER - X XX X XX XX PLATING CODE PIN STYLE LENGTH PACKAGING OPTION TOTAL POSITIONS LEAD-FREE THT LF Packaging Configuration Option Single row 77311 Plastic bag THT - Double row 77313 Tape-and-reel with pick-up cap SMT A Tube with pick-up cap SMT B SMT Single row 98401 Double row 95278 0.76µm (30µin.) Gold or GXT on contact, tin on solder side THT 1 0.38µm (15µin.) Gold or GXT on contact area, tin on solder side 8 0.25µm (10µin.) Gold or GXT on contact area, tin on solder side 5 Tin 4 SMT Mating Length Solder Overall Pin Style 5.84 2.41 10.80 01* 5.84 3.05 11.43 18* 5.84 3.42 11.80 02 Single row THT 02 to 36 6.60 2.66 11.82 27 Single row SMT 03 to 17 7.75 3.06 13.35 22 Double row THT 04 to 72 6.75 2.90 12.20 24* Double row SMT 04 to 50 Double row SMT with pegs 08 to 50 *Most popular configurations Mating Pin Style 5.84 01 8.08 02 www.fci.com/products/bergstik 9 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED VERTICAL HEADERS SPECIAL SIZES APPLICATION PRODUCT 0.62 square pin 0.62 square pin Recommended PCB Layouts Dimensions in mm 10 BERGSTIK® UNSHROUDED VERTICAL HEADERS SPECIAL SIZES TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: 68000/ 67996 • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-114 ELECTRICAL PERFORMANCE APPROVALS AND CERTIFICATIONS • Current Rating: 3A per contact • RoHS compatible according to the European Union Directive 2002/95/IEC • Insulation Resistance: 5000MΩ­ min • Dielectric Withstanding Voltage: 1500V PACKAGING ENVIRONMENTAL PERFORMANCE • Bags • Operating Temperature: -65°C to +125°C • O  ptional: Tubes or tape-and-reel with pick-up cap (only applicable for SMT pin style 01) MECHANICAL PERFORMANCE PROCESSING INFORMATION • Retention Force: 9N min. • C  ompatible with wave, vapor-phase, and IR reflow soldering processes • Retentive Leg Insertion Force: >44.48N max. • Retentive Leg Board Retention: 2.22N PART NUMBER SELECTOR Customize your own part number using custom dimensions (Please allow for initial setup on our system) XXXXX BASE PART NUMBER - X XX PLATING CODE TOTAL POSITIONS - XXX XXX XX MATING DIMENSION SOLDER SIDE DIMENSION LEAD-FREE THT Single row 68000 Single row 01 to 36 Double row 67996 Double row 01 to 72 0.76μm (30μin.) Gold or GXT 1 0.38μm (15μin.) Gold or GXT 2 Tin 4 In 0.1mm increments e.g. 030 = 3.0mm LF In 0.1mm increments e.g. 255 = 25.5mm Note: 1. The total combined dimension for mating and solder side may not exceed 27mm 2. Standard packaging in bulk 3. Special packaging availability upon request www.fci.com/products/bergstik 11 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED CONTINUOUS HEADERS APPLICATION PRODUCT Recommended PCB Layouts Dimension in mm 12 BERGSTIK® UNSHROUDED CONTINUOUS HEADERS TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: 54101/ 54102/ 77311/ 77313 • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-059 ELECTRICAL PERFORMANCE APPROVALS AND CERTIFICATIONS • Current Rating: 3A per contact • R  oHS compatible according to the European Union Directive 2002/95/IEC • Insulation Resistance: 5000MΩ­ min • Dielectric Withstanding Voltage: 1500V PACKAGING ENVIRONMENTAL PERFORMANCE • Reel • Operating Temperature: -65°C to +125°C PROCESSING INFORMATION MECHANICAL PERFORMANCE • C  ompatible with wave, vapor-phase, and IR reflow soldering processes • Retention Force: 9N min. PART NUMBER SELECTOR XXXXX BASE PART NUMBER - X XX PLATING CODE PIN STYLE LENGTH THT XX - 00 XX LEAD-FREE Mating Solder Overall Pin Style Single row 77311 5.84 2.41 10.80 01 Double row 77313 5.84 3.05 11.43 18 5.84 3.42 11.80 02 6.60 2.66 11.82 27 7.75 3.06 13.35 22 6.75 2.90 12.20 24 0.76μm (30μin.) Gold or GXT on mating area, tin on solder side 1 0.38μm (15μin.) Gold or GXT on contact area, tin on solder side 8 Tin 4 LF Standard www.fci.com/products/bergstik 13 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED RIGHT ANGLE HEADERS STANDARD SIZES APPLICATION PRODUCT 0.62 square pin 0.62 square pin Recommended PCB Layouts Dimension in mm 14 BERGSTIK® UNSHROUDED RIGHT ANGLE HEADERS STANDARD SIZES TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: 77315/ 77317 • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-114 ELECTRICAL PERFORMANCE APPROVALS AND CERTIFICATIONS • Current Rating: 3A per contact • R  oHS compatible according to the European Union Directive 2002/95/IEC • Insulation Resistance: 5000MΩ­ min • Dielectric Withstanding Voltage: 1500V PACKAGING ENVIRONMENTAL PERFORMANCE • Bags • Operating Temperature: -65°C to +125°C PROCESSING INFORMATION MECHANICAL PERFORMANCE • C  ompatible with wave, vapor-phase, and IR reflow soldering processes • Retention Force: 9 N min. PART NUMBER SELECTOR XXXXX BASE PART NUMBER - X XX PLATING CODE PIN STYLE LENGTH - XX XX TOTAL POSITIONS LEAD-FREE THT Single row 77315 Double row 77317 0.76μm (30μin.) Gold or GXT on mating area, tin on solder side 1 0.38μm (15μin.) Gold or GXT on contact area, tin on solder side Tin Mating Solder 8 5.84 4 LF Single row THT 02 to 36 Double row THT 04 to 72 Pin Style 77315 77317 2.57 01 03 5.84 3.05 18 04 6.75 2.90 24 12 www.fci.com/products/bergstik 15 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED RIGHT ANGLE HEADERS SPECIAL SIZES APPLICATION PRODUCT 0.62 square pin 0.62 square pin Recommended PCB Layouts Dimension in mm 16 BERGSTIK® UNSHROUDED RIGHT ANGLE HEADERS SPECIAL SIZES TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: 55101/ 55102/ 68015/ 68020 • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-114 ELECTRICAL PERFORMANCE APPROVALS AND CERTIFICATIONS • Current Rating: 3A per contact • R  oHS compatible according to the European Union Directive 2002/95/IEC • Insulation Resistance: 5000MΩ­ min • Dielectric Withstanding Voltage: 1500V PACKAGING ENVIRONMENTAL PERFORMANCE • Bags • Operating Temperature: -65°C to +125°C PROCESSING INFORMATION MECHANICAL PERFORMANCE • C  ompatible with wave, vapor-phase, and IR reflow soldering processes • Retention Force: 9N min. • Retentive Leg Insertion Force: >44.48N max. • Retentive Leg Board Retention: 2.22N PART NUMBER SELECTOR Customize your own part number using custom dimensions (Please allow for initial setup on our system) XXXXX BASE PART NUMBER - X XX PLATING CODE TOTAL POSITIONS - XXX XXX XX MATING DIMENSION SOLDER SIDE DIMENSION LEAD-FREE LF THT Single row 68015 Single row 01 to 36 Double row 68020 Double row 02 to 72 0.76μm (30μin.) Gold or GXT 1 0.38μm (15μin.) Gold or GXT 2 Tin 4 In 0.1mm increments min. = 2.0mm max. = 14.7mm e.g. 030 = 3.0mm In 0.1mm increments min. = 2.3mm max. = 15.2mm e.g. 135 = 13.5mm Note: 1. Bend dimension 1.52mm only 2. The total combined dimension for mating and solder side may not exceed 25.5mm www.fci.com/products/bergstik 17 BOARD/WIRE-TO-BOARD CONNECTORS BERGSTIK® UNSHROUDED STACKING HEADERS APPLICATION Board spacing = stack height of header+ height of the receptacle (See application drawings on next page) PRODUCT Recommended PCB Layouts Dimension in mm 18 BERGSTIK® UNSHROUDED STACKING HEADERS TECHNICAL INFORMATION MATERIALS SPECIFICATIONS • Housing: High temperature thermoplastic, Black • File no. E66906 • Flammability Rating: UL94V-0 •  File no. LR46923 • Pin: Phosphor-bronze • Product Drawing: By 5-digit base part number • Plating: Gold or Tin over 1.27μm (50μin.) Nickel • Product Specification: BUS-12-114 ELECTRICAL PERFORMANCE APPROVALS AND CERTIFICATIONS • Current Rating: 3A per contact • R  oHS compatible according to the European Union Directive 2002/95/IEC • Insulation Resistance: 5000MΩ­ min • Dielectric Withstanding Voltage: 1500V PACKAGING ENVIRONMENTAL PERFORMANCE • Bags • Operating Temperature: -65°C to +125°C PROCESSING INFORMATION MECHANICAL PERFORMANCE • C  ompatible with wave, vapor-phase, and IR reflow soldering processes • Retention Force: 9N min. PART NUMBER SELECTOR Customize your own part number using custom dimensions (Please allow for initial setup on our system) XX X X X 54 LEAD SOLDER SIDE DIMENSION ROW OPTION THT 1 SMT 2 2.41mm 1 3.05mm 2 SMT (double row only) 4 Single row (THT only) 1 Double row 2 - X XX XX PLATING CODE PIN STYLE LENGTH TOTAL POSITIONS 0.76μm (30μin.) Gold or GXT on contact area, tin on solder side 0.38μm (15μin.) Gold or GXT on contact area, tin on solder side XXXX STACK HEIGHT XX LEAD-FREE LF 1 8 Overall* THT Overall* SMT Pin Style 12.20 10.42 01 13.50 11.72 02 15.90 14.12 03 6.76 14.98 04 17.65 15.87 05 18.91 17.13 06 20.96 19.18 23.50 XX.XX = mm Specify mm i.e. 08.50 = 8.50mm in 0.50mm increments 08.00 min. - 25.00 max. THT 09.50 min. - 26.00 max. SMT Single row (THT) 02 to 36 07 Double row (THT) 04 to 72 21.72 08 Double row (SMT) 04 to 50 26.04 24.26 09 28.58 26.80 10 31.12 29.34 11 33.66 31.88 12 *Other overall lengths available upon request (Up to 65mm) www.fci.com/products/bergstik 19 FCIBERG0615EA4 www.fci.com For more information, please contact: communications@fci.com