BLM8D1822S-50PB;
BLM8D1822S-50PBG
LDMOS 2-stage integrated Doherty MMIC
Rev. 4 — 28 September 2018
Product data sheet
1. Product profile
1.1 General description
The BLM8D1822S-50PB(G) is a dual section, 2-stage fully integrated Doherty MMIC
solution using Ampleon’s state of the art GEN8 LDMOS technology. The carrier and
peaking device, input splitter and output combiner are integrated in a single package. This
multiband device is perfectly suited as general purpose driver or small cell final in the
frequency range from 1805 MHz to 2170 MHz. Available in gull wing or flat lead outline.
Table 1.
Performance
Typical RF performance at Tcase = 25 °C; IDq = 104 mA (carrier); VGSq(peaking) = VGSq(carrier) − 0.65 V.
Test signal: 3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF; per section.
Test signal
f
VDS
PL(AV)
(MHz)
(V)
(W)
single carrier W-CDMA
2167.5
28
5
ηD
ACPR5M
(dB)
(%)
(dBc)
26.5
37
34
Gp
1.2 Features and benefits
Integrated input splitter
Integrated output combiner
High efficiency
Designed for broadband operation (frequency 1805 MHz to 2170 MHz)
High section-to-section isolation enabling multiple combinations
Integrated temperature compensated bias
Independent control of carrier and peaking bias
Integrated ESD protection
Excellent thermal stability
Source impedance 50 ; high power gain
For RoHS compliance see the product details on the Ampleon website
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
1.3 Applications
RF power MMIC for multi-carrier and multi-standard GSM, W-CDMA and LTE base
stations in the 1805 MHz to 2170 MHz frequency range. Possible circuit topologies are
the following as also depicted in Section 8.1:
Dual section or single ended
Quadrature combined
Push-pull
2. Pinning information
2.1 Pinning
pin 1 index
VDS(A1)
VGS(A_P)
VGS(A_C)
RF_IN_A
n.c.
n.c.
n.c.
n.c.
n.c.
n.c.
RF_IN_B
VGS(B_C)
VGS(B_P)
VDS(B1)
1
2
3
4
5
6
7
16
RF_OUT_
VDS(A2)
8
9
10
11
12
13
14
15
RF_OUT_
VDS(B2)
amp00512
Transparent top view
The exposed backside of the package is the ground terminal of the device.
Fig 1.
Pin configuration
2.2 Pin description
Table 2.
BLM8D1822S-50PB_S-50PBG
Product data sheet
Pin description
Symbol
Pin
Description
VDS(A1)
1
drain-source voltage of driver stages of section A
VGS(A_P)
2
gate-source voltage of peaking A_P
VGS(A_C)
3
gate-source voltage of carrier A_C
RF_IN_A
4
RF input section A
n.c.
5
not connected
n.c.
6
not connected
n.c.
7
not connected
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
2 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
Table 2.
Pin description …continued
Symbol
Pin
Description
n.c.
8
not connected
n.c.
9
not connected
n.c.
10
not connected
RF_IN_B
11
RF input section B
VGS(B_C)
12
gate-source voltage of carrier B_C
VGS(B_P)
13
gate-source voltage of peaking B_P
VDS(B1)
14
drain-source voltage of driver stages of section B
RF_OUT_B/VDS(B2)
15
RF output section B / drain-source voltage of final stages of
section B
RF_OUT_A/VDS(A2)
16
RF output section A / drain-source voltage of final stages of
section A
GND
flange
RF ground
3. Ordering information
Table 3.
Ordering information
Type number
Package
BLM8D1822S-50PB
Name Description
Version
-
plastic, heatsink small outline package;
16 leads (flat)
SOT1211-3
plastic, heatsink small outline package; 16 leads
SOT1212-3
BLM8D1822S-50PBG -
4. Block diagram
VGS(A_P)
VDS(A1)
Bias peak
RF_IN_A
VGS(A_C)
Bias carr
VGS(B_P)
Bias peak
RF_IN_B
VDS(B1)
VGS(B_C)
RF_OUT_
VDS(A2)
RF_OUT_
VDS(B2)
Bias carr
amp00034
Fig 2.
BLM8D1822S-50PB_S-50PBG
Product data sheet
Block diagram
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
3 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
VDS
Min
Max
Unit
drain-source voltage
-
65
V
VGS
gate-source voltage
0.5
+13
V
Tstg
storage temperature
65
+150
C
-
225
C
-
150
C
Tj
junction temperature
Tcase
case temperature
[1]
Conditions
[1]
Continuous use at maximum temperature will affect the reliability. For details refer to the online MTF
calculator.
6. Thermal characteristics
Table 5.
Thermal characteristics
Measured for total device.
Symbol Parameter
Rth(j-c)
[1]
Conditions
thermal resistance from junction to case
Value Unit
Tcase = 90 C; PL = 10 W
[1]
1.06
K/W
Tcase = 90 C; PL = 20 W
[1]
0.86
K/W
When operated with a 1-carrier W-CDMA with PAR = 8 dB.
7. Characteristics
Table 6.
DC characteristics
Tcase = 25 °C; per section unless otherwise specified.
Symbol Parameter
Conditions
Min Typ
Max Unit
2.5
Carrier
VGSq
IDSX
IGSS
gate-source quiescent voltage
drain cut-off current
VDS = 28 V; ID = 104 mA
1.6
2.1
VGS = 5.65 V; VDS = 10 V
[1]
-
2.60 -
A
VGS = 5.65 V; VDS = 10 V
[2]
-
0.52 -
A
-
-
nA
140
V
gate leakage current
VGS = 1 V; VDS = 0 V
drain cut-off current
VGS = 5.65 V; VDS = 10 V
[1]
-
2.74 -
A
VGS = 5.65 V; VDS = 10 V
[2]
-
0.57 -
A
-
-
140
nA
65
-
-
V
-
-
1.4
A
65
-
-
V
-
-
1.4
A
Peaking
IDSX
IGSS
gate leakage current
VGS = 1 V; VDS = 0 V
Final stages
V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 300 mA
IDSS
drain leakage current
VGS = 0 V; VDS = 28 V
Driver stages
V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 60 mA
IDSS
BLM8D1822S-50PB_S-50PBG
Product data sheet
drain leakage current
[1]
Final stage.
[2]
Driver stage.
VGS = 0 V; VDS = 28 V
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
4 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
Table 7.
RF Characteristics
Typical RF performance at Tcase = 25 °C; VDS = 28 V; IDq = 104 mA (carrier);
VGSq(peaking) = VGSq(carrier) − 0.65 V; PL(AV) = 5 W. Unless otherwise specified, measured in an
Ampleon straight lead production circuit.
Symbol
Parameter
Test signal: single carrier W-CDMA
Conditions
Min
Typ
Max Unit
-
26
-
[1]
Gp
power gain
f = 1807.5 MHz
f = 2167.5 MHz
24.5 26.5 28.5 dB
D
drain efficiency
f = 2167.5 MHz
31
37
-
%
RLin
input return loss
f = 2167.5 MHz
-
19
10
dB
ACPR5M
adjacent channel power ratio (5 MHz)
f = 2167.5 MHz
-
34
26
dBc
PARO
output peak-to-average ratio
f = 2167.5 MHz
6.7
7.8
-
dB
[1]
dB
3GPP test model 1; 64 DPCH; PAR = 9.9 dB at 0.01% probability on CCDF.
8. Application information
Table 8.
Typical performance
Tcase = 25 °C; VDS = 28 V; IDq = 190 mA (carrier and peaking). Test signal: 1-carrier W-CDMA; test model 1; 64 DPCH;
PAR = 9.9 dB at 0.01 % probability CCDF; unless otherwise specified, measured in an Ampleon f = 1805 MHz to 2170 MHz
combined integrated Doherty application circuit (see Figure 3 for the component layout and Figure 4 for the electrical
schematic).
Symbol
Min Typ
Max Unit
f = 1960 MHz
[1]
-
48.4
-
dBm
s21/s21(norm) normalized phase response
at 3 db compression point;
f = 1960 MHz
[1]
-
0.4
-
D
drain efficiency
8 db OBO (PL = 40.4 dBm);
f = 1960 MHz
-
38.9
-
%
PL(1dB)
Parameter
Conditions
output power at 1 dB gain compression
Gp
power gain
PL(AV) = 40.4 dBm; f = 1960 MHz
-
25
-
dB
Bvideo
video bandwidth
PL(AV) set to obtain
IMD3 = 30 dBc; 2-tone CW;
f = 1960 MHz
-
185
-
MHz
Gflat
gain flatness
PL(AV) = 40.4 dBm; f = 1805 MHz
to 2170 MHz
-
1
-
dB
ACPR5M
adjacent channel power ratio (5M)
PL(AV) = 40.4 dBm; f = 1960 MHz
-
38.2 -
dB
G/T
gain variation with temperature
f = 2140 MHz
-
0.04
-
dB/C
isolation
between sections A and B;
PL(AV) = 15.2 dBm; f = 2140 MHz;
measured on dual section
evaluation board
-
24
-
dB
Rollett stability factor
Tcase = 40 C; f = 0.3 GHz to
3 GHz
-
>3
-
s12
K
2
[1]
25 ms CW power sweep measurement.
[2]
For both sections (S-parameters measured with load pull jig).
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
[2]
© Ampleon Netherlands B.V. 2018. All rights reserved.
5 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
50 mm
VGS peak
VGS carrier
GND
VDS
Ferrite
10 μF
820 Ω
6.8 pF
10 μF
15 kΩ
10 μF
5.1 Ω
1 μF
1 μF
2.7 Ω
80 mm
1.5 pF
2.2 pF
5.1 Ω
9.1 pF
X3C19F1-03S
100 Ω
100 Ω
X3C19F1-03S
39.3 mm
9.1 pF
2.2 pF
50 Ω 2.7 Ω
5.1 Ω
1 μF
1 μF
1.5 pF
5.1 Ω
10 μF
15 kΩ
Ferrite
820 Ω
10 μF
6.8 pF
10 μF
VGS carrier
VGS peak
VDS
34.2 mm
GND
amp00513
Printed-Circuit Board (PCB): Rogers 4350; thickness = 0.508 mm.
Fig 3.
Component layout
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
6 of 22
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BLM8D1822S-50PB_S-50PBG
Product data sheet
Ferrite
VDS_A
28 V
10 μF/50 V
VDS(A1) 1
VGS(A_P)
VGS peak
1 μF/25 V
15 kΩ
BLM8D1822S-50PB(G) Path A
2
2x 10 μF/50 V
Bias Peak
6.8 pF
VGS(A_C) 3
5.1 Ω
RF_IN_A 4
VGS carrier
820 Ω
n.c.
5.1 Ω
Bias Carrier
5
1 μF/25 V
n.c.
RF in
Symmetric Doherty
1.5 pF
6
16
7
RF_OUT_A / VDS(A2)
2x 100 Ω
2.7 Ω
Anaren
3dB Hybrid
X3C19F1-03S
50 Ω
VGS carrier
820 Ω
Anaren
3dB Hybrid
X3C19F1-03S
9.1 pF
2.7Ω
2.2 pF
9.1 pF
n.c.
n.c.
5.1 Ω
15
RF_OUT_B / VDS(B2)
9
RF out
10
RF_IN_B 11
5.1 Ω
15k Ω
Bias Peak
1.5 pF
n.c.
VGS peak
8
Bias Carrier
1 μF/25 V
VGS(B_C) 12
Symmetric Doherty
7 of 22
© Ampleon Netherlands B.V. 2018. All rights reserved.
VGS(B_P) 13
6.8 pF
VDS(B1) 14
BLM8D1822S-50PB(G) Path B
28 V
VDS_B
10 μF/50 V
2x 10 μF/50 V
Ferrite
amp00036
Fig 4.
Electrical schematic
BLM8D1822S-50PB(G)
1 μF/25 V
2.2 pF
LDMOS 2-stage integrated Doherty MMIC
Rev. 4 — 28 September 2018
All information provided in this document is subject to legal disclaimers.
n.c.
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
8.1 Possible circuit topologies
-3 dB / Φ-0°
In A
In
Out A
Out
-3 dB / Φ-0°
In B
Out B
amp00514
Fig 5.
Dual section or single ended
3 dB Coupler
3 dB Coupler
In
-3 dB / Φ-0°
-3 dB / Φ-90°
Out
amp00515
Fig 6.
Quadrature combined
Splitter
In
Combiner
-3 dB / Φ-0°
λ/2
λ/2
-3 dB / Φ-180°
Out
amp00516
Fig 7.
BLM8D1822S-50PB_S-50PBG
Product data sheet
Push-pull
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
8 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
8.2 Ruggedness in a Doherty operation
The BLM8D1822S-50PB and BLM8D1822S-50PBG are capable of withstanding a load
mismatch corresponding to VSWR = 10 : 1 through all phases under the following
conditions: VDS = 32 V; IDq = 104 mA (carrier); VGSq(peaking) = VGSq(carrier) 0.65 V;
Pi corresponding to PL(3dB) under ZS = 50 load; f = 2140 MHz (CW); Tcase = 25 C per
section unless otherwise specified
8.3 Impedance information
Table 9.
Typical impedance for optimum Doherty operation
Measured load-pull data per section; test signal: pulsed CW; Tcase = 25 °C; VDS = 28 V;
IDq = 104 mA (carrier); VGSq(peaking) = VGSq(carrier) − 0.65 V; tp = 100 μs; δ = 10 %. Typical values per
section unless otherwise specified.
tuned for optimum Doherty operation
f
ZL
Gp(max)
PL
ηadd [1]
ηadd [2]
(MHz)
(Ω)
(dB)
(dBm)
(%)
(%)
BLM8D1822S-50PB
1700
4.20 j2.10
27.1
45.2
46.1
39.0
1800
4.00 j2.90
28.6
45.2
48.8
41.4
1900
3.85 j3.90
27.6
45.2
47.1
42.1
2000
4.90 j5.50
27.5
45.2
49.4
43.2
2100
5.40 j5.70
27.5
45.2
53.5
41.9
2200
8.00 j5.20
27.1
45.2
55.3
40.6
2300
9.10 j4.70
25.6
45.2
53.8
37.4
BLM8D1822S-50PBG
BLM8D1822S-50PB_S-50PBG
Product data sheet
1700
4.20 j3.90
27.8
45.2
43.3
37.8
1800
4.10 j4.50
28.1
45.2
45.4
39.7
1900
3.90 j6.00
27.6
45.2
45.4
40.8
2000
4.60 j7.80
27.3
45.2
45.2
40.1
2100
5.40 j8.40
27.7
45.3
50.1
52.0
2200
8.20 j8.50
27.5
45.2
53.0
38.6
2300
9.50 j7.50
26.2
45.2
54.7
36.2
[1]
at 45 dBm (nearly 3 dB compression point).
[2]
at 37 dBm (nearly 8 dB OBO point).
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
9 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
8.4 Graphs
amp00037
30
Gp
(dB)
(1)
10
0
amp00038
28
RLin
(dB)
Gp
(dB)
0
RLin
(dB)
-10
(2)
26
-10
(1)
-10
-20
24
-30
-30
-50
-40
(2)
22
-70
0
-50
500 1000 1500 2000 2500 3000 3500 4000
f (MHz)
-30
20
-40
1800 1850 1900 1950 2000 2050 2100 2150 2200
f (MHz)
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: CW.
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: CW.
(1) magnitude of Gp
(1) magnitude of Gp
(2) magnitude of RLin
(2) magnitude of RLin
Fig 8.
Wideband power gain and input return loss as
function of frequency; typical values
BLM8D1822S-50PB_S-50PBG
Product data sheet
-20
Fig 9.
In-band power gain and input return loss as
function of frequency; typical values
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
10 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
amp00039
27
60
Gp
(dB)
26
50
25
40
amp00040
15
____ φs21/φs21(norm)
(deg)
10
ηD
(%)
(3)
(2)
(1)
(1)
(1)
(2)
(2)
(3)
(3)
24
5
23
30
0
20
-5
10
-10
0
-15
ηD
22
21
29
33
37
41
45
PL (dBm)
49
29
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: CW.
33
37
41
45
PL (dBm)
49
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: 25 ms CW power sweep.
(1) f = 1805 MHz
(1) f = 1805 MHz
(2) f = 1960 MHz
(2) f = 1960 MHz
(3) f = 2170 MHz
(3) f = 2170 MHz
Fig 10. Power gain and drain efficiency as function of
output power; typical values
Fig 11. Normalized phase response as a function of
output power; typical values
amp00041
-10
IMD
(dBc)
(1)
(2)
IMD3
-30
(1)
(2)
IMD5
IMD7
-50
(1)
(2)
-70
-90
1
10
102
tone spacing (MHz)
103
Tcase = 25 C; VDS = 28 V; IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier and peaking); VGS(A_C) = VGS(B_C) = 2.77 V
(carrier); VGS(A_P) = VGS(B_P) = 1.65 V (peaking). Test signal: 2-tone CW; fc = 1960 MHz.
(1) IMD low
(2) IMD high
Fig 12. Intermodulation distortion as a function of tone spacing; typical values
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
11 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
amp00042
30
50
Gp
(dB)
ηD
(%)
(1)
(1)
(2)
(2)
(3)
(3)
28
40
10
26
30
8
24
20
6
10
4
Gp
22
ηD
amp00043
12
PARO
(dB)
PARO
52
PL(M)
(dBm)
48
44
(1)
(1)
(2)
(2)
(3)
(3)
40
36
PL(M)
20
0
25
27.5
30
32.5
35
37.5
40 42.5
PL (dBm)
45
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: 1-carrier W-CDMA; test model 1; 64 DCPH;
PAR 9.9 dB at 0.01 % probability CCDF.
2
32
25
27.5
30
(1) f = 1805 MHz
(2) f = 1960 MHz
(2) f = 1960 MHz
(3) f = 2170 MHz
(3) f = 2170 MHz
BLM8D1822S-50PB_S-50PBG
Product data sheet
35
37.5
40 42.5
PL (dBm)
45
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: 1-carrier W-CDMA; test model 1; 64 DCPH;
PAR 9.9 dB at 0.01 % probability CCDF.
(1) f = 1805 MHz
Fig 13. Power gain and drain efficiency as function of
output power; typical values
32.5
Fig 14. Output peak-to-average ratio and peak output
power as function of output power;
typical values
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Rev. 4 — 28 September 2018
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12 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
amp00044
-20
ACPR5M
(dBc)
-30
(1)
(2)
(3)
-40
-20
ACPR10M
(dBc)
-30
amp00045
40
|s12|2
(dB)
35
-40
30
-50
25
-60
20
-70
15
-80
10
2080
ACPR5M
-50
(1)
(2)
(3)
-60
ACPR10M
-70
-80
25
27.5
30
32.5
35
37.5
40 42.5
PL (dBm)
45
Tcase = 25 C; VDS = 28 V;
IDq(A_P) + IDq(A_C) + IDq(B_P) + IDq(B_C) = 190 mA (carrier
and peaking);
VGS(A_C) = VGS(B_C) = 2.77 V (carrier);
VGS(A_P) = VGS(B_P) = 1.65 V (peaking).
Test signal: 1-carrier W-CDMA; test model 1; 64 DCPH;
PAR 9.9 dB at 0.01 % probability CCDF.
2100
2120
2140
2160
2180
f (MHz)
2200
Tcase = 25 C; VDS = 28 V; IDq = 190 mA (carrier and
peaking); measured on dual section evaluation board.
(1) f = 1805 MHz
(2) f = 1960 MHz
(3) f = 2170 MHz
Fig 15. Adjacent channel power ratio as function of
output power; typical values
BLM8D1822S-50PB_S-50PBG
Product data sheet
Fig 16. Isolation as a function of frequency;
typical values
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Rev. 4 — 28 September 2018
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13 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
9. Package outline
SOT1211-3
(18.01)
(2.15)
(15.44)
(0.75)
7.45
15
16
A
L 0.05 A
R1.38
9.96(1)
16.00
9.78
15.96 B0.20
(7.04)
(4.47)
E 0.10 (4)
P2.00 0.1Z
R0.16 max.
1
14
1.50
1.00 (12x)
0.35 (14x) (3)
20.75(1)
R1.00
0.10
metal protrusion 4x
(ground) in corners (2)
1.57 (5)
0.22 B0.05
L 0.25 B
+0.08
3.92 - 0.03
L 0.05 B
R0.32
B
20.57
Min. 5.5
Min. 7.8
(0.20) molding compound around
the perimeter of the heatsink
R0.60(4x)
pin 17 (6)
L 0.25 B
5.50 (3)
Min. 15.5
Min. 18.5
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
SOT1211-3
Third angle projection
1
7/26/2018
Sheet 1 of 2
Fig 17. Package outline SOT1211-3 (sheet 1 of 2)
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
14 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
SOT1211-3
Drawing Notes
Description
Items
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
(1)
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm. max. At all other areas the
(2)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
(3)
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
(4)
The lead coplanarity over all leads is 0.1 mm maximum.
(5)
Dimension is measured 0.5 mm from the edge of the top package body.
(6)
The hatched area indicates the exposed metal heatsink.
(7)
The leads and exposed heatsink are plated with matte Tin (Sn).
mold protrusion is maximum 0.15 mm per side. See also detail B.
location of metal protrusion (2)
DETAIL A
SCALE 25:1
B
A
0 .2
a
5m
x. (
1)
lead dambar
location
0
0 .6
2m
5
0.1
ax
ma
x.
m
.2 5
ax
. (1
)
(1)
(1)
DETAIL B
SCALE 50:1
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
SOT1211-3
Third angle projection
1
7/26/2018
Sheet 2 of 2
Fig 18. Package outline SOT1211-3 (sheet 2 of 2)
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
15 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
SOT1212-3
(18.01)
0.22 B0.05
(15.44)
(2.15)
7.45
A
(0.75)
16
L 0.05 A
15
9.78
9.96(1)
(4.47)
(7.04)
16
13.2 B.30
R1.38
P2 0.1Z
C
metal protrusion 4x
(ground) in corners (2)
1.5
1 (12x)
R0.16 max.
14
1
0.35 (14x) (3)
L 0.25 B
20.75 (1)
L 0.05 B
3.92
R1
DETAIL C
SCALE 25:1
+.08
- .03
R0.32
B
20.57
0.10
0.95 B0.15
H
3.0°
Min. 5.5
Min. 7.8
(0.20) compound rim all around the
perimeter of the heatsink
+4°
- 3°
0.00 +- 0.06
0.02 (6)
pin 17 (4)
Gage plane
0.35 (7)
Seating plane
R0.60 (4x)
L 0.25 B
5.5 (3)
Min. 15.5
Min. 18.5
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
SOT1212-3
Third angle projection
1
7/26/2018
Sheet 1 of 2
Fig 19. Package outline SOT1212-3 (sheet 1 of 2)
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
16 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
SOT1212-3
Drawing Notes
Description
Items
Dimensions are excluding mold protrusion. Areas located adjacent to the leads have a maximum mold protrusion of 0.25
(1)
mm (per side) and 0.62 mm max. in length. In between the 14 leads the protrusion is 0.25 mm max. At all other areas the
(2)
The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A).
mold protrusion is maximum 0.15 mm per side. See also detail B.
(3)
The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location.
(4)
The hatched area indicated the exposed heatsink.
(5)
The leads and exposed heatsink are plated with matte Tin (Sn).
Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the
(6)
heatsink is higher than the bottom of the lead.
(7)
Gage plane (foot length) to be measured from the seating plane.
location of metal protrusion (2)
B
DETAIL A
SCALE 25:1
A
0 .6
2m
ax .
(1)
lead dambar
location
5
0.2
x
ma
)
.(1
5
0.1
x
ma
. (1
)
DETAIL B
SCALE 50:1
Package outline drawing:
units in mm.
Tolerances unless otherwise stated:
Revision:
Angle: B 1° Revision date:
Dimension: B 0.05
SOT1212-3
Third angle projection
1
7/26/2018
Sheet 2 of 2
Fig 20. Package outline SOT1212-3 (sheet 2 of 2)
BLM8D1822S-50PB_S-50PBG
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
17 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
10. Handling information
CAUTION
This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling
electrostatic sensitive devices.
Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or
equivalent standards.
Table 10.
ESD sensitivity
ESD model
Class
Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002
C2 [1]
Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001
1C [2]
[1]
CDM classification C2 is granted to any part that passes after exposure to an ESD pulse of 500 V.
[2]
HBM classification 1C is granted to any part that passes after exposure to an ESD pulse of 1000 V.
11. Abbreviations
Table 11.
Acronym
BLM8D1822S-50PB_S-50PBG
Product data sheet
Abbreviations
Description
3GPP
3rd Generation Partnership Project
CCDF
Complementary Cumulative Distribution Function
CW
Continuous Wave
DPCH
Dedicated Physical CHannel
ESD
ElectroStatic Discharge
GEN8
Eighth Generation
GSM
Global System for Mobile Communications
LDMOS
Laterally Diffused Metal Oxide Semiconductor
LTE
Long Term Evolution
MMIC
Monolithic Microwave Integrated Circuit
MTF
Median Time to Failure
OBO
Output Back Off
PAR
Peak-to-Average Ratio
RoHS
Restriction of Hazardous Substances
VSWR
Voltage Standing-Wave Ratio
W-CDMA
Wideband Code Division Multiple Access
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
18 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
12. Revision history
Table 12.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
BLM8D1822S-50PB_S-50PBG v.4
20180928
Product data sheet
-
BLM8D1822S-50PB_
S-50PBG v.3
Modifications
•
Section 9 on page 14: package outline versions updated
BLM8D1822S-50PB_S-50PBG v.3
20171123
Product data sheet
-
BLM8D1822S-50PB_
S-50PBG v.2
BLM8D1822S-50PB_S-50PBG v.2
20171117
Product data sheet
-
BLM8D1822S-50PB_
S-50PBG v.1
BLM8D1822S-50PB_S-50PBG v.1
20160322
Product data sheet
-
-
BLM8D1822S-50PB_S-50PBG
Product data sheet
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Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
19 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.ampleon.com.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. Ampleon does not give any representations or
warranties as to the accuracy or completeness of information included herein
and shall have no liability for the consequences of use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local Ampleon sales office. In
case of any inconsistency or conflict with the short data sheet, the full data
sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
Ampleon and its customer, unless Ampleon and customer have explicitly
agreed otherwise in writing. In no event however, shall an agreement be valid
in which the Ampleon product is deemed to offer functions and qualities
beyond those described in the Product data sheet.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, Ampleon does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. Ampleon takes no responsibility for
the content in this document if provided by an information source outside of
Ampleon.
In no event shall Ampleon be liable for any indirect, incidental, punitive,
special or consequential damages (including - without limitation - lost profits,
lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, Ampleon’s aggregate and cumulative liability towards customer
for the products described herein shall be limited in accordance with the
Terms and conditions of commercial sale of Ampleon.
Right to make changes — Ampleon reserves the right to make changes to
information published in this document, including without limitation
specifications and product descriptions, at any time and without notice. This
document supersedes and replaces all information supplied prior to the
publication hereof.
Suitability for use — Ampleon products are not designed, authorized or
warranted to be suitable for use in life support, life-critical or safety-critical
systems or equipment, nor in applications where failure or malfunction of an
BLM8D1822S-50PB_S-50PBG
Product data sheet
Ampleon product can reasonably be expected to result in personal injury,
death or severe property or environmental damage. Ampleon and its
suppliers accept no liability for inclusion and/or use of Ampleon products in
such equipment or applications and therefore such inclusion and/or use is at
the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Ampleon makes no representation
or warranty that such applications will be suitable for the specified use without
further testing or modification.
Customers are responsible for the design and operation of their applications
and products using Ampleon products, and Ampleon accepts no liability for
any assistance with applications or customer product design. It is customer’s
sole responsibility to determine whether the Ampleon product is suitable and
fit for the customer’s applications and products planned, as well as for the
planned application and use of customer’s third party customer(s). Customers
should provide appropriate design and operating safeguards to minimize the
risks associated with their applications and products.
Ampleon does not accept any liability related to any default, damage, costs or
problem which is based on any weakness or default in the customer’s
applications or products, or the application or use by customer’s third party
customer(s). Customer is responsible for doing all necessary testing for the
customer’s applications and products using Ampleon products in order to
avoid a default of the applications and the products or of the application or
use by customer’s third party customer(s). Ampleon does not accept any
liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — Ampleon products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.ampleon.com/terms, unless otherwise agreed in a valid written
individual agreement. In case an individual agreement is concluded only the
terms and conditions of the respective agreement shall apply. Ampleon
hereby expressly objects to applying the customer’s general terms and
conditions with regard to the purchase of Ampleon products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
20 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
Non-automotive qualified products — Unless this data sheet expressly
states that this specific Ampleon product is automotive qualified, the product
is not suitable for automotive use. It is neither qualified nor tested in
accordance with automotive testing or application requirements. Ampleon
accepts no liability for inclusion and/or use of non-automotive qualified
products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without Ampleon’s warranty of the product for such
automotive applications, use and specifications, and (b) whenever customer
uses the product for automotive applications beyond Ampleon’s specifications
such use shall be solely at customer’s own risk, and (c) customer fully
indemnifies Ampleon for any liability, damages or failed product claims
resulting from customer design and use of the product for automotive
applications beyond Ampleon’s standard warranty and Ampleon’s product
specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Any reference or use of any ‘NXP’ trademark in this document or in or on the
surface of Ampleon products does not result in any claim, liability or
entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of
the NXP group of companies and any reference to or use of the ‘NXP’
trademarks will be replaced by reference to or use of Ampleon’s own
trademarks.
14. Contact information
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
BLM8D1822S-50PB_S-50PBG
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 28 September 2018
© Ampleon Netherlands B.V. 2018. All rights reserved.
21 of 22
BLM8D1822S-50PB(G)
LDMOS 2-stage integrated Doherty MMIC
15. Contents
1
1.1
1.2
1.3
2
2.1
2.2
3
4
5
6
7
8
8.1
8.2
8.3
8.4
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 3
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Application information. . . . . . . . . . . . . . . . . . . 5
Possible circuit topologies . . . . . . . . . . . . . . . . 8
Ruggedness in a Doherty operation . . . . . . . . . 9
Impedance information . . . . . . . . . . . . . . . . . . . 9
Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Handling information. . . . . . . . . . . . . . . . . . . . 18
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Contact information. . . . . . . . . . . . . . . . . . . . . 21
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© Ampleon Netherlands B.V. 2018.
All rights reserved.
For more information, please visit: http://www.ampleon.com
For sales office addresses, please visit: http://www.ampleon.com/sales
Date of release: 28 September 2018
Document identifier: BLM8D1822S-50PB_S-50PBG
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