BLP05H6700XRGY

BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor Rev. 2 — 13 September 2018 Product data sheet 1. Product profile 1.1 General description A 700 W extra rugged LDMOS power transistor optimized for broadcast, industrial, aerospace and defense applications in the HF to 600 MHz band. Table 1. Application information Test signal pulsed RF f VDS PL Gp ηD (MHz) (V) (W) (dB) (%) 108 50 700 26 75 1.2 Features and benefits  Easy power control  Integrated dual sided ESD protection enables class C operation and complete switch off of the transistor  Excellent ruggedness VSWR 65 : 1  High efficiency  Excellent thermal stability  Designed for broadband operation (HF to 600 MHz)  50 V operation for easy broadband matching  Package available in both straight leads and gull wing form  For RoHS compliance see the product details on the Ampleon website 1.3 Applications  Industrial, scientific and medical applications  Broadcast transmitter applications  Aerospace and defense applications BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol BLP05H6700XR (SOT1138-3) 1 gate 2 2 gate 1 3 drain 1 4 drain 2 5 4 4 3 1 5 2 [1] source 1 2 3 aaa-003574 BLP05H6700XRG (SOT1204-3) 1 gate 2 2 gate 1 3 drain 1 4 drain 2 5 4 4 3 1 5 [1] source 2 1 2 3 aaa-003574 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number BLP05H6700XR Package Name Description - plastic, heatsink small outline package; 4 leads (flat) SOT1138-3 BLP05H6700XRG - Version plastic, heatsink small outline package; 4 leads SOT1204-3 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Max Unit VDS drain-source voltage - 135 V gate-source voltage 6 +11 V Tstg storage temperature 65 +150 C Tcase case temperature - 150 C - 225 C [1] Product data sheet Min VGS Tj BLP05H6700XR_H6700XRG Conditions junction temperature [1] Continuous use at maximum temperature will affect the reliability, for details refer to the online MTF calculator. All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 2 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Rth(j-case) thermal resistance from junction to case Tj = 150 C Zth(j-case) transient thermal impedance from junction to case Tj = 150 C; tp = 100 s;  = 20 % [1] [1][2] [3] Typ Unit 0.21 K/W 0.064 K/W Tj is the junction temperature. [2] Rth(j-c) is measured under RF conditions. [3] see Figure 1. amp00265 0.25 Zth(j-c) (K/W) 0.2 (7) (6) (5) (4) (3) (2) (1) 0.15 0.1 0.05 0 10-7 10-6 10-5 10-4 10-3 10-2 10-1 tp (s) 1 (1)  = 1 % (2)  = 2 % (3)  = 5 % (4)  = 10 % (5)  = 20 % (6)  = 50 % (7)  = 100 % (DC) Fig 1. BLP05H6700XR_H6700XRG Product data sheet Transient thermal impedance from junction to case as a function of pulse duration All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 3 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 6. Characteristics Table 6. DC characteristics Tj = 25 °C per section; unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.75 mA Min Typ Max Unit 135 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 275 mA 1.33 1.9 2.33 V VGSq gate-source quiescent voltage VDS = 50 V; ID = 50 mA - 2.1 - V IDSS drain leakage current VGS = 0 V; VDS = 50 V - - 1.4 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 36 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 140 nA RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 9.625 A - 0.16 -  Table 7. AC characteristics Tj = 25 °C per section; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Crs feedback capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz - 2.75 - pF Ciss input capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz - 297 - pF Coss output capacitance VGS = 0 V; VDS = 50 V; f = 1 MHz - 104 - pF Table 8. RF characteristics Test signal: pulsed RF; tp = 100 μs; δ = 20 %; f = 108 MHz; RF performance at VDS = 50 ; IDq = 100 mA; Tcase = 25 °C; unless otherwise specified; in a class-AB production test circuit. BLP05H6700XR_H6700XRG Product data sheet Symbol Parameter Conditions Min Typ Max Unit Gp power gain PL = 700 W 25 26 - dB RLin input return loss PL = 700 W - 13 - dB D drain efficiency PL = 700 W 72 75 - % All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 4 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor amp00266 600 Coss (pF) 500 400 300 200 100 0 0 10 20 30 40 50 VDS (V) 60 VGS = 0 V; f = 1 MHz. Fig 2. Output capacitance as a function of drain-source voltage; typical values per section 7. Test information 7.1 Ruggedness in class-AB operation The BLP05H6700XR and the BLP05H6700XRG are capable of withstanding a load mismatch corresponding to VSWR > 65 : 1 through all phases under the following conditions: VDS = 50 V; IDq = 100 mA; PL = 700 W pulsed; f = 108 MHz. 7.2 Impedance information drain 1 gate 1 Zi ZL gate 2 drain 2 001aan207 Fig 3. Definition of transistor impedance Table 9. Typical push-pull impedance Simulated Zi and ZL device impedance; impedance info at VDS = 50 V and PL = 700 W. BLP05H6700XR_H6700XRG Product data sheet f Zi ZL (MHz) (Ω) (Ω) 108 5.9  j19.1 5.5 + j1.1 All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 5 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 7.3 Test circuit 200 mm - + C23 R5 L3 C6 C8 R3 L1 T2 C12 C10 R1 80 mm C14 C2 C1 C5 C16 C4 C20 C18 C19 C21 C17 C3 C15 C22 R2 C9 C7 T1 C13 L2 C11 R4 R6 L4 17 mm 22 mm - + C24 amp00267 Printed-Circuit Board (PCB): Taconic RF-35; r = 3.5 F/m; thickness = 0.765 mm; thickness copper plating = 35 m. See Table 10 for a list of components. Fig 4. Component layout for class-AB production test circuit Table 10. List of components For test circuit see Figure 4. Component Description Value C1 multilayer ceramic chip capacitor 510 pF [1] ATC 100B C2, C3 multilayer ceramic chip capacitor 62 pF [1] ATC 100B 20 pF [1] ATC 100B [1] ATC 100B C4 C5 multilayer ceramic chip capacitor 160 pF C6, C7 multilayer ceramic chip capacitor 4.7 F, 100 V C8, C9 multilayer ceramic chip capacitor 820 pF [1] ATC 100B [1] ATC 100B C10, C11 multilayer ceramic chip capacitor 820pF C12, C13 multilayer ceramic chip capacitor 4.7 F, 100 V C14, C15 multilayer ceramic chip capacitor 91 pF [1] ATC 100B C16 multilayer ceramic chip capacitor 36 pF [1] ATC 100B 22 pF [1] ATC 100B ATC 100B ATC 100B C17 BLP05H6700XR_H6700XRG Product data sheet multilayer ceramic chip capacitor Remarks multilayer ceramic chip capacitor C18, C19 multilayer ceramic chip capacitor 47 pF [1] C20, C21 multilayer ceramic chip capacitor 120 pF [1] All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 6 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor Table 10. List of components …continued For test circuit see Figure 4. Component Description Value Remarks [1] C22 multilayer ceramic chip capacitor 220 pF C23, C24 electrolytic capacitor 2200 F, 64 V L1, L2 air inductor 10 turns, d = 2 mm 0.5 mm copper wire L3, L4 air inductor 6 turns, d = 2 mm 0.5 mm copper wire R1, R2 resistor 4.7 k SMD 1206 R3, R4 shunt resistor 0.01  FC4L110R010FER R5, R6 metal film resistor 10 , 0.6 W T1, T2 semi rigid coax 50 , 160 mm [1] ATC 100B EZ 86-TP/M17 American Technical Ceramics type 100B or capacitor of same quality. 7.4 Graphical data amp00268 28 Gp (dB) ηD (%) 26 amp0026 63 80 PL (dBm) Ideal PL 61 60 (2) 24 40 Gp (1) 59 PL 22 20 57 ηD 20 0 100 200 300 400 500 600 700 PL (W) 0 800 55 28 VDS = 50 V; IDq = 100 mA; f = 108 MHz; tp = 100 s;  = 20 %. 29 30 31 32 33 34 Pi (dBm) 35 VDS = 50 V; IDq = 100 mA; f = 108 MHz; tp = 100 s;  = 20 %. (1) PL(1dB) = 58.4 dBm (692 W) (2) PL(3dB) = 58.8 dBm (765 W) Fig 5. Power gain and drain efficiency as function of output power; typical values BLP05H6700XR_H6700XRG Product data sheet Fig 6. Output power as a function of input power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 7 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor amp00270 30 Gp (dB) amp00271 80 ηD (%) 28 (1) (2) (3) (4) 60 (1) (2) (3) (4) 26 40 24 20 22 20 0 0 100 200 300 400 500 600 700 PL (W) 800 0 VDS = 50 V; f = 108 MHz; tp = 100 s;  = 20 %. 100 200 (1) IDq = 50 mA (2) IDq = 100 mA (2) IDq = 100 mA (3) IDq = 200 mA (3) IDq = 200 mA (4) IDq = 400 mA (4) IDq = 400 mA Power gain as a function of output power; typical values Fig 8. amp00272 30 Gp (dB) 400 500 600 700 PL (W) 800 VDS = 50 V; f = 108MHz; tp = 100 s;  = 20 %. (1) IDq = 50 mA Fig 7. 300 Drain efficiency as a function of output power; typical values 80 (1) ηD (%) (2) (3) (5) (4) amp00273 (6) 28 60 26 40 (6) 24 (5) (4) (3) 20 (2) 22 (1) 20 0 0 100 200 300 400 500 600 700 PL (W) 800 IDq = 100 mA; f = 108 MHz; tp = 100 s;  = 20 %. 0 100 200 (1) VDS = 25 V (2) VDS = 30 V (2) VDS = 30 V (3) VDS = 35 V (3) VDS = 35 V (4) VDS = 40 V (4) VDS = 40 V (5) VDS = 45 V (5) VDS = 45 V (6) VDS = 50 V (6) VDS = 50 V Power gain as a function of output power; typical values BLP05H6700XR_H6700XRG Product data sheet 400 500 600 700 PL (W) 800 IDq = 100 mA; f = 108 MHz; tp = 100 s;  = 20 %. (1) VDS = 25 V Fig 9. 300 Fig 10. Drain efficiency as a function of output power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 8 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 8. Package outline SOT1138-3 (18.01) (2.15) (15.44) (0.75) E 0.10 (4) 6.85 3 A L 0.05 A 9.78 9.96(1) 16.00 (4.47) (7.04) 15.96 B0.20 4 P2.00 0.1Z 0.10 R0.16 max. 1 2 5.85(3) R1.00 B 20.75(1) metal protrusion 4x (ground) in corners (2) L 0.25 B 0.22B0.05 L 0.05 B 20.57 1.57 (5) 3.92 +- 0.08 0.03 R0.32 Min. 5.5 Min. 7.8 (0.20) molding compound rim around the perimeter of the heatsink pin 5 (6) R0.60 (4x) Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1138-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 11. Package outline SOT1138-3 (sheet 1 of 2) BLP05H6700XR_H6700XRG Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 9 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor SOT1138-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. All areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and max. 0.62 mm in length. (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The lead coplanarity over all leads is 0.1 mm maximum. (5) Dimension is measured 0.5 mm from the edge of the top package body. (6) The hatched area indicates the exposed metal heatsink. (7) The leads and exposed heatsink are plated with matte Tin (Sn). At all other areas the mold protrusion is maximum 0.15 mm per side. See also detail B. location of metal protrusion (2) B DETAIL A SCALE 25:1 A 5 0.2 lead dambar location 0.6 2m ax ma x. (1) (1 ) 5 0.1 ma 1) x .( DETAIL B SCALE 50:1 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1138-3 Third angle projection 1 7/26/2018 Sheet 2 of 2 Fig 12. Package outline SOT1138-3 (sheet 2 of 2) BLP05H6700XR_H6700XRG Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 10 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor SOT1204-3 (18.01) (15.44) 0.22 ± 0.05 (2.15) (0.75) 6.85 R1.38 3 A L 0.05 A 9.78 9.96(1) (7.04) 16.00 (4.47) 13.20 B0.30 4 P2.00 0.1Z 2 1 5.85 (3) R0.16 max. L 0.25 B metal protrusion 4x (ground) in corners (2) L 0.05 B 20.75(1) R1.00 C +0.08 3.92 - 0.03 DETAIL C SCALE 25:1 R0.32 20.57 0.10 0.95 B0.15 H B Min. 5.5 Min. 7.8 (0.20) molding compound rim around the perimeter of the heatsink +0.06 0.00 - 0.02(6) Gage plane R0.60(4x) pin 5 (4) 0.35 (7) +4° 3.0° - 3° Seating plane Min. 15.5 Min. 18.5 Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1204-3 Third angle projection 1 7/26/2018 Sheet 1 of 2 Fig 13. Package outline SOT1204-3 (sheet 1 of 2) BLP05H6700XR_H6700XRG Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 11 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor SOT1204-3 Drawing Notes Description Items Dimensions are excluding mold protrusion. All areas located adjacent to the leads have a maximum mold protrusion of 0.25 (1) mm (per side) and 0.62 mm max. in length. (2) The metal protrusion (tie bars) in the corner will not stick out of the molding compound protrusions (detail A). At other areas the mold protrusion is maximum 0.15 mm per side. See also detail B. (3) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (4) The hatched area indicated the exposed heatsink. (5) The leads and exposed heatsink are plated with matte Tin (Sn). Dimension is measured with respect to the bottom of the heatsink Datum H. Positive value means that the bottom of the (6) heatsink is higher than the bottom of the lead. (7) Gage plane (foot length) to be measured from the seating plane. location of metal protrusion (2) B DETAIL A SCALE 25:1 A lead dambar location 0.2 0 .6 DETAIL B SCALE 50:1 Package outline drawing: units in mm. 2m 5 0 .1 ax ma Third angle projection x. (1) 1) x .( (1) Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1204-3 a 5m 1 7/26/2018 Sheet 2 of 2 Fig 14. Package outline SOT1204-3 (sheet 2 of 2) BLP05H6700XR_H6700XRG Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 12 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 9. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. Table 11. ESD sensitivity ESD model Class Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002 C2A [1] Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001 2 [2] [1] CDM classification C2A is granted to any part that passes after exposure to an ESD pulse of 500 V. [2] HBM classification 2 is granted to any part that passes after exposure to an ESD pulse of 2000 V. 10. Abbreviations Table 12. Abbreviations Acronym Description ESD ElectroStatic Discharge HF High Frequency LDMOS Laterally Diffused Metal-Oxide Semiconductor MTF Median Time to Failure SMD Surface Mounted Device RoHS Restriction of Hazardous Substances VSWR Voltage Standing Wave Ratio 11. Revision history Table 13. Revision history Document ID Release date BLP05H6700XR_H6700XRG 20180913 v.2 Modifications • • • • Product data sheet Change notice Supersedes Product data sheet - BLP05H6700XR_H6700XRG v.1 Table 2 on page 2: package outline versions changed to SOT1138-3 and SOT1204-3 Table 3 on page 2: package outline versions changed to SOT1138-3 and SOT1204-3 Figure 4 on page 6: figure updated Section 8 on page 9: package outline versions changed from SOT1138-2 and SOT1204-2 to SOT1138-3 and SOT1204-3 BLP05H6700XR_H6700XRG 20170217 v.1 BLP05H6700XR_H6700XRG Data sheet status Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 - © Ampleon Netherlands B.V. 2018. All rights reserved. 13 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an BLP05H6700XR_H6700XRG Product data sheet Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 14 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’ standard warranty and Ampleon’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 13. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLP05H6700XR_H6700XRG Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 13 September 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 15 of 16 BLP05H6700XR; BLP05H6700XRG Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description. . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics. . . . . . . . . . . . . . . . . . . 3 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 5 Ruggedness in class-AB operation. . . . . . . . . . 5 Impedance information . . . . . . . . . . . . . . . . . . . 5 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 Handling information. . . . . . . . . . . . . . . . . . . . 13 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 13 Legal information. . . . . . . . . . . . . . . . . . . . . . . 14 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Contact information. . . . . . . . . . . . . . . . . . . . . 15 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2018. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 13 September 2018 Document identifier: BLP05H6700XR_H6700XRG