BLP8G10S-270PWY

BLP8G10S-270PWY

  • 厂商:

    AMPHENOL(安费诺)

  • 封装:

    SOT-1221-2

  • 描述:

    RF FET LDMOS 65V 20DB SOT12212

  • 数据手册
  • 价格&库存
BLP8G10S-270PWY 数据手册
BLP8G10S-270PW Power LDMOS transistor Rev. 2 — 1 October 2015 Product data sheet 1. Product profile 1.1 General description 270 W LDMOS packaged symmetric Doherty power transistor for base station applications at frequencies from 700 MHz to 900 MHz. Table 1. Typical performance Typical RF performance at Tcase = 25 C in a Doherty application test circuit. VDS = 28 V; IDq = 500 mA (main); VGS(amp)peak = 0.5 V, unless otherwise specified. Test signal 1-carrier W-CDMA [1] f VDS PL(AV) Gp D ACPR (MHz) (V) (dBm) (dB) (%) (dBc) 716 to 768 28 47.5 17.3 46 35 [1] Test signal: 1-carrier W-CDMA; 3GPP test model 1; 64 DPCH; PAR = 9.65 dB at 0.01% probability on CCDF per carrier. 1.2 Features and benefits          Excellent ruggedness High-efficiency Low thermal resistance providing excellent thermal stability Lower output capacitance for improved performance in Doherty applications Designed for low memory effects providing excellent digital pre-distortion capability Internally matched for ease of use Integrated ESD protection Bias through video leads Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications  RF power amplifiers for base stations and multi carrier applications in the 700 MHz to 900 MHz frequency range BLP8G10S-270PW Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline 1, 2 gate 3, 6 bias/video decoupling 4, 5 drain 7 source 6 5 4 Graphic symbol 3 4 3 2 [1] 7 1 1 6 2 5 aaa-008888 [1] Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package Name Description Version BLP8G10S-270PW HSOP6F plastic, heatsink small outline package; 6 leads (flat) SOT1221-2 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS drain-source voltage - 65 V VGS(amp)main main amplifier gate-source voltage 0.5 +13 V VGS(amp)peak peak amplifier gate-source voltage 0.5 +13 V Tstg storage temperature 65 +150 C Min - 225 C [1] junction temperature Tj [1] Conditions Max Unit Continuous use at maximum temperature will affect the reliability, for details refer to the on-line MTF calculator. 5. Thermal characteristics Table 5. BLP8G10S-270PW Product data sheet Thermal characteristics Symbol Parameter Conditions Rth(j-c) thermal resistance from junction to case VDS = 28 V; IDq = 650 mA (main); VGS(amp)peak = 0.5 V; Tcase = 80 C; Typ Unit PL = 56 W 0.50 K/W PL = 89 W 0.43 K/W All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 2 of 15 BLP8G10S-270PW Power LDMOS transistor 6. Characteristics Table 6. DC characteristics Per section; Tj = 25 C unless otherwise specified. Symbol Parameter Conditions V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 2.25 mA Min Typ Max Unit 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 225 mA 1.5 1.9 2.3 V VGSq gate-source quiescent voltage VDS = 28 V; ID = 1000 mA 1.7 2.1 2.5 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V; VDS = 10 V - 37.5 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 140 nA gfs forward transconductance VDS = 10 V; ID = 11.25 mA - 14 - S RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 7875 mA - 90 148 m Table 7. RF characteristics Test signal: 1-carrier W-CDMA; 3GPP test model 1; 64 DPCH; PAR = 9.65 dB at 0.01 % probability on the CCDF per carrier; f1 = 718.5 MHz; f2 = 765.5 MHz; RF performance at VDS = 28 V; IDq = 2000 mA (main); Tcase = 25 C; unless otherwise specified; in a class AB production test circuit at frequencies from 716 MHz to 768 MHz. Symbol Parameter Conditions Min Typ Max Unit Gp RLin power gain PL(AV) = 56 W 19 20 - dB input return loss PL(AV) = 56 W - 16 12 dB D drain efficiency PL(AV) = 56 W 25 29 - % ACPR adjacent channel power ratio PL(AV) = 56 W - 38 33 dBc Table 8. RF characteristics Test signal: pulsed RF; f1 = 718.5 MHz; f2 = 756.5 MHz; tp = 10 ms;  = 10 %; RF performance at VDS = 28 V; IDq = 2000 mA (main); Tcase = 25 C; unless otherwise specified; in a class-AB narrow band production circuit. BLP8G10S-270PW Product data sheet Symbol Parameter PL(3dB) output power at 3 dB gain compression Conditions All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 Min Typ Max Unit 315 365 - W © Ampleon Netherlands B.V. 2016. All rights reserved. 3 of 15 BLP8G10S-270PW Power LDMOS transistor 7. Application information 7.1 Application circuit 40 mm 40 mm L3 C26 C5 L1 R3 C18 R2 C3 Q1 C17 C14 C16 C15 C1 C11 C7 R1 X1 C9 C10 C8 75 mm C25 C12 C2 C4 Q2 C19 C21 C22 C13 C23 C6 R4 L2 C24 R5 L4 aaa-019800 Printed-Circuit Board (PCB): Rogers RO3006: r = 6.15; thickness = 0.635 mm; thickness copper plating = 70 m. See Table 11 for a list of components. Fig 1. Component layout Table 9. List of components See Figure 15 for component layout. Component Description Value Remarks C1, C2, C3, C4, C14, C19, C25 multilayer ceramic chip capacitor 82 pF ATC 600F C5, C6, C16, C17, C22, C23, C26 multilayer ceramic chip capacitor 10 F Murata: GRM32ER71H106KA12 C7, C8, C9, C10 multilayer ceramic chip capacitor 15 pF ATC 600F C11, C12 multilayer ceramic chip capacitor 5.6 pF ATC 600F C13 multilayer ceramic chip capacitor 1.8 pF ATC 600F C15, C21 multilayer ceramic chip capacitor 1 F Murata: GRM31CR72A105KA01L C18, C24 electrolytic capacitor 2200 F Multicomp: MCGPR35V228M16X32 L1, L2, L3, L4 chip ferrite bead - Murata; BLE32PN300SN1L Q1, Q2 transistor - Fairchild: MMBT2222 R1 resistor 50  Panasonic: ERJ-L14KF50MU R2, R4 resistor 1.1 k Vishay Dale BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 4 of 15 BLP8G10S-270PW Power LDMOS transistor Table 9. List of components See Figure 15 for component layout. Component Description Value Remarks R3 resistor 1.2 k Vishay Dale R5 resistor 3.9 k Vishay Dale X1 hybrid coupler 3 dB, 90 Anaren: X3C07P1-03S 7.2 Graphical data measured at frequency band from 716 MHz to 768 MHz 7.2.1 Pulsed CW aaa-019723 70 ηD (%) aaa-019724 19 Gp (dB) 60 18 (3) (2) (1) 50 17 40 16 30 15 20 14 10 (3) (2) (1) 13 0 50 100 150 200 250 300 350 PL (W) 400 0 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V; tp = 100 s;  = 10 %. 50 100 (1) f = 716 MHz (2) f = 742 MHz (2) f = 742 MHz (3) f = 768 MHz (3) f = 768 MHz Drain efficiency as a function of output power; typical values BLP8G10S-270PW Product data sheet 200 250 300 PL (W) 350 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V; tp = 100 s;  = 10 %. (1) f = 716 MHz Fig 2. 150 Fig 3. Power gain as a function of output power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 5 of 15 BLP8G10S-270PW Power LDMOS transistor 7.2.2 1-Carrier W-CDMA PAR = 9.7 dB per carrier at 0.01 % probability on the CCDF; 3GPP test model 1 with 64 DPCH (100 % clipping). aaa-019725 18 Gp (dB) 60 ηD (%) Gp 17 50 (1) (1) (2) (2) (3) (3) 16 aaa-019726 -25 ACPR5M (dBc) -30 40 -35 15 30 14 20 -40 ηD 13 -45 10 12 0 20 40 60 80 PL (W) (1) (2) (3) 0 100 -50 0 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. 20 (1) f = 716 MHz (2) f = 742 MHz (2) f = 742 MHz (3) f = 768 MHz 60 80 PL (W) 100 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. (1) f = 716 MHz Fig 4. 40 (3) f = 768 MHz Power gain and drain efficiency as function of output power; typical values Fig 5. aaa-019727 11 PAR (dB) Adjacent channel power ratio (5 MHz) as a function of output power; typical values aaa-019728 21 RLin (dB) 10 19 9 (3) 17 (2) (1) (2) (3) 8 15 7 13 6 11 5 (1) 9 0 20 40 60 80 PL (W) 100 0 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. 20 (1) f = 716 MHz (2) f = 742 MHz (2) f = 742 MHz (3) f = 768 MHz (3) f = 768 MHz Peak-to-average power ratio as a function of output power; typical values BLP8G10S-270PW Product data sheet 60 80 PL (W) 100 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. (1) f = 716 MHz Fig 6. 40 Fig 7. Input return loss as a function of output power; typical values All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 6 of 15 BLP8G10S-270PW Power LDMOS transistor 7.2.3 2-Carrier W-CDMA PAR = 8.4 dB at 0.01 % probability on the CCDF; 3GPP test model 1 with 64 DPCH (46 % clipping). aaa-019729 19 Gp (dB) ηD (%) Gp 18 aaa-019730 -15 ACPR5M (dBc) -25 -15 (1) (2) (3) 40 -35 16 -5 ACPR10M (dBc) ACPR5M 50 (1) (1) (2) (2) (3) (3) 17 60 -25 30 ACPR10M -45 ηD 15 14 13 20 40 60 80 PL (W) (1) (2) (3) -55 10 0 -35 20 0 100 -65 0 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. 20 40 60 80 PL (W) -55 100 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. (1) f = 716 MHz (1) f = 716 MHz (2) f = 742 MHz (2) f = 742 MHz (3) f = 768 MHz Fig 8. -45 (3) f = 768 MHz Power gain and drain efficiency as function of output power; typical values Fig 9. Adjacent channel power ratio (5 MHz) and adjacent channel power ratio (10 MHz) as function of output power; typical values aaa-019731 21 RLin (dB) 19 (3) 17 (2) (1) 15 13 11 9 0 20 40 60 80 PL (W) 100 VDS = 28 V; IDq = 500 mA; VGS(amp)peak = 0.50 V. (1) f = 716 MHz (2) f = 742 MHz (3) f = 768 MHz Fig 10. Input return loss as a function of output power; typical values BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 7 of 15 BLP8G10S-270PW Power LDMOS transistor 7.2.4 CW aaa-019732 4 AM to PM (deg) 0 aaa-019733 8 td(grp) (ns) 4 -4 (1) (2) (3) -8 0 -12 -4 -16 -20 30 35 40 45 50 55 PL (dBm) -8 500 60 VDS = 28 V; IDq = 500 mA (main); VGS(amp)peak = 0.50 V. 600 700 800 900 f (MHz) 1000 VDS = 28 V; IDq = 500 mA (main); VGS(amp)peak = 0.50 V. PL = 27.5 dBm. (1) f = 716 MHz (2) f = 742 MHz (3) f = 768 MHz Fig 11. AM to PM as a function of output power; typical values Fig 12. Group delay time as a function of frequency; typical values 7.2.5 2-Tone VBW aaa-019734 0 IMD (dBc) -15.2 (1) (2) IMD3 -30.4 IMD5 (1) (2) IMD7 -45.6 (1) (2) -60.8 -76 1 10 102 carrier spacing (MHz) 103 VDS = 28 V; IDq = 500 mA (main device); VGS(amp)peak = 0.50 V; f = 742 MHz. (1) IMD low (2) IMD high Fig 13. VBW capability in Doherty demo BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 8 of 15 BLP8G10S-270PW Power LDMOS transistor 8. Test information 8.1 Ruggedness in Doherty operation The BLP8G10S-270PW is capable of withstanding a load mismatch corresponding to VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; IDq = 2000 mA; f =719 MHz. Test signal: 1-carrier W-CDMA; PL = 85 W (5 dB OBO); 100 % clipping 8.2 Impedance information Table 10. Typical impedance of main or peak device Measured load-pull data of main device; IDq = 700 mA (main); VDS = 28 V; pulsed CW (tp = 100 s;  = 10 %). f ZS [1] ZL [1] PL [2] D [2] Gp [2] (MHz) () () (W) (%) (dB) Maximum power load 728 3.1  j0.8 1.3  j2.0 261.2 60.0 17.3 748 3.1  j1.1 1.3  j1.9 258.6 60.6 17.3 768 3.1  j1.4 1.3  j1.9 252.1 60.3 17.4 869 4.4  j2.2 1.4  j2.6 240.6 60.1 17.3 880 4.7  j2.3 1.3  j2.6 237.3 59.9 17.3 894 5.1  j2.0 1.3  j2.6 235.9 60.5 17.3 Maximum drain efficiency load 728 3.1  j0.8 3.5  j1.1 164.7 73.4 20.0 748 3.1  j1.1 3.5  j0.7 150.3 73.2 20.2 768 3.1  j1.4 3.2  j0.7 150.3 72.2 20.0 869 4.4  j2.2 2.4  j1.0 141.9 71.4 19.8 880 4.7  j2.3 2.4  j1.0 136.7 70.4 19.7 894 5.1  j2.0 2.0  j1.4 155.9 70.3 19.3 [1] ZS and ZL defined in Figure 14. [2] At 3 dB gain compression. drain ZL gate ZS 001aaf059 Fig 14. Definition of transistor impedance BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 9 of 15 BLP8G10S-270PW Power LDMOS transistor 8.3 Test circuit 150 mm C11 C5 C9 C10 C3 C4 C15 R1 C1 60 mm C2 C16 C14 C13 C6 C12 C8 C7 aaa--019710 Printed-Circuit Board (PCB): Rogers RO4350B: thickness = 0.762 mm; thickness copper plating = 35 m. See Table 11 for a list of components. Fig 15. Component layout Table 11. List of components See Figure 15 for component layout. Component Description Value C1, C3, C6, C9, C12 multilayer ceramic chip capacitor 82 pF [1] ATC 800B multilayer ceramic chip capacitor 180 pF [1] ATC 800B C4, C7, C10, C13 multilayer ceramic chip capacitor 1 F [2] Murata C5, C8, C11, C14 multilayer ceramic chip capacitor 10 F, 50 V [2] Murata C15, C16 electrolytic capacitor 2200 F, 63 V R1 resistor 5 k C2 BLP8G10S-270PW Product data sheet [1] American Technical Ceramics type 800B or capacitor of same quality. [2] Murata or capacitor of same quality. All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 Remarks SMD 1206 © Ampleon Netherlands B.V. 2016. All rights reserved. 10 of 15 BLP8G10S-270PW Power LDMOS transistor 9. Package outline HSOP6F: plastic, heatsink small outline package; 6 leads(flat) SOT1221-2 D E X c B D3 A E3 y v HE A D1 D2 e1 e3 e2 b1 (2x) b2 (2x) 6 5 4 w B w B 3 (8x) METAL PROTRUSIONS (SOURCE) e7 (2x) F (6x) e6 (2x) E2 E1 A A2 A1 pin 1 index Q1 detail X 2 b (2x) 1 e4 (2x) w B e5 (2x) e6 e 0 10 mm scale Dimensions (mm are the original dimensions) Unit mm max nom min A A1 3.9 0.2 0.1 0 A2 b b1 b2 D(1) c D1 D2 D3 E(1) E1 e7 F HE Q1 16.16 1.62 2.97 4.07 0.4 15.96 1.57 15.76 1.52 E2 E3 e 3.65 4.05 3.55 0.50 0.27 20.62 19.00 16.05 20.44 10.01 8.18 5.89 9.83 3.60 4.00 3.50 0.45 0.22 20.57 18.95 16.00 20.39 9.96 8.13 5.84 9.78 8.0 3.55 3.95 3.45 0.40 0.17 20.52 18.90 15.95 20.34 9.91 8.08 5.79 9.73 v w 0.25 0.25 e1 e2 e3 14.5 6.5 4.0 e4 Outline version SOT1221-2 IEC JEDEC JEITA European projection e5 8.45 9.55 Note 1. Package body dimensions “D and “E do not include mold and metal protrusions. Allowable protrusion is 0.25 mm per side. 2. Lead width dimensions “b, “ b1 and “ b2 do not include dambar protrusions. Allowable dambar protrusion is 0.25 mm in total per lead. References y 0.1 sot1221-2_po Issue date 15-01-12 15-06-08 --- Fig 16. Package outline SOT1221-2 (HSOP6F) BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 11 of 15 BLP8G10S-270PW Power LDMOS transistor 10. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. 11. Abbreviations Table 12. Abbreviations Acronym Description 3GPP 3rd Generation Partnership Project AM Amplitude Modulation CCDF Complementary Cumulative Distribution Function CW Continuous Wave DPCH Dedicated Physical CHannel ESD ElectroStatic Discharge LDMOS Laterally Diffused Metal-Oxide Semiconductor MTF Median Time to Failure OBO Output Back-Off PAR Peak-to-Average Ratio PM Phase Modulation SMD Surface Mounted Device VBW Video Bandwidth VSWR Voltage Standing Wave Ratio W-CDMA Wideband Code Division Multiple Access 12. Revision history Table 13. Revision history Document ID Release date Data sheet status Change notice Supersedes BLP8G10S-270PW v.2 20151001 Product data sheet - BLP8G10S-270PW v.1 Modifications: BLP8G10S-270PW v.1 BLP8G10S-270PW Product data sheet • The format of this document has been redesigned to comply with the new identity guidelines of Ampleon • Legal texts have been adapted to the new company name where appropriate 20150917 Product data sheet - All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 - © Ampleon Netherlands B.V. 2016. All rights reserved. 12 of 15 BLP8G10S-270PW Power LDMOS transistor 13. Legal information 13.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 13.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 13.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an BLP8G10S-270PW Product data sheet Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 13 of 15 BLP8G10S-270PW Power LDMOS transistor Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’ standard warranty and Ampleon’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 13.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 14. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLP8G10S-270PW Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 2 — 1 October 2015 © Ampleon Netherlands B.V. 2016. All rights reserved. 14 of 15 BLP8G10S-270PW Power LDMOS transistor 15. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.2.1 7.2.2 7.2.3 7.2.4 7.2.5 8 8.1 8.2 8.3 9 10 11 12 13 13.1 13.2 13.3 13.4 14 15 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Application information. . . . . . . . . . . . . . . . . . . 4 Application circuit . . . . . . . . . . . . . . . . . . . . . . . 4 Graphical data measured at frequency band from 716 MHz to 768 MHz . . . . . . . . . . . . . . . . . . . . 5 Pulsed CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 6 2-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . . 7 CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2-Tone VBW . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 9 Ruggedness in Doherty operation . . . . . . . . . . 9 Impedance information . . . . . . . . . . . . . . . . . . . 9 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Handling information. . . . . . . . . . . . . . . . . . . . 12 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2016. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 1 October 2015 Document identifier: BLP8G10S-270PW
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