BLP9G0722-20Z

BLP9G0722-20Z

  • 厂商:

    AMPHENOL(安费诺)

  • 封装:

    SOT-1482-1

  • 描述:

    RF MOSFET LDMOS 28V SOT1482-1

  • 数据手册
  • 价格&库存
BLP9G0722-20Z 数据手册
BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor Rev. 3 — 26 February 2018 Product data sheet 1. Product profile 1.1 General description 20 W plastic LDMOS power transistor for base station applications at frequencies from 100 MHz to 2700 MHz. Table 1. Application performance (multiple frequencies) Typical RF performance at Tcase = 25 C; IDq = 180 mA; in a class-AB demo board, tested on gull wing lead device. Test signal 1-carrier W-CDMA [1] f IDq VDS PL(AV) Gp D ACPR5M (MHz) (mA) (V) (dBm) (dB) (%) (dBc) 400 to 430 180 28 35 25.5 24 45 [1] 728 to 768 180 28 35 23 22 45 [1] 1805 to 1880 180 28 35 19 21 45 [1] 2110 to 2170 180 28 35 18 21 45 [1] 2300 to 2400 180 28 35 17.3 21 45 [1] 2570 to 2620 180 28 35 16 20 45 [1] Test signal: 3GPP test model 1; 64 DCHP; PAR = 7.2 dB at 0.01 % probability on CCDF. 1.2 Features and benefits        High efficiency Excellent ruggedness Designed for broadband operation Excellent thermal stability High power gain Integrated ESD protection Compliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances (RoHS) 1.3 Applications  FDD/TDD LTE  GSM EDGE  CDMA  W-CDMA  MC-GSM  WiMAX BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 2. Pinning information Table 2. Pinning Pin Description Simplified outline Graphic symbol BLP9G0722-20 (SOT1482-1) 1 drain 2 gate 3 source 2 [1] 1 3 2 1 3 sym112 BLP9G0722-20G (SOT1483-1) 1 drain 2 gate 3 source 2 [1] 1 3 2 3 1 [1] sym112 Connected to flange. 3. Ordering information Table 3. Ordering information Type number Package BLP9G0722-20 Name Description Version - plastic; heatsink small outline package; 2 leads (flat) SOT1482-1 plastic; heatsink small outline package; 2 leads SOT1483-1 BLP9G0722-20G - 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDS Conditions Min Max Unit drain-source voltage - 65 V VGS gate-source voltage 5 +13 V Tstg storage temperature 65 +150 C Tj junction temperature - 225 C 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Rth(j-c) BLP9G0722-20_9G0722-20G Product data sheet Conditions thermal resistance from junction to case Tcase = 80 C; PL = 3 W All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 Typ Unit 1.1 K/W © Ampleon Netherlands B.V. 2018. All rights reserved. 2 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 6. Characteristics Table 6. DC characteristics Tj = 25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit V(BR)DSS drain-source breakdown voltage VGS = 0 V; ID = 0.3 mA 65 - - V VGS(th) gate-source threshold voltage VDS = 10 V; ID = 30 mA 1.5 2.0 - V VGSq gate-source quiescent voltage VDS = 28 V; ID = 180 mA 1.6 2.1 2.6 V IDSS drain leakage current VGS = 0 V; VDS = 28 V - - 1.4 A IDSX drain cut-off current VGS = VGS(th) + 3.75 V - 6 - A IGSS gate leakage current VGS = 11 V; VDS = 0 V - - 140 nA gfs forward transconductance VDS = 10 V; ID = 30 mA - 300 - mS RDS(on) drain-source on-state resistance VGS = VGS(th) + 3.75 V; ID = 1.05 A - 500 - m Table 7. RF characteristics A derivative functional RF test is performed in production. The performance as mentioned below is verified by design and characterization in a class AB production board. Test signal: pulsed CW;  = 10%; tp = 100 s; VDS = 28 V; IDq = 180 mA; Tcase = 25 C; f = 1842.5 MHz. Symbol Parameter Conditions Min Typ Max Unit Gp D power gain PL(AV) = 35 dBm 17 19 - dB drain efficiency PL(AV) = 35 dBm 18 22 - % RLin input return loss PL(AV) = 35 dBm - 10 6 dB PL(1dB) output power at 1 dB gain compression 42.5 43.9 - dBm PL(3dB) output power at 3 dB gain compression 43 44.3 - dBm 7. Test information 7.1 Ruggedness in Doherty operation The BLP9G0722-20 and BLP9G0722-20G are capable of withstanding a load mismatch corresponding to a VSWR = 10 : 1 through all phases under the following conditions: VDS = 28 V; PL = 20 W (CW); f = 728 MHz and 1805 MHz on development board. 7.2 Impedance information Table 8. Typical impedance of BLP9G0722-20G Measured load-pull data; IDq = 180 mA; VDS = 28 V. f ZS [1] ZL [1] PL [2] D [2] Gp [2] (MHz) () () (W) (%) (dB) Maximum power load BLP9G0722-20_9G0722-20G Product data sheet 740 0.5 + j0.1 10.6  j1.0 37 55.1 22.8 880 0.6  j1.4 3.8 + j2.0 49 70.9 22.8 1810 1.6  j5.5 3.4  j1.0 43 62.2 19.0 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 3 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor Table 8. Typical impedance of BLP9G0722-20G …continued Measured load-pull data; IDq = 180 mA; VDS = 28 V. f ZS [1] ZL [1] PL [2] D [2] Gp [2] (MHz) () () (W) (%) (dB) 1840 1.3  j5.8 3.0  j1.2 43 62.7 19.1 1880 1.3  j6.2 2.6  j1.5 42 61.2 18.7 2110 5.3  j9.6 2.6  j2.5 41 58.2 17.7 2170 6.2  j8.1 2.6  j2.5 41 60.4 18.2 Maximum drain efficiency load 740 0.5 + j0.1 6.0 + j10.0 20 74.1 24.8 880 0.6  j1.4 3.7 + j5.9 26 82.7 24.7 1810 1.6  j5.5 1.9 + j0.2 31 70.9 20.9 1840 1.3  j5.8 1.7 + j0.0 29 69.8 21.3 1880 1.3  j6.2 1.6  j0.2 28 69.8 21.3 2110 5.3  j9.6 1.7  j1.5 32 65.6 19.5 2170 6.2  j8.1 1.6  j1.7 30 65.9 20.2 [1] ZS and ZL defined in Figure 1. [2] at 3 dB gain compression. Table 9. Typical impedance of BLP9G0722-20 Measured load-pull data; IDq = 180 mA; VDS = 28 V. f ZS [1] ZL [1] PL [2] D [2] Gp [2] (MHz) () () (W) (%) (dB) Maximum power load 740 0.6 + j0.6 10.6  j1.0 39 56.8 22.7 880 0.6  j0.7 4.0 + j1.6 51 70.9 22.1 1810 1.8  j5.4 3.0  j1.2 44 60.9 19.1 1840 1.6  j5.8 3.0  j1.2 44 62.6 19.6 1880 1.8  j6.1 2.9  j1.6 44 60.9 19.1 2110 7.3  j8.2 2.6  j2.5 41 57.7 17.8 2170 8.7  j6.8 2.6  j2.5 43 62.1 18.7 Maximum drain efficiency load BLP9G0722-20_9G0722-20G Product data sheet 740 0.6 + j0.6 6.0 + j10.0 22 77.0 24.6 880 0.6  j0.7 3.7 + j5.9 26 85.3 24.4 1810 1.8  j5.4 1.9 + j0.0 33 69.4 20.9 1840 1.6  j5.8 1.9 + j0.0 31 69.4 21.7 1880 1.8  j6.1 1.8  j0.2 32 70.7 21.6 2110 7.3  j8.2 1.5  j1.4 30 65.3 19.9 2170 8.7  j6.8 1.4  j1.6 29 69.3 21.3 [1] ZS and ZL defined in Figure 1. [2] at 3 dB gain compression. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 4 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor drain ZL gate ZS 001aaf059 Fig 1. Definition of transistor impedance 7.3 Test circuit 76.2 mm C6 C1 C7 C8 C10 C9 C2 40 mm R1 C11 C12 C13 C3 C4 C5 BLP9G0722-20G 700MHz Rogers 4350 20mil amp00286 Printed-Circuit Board (PCB): Rogers RO4350B; thickness = 0.508 mm. See Table 10 for a list of components. Fig 2. Component layout for test circuit at 740 MHz Table 10. List of components See Figure 2 for component layout. Component BLP9G0722-20_9G0722-20G Product data sheet Description Value Remarks C1, C7, C8, C9 multilayer ceramic chip capacitor 10 F, 50 V Murata C2, C3, C10, C11 multilayer ceramic chip capacitor 36 pF ATC 600F C4, C5 multilayer ceramic chip capacitor 15 pF ATC 600F C6 electrolytic capacitor 2200 F, 50 V C12 multilayer ceramic chip capacitor 5.6 pF ATC 600F C13 multilayer ceramic chip capacitor 0.2 pF ATC 600F R1 resistor 5.1  SMD 0805 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 5 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 76.2 mm C8 C1 C2 C3 C9 C10 C4 C11 C5 R1 C6 40 mm C12 C13 C14 C16 BLP9G0722-20G 1800MHz Rogers 4350 20mil C15 C7 amp00287 Printed-Circuit Board (PCB): Rogers RO4350B; thickness = 0.508 mm. See Table 11 for a list of components. Fig 3. Component layout for test circuit at 1800 MHz Table 11. List of components See Figure 3 for component layout. BLP9G0722-20_9G0722-20G Product data sheet Component Description Value Remarks C1, C9, C10 multilayer ceramic chip capacitor 10 F, 50 V Murata C2, C3, C11, C13 multilayer ceramic chip capacitor 12 pF ATC 600F C4, C5 multilayer ceramic chip capacitor 0.8 pF ATC 600F C6 multilayer ceramic chip capacitor 6.2 pF ATC 600F C7 multilayer ceramic chip capacitor 2 pF ATC 600F C8 electrolytic capacitor 2200 F, 50 V C12, C15 multilayer ceramic chip capacitor 0.3 pF ATC 600F C14 multilayer ceramic chip capacitor 2.2 pF ATC 600F C16 multilayer ceramic chip capacitor 0.3 pF ATC 600F R1 resistor 5.1  SMD 0805 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 6 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 76.2 mm C6 C1 C2 C3 C7 C8 R1 C4 40 mm C9 C10 C5 C11 BLP9G0722-20G 2100MHz Rogers 4350 20mil C12 amp00288 Printed-Circuit Board (PCB): Rogers RO4350B; thickness = 0.508 mm. See Table 12 for a list of components. Fig 4. Component layout for test circuit at 2100 MHz Table 12. List of components See Figure 4 for component layout. BLP9G0722-20_9G0722-20G Product data sheet Component Description Value Remarks C1, C8 multilayer ceramic chip capacitor 10 F, 50 V Murata C2, C7, C10 multilayer ceramic chip capacitor 12 pF ATC 600F C3 multilayer ceramic chip capacitor 62 pF ATC 600F C4 multilayer ceramic chip capacitor 5.6 pF ATC 600F C5 multilayer ceramic chip capacitor 0.5 pF ATC 600F C6 electrolytic capacitor 2200 F, 50 V C9 multilayer ceramic chip capacitor 2.2 pF ATC 600F C11 multilayer ceramic chip capacitor 1.2 pF ATC 600F C12 multilayer ceramic chip capacitor 1.8 pF ATC 600F R1 resistor 5.1  SMD 0805 All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 7 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 7.4 Graphical data 7.4.1 CW amp00289 27 80 Gp (dB) (1) (2) ηD (%) 60 21 (1) (2) 40 19 60 (1) (2) Gp 23 80 Gp (dB) ηD (%) 25 amp00290 23 Gp 40 (1) (2) 21 20 17 20 ηD ηD 19 0 0 5 10 15 20 25 30 35 PL (W) 15 40 0 0 VDS = 28 V; IDq = 180 mA. 5 10 20 25 30 35 PL (W) 40 VDS = 28 V; IDq = 180 mA. (1) f = 728 MHz (1) f = 1805 MHz (2) f = 768 MHz (2) f = 1880 MHz Fig 5. 15 Power gain and drain efficiency as function of output power; typical values Fig 6. Power gain and drain efficiency as function of output power; typical values amp00291 22 80 Gp (dB) ηD (%) 20 60 (1) (2) Gp 18 40 (1) (2) 16 20 ηD 14 0 0 5 10 15 20 25 30 35 PL (W) 40 VDS = 28 V; IDq = 180 mA. (1) f = 2110 MHz (2) f = 2170 MHz Fig 7. Power gain and drain efficiency as function of output power; typical values BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 8 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 7.4.2 Pulsed CW amp00292 27 Gp (dB) 80 (1) (2) 25 amp00293 23 80 Gp (dB) ηD (%) ηD (%) 60 21 40 19 (1) (2) 60 Gp Gp 23 (1) (2) 40 (1) (2) 21 20 17 20 ηD ηD 19 0 0 5 10 15 20 25 30 35 PL (W) 15 40 0 0 VDS = 28 V; IDq = 180 mA. 5 10 20 25 30 35 PL (W) 40 VDS = 28 V; IDq = 180 mA. (1) f = 728 MHz (1) f = 1805 MHz (2) f = 768 MHz (2) f = 1880 MHz Fig 8. 15 Power gain and drain efficiency as function of output power; typical values Fig 9. Power gain and drain efficiency as function of output power; typical values amp00294 22 80 Gp (dB) ηD (%) (1) (2) 20 60 Gp 18 40 (1) (2) 16 20 ηD 14 0 0 5 10 15 20 25 30 35 PL (W) 40 VDS = 28 V; IDq = 180 mA. (1) f = 2110 MHz (2) f = 2170 MHz Fig 10. Power gain and drain efficiency as function of output power; typical values BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 9 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 7.4.3 1-Carrier W-CDMA amp00295 26 80 Gp (dB) amp00296 22 ηD (%) (1) (2) 24 60 20 Gp (1) (2) 60 (1) (2) 40 Gp (1) (2) 22 20 40 18 20 16 20 ηD ηD 18 0 0 80 Gp (dB) ηD (%) 1 2 3 4 5 6 7 PL (W) 14 8 0 0 VDS = 28 V; IDq = 180 mA. 1 2 3 4 5 6 7 PL (W) 8 VDS = 28 V; IDq = 180 mA. (1) f = 728 MHz (1) f = 1805 MHz (2) f = 768 MHz (2) f = 1880 MHz Fig 11. Power gain and drain efficiency as function of output power; typical values Fig 12. Power gain and drain efficiency as function of output power; typical values amp00297 22 80 Gp (dB) ηD (%) 20 60 Gp (1) (2) 18 40 (1) (2) 16 20 ηD 14 0 0 1 2 3 4 5 6 7 PL (W) 8 VDS = 28 V; IDq = 180 mA. (1) f = 2110 MHz (2) f = 2170 MHz Fig 13. Power gain and drain efficiency as function of output power; typical values BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 10 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor amp00298 -50 ACPR5m (dBc) amp00299 -30 ACPR5m (dBc) -54 -36 (2) -58 (2) -62 (1) -42 (1) -48 -66 -54 -70 -60 0 2 4 6 8 PL (W) 10 0 VDS = 28 V; IDq = 180 mA. 2 4 6 8 PL (W) 10 VDS = 28 V; IDq = 180 mA. (1) f = 728 MHz (1) f = 1805 MHz (2) f = 768 MHz (2) f = 1880 MHz Fig 14. Adjacent channel power ratio (5 MHz) as a function of output power; typical values Fig 15. Adjacent channel power ratio (5 MHz) as a function of output power; typical values amp00300 -30 ACPR5m (dBc) -36 (2) -42 (1) -48 -54 -60 0 2 4 6 8 PL (W) 10 VDS = 28 V; IDq = 180 mA. (1) f = 2110 MHz (2) f = 2170 MHz Fig 16. Adjacent channel power ratio (5 MHz) as a function of output power; typical values BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 11 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 8. Package outline SOT1482-1 0.24 B 0.025 L 0.25 A L 0.2 B B 6.1 (#1) 11.16 B0.1 1.57 1.78 B0.1 (#4) 0.5 B0.1 5.92 4.95 (#2) #6 (1.2) #6 PIN 1 (1) 1.04 10.67 B0.1 (#4) A 2.03 #6 9.65 (#1) (0.2) 3.8 min. 4.5 max. Compound allowed Flash/bleed allowed hatched area (2x) Exposed Heatsink 7.4 min. 8.7 max. Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1482-1 Third angle projection 6 1/4/2017 Sheet 1 of 2 Fig 17. Package outline SOT1482-1 (sheet 1 of 2) BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 12 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor SOT1482-1 Drawing Notes Description Items Dimensions are excluding mold protrusion. The mold protrusion is maximum 0.15 mm per side. See also detail B. (1) In the dambar area max. protrusion is 0.55 mm. max. in length and 0.3 mm. max. in width (4x). See also detail B. (2) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (3) The leads and exposed heatsink are plated with matte Tin (Sn). Dimensions (Heatsink ears) 10,67 and 1,78 do not include mouldprotrusion. Overall Max. dimensions incl. mould (4) protrusions is 10.92 mm. (max.) and 2.03 mm. (max.) (5) Lead coplanarity over the leads is 0,1 mm. maximum. (6) Surfaces may remain unplated (not solderable surfaces) x.) (0.3 ma B DETAIL B SCALE 50 : 1 5 (0. 5m ) ax . Lead Dambar protrusion (#2) ) ax. (#1 0.15 m Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1482-1 Third angle projection 6 1/4/2017 Sheet 2 of 2 Fig 18. Package outline SOT1482-1 (sheet 2 of 2) BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 13 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor SOT1483-1 0.24 B0.025 1.78 B0.10 (#4) L 0.25 A L 0.2 B 5.92 6.10 (#1) B 8.13 B0.10 4.95 (#2) 1.57 0.50 B0.10 #5 #5 A PIN 1 2.03 Gage Plane (2.08) DETAIL A SCALE 25 : 1 #5 10.67 B0.10 (#4) (0.20) 3.8 min. 4.5 max. Compound allowed 0.43 - 0.63 9.65 (#1) Seating Plane A 0.25 0.00 - 0.10 2` - 8` Flash/bleed allowed hatched area (2x) Exposed Heatsink 7.4 min. 8.7 max. Package outline drawing: units in mm. Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1483-1 Third angle projection 7 2/21/2017 Sheet 1 of 2 Fig 19. Package outline SOT1483-1 (sheet 1 of 2) BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 14 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor SOT1483-1 Drawing Notes Description Items Dimensions are excluding mold protrusion. The mold protrusion is maximum 0.15 mm per side. See also detail B. (1) In the dambar area max. protrusion is 0.55mm max. in lenght and 0.3 mm max. in width (4x) See also detail B. (2) The lead dambar (metal) protrusions are not included. Add 0.14 mm max to the total lead dimension at the dambar location. (3) The leads and exposed heatsink are plated with matte Tin (Sn). Dimensions (Heatsink ears) 10,67 and 1,78 do not include mouldprotrusion. Overall Max. dimensions incl. mould (4) protrusions is 10,92 mm. (max.) and 2,03 mm. (max.). (5) Surfaces may remain unplated (not solderable surfaces). DETAIL B SCALE 50 : 1 x.) (0.3 ma B 5 (0. 5m ) ax . Lead Dambar protrusion (#2) Package outline drawing: units in mm. ) ax. (#1 0.15 m Tolerances unless otherwise stated: Revision: Angle: B 1° Revision date: Dimension: B 0.05 SOT1483-1 Third angle projection 7 2/21/2017 Sheet 2 of 2 Fig 20. Package outline SOT1483-1 (sheet 2 of 2) BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 15 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 9. Handling information CAUTION This device is sensitive to ElectroStatic Discharge (ESD). Observe precautions for handling electrostatic sensitive devices. Such precautions are described in the ANSI/ESD S20.20, IEC/ST 61340-5, JESD625-A or equivalent standards. Table 13. ESD sensitivity ESD model Class Charged Device Model (CDM); According to ANSI/ESDA/JEDEC standard JS-002 C2A [1] Human Body Model (HBM); According to ANSI/ESDA/JEDEC standard JS-001 2 [2] [1] CDM classification C2A is granted to any part that passes after exposure to an ESD pulse of 500 V, but fails after exposure to an ESD pulse of 750 V. [2] HBM classification 2 is granted to any part that passes after exposure to an ESD pulse of 2000 V, but fails after exposure to an ESD pulse of 4000 V. 10. Abbreviations Table 14. BLP9G0722-20_9G0722-20G Product data sheet Abbreviations Acronym Description 3GPP 3rd Generation Partnership Project CCDF Complementary Cumulative Distribution Function CDMA Code Division Multiple Access CW Continuous Wave DCPH Dedicated Physical CHannel EDGE Enhanced Data rates for GSM Evolution ESD ElectroStatic Discharge FDD Frequency Division Duplex GSM Global System for Mobile Communication LDMOS Laterally Diffused Metal-Oxide Semiconductor LTE Long Term Evolution MC-GSM Multi Carrier GSM MTF Median Time to Failure PAR Peak-to-Average Ratio SMD Surface Mounted Device TDD Time Division Duplex W-CDMA Wideband Code Division Multiple Access WiMAX Worldwide Interoperability for Microwave Access All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 16 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 11. Revision history Table 15. Revision history Document ID Release date Data sheet status Change notice Supersedes BLP9G0722-20_9G0722-20G v.3 20180226 Modifications: • Product data sheet - BLP9G0722-20_9G0722-20G v.2 Section 1.1 on page 1: changed “400 MHz” to “100 MHz” BLP9G0722-20_9G0722-20G v.2 20170801 Product data sheet - BLP9G0722-20_9G0722-20G v.1 BLP9G0722-20_9G0722-20G v.1 20170606 Product data sheet - - BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 17 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. Definition [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ampleon.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Ampleon does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Ampleon sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between Ampleon and its customer, unless Ampleon and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the Ampleon product is deemed to offer functions and qualities beyond those described in the Product data sheet. 12.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, Ampleon does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Ampleon takes no responsibility for the content in this document if provided by an information source outside of Ampleon. In no event shall Ampleon be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, Ampleon’s aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of Ampleon. Right to make changes — Ampleon reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — Ampleon products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an BLP9G0722-20_9G0722-20G Product data sheet Ampleon product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Ampleon and its suppliers accept no liability for inclusion and/or use of Ampleon products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. Ampleon makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using Ampleon products, and Ampleon accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the Ampleon product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. Ampleon does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using Ampleon products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). Ampleon does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — Ampleon products are sold subject to the general terms and conditions of commercial sale, as published at http://www.ampleon.com/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. Ampleon hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of Ampleon products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 18 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor Non-automotive qualified products — Unless this data sheet expressly states that this specific Ampleon product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. Ampleon accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without Ampleon’s warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond Ampleon’s specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies Ampleon for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond Ampleon’s standard warranty and Ampleon’s product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Any reference or use of any ‘NXP’ trademark in this document or in or on the surface of Ampleon products does not result in any claim, liability or entitlement vis-à-vis the owner of this trademark. Ampleon is no longer part of the NXP group of companies and any reference to or use of the ‘NXP’ trademarks will be replaced by reference to or use of Ampleon’s own trademarks. 13. Contact information For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales BLP9G0722-20_9G0722-20G Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 26 February 2018 © Ampleon Netherlands B.V. 2018. All rights reserved. 19 of 20 BLP9G0722-20; BLP9G0722-20G Power LDMOS transistor 14. Contents 1 1.1 1.2 1.3 2 3 4 5 6 7 7.1 7.2 7.3 7.4 7.4.1 7.4.2 7.4.3 8 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2 Thermal characteristics . . . . . . . . . . . . . . . . . . 2 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 3 Ruggedness in Doherty operation . . . . . . . . . . 3 Impedance information . . . . . . . . . . . . . . . . . . . 3 Test circuit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Graphical data . . . . . . . . . . . . . . . . . . . . . . . . . 8 CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Pulsed CW . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 1-Carrier W-CDMA . . . . . . . . . . . . . . . . . . . . . 10 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12 Handling information. . . . . . . . . . . . . . . . . . . . 16 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17 Legal information. . . . . . . . . . . . . . . . . . . . . . . 18 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Contact information. . . . . . . . . . . . . . . . . . . . . 19 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © Ampleon Netherlands B.V. 2018. All rights reserved. For more information, please visit: http://www.ampleon.com For sales office addresses, please visit: http://www.ampleon.com/sales Date of release: 26 February 2018 Document identifier: BLP9G0722-20_9G0722-20G
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