CE1006000110111

Cool Edge 0.80mm Hybrid Power & Signal Connectors HYBRID CONNECTOR FOR VERSATILE BOARD-TO-BOARD APPLICATIONS Cool Edge Hybrid Power and Signal connectors provide one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS/SATA, and offer multiple BTB configurations such as mezzanine, coplanar and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot plug capable. These connectors feature modular tooling that allows multiple power-signal combinations for vertical configurations. It is also available in right angle and straddle mount options. TARGET MARKETS § Right angle and straddle mount options are available upon request § Comes with cable-to-board option § High Speed 0-32 Gb/s (or 56Gb/s PAM4) capability § Supports multiple impedance systems FEATURES BENEFITS § Power pin pitch at 9.10mm with current rating of 25A per § Supports medium to high power BTB applications pin § Signal pin pitch at 0.80mm with current rating of 0.5A per § Supports most mating board applications pin § Power pins from 2 to 6 and signal pins range from 20 to § Allows flexible power-signal combinations 200 § Through hole power pin termination § Provides higher power through several power layers § Open pin field design § Supports both single-ended and differential pairs with speeds up to 32Gb/s (or 56Gb/s PAM4) § Vertical, right angle, and straddle mount configurations for coplanar, mezzanine, and backplane applications § Built-in guide block option § Supports multiple applications ranging from ICT to consumer § Tolerates mis-alignment and facilitates blind-mating conditions § Supports 1.6mm thick mating board § Supports most standard BTB applications § Slimmer form factor than standard PCIe® § Serves as a space-saving alternative compared to the standard www.amphenol-icc.com Amphenol Information Communications and Commercial Products Cool Edge 0.80mm Hybrid Power & Signal Connectors TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL § Contact Base Metal: Copper alloy § Temperature Life: 105±2˚C for 240 hours. Per § Contact Area Finish: Gold over nickel § Solder Area Finish: Tin over nickel § Housing: High temperature thermoplastic (UL 94V-0) ELECTRICAL PERFORMANCE § Contact Resistance: 30mΩ max. initial; 15mΩ max. change after test § Current Rating: 25A per power pin, 0.5A per signal pin with temperature rise not exceeding 30˚C § Dielectric Withstanding Voltage: 1000V DC for power and 500V DC for signal MECHANICAL PERFORMANCE § Durability: 200 mating cycles § Mating Force: 10N/pin max. for power pin; 0.6N/pin max. for signal pin § Unmating Force: 1.5N/pin min. for power pin; 0.06N/pin min. for signal pin SPECIFICATIONS § Amphenol Product Specification: SCE001 § Thermal Shock: 10 cycles between -55˚C to +85˚C. Per EIA 364-32 § Humidity: 24 cycles between 25±3˚C at 80±3% RH and 65±3˚C at 50±3% RH. Per EIA 364-31 § Mixed Flow Gas APPROVALS & CERTIFICATION § UL PACKAGING § Tray/Reel TOOLING INFORMATION § Special pin count option available upon request TARGET MARKETS/APPLICATIONS Server and Storage Systems High-end Computing system Baseband Radio Units Networking Commercial Systems SSIOCOOL0800821EA4 § Amphenol Application Specification: SCE002 EIA 364-17 www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice.