CED011481142001

Double Density Cool Edge 0.80mm Connectors HIGH SPEED SPACE-SAVING HYBRID CONNECTOR FOR BOARD-TO-BOARD APPLICATIONS The 0.80mm pitch Double Density Cool Edge connectors offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-InCard thicknesses. § Provide options for 1.60mm and 2.36mm AIC § Hybrid configuration with differential, single-ended and TARGET MARKETS power pin options § High speeds of up to 32GT/s(or 56GT/s PAM4) capability § Saves much more space than most of the cardedge connectors in market § 76 to 428 contacts FEATURES BENEFITS § 0.80mm pitch § Support high density hybrid applications § 2A per pin for power application § 0.5A per pin for signal application § Signal pins options from 76 to 428 § Support maximum 70 lanes per connector § Hybrid configurations § Allows flexible power-signal combinations § Accommodates 1.60mm and 2.36mm thick mating boards § Supports most of the standard AIC applications § Optimized contact design to meet 32Gb/s § Meets next generation signal speed requirements § Special power contact design § Can carry more than 2A per pin § Compact connector design § Shortened trace lengths compared with standard cool edge connectors § Cable solution is available www.amphenol-icc.com § Increased system interconnect flexibility Amphenol Information Communications and Commercial Products Double Density Cool Edge 0.80mm Connectors TECHNICAL INFORMATION MATERIAL APPROVALS AND CERTIFICATIONS § Contact Base Metal: Copper alloy § RoHS compliant § Contact Area Finish: Gold over nickel PACKAGING § Solder Area Finish: Tin over nickel § Housing: High temperature thermoplastic (UL 94V-0) ELECTRICAL PERFORMANCE § Contact Resistance: (Initial) 30mΩ max., 15mΩ max. change after test § Current Rating: 2A per pin for power application/0.5A per pin for signal application with temperature rise not exceeding 30°C § Dielectric Withstanding Voltage: 500V § Operating Voltage: 12V DC (for special requirements, please contact us) § Tray § Tape & Reel (support less than 284pin) TARGET MARKETS/APPLICATIONS Baseband Commercial Systems Networking Radio Units High-end Computing System Server and Storage Systems High-end Computing System Server and Storage Systems MECHANICAL PERFORMANCE § Durability: 100 mating cycles § Mating Force: 0.38N/pin max. for signal pin § Unmating Force: 0.03N/pin min. for signal pin ENVIRONMENTAL § Temperature Life: 105±2°C for 240 hours per EIA 364-17 § Thermal Shock: 10 cycles between -55°C to +85°C per EIA 364-32 § Humidity: 24 cycles between 25±3˚C at 80±3% RH and 65±3°C at 50±3% RH per EIA 364-31 § Mixed flow gas § Operating Temperature Range: -55°C to +105°C § Storage Temperature Range: -15°C to +55°C www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice. Double Density Cool Edge 0.80mm Connectors PART NUMBER SELECTOR - CABLE CONNECTOR CED X 1 XXX 1 1 X X XX X Plating spec 1 0.76μm Au Total Pin Count 2 0.38μm Au 076 3 Gold flash 112 4 0.76μm PdNi+GF 148 200 248 Single end wafer 284 00 0 wafer 320 01 . . ... 1 wafer 356 392 . More options available 428 Card Thickness Power Pin No power wafer 1 1 Power wafer 2 . . 9 2 Power wafer . . Power wafer A 10 Power wafer B . . ... 11 Power wafer . . More options available 1 1.60mm (1.57mm) 2 2.36mm Packaging Specification 1 Hard tray (320X230) with mylar 2 Hard tray (320X136) with mylar 3 Tube with mylar 4 Tape & Reel with mylar (support pin count less than 284) 5 Hard tray (320X230) without mylar 6 Hard tray (320X136) without mylar SSIODDCE0220EA4 0 www.amphenol-icc.com Disclaimer Please note that the above information is subject to change without notice.