DDR502112001K

Storage & Server IO DDR5 Memory Module Sockets (SMT) COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023 Vertical DDR5 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. §§Able to withstand high level system level shock and vibration testing module weight §§Easy to insert and extract the module card §§Supports thicker multilevel motherboard §§Optimizes airflow §§Meets environmental requirements TARGET MARKETS FEATURES BENEFITS §§Smaller pitch and lower operating voltage §§Results in less energy consumption §§Supports faster data rates §§Faster transition §§Reduced product width §§Saves board space §§Lower insertion force §§Easier for module card insertion and extraction §§Different color options for housing and latches §§Facilitates quick visual identification from PCB §§Narrow latch option §§Facilitates good airflow www.amphenol-icc.com Amphenol Information Communications and Commercial Products DDR5 Memory Module Sockets (SMT) TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL §§ Contacts: Copper alloy, Gold flash or 15 µin min. §§ Solderability: 95% min. of gold or 30 µin min. of gold (Contact area), Tin or matte tin plating (Solder Area), Nickel plating over all (Underplate) §§ Insulator: High temperature, thermal plastic (UL94V-0), color option §§ Boardlock: Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate) ELECTRICAL PERFORMANCE §§ Voltage Rating: 30V AC (RMS)/DC §§ Current Rating: 0.7 Amps/pin max. MECHANICAL PERFORMANCE §§ Insertion Force: 106.8N max. §§ Withdrawal Force: 19.77N min. §§ Retention Force: §§ Contact: 300gf min. per pin §§ Boardlock: 13.3N min. §§ Durability: 25 cycles §§ Vibration, Mechanical Shock §§ Latch Overstress Force: 3.5kg min. force held for 10s with no damage §§ Resistance to Soldering Heat: Visual-no damage or discoloration of connector materials §§ Temperature Life, Thermal Shock §§ Cycling Temperature and Humidity §§ Temperature Rise: 30°C max. §§ Mixed Flowing Gas, Thermal Disturbance, Salt Spray APPROVALS & CERTIFICATION §§ UL E66906 SPECIFICATIONS §§ Amphenol Product Specification: S-DDR-005 §§ Amphenol Packaging Specification: PKSDDR5001 §§ Amphenol Application Specification: S-DDR-006 §§ JEDEC Module Outlines: MO-329 §§ JEDEC Socket Outlines: SO-023 PACKAGING §§ Tray TARGET MARKETS/APPLICATIONS §§ Reseating: No damage §§ Latch Actuation Force: The force to fully actuate the latch open shall be 4.5kgf max. per latch §§ Module Rip Out Force: 9.1kgf min. retention force of the module in connector with no damage §§ Retention of Connector to PCB: No lifting of Routers Switches Wireless Infrastructure Desktop PCs Server and Storage Systems Super Computers Workstations Embedded Systems connector from applicable PCB §§ Total Insertion Force: 75N max. PART NUMBERS Description Type Part Numbers DDR5 Surface mount (SMT) termination with forklocks DDR502* www.amphenol-icc.com SSIODDR50918EA4 *denotes base part number. Please contact Amphenol ICC for complete part numbers. Disclaimer Please note that the above information is subject to change without notice.