DDR504111002KQ

Storage & Server IO DDR5 Memory Module Sockets (SMT) COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023 Vertical DDR5 DIMM sockets from Amphenol ICC provide 288 contacts on 0.85mm pitch and are designed to accept DDR5 memory modules that conform to JEDEC MO-329. The sockets facilitate convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. § Able to withstand high level system level shock and vibration testing module weight § Easy to insert and extract the module card § Supports thicker multilevel motherboard § Optimizes airflow § Meets environmental requirements TARGET MARKETS FEATURES BENEFITS § Smaller pitch and lower operating voltage § Results in less energy consumption § Supports faster data rates § Faster transition § Reduced product width § Saves board space § Lower insertion force § Easier for module card insertion and extraction § Different color options for housing and latches § Facilitates quick visual identification from PCB § Narrow latch option § Facilitates good airflow www.amphenol-icc.com Amphenol Information Communications and Commercial Products DDR5 Memory Module Sockets (SMT) TECHNICAL INFORMATION MATERIAL ENVIRONMENTAL § Contacts: Copper alloy, Gold flash or 15 µin min. § Solderability: 95% min. of gold or 30 µin min. of gold (Contact area), Tin or matte tin plating (Solder Area), Nickel plating over all (Underplate) § Insulator: High temperature, thermal plastic (UL94V-0), color option § Boardlock: Copper alloy, Tin plating (Solder Area), Nickel plating overall (Underplate) ELECTRICAL PERFORMANCE § Voltage Rating: 30V AC (RMS)/DC § Current Rating: 1.0 Amps/pin max. MECHANICAL PERFORMANCE § Insertion Force: 106.8N max. § Withdrawal Force: 19.77N min. § Retention Force: § Contact: 300gf min. per pin § Boardlock: 13.3N min. § Durability: 25 cycles § Vibration, Mechanical Shock § Latch Overstress Force: 3.5kg min. force held for 10s with no damage § Resistance to Soldering Heat: Visual-no damage or discoloration of connector materials § Temperature Life, Thermal Shock § Cycling Temperature and Humidity § Temperature Rise: 30°C max. § Mixed Flowing Gas, Thermal Disturbance, Salt Spray APPROVALS & CERTIFICATION § UL E66906 SPECIFICATIONS § Amphenol Product Specification: S-DDR-005 § Amphenol Packaging Specification: PKSDDR5002 § Amphenol Application Specification: S-DDR-006 § JEDEC Module Outlines: MO-329 § JEDEC Socket Outlines: SO-023 PACKAGING § Tray TARGET MARKETS/APPLICATIONS § Reseating: No damage § Latch Actuation Force: The force to fully actuate the latch open shall be 4.0kgf max. per latch § Module Rip Out Force: 9.1kgf min. retention force of the module in connector with no damage § Retention of Connector to PCB: No lifting of Routers Switches Wireless Infrastructure Desktop PCs Server and Storage Systems Super Computers Workstations Embedded Systems connector from applicable PCB § Total Insertion Force: 35N max. PART NUMBERS Description Type Part Numbers DDR5 Surface mount (SMT) termination with board lock DDR504* www.amphenol-icc.com SSIODDR51220EA4 *denotes base part number. Please contact Amphenol ICC for complete part numbers. Disclaimer Please note that the above information is subject to change without notice.